Transcript Loadpoint

Loadpoint
MEMS
Technology
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Loadpoint Background
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European SME,
Involved in MEMS since 1976
– Pressure sensors, Medical Ultra-Sonics, ink
jet printers, actuators.
Direct process development service
Consumable support
890 Dicing machines, 3,600 Dicing spindles in
operation world wide
40 years experience of electronics industry
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Division of the MST Market
by Sector
4%
World Market for MST
2005: $68 billion
3%
7%
Transportation
Telecom
Other
IT Peripherals
Medical
28%
58%
Based on Nexus market analysis
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Nanotechnology Sectors
Nano Powders
13%
Nano Processes
1%
MEMS 14%
Consulting 2%
Nano Materials
11%
Nano Biotechnology
19%
Nano Instruments
18%
Nano Devices
19%
Nano
Chemicals 3%
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Global Funding of
Nanotechnology *
Amount (US$ mil.)
3500
3000
2500
2000
1500
1000
500
0
1999
2000
2001
2002
2003
* Approximate figures based on NanoInvestorNews.com
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Switzerland:
Unsurprisingly,
watches
MEMS
Japan:
Optics
Germany:
Automotive
and RF MEMS
for ‘phones
Canada, Benelux:
Microfluidics for
Medi-MEMS
Countries
developing
innovative fields
Italy and Spain:
Food Quality +
Biosensors
Singapore:
Biosensors
and OpticalNetworks
Israel: Anti-terror
devices
Nordic Zone: Maritime
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MEMS The role of SME’s
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Highest costs are in Test and Packaging
Unavailability of machinery for flexible or
small batch production
leading to specialist service providers
Small flexible SME’s providing appropriate
technology
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MEMS China
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China, 2002 200 Million Yuan approved for MEMS
special project under five years plan 863 (high Tech
and Development Research Programme
Fundamental Research Programme 973 (since 1997):
134 projects, 2.5B Yuan, MOEMS project, Nano
Materials Project and Nano Electronics projects
included
One of the few countries including agricultural
research as part of nanotechnology.
13th Institute of China Electronics Technology Group
offering flexible 3/4 inch MEMS fabrication line with
test and packaging equipment
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MEMS Directions
Ultrasonic
transducers
Medical
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Italian and Japanese sensors applied to
genomics and DNA/RNA
Ultrasonic transducers for diagnosis and
endoscopy
Benelux and Japan: Intra-vascular
blood sensor
Canada and Benelux - blood lab on a
chip with micro-needles for thumb blot.
Canada: diagnosis integration of Microfluidics, MEMS and Optical devices
Micro-needles
Intravascular MEMS
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CardioMEMS
MEMS Directions
Automotive
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Sensors becoming the key to the Safe-Car
– Micro-accelerometers
– Crash Sensors
– Roll Sensors
– Tyre pressure sensors
– Vision Assistance etc.
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Communications
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RF MEMS and Optical devices are the focus
Australian development in relays
Canada showing particular interest in RF and
now X-ray MEMS
Taiwan, biggest government investment of
MST is in this area - US$ 200 Million
Optical and Display
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USA & Israel Micro-mirror arrays
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Microfluidics
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Fuel injectors for automotive industry
Blood sampling and other medical uses
Microassembly
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Synchrotron Projects - for imaging at molecular
level
Australia spending $206M, other projects in
Canada and Germany
Microfluidics will be important for this area, fine
spraying seems to be the best emerging method
of production for nano-materials
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MEMS, demands
One MEMS structure
Needs to be be
connected to and
protected from the
outside world
Source Competence Centre for
Microactuators and non-Silicon
microsystems
So the mirror
structure material,
cover and possible
interconnect layer
need to be diced
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Applications, driving forces for
convergence for MEMS dicing
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MEMS  CSP  WSP
BGA, UBGA, FR3 / FR4 & copper sub-frame
Silicon, Glass, Quartz,
Ceramic substrates, LTCC and similar
PZT integrated transducers & actuators
Stainless steel, copper etc.
GaAs and SAWF materials and similar
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MEMS Process Points 1
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MEMS, BGA, BGA or similar converge at
WSP level
Material thickness, hardness and polymaterial layers
Cutting energy dissipation and strength of
material
Sensitive surface topography and coatings.
Process Temperature control
Keeping cutting swarf out of mechanisms
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MEMS Process Points 2
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Some structures
have special needs
Dicing Lab on Chip
has considerable
demands
Temporary seals for
chemical /
compound needed
Protection of
bonding pads
Source:Competence Centre for
Microactuators and non-Silicon
microsystems
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MEMS Outlines
Packages have standard
features and these outlines
indicate some seen.
Solutions exist for all of these
although some development
is usually needed to
determine full process
Combination with BGA
coming
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Wafer Scale Packaging
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Practical
Considerations
Interconnect
Bonding
Moulded cover
material
Flatness of moulded
package
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Large Area MEMS
Integration of BGA & BGA dicing techniques
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Specialist application
with points to watch
– Frame material
– Flatness
– Work holding
– In line v stand alone
Next generation of multi
layer devices
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MEMS Future Packages
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Integration of other materials will mean that
multi-layer devices could evolve from forms
currently seen, for example: Fibre board with interconnect & external connection
Signal processing
layer
Sensor layer
Actuation layer
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MEMS - the future
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Integration of more materials into the structure, up to at
least 6 layers
Move to low profile wafer scale packaging with BGA
concepts
Issues
– Grinding and surface finishing for layer bonding
– Dicing a mixture of materials with diverse
characteristics, design for dicing
Accurate break down into process elements for process
development
Design for dicing!
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Our Major Products
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NanoAce
Dicer/Grinder
300mm diameter
material
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PicoAce
Nanogrinder
300mm diameter
material
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MicroAce Dicer
150mm diameter
material
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Loadpoint
Chelworth IE, Cricklade, Swindon, Wiltshire, SN6 6HE, UK
Tel ++441 793 751160; email [email protected]
Web: www.loadpoint.co.uk
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