Transcript 'There Is More Than Moore in Automotive

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"There Is More Than Moore
in Automotive …"
Hartmut Hiller
Infineon Technologies AG
Senior Director Design Methodology
Business Group Automotive, Industrial & Multimarket
Some Semi-conductor enabled functions of a typical car
Body & Convenience
Xenon Light, Seat Position,
Climate Control, Dashboard
Powertrain
Engine Control
Transmission Control
Battery Management
Climate Control
Airbag
Night Vision
Park Distance
Control
Steering
Hybrid
Cooling
FAN
Light
Transmission
Engine
Battery
Management
Blindspot
Detection
Mirror
Dashboard
Suspension
Door
Central Lock
TPMS
ABS
Brake
ESP
Adaptive
Cruise Control
Safety
Chassis
Airbag, ABS Brakes,
Adaptive Cruise Control
Active Suspension,
Power Steering
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Nico Kelling (IFJ AIM MC)
Automotive Microelectronics Trends  More Than
50% of $-value of Electronics is Semiconductors
450%
Growth in % (1995 = 100%)
400%
350%
Semiconductor 425% CAGR
content of car
11.3%
Value of
Semiconductor per car
2008: 320 US$
2020: 700 US$
300%
Electronics
255%
content of car
CAGR
250%
6.9%
200%
Car volume 144%
150%
CAGR
2.6%
100%
1995
1997
1999
2001
2003
2005
2007
2009
Source: ZVEI
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Full spectrum of semi-conductor technologies
is needed
Silicon Sensors
Computing
Sensing
Special processes
High precision
Great robustness
Smart
Sensors
Power Semicon.
Actuating
Microcontrollers
50 m transistors
High current
High voltage
High temperatures
Smart
Power
Non-volatile memory
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While
Moore’s
technologies
Law: Driverfor
forAutomotive
CMOS & DRAM
follow at a distance
Technology Node – Minimum structure (nm)
1000
130nm
100
90nm
Emerging Memories
2-year Cycle
65nm
Bipolar CMOS DMOS
3-year Cycle
eFlash Automotive MC
22nm
DRAM ½ Pitch
MPU/ASIC ½ Pitch
10
1995
1998
2001
2004
2007
Year of Production
2010
2013
2016
Source: ITRS Roadmap, Infineon, Internet Announcements
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The special challenges for Automotive Technologies
1. Extended Temperature Range: -50° C to 175+° C
2. Extreme mechanical stress (vibration, pressure, temp. cycles)
3. Extreme voltages/currents for Power-Semiconductors (Switches)
4. Long term reliability requirement
5. Large eFlash with 10 years data stability
6. Demanding ESD / EMC / EOS requirements
7. Zero Defect Requirement
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The special challenges for Automotive Technologies
QUALITY
This builds the basis for our RELIGION which is called
( No compromises )
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Infineon’s Automotive Excellence Program
44th Design Automation Conference
San Diego, June 2007
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We deliver "World Class Quality" from Day Zero
Secure
Former
Ramp
Quality *
Effort
Wspw
Time
* := Functionality, Zero Defect, Yield, Reliability, Robustness, Spec. Corners
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Unfortunately "World Class" does not come for free
The Goal
Quality
Wspw
Learning
Test-Chip
Test-Chip
Product A-Step
Learning
Learning
Effort
Product A-Step
Product B-Step
Time
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Our today’s "Top 3 Challenges" (w/o good EDA solutions)
Today’s EDA Tools provide "sub-optimal" Support for:
1. The embedded Flash Challenge
2. EMC Modelling
3. To overcome the "Analogue / Digital Wall"
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1. The embedded Flash challenge
A typical Infineon
High-End µC
The eFlash challenges:
1. Tremendous analogue complexity
pushing the tool limits ( 18 Mio
Transistors  100 Mio extr. Devices)
2. Complex Mixed Signal function;
FSI with own CPU for calibration
3. Electro-Migration verification
4. Dynamic IR Drop verification
5. Hierarchical Extraction
6. True Latchup Issues (due to high
Voltages during write/erase)
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Chip
2. EMC Modelling
Abstraction via Own Tool
Netlist
Package
Real Layout
Simulations:






EME Simulation Results
VDD/VSS-Currents
Voltage Drop
Noise Crosstalk
EME
ESD
Parasitic
Resonances
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3. The digital / analogue Wall
Timing closure;
Behavioral Correctness;
non distrubant analogue
Transitor level opt.;
Transient behavior;
Noise; …
1-2 Iterations / macro
+ FRUSTRATION 
Macro
AMS community / db
Full-Chip community / db
And that‘s what we strive for
Sys- Level
Dig. Design
AMS Design
SIP
Abstraction
Abstraction
Abstraction
Abstraction
Common database
& Common Methods (example: Full Chip Crosstalk analysis )
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Tomorrows "Top 3 Challenges"
The "Monsters ahead":
1. Modelling Parasitic devices
2. "Adding Brain to Power"
3. On the Way to "Zero Pin Sensors"
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1. Modelling Parasitic Devices
Modelling of parasitic devices/substrates is "the blind spot" in
today’s EDA (Example: ReverseCurrent Injection for Power-Semi):
"One" Problem:
 if potential drops below Vdd
(!!! critical with inductive loads !!!)
Parasitic NPN
Today’s solutions: Expert Reviews & Checklists to ensure that
proper design measures are taken
But unfortunately you see such a problem the first time on Si
(  lack of EDA supported methods )
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2. "Adding Brain To Power"
Next
Current
Step:
Product (MCM):
µ-Controller
Power-Chip
horizontal integration
(based on IFX 130nm node)
and the Next Challenges
(w/o good EDA answers):
1. Voltage Dependent Design Rules
2. New effects (parasitcs) due to substrate coupling  substrate Modelling
3. Diverging Time Constants (kHz  100s of MHz)
4. Diverging Current Ranges (µA  some A)
5. Thermal simulation with analogue view ( matching  isotherm req.)
6. Digital / Analogue / High Voltage Co-Design
7.
......
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3. On the Way to "Zero Pin Sensors"
The Next Level of Sensor Integration
(!!! truly autonomous !!!):
European Commission #026461 – e-CUBES
and the Next (EDA) Challenges coming with it:
1. How to test an pin-less device (new BIST methods)?
2. Overall System Level verification  Full Range: mechanical thru High Speed-RF
3. Highly sophisticated System In Package (SIP) flow / methodology needed
4. Sophisticated Power Saving techniques
5. High density interchip wiring & interchip vias
6. Interchip Crosstalk
7.
......
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Conclusions
Quality & Reliability are the driving forces for Automotive
Products are facing (simultaneously) a broad range of challenges:
* Mechanical
* Thermal
* Robustness
* Mixed Signal Complexity
* ESD / EOS / EMC
The EDA issues shown are our prominent ones
beside
HW / SW integration, Funct. (MS) Verification, ESD robustness,
......
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http://www.infineon.com
Thank you for your attention
Hope you got some MORE insight
why
"There is MORE than MOORE in Automotive …"
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