Transcript Ormet Circuits, Inc. Technical Overview

Ormet Circuits, Inc.
Ormet Circuits, Inc.
Technology Overview
Presentation
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Ormet Circuits Confidential
Ormet Circuits, Inc.
Mission
Ormet Circuits provides conductive
pastes and inks that enable electrical
interconnection and thermal
management in electronic substrates,
components and assemblies.
Ormet Circuits, Inc.
Opportunity
• Industry currently uses 3 technologies to form electronic
interconnections
– Copper Plating
• Printed circuit boards
• Time consuming with poor yield for new designs
– Solder
• IC packaging for power devices
• High temperature processes reduce reliability
• Environmental concerns
– Conductive Adhesives
• Used as an alternate to solder in some applications
• Limited electrical and thermal properties
Ormet Circuits, Inc.
Ormet Circuits Confidential
Ormet Circuits Technology
Copper and alloy particles
in a liquid organic formulation
Sintered metal network
Ormet Circuits, Inc.
Ormet® materials do not remelt Transient Liquid Phase Sintering (TLPS)
DSC Analysis of Ormet 700 Lead Free Composition
First thermal
cycle
Second thermal
cycle, no re-melt
below 265ºc.
5/2/08
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Ormet Circuits, Inc.
Ormet Paste Before Cure
Point
Copper
1
2
3
Tin
Bismuth
98.48
1.52
100
100
Ormet Circuits, Inc.
Ormet Technology After Cure
Point
Copper
Tin
1
52
47
2
70
29
3
54
45
4
71
28
5
Bismuth
100
Ormet Circuits, Inc.
Ormet Materials Final Reactants
Bismuth
Melt 267° C
~16% of total matrix
Copper
Melt 1085° C
Cu3Sn intermetallic
Melt 640° C
Cu6Sn5 intermetallic
Melt 415° C
Direction of
tin migration
Ormet Circuits, Inc.
Value Proposition of
Ormet Technology
• Low temperature metallic joining
– Processing temperatures between 150-200C
• Compatible with Pb-free solder reflow profiles
– Thermally stable up to 265C
• Superior shear strength versus conductive adhesives
– Metallic joining 25% higher strength versus adhesives
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Ormet Circuits Confidential
Ormet Circuits, Inc.
Properties Comparison
Material
Electrical
Resistivity
Thermal
Via
Fill Materials
for Multilayer
(micro ohm cm)
PCBÕs Conductivity
(w/mK)
Tg
CTE-1 CTE-2
Movement*
(ppm) (ppm)
(mils/inch)
Fill Product (C)
Ormet 800
Copper
Solder
Ormet
None
22
22
2
Peters PP2795
San Ei PHP900
Dupont CB100
Tatsuta AE3030
Taiy o 7901
Epoxy / Silver
Coefficient of
Thermal Expansion
(ppm/ °
C)
140
25 140
115
172
20-40
110
6
400
40
40
34
40
45
16
150
21
80
13
35
45
9
86
13
25-58
120
20
* From 25 to 250 degrees C
100
3/8/2007
2
22
20
1=46
:
2240
16
FR4
12-16 (x,y)
72-85 (z)
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Ormet Circuits, Inc.
Thermal Properties
CMC data to explore range of thermal
properties in commercial products
• Measured by laser flash in
free standing film and 3- layer
structures
• Ormet has products ranging
from 25 W/mK to 58 W/mK
Unovis Data to explore thermal conductivity vs sintering temperature in Ormet 700
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Peak Temp
(°C)
150
190
217
250
150
Surface
as cast
as cast
as cast
as cast
1000 grit
Thickness
(cm)
0.0706
0.0725
0.072
0.0722
0.0627
Density*
(g/cm3)
4.8
4.8
4.8
4.8
4.8
Specific
Heat
Capacity*
(J/gK)
0.48
0.48
0.48
0.48
0.48
Thermal
Conductivity
(W/mK)
26.5
27.0
27.9
25.9
25.5
Ormet Circuits, Inc.
Commercial Applications
• Current product line used in fabrication
of high complexity PCBs for server,
mainframe and defense applications
– Core via-fill & z-axis interconnection
– Yield, reliability and performance drivers
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Ormet Circuits, Inc.
Ormet Interconnects in PCB
Applications
Filled Via
Ormet® Interconnect
Pyralux Adhesive
Layer
Copper Plated Via
Source: Endicott Interconnect Technologies
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Ormet Circuits, Inc.
X-Sections of Filled Vias
• 8 mil diameter
• 93 mil depth
• 50µm Diameter
• 400µm Depth
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Ormet Circuits, Inc.
Die Attach Development
7/23/08
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Confidential
Objective
• Assess new products for die attach
application
• Target is to provide alternative to high
Lead solders
• Approach
– Investigate patented Liquid Phase
Sintering Technology
– Investigate alternative cure profiles
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Confidential
Test conditions
1.
2.
3.
4.
Room temperature die shear (post-cure)
260C die shear (post-cure)
260C die shear (post 85/85 for 24hrs)
Room temperature die shear (post 85/85 for 24hrs + 3
260C solder reflow profiles)
Test Vehicle
• 4x4mm copper die on Ag plated copper leadframe
• Bondline thickness 25-35 microns
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Ormet Circuits, Inc.
Cure Conditions
• Condition 1:
– 30 min ramp to 170C + 30 min @ 170C
• Condition 2:
– 30 min ramp to 170C + 90 min @ 170C
• Condition 3:
– 30 min ramp to 190C + 60 min @ 190C
• Condition 4:
– 30 min ramp to 205C + 30 min @ 205C
• Condition 5:
– 30 min ramp to 205C + 90 min @ 205C
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Ormet Circuits, Inc.
Test Results: Room Temperature DSS
Post 24hrs @ 85/85 + 3
reflows @ 260C
60.0
60.0
50.0
50.0
40.0
40.0
554
30.0
RD256
RD260
20.0
10.0
DSS (kg)
DSS Strength (kg)
Post Cure
554
30.0
RD256
RD260
20.0
10.0
0.0
0.0
1
2
3
Cure Condition
4
5
1
2
3
Cure Condition
4
5
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Ormet Circuits, Inc.
Test Results: 260C Die Shear
Post 24hrs @ 85/85
16.0
16.0
14.0
14.0
12.0
12.0
10.0
10.0
554
8.0
RD256
6.0
RD260
DSS (kg)
DSS (kg)
Post Cure
RD256
6.0
4.0
4.0
2.0
2.0
0.0
0.0
1
2
3
Cure Condition
4
5
554
8.0
RD260
1
2
3
Cure Condition
4
5
Ormet Circuits, Inc.
Confidential
Die Shear Observations
• Failure mode was 100% cohesive
• Small voiding observed
• Strong effect of high cure temperature
– Compare condition #1 vs condition #4
– Compare condition #2 vs condition #5
• Longer cure time also will increase adhesion
– Compare condition #1 vs condition #2
– Compare condition #4 vs condition #5
• 554 performance was improved through cure profile optimization
– Compare condition #3 vs #’s 4 & 5
• RD256 has notably better results than other formulations
– Being sampled to beta sites as Ormet 555
– Silver version being sampled as Ormet 580
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Confidential
Cross Section Analysis: RD256
Post Cure
Post 85/85 + 3 reflows @ 260C
Excellent metallic bonding to surfaces and throughout material.
No signs of delamination after reliability testing
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Confidential
Void Free Attach
61m
25m
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Confidential
Ormet Circuits, Inc.
Beta Site Testing
• Test Vehicle:
– 3x3mm Si die with Ag back-side plating
– Ag-plated lead frame
• Output
– Electrical resistance (RDSON)
– Thermal resistance (dVSD)
• Reliability Testing
–
–
–
–
0hr
After MSL1
after MSL1 + UHST (96hr, 121C, 100% RH)
after MSL1 and TMCL (500cycles, -65C/+150C)
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Ormet Circuits, Inc.
New Trials: Power & RF Modules
• Provide 1 material
solution
– Replace solders for
passives
– Replace conductive
adhesives for metalbacked IC’s, copper
clips
Initial Beta Site Sampling
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Confidential
Ormet Circuits, Inc.
Die Attach Summary
• Ormet is in beta site evaluation with new formulations for
die attach
– Focus is for High –Pb solder replacement
– Die size target is <1x1mm to 4x4mm
• Viscosity is well suited to screen printing
– Low viscosity in development (RP-016)
• Very high 260C adhesion after moisture exposure to bare
copper
• Customer reliability results look very promising
• Advance applications in development
– B-stage paste
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Confidential
Wirebond Replacement
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Confidential
Wire-bond Replacement Application Detail
Mold
Compound
Ormet
Memory Chips
IC Substrate
Photos courtesy of VCI
Ormet’s technology is superior in T-cycling to
conductive adhesive materials due to sintering to
the bond pad and within the paste.
Ormet Circuits, Inc.
16 Flash Memory Die Stack
• Innovative solution to advanced die stacking applications
•100 micron lines
•250 micron pitch
•Smaller form factor with lower assembly cost
•High electrical performance
• In collaboration with Asymtek and Vertical Circuits, Inc.
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Confidential
Ormet Circuits, Inc.
Excellent Reliability Results
Proven Reliability at 2 major Flash Memory OEMs
PRETEST
60'C 90'C RH THB
CTH -A
TCB
HTS 150’C
HAST -
Source Lot#
Live Die
after reflow
504hr
1008hr
72hr
250Cyc
500Cyc
750Cyc
1000Cyc
BD4S2YG.11
2
0/320
0/34
0/34
0/30
0/67
0/67
0/67
0/62
BDZS2YG.11
4
0/160
0/33
0/35
0/35
0/33
BD2PMWG.11
4
0/143
0/33
0/35
0/32
0/31
96hr
504hr
1008hr
0/71
0/71
0/31
0/31
0/22
0/33
NA
NA
0/138
0/20
0/20
8 die stack flash memory CSP
Data courtesy of VCI
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Confidential
Ormet Circuits, Inc.
Staggered Die Stack
8
7
6
5
4
3
2
1
Staggered die stack in development with Vertical Circuits
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Ormet Circuits, Inc.
Application
Via Fill & Z-axis
Interconnection
Die Attach
Conductive
lines and traces
Solder Replacement
PTH fill
Ormet Circuits
Product Line Overview
Product
Lead Free
Process
Viscosity Thermal Conductivity
Cure
Ormet 701
A copper-based conductive paste used to form Z-axis interconnects by
filling microvias in multilayer boards and substrates
Yes
Screen Print / 200-300
Dispense
KCPS
25 W/mK
Lamination Press
Autoclave
Vacuum Bag
Ormet 701AG
A silver-based conductive paste used to form Z-axis interconnects by
filling microvias in multilayer boards and substrates
Yes
Screen Print / 200-300
Dispense
KCPS
25 W/mK
Lamination Press
Autoclave
Vacuum Bag
Ormet 7001
A lead- based conductive paste used to form Z-axis interconnects by
filling microvias in multilayer boards and substrates
No
Screen Print / 200-300
Dispense
KCPS
25 W/mK
Lamination Press
Autoclave
Vacuum Bag
Yes
Screen Print / 100-300
Dispense
KCPS
25 W/mK
Box Oven
with Nitrogen
Atmosphere
Yes
Screen Print / 100-300
Dispense
KCPS
25 W/mK
Box Oven
with Nitrogen
Atmosphere
Ormet 260
A screen printable, electrically conductive paste used for signal circuit
creation and jumper wire repair.
Yes
Screen Print / 150-300
Dispense
KCPS
25 W/mK
Reflow or Box Oven
with Nitrogen
Atmosphere
Ormet 260C
A dispensable or screen printable, non slumping, electrically conductive
paste used for creating conductive lines down to 80 microns.
Yes
Screen Print / 200-300
Dispense
KCPS
25 W/mK
Reflow or Box Oven
with Nitrogen
Atmosphere
Ormet 2600
A lead based screen printable, electrically conductive paste used for
signal circuit creation and jumper wire repair.
No
Screen Print / 150-300
Dispense
KCPS
25 W/mK
Reflow or Box Oven
with Nitrogen
Atmosphere
Ormet 400
A screen printable conductive paste used as an alternative to solder
paste.
Yes
Screen Print / 100-300
Dispense
KCPS
25 W/mK
Reflow or Box Oven
with Nitrogen
Atmosphere
Ormet 802
A conductive paste used for plugging thermal vias and copper through
holes.
Yes
Pneumatic
Pressure Fill
58 W/mK
Lamination Press
Autoclave
Vacuum Bag
Ormet 555:
A copper-based dispensable, or screen printable, electrically and
thermally conductive paste for discrete, IC, and LED die attach
applications.
Ormet 580
A silver-based dispensable, or screen printable, electrically and
thermally conductive paste for discrete, IC, and LED die attach
applications.
400-600
KCPS
Ormet Circuits, Inc.
Summary
• Ormet’s TLPS is in HVM to form high
performance PCB interconnections
• Provides Pb-free compatibility with low
temperature assembly
• Ongoing work to assess technology for
electronics assembly applications
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Ormet Circuits Confidential