Transcript Slide 1

History and Overview of SEMI S2
Lauren Crane
Applied Materials
Rev 1
S2 Time Line
2
1985 –
Work begins on a SEMI sponsored safety guideline to help unify
equipment safety criteria in the industry and hopefully prevent
outside agency involvement
1988 –
A draft document is circulated which is taken up for informal use
while its contents continue to be developed.
1991 –
The first version is published as “S2-93”. With this increased profile,
and subsequent official impact, opportunities for improvement are
quickly identified an revision work begins again.
1993 –
The second version is published as “S2-93”, now 20 pages long.
North American standards comprise most of the normative
references.
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S2 Time Line
199? –
The SEMATECH (user) organization publishes an S2 “Interpretive”
guide, which is soon revised and re-titled an S2 “application” guide
which addresses many perceived gaps in the SEMI S2 document
1995 –
1996 –
The European Machinery Directive become mandatory
A related information section is added to S2-93 comparing its criteria
to that of the Machinery Directive’s Annex I Essential Health and
Safety Requirements. This slightly expanded document is published
as S2-93A.
1996/7 – Anticipating the SEMI 5-yr rewrite deadline, a task force forms to
begin work on “S2-98” with some key drivers:
•More international (fewer NA-centric references)
•Less interpretive (consider “gaps” from the SEMATECH guide)
•Specific assessment method
•Expand issues covered
•Reference other S-guidelines
•Leverage lessons learned
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S2 Time Line
2000 –
After more than 3 years of work and expanding the task force
structure into ‘working groups’ S2-0200 is published, now some 75
pages long.
2002 –
First of several small revisions addressing fire protection criteria,
electrical test references, FECS topic, EMO circuit fault tolerance
2004 –
Began use of ‘Delayed Effectivety’ sections to better manage change
• Laser Data Sheet & Changes to laser criteria
• Risk assessment terminology to align with S10
2006 –
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First round of delayed effectivity sections become mandatory along
with some additional small revisions
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S2 Sections 1 thru 4 – Introduction
The following slides are intended to indicate S2 topics only
and might not accurately express the exact S2 criteria.
Please read S2 for full details
1 – Purpose
Performance based considerations
2 – Scope
Equipment used to manufacturer, measure, assemble, and test semiconductor
products
3 – Limitations
Doesn’t cover all possible EHS design criteria
Not intended to verify compliance with local regulatory requirements
4 – Reference Standards
Both normative and informative standards are referenced
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S2 Section 5 – Terminology
5.2.49 – Operator {Operation}
run the equipment to perform its intended function
5.2.41 – Maintenance {Maintenance Personnel}
tasks that keep working equipment working
5.2.63 – Service {Service Personnel}
tasks intended to fix broken equipment
NFPA 704
F
H
R
S
Fire
Health
Reactivity
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Risk Special Code
OX
0 Lo
Oxidizer
1
SA
2
Simple Asphixiant
3
W
4 Hi Water Reactive
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5.2.26 – HPM – Hazardous
Production Material
A material with a hazard class of 3 or 4
per NFPA 704
S2 Sections 6 thru 9 – Basics
6 – Safety Philosophy
Consider installation, operation, maintenance, service & disposal
Ensure single point, reasonably foreseeable failures do not endanger
personnel, facilities or the community
7 – General Provisions
Provide special hardware and tools needed for safety
The official values of S2 are metric
8 – Evaluation Process
Evaluation report should include only sections 9.6 and 10 thru 27
Non-conformances should be risk ranked per SEMI S10
Note: “Should” criteria are for evaluation
9 – Documents Provided to User
Manuals should conform to SEMI S13
lists of information for user and evaluator
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S2 Section 10 – Hazard Warning
Labels
▪ Hazard warning labels should conform to SEMI S1
Exception – labels dictated by law should conform to law
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S2 Section 11 – Safety Interlock
Systems
▪ Alert the operator on when activated
▪ Bypasses are okay, but should “auto-restore
when leaving the maintenance mode.
▪ Tool-only bypass for interlocks protecting operator tasks
▪ Protect adjustable interlock set points from change
▪ Electromechanical systems are preferred. Can also
be FECS (Fail to Safe Equipment Control System –
e.g., a PLC) or solid state but additional testing is
required.
▪ Ensure ungrounded control contacts
▪ Enclosures of hazards should be
interlocked or
Tool-accessible w/ label (plus internal barriers)
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S2 Section 12 – Emergency
Shutdown
240 VA
30 V
30
60 V
current
Hazardous
AC & DC
20
10
OK
8
16
voltage
24
32
60
68
Hazardous AC
▪ Remove hazardous voltage and 240 VA
power beyond main enclosure
Exception - not needed for ≤ 2.4 kVA
with accessible main disconnect if there
are only electrical hazards
Exception - EMO, safety device, data
logging equipment circuits under
certain conditions
▪ No intended bypass
▪ Provide instructions for connecting to any
EMO interface ports
▪ Electromechanical systems are preferred –
can be FECS or solid state with extra testing
▪ Actuators no more than 10 ft of travel from
operation and maintenance positions
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S2 Section 13 – Electrical Design
▪ Limit the need for work w/ live hazardous potentials
▪ Conform to an appropriate
electrical design standard
SEMI S22
NFPA 79
UL 508A
UL 61010
▪ Provide barriers against accidental contact, dropped tools,
liquid leaks
x
▪ Prevent access and top
D
entry per Appendix 1
Dmax
~x
▪ Use ATL certified parts if they are safety critical
▪ Use a color code for conductor insulation
▪ Multiple feeds okay if labeled
▪ Opening main disconnect kills all power (even UPS)
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Accredited
Testing
Laboratory
S2 Section 14 – Fire Protection
▪ Provide fire systems (detection or suppression) per a SEMI
S14 fire risk assessment [or provide locations for end users
to install their own devices
▪ Provide a summary report to the user
▪ Fire system activation should cause an audible and
visual alarm at the tool and shut down chemical feeds
▪ Manual activation capability is required for
suppression, optional for detection
▪ If suppressant release is hazardous (e.g., asphyxiation,
noise), time to escape may be needed.
▪ If fire system faults,
notify the operator
shut down tool after
current wafer is done
signal the facility
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▪ Design fire systems to be
always on (incl. 24 hr battery)
▪ Document safe work practices,
and inspection methods
S2 Section 15 – Heated Chemical
Baths
▪ Use SEMI S3 to assess “heated chemical baths”
S3 title is now “Safety Guideline for Process Liquid Heating Systems”
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S2 Section 16 – Ergonomics and
Human Factors
▪ Conform to SEMI S8
Summary of SEMI S8 Supplier Ergonomic Success Criteria (SESC)
1 Manual Material Handling
Assess any parts > 10 lbs or > 5lbs & lifted 1x/5min
2 Product Loading in a
JDEC trays, magazines, reticle cassettes…not wafers.
Standing Posture
3 Wafer Cassette Loading
Load port dimensions
4 Work in Process Storage
Wafer cassette shelves
5 Manual Wafer Cassette
Section 3 limits hand rotations to 10°
Rotation Device Design
6 Handle Design
Specs & force limits for various handle types
7 Maintainability and
Lighting & dimensions for various working postures
Serviceability
8 Display Location
Video display parameters
9 Hand Control Location
Operation & maintenance (not service) Height and reach
based on frequency of use
10 Workstation Design
Seated & standing body fit, control locations
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S2 Section 17 - Hazardous Energy
Isolation
▪ Sub-assembly isolation may be provided for sub-assembly work (instead
of total tool isolation)
▪ Manuals should identify hazardous
energies and how to
Shut down
Isolate
Affix Lock
Verify
Restore
▪ Isolation devices should be readily accessible
and only lockable only in the de-energized
(“off”) position
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S2 Section 18 – Mechanical Design
▪ Stable during shipping, installation and operating. 10° Tilt test
for unanchored equipment
▪ Provide guards for
hazardous moving parts
▪ Consider fatigue, aging,
corrosion and abrasion
▪ Ensure possible rupture
fragments will be contained
▪ Pipes & tubing designed with
‘appropriate’ safety factor
▪ Excessive temperatures “Cold” = -10° C
“Hot” varies with material.
Max Temp C
Polymer Ceramic Metal
Parts that might be touched.
95
80
65
Parts held for < 5s in normal use.
85
70
60
Parts held continuously in normal use.
60
56
51
Accessible Parts
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S2 Section 19 – Seismic Protection
▪ Control risks resulting from seismic events
(it may not be feasible to eliminate them)
▪ Make safety critical parts accessible for assessing damage
▪ Design equipment and anchorage
points to withstand…
▪ Clearly identify
the location of
anchorage
points
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Equip w/ HPMs
Equip w/o HPMs
Horizontal loading of Horizontal loading of
94% of weight
63% of weight
85% of weight is available to resist
overturning
▪ Provide in user documents
dimensions and weight of each module
drawing of equipment
location and type of feet
weight distribution on each foot
location of CG in each module
acceptable anchorage points
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S2 Section 20 – Automated Material
Handlers
▪ Scope: ►Substrate Handlers ►Industrial Robots
►Unmanned Transport Vehicles (UTVs)
▪ For general devices and substrate handlers, provide personnel
safeguarding based on a hazard assessment
▪ Asses Industrial Robots to
an appropriate standard
(e.g., ANSI/RIA 15.06)
▪ For UTVs (both floor and space traveling) provide
Collision avoidance
Interlocks to ensure a secure load
Unsafe conditions detection
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S2 Section 21 – Environmental
Considerations
▪ To the extent practicable do not use Ozone Depleting Substances
or Perflourocarbons
▪ Facilitate decommissioning and disposal (See SEMI S12)
▪ Consider conservation
Re-use or recycle (H2O & chemicals)
Reduce flows (e.g., when idle)
Minimize service,
maintenance and
packaging materials
▪ Prevent unintended releases;
110% secondary containment & leak sensors
Access to inspect and remove spills
Ref
Means to check fill levels
Appendix 3
Accept shut off signal from remote monitor
▪ For effluents, wastes and emissions…
Prevent hazardous mixtures
Make point of use collection accessible
Consider point of use abatement
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S2 Section 22 – Exhaust Ventilation
▪ Design exhaust interlock alarms
to be capable of interfacing with
the user facility.
▪ Per Appendix 2 exhaust for a gas box
must dilute flammables below 25% of LEL
▪ Optimize exhaust flow. Target pressure: -0.1 in. H2O
(-1.0 in H2O for pump exhaust)
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Supplemental control
Secondary Control
▪ Provide exhaust
interlocks for equipment
handling HPM’s
Primary Control
▪ Exhaust systems
should be assessed
per Appendix 2 and
SEMI S6.
S2 Section 23 – Chemicals
▪ Create an inventory of chemicals and identify them
as HPM or ODOROUS or IRRITANT
▪ Perform a hazard analysis which addresses potential
Mixing of incompatibles
Routine emissions
Maintenance emissions
Ref
Appendix 3
Failure points (e.g., fittings, pumps)
▪ Label hazardous gas
enclosure doors
▪ Exposure Limit Criteria
Scenario
Criteria
Normal Operation
1% of OEL
Maintenance
25% of OEL
Equipment Failure
25% of OEL
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▪ Appendix 2 also addresses
some chemical leak limits.
S2 Section 24 – Ionizing
Radiation
▪ Limits
2 μS/hr
10 μS/hr
normal operation
maintenance & service
x - ray
 - ray
As Low As
Reasonably
Achievable
▪ Prevent access to radioactive materials.
▪ Minimize need to remove shielding.
▪ Conduct a tool radiation survey per Appendix 4,
at tool surface or closest approach to source.
▪ Provide a phone number and address for radiation safety
support personnel
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S2 Section 25 – Non-ionizing
Radiation & Fields
▪ Appendix 5, contains test methods and limits for operation and
service/maintenance scenarios for various frequency regimes
3 kHz 100 MHz
Pacemaker Warning
levels 0 Hz - 3 kHz
0 Hz
Electric & Magnetic Fields
▪ Direct values
for induced &
contact current
1nm 700nm 400nm
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IR
1 Hz 300 MHz
50/60 Hz
▪ 20% of the
ACGIH values for
Irradiance and
Radiance (1996)
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Power Density
0.3 – 300 GHz
400nm
180nm
UV
▪ Direct values and 20%
of the IEEE C95.1-1991
values for ‘controlled’ &
‘uncontrolled’ access
▪ 20% of the IEEE
C95.1-1991 values
▪ Direct values
for Irradiance
S2 Section 26 – Lasers
▪ Design the equipment to be no greater than laser class 2
(higher class lasers may be incorporated)
▪ Label product w/ laser class
(usually not required for class 1)
▪ Provide the end user
certain laser data
including…
Energy/Power
Temporal Mode
Pulse Rep Rate
Pulse Duration
Pulse Waveform
Physical Location
Description of laser hazards
Administrative controls for safety
during maintenance & service
Necessary PPE
▪ Have proof of laser certification, and justification if
engineering controls are not used to protect personnel
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S2 Section 27 – Sound Pressure
Level
360°
1m
1.5 m
3.5 m
▪ Limits: 80 dBA continuous
120 dB impulse
1.2 m
Ambient
▪ Correction to determine object noise when
object + ambient noise is measured.
If (A + O) – A = X
Then O = (A+O) – Y
For X = 3 4 5 6 7 8 9 10 dBA
Y= 3.0 2.5 1.7 1.3 1.0 0.8 0.6 0.4 dBA
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Object
S2 Section 28 and RI’s
28 – Related Documents
Reference material with no impact on assessment
Related Information
1 Equipment/Product Safety Program
2 Additional Standards That May Be Helpful
3 Hazard Labels
12 Light Tower Color and
4 EMO Reach Considerations
Audible Alert Codes
5 Seismic Protection
13 Surface Temperature
6 Continuous Hazardous Gas Detection
Documentation
7 Documentation of Ionizing Radiation
14 Recommendations for
FECS Design
8 Documentation of Non-ionizing Radiation
9 Laser Checklist
10 Laser Certification Requirements by Region of Use
11 Other Requirements by Region of Use
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