Transcript Intro and VXI - VTI Instruments

VXI Overview
A Proven High Performance Instrument Architecture
VXIbus (VMEbus Extensions for Instrumentation) (IEEE-STD-1155)
Developed in 1987 to provide a standard modular open industry
arc hitec ture for instrumentation.
Intended to provide:
 High-density platform through shared resourc es
 Prec ise tim ing c oordination between instrum ents
 Longer system support through m ulti-vendor solutions
 Capability to address high-perform anc e requirem ents
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VXIbus Basics
A VXIbus system or subsystem c onsists of a mainframe, VXIbus
devic es, a slot 0 c ard, resourc e manager, and host c ontroller.
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VXIbus Devices:
Typic ally message-based or register-based devic es
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VXIbus Mainframe:
Houses the VXIbus devic es (4,5,6 and 13 slot mainframes)
Contains the power and c ooling mec hanism
Contains the c ommunic ation bac kplane
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Slot 0 Interface:
Bac kplane management and (Shared) System Cloc k sourc es
Arbitration
Remote c ontrol through various c omm interfac es
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Resource Manager:
Configures the modules for proper operation at
power-up and reset
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Host Controller:
Controls the operations of the ATE system and environment
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Specification Overview
Electrical
The VXIbus specifies has two primary backplane connectors (P1
and P2). The P1 connector, (mandatory in VME or VXIbus), carries
the data transfer bus. The P2 connector, expands the data transfer
bus to a full 32-bit size, and adds:
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Four additional power supply voltages
The loc al bus
Analog sumbus
TTL and ECL trigger buses
10 MHz differential ECL c loc k signal
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Specification Overview
P1
P2
16-bit data VMEbus
24-bit addressing
+ 5, + /-12 Volts
32-bit data VMEbus
10 MHz c loc k bus
Analog sumbus
12-pin local bus
TTL/ECL trigger buses
-5.2, -2, + /-24 Volts
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P1
B Size
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C Size
Industry’s most common and widely
supported modular footprint is the Csize card
P2
P2
Spacing
C Size
23.3 x 34 cm
(9.2 x 13.4 in.)
3 cm
(1.2 in.)
B Size (VME)
23.3 x 16 cm
(9.2 x 6.3 in.)
2 cm
(0.8 in.)
4
C-size cards allow for the addition of
EMC/EMI shielding
P1
Size
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Mec hanic al
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One unique logical address (ULA) per
VXIbus device, allowing for 256 ULAs in
a single VXIbus system
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Other platforms (i.e. M-modules, PMC,
PXI, VME) can be accommodated
through the use of adapters
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Specification Overview
P1
P2
Volts Qty Pins
P1
P1
GND
8
+ 5V
3
+ 12V
1
-12V
1
Volts Qty Pins
P2
P2
GND
18
+ 5V
4
+ 12V
-12V
+ 24V
1
-24V
1
-5.2V
5
-2V
2
Power
P1
15W
12W
12W
Power
P2
20W
24W
24W
26W
4W
Power
P1& P2
35W
12W
12W
24W
24W
26W
4W
Power & Cooling
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The VXIbus mainframe is spec ified for power delivered.
Eac h power supply has a peak DC c urrent delivery
and peak-to-peak dynamic c urrent delivery.
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By c alc ulating the total power and c urrent of modules within
the system, the total system power c an be determined.
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The VXIbus mainframe spec ifies worst-c ase pressure drops
vs. airflow rate through a single slot.
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Eac h instrument must spec ify airflow and bac k pressure
required (normally for a 10oC rise in temperature). System
c ooling c an be determined by plotting on a mainframe graph.
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Optimize mainframe for c ooling/power. Remember that more c ooling
extends c omponent life.
1.5 litres/sec
0.2 mm H20
for 10o rise
H20
(mm)
6
Per slot airflow (litres/sec)
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Specification Overview
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Power & Cooling
Power - VXI added power supplies
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+5 V DC - Main power source for most VXI Instruments
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+/- 12 V DC - Used for powering analog devices,
communications interfaces
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+/- 24 V DC - Used for powering analog signal sources (20V
into hi Z) plus +/- 15 V regulators\
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-5.2 V DC - For ECL devices
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-2 V DC - Used for the termination of ECL loads
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+5 V DC STDBY - Standby for memory / power lost
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Specification Overview
EMI/EMC
The VXIbus spec ifies radiated and c onduc ted EMC
limits for both generation and susc eptibility. This ensures
that modules c ontaining sensitive elec tronic c irc uits perform to
expec tations without interferenc e from any other module
operating in the system.
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Communicating with the VXIbus Instruments
3F
Hardware Communications:
Device Dependent
Registers
VXI Configuration Space
 External c omputer to VXIbus c hassis interfac e:
GPIB/VXI, MXI2/VXI, USB 2.0/VXI, Firewire/VXI, LAN/VXI, etc .
PC-platform and OS independent
 Embedded c omputer:
Resides in the slot 0, generally PC-based
· Upper 16 kB of
A16 space reserv ed f or
VXI conf iguration space
· 64 B per dev ice
· 8-bit logical address
specif ies base
address f or each dev ice
· 256 dev ices per VXI
sy stem
Two main ways to communicate with a VXIbus device:
20
1E
1C
1A
18
16
14
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
12
10
0E
0C
0A
08
A32 Pointer
A24 Pointer
Data Low
Data High
Response/Data Extended
Protocol/Signal
06
04
02
00
Off set
Status/Control
Device Type
ID Register
Reserved by VXIbus
Specif ication
Configuration Registers
Required f or all VXI
Devices
 Message-based devices
The message-based devic e has a Word Serial Protoc ol to allow
ASCII-level c ommunic ations. SCPI builds upon this.
 Register-based devices
The register-based devic e c ommunic ates only through register
reads and writes. Configuration is c ontrolled by VXIbus-defined
c onfiguration registers but programmed through devic e dependent
registers.
VXI plug&play drivers use the VISA protocol to provide an API that is
communications agnostic.
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Communication Registers
Required f or VXI
Message-based Devices
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Software
Controlling a VXIbus Instrument
Software Model
Windows OS
Operating System
Controlling a printer
Windows OS
LabView/CVI/Vee/Visual Basic/C++
Application Development
Environment
Microsoft Word
VXIbus Instrument PnP Driver
Software Driver
Epson Printer Driver
VISA
Hardware Driver
BIOS (parallel port control)
VXI Slot 0 Interface
Hardware Interface
Parallel Port
VXIbus Instrument
Device to Control
Epson Printer
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Using the Trigger Bus
•
TTL0 – DMM measure complete, close next relay channel
•
TTL1 – Relay has settled, initiate DMM measurement
Application
TTL
0
TTL
1
• Highly deterministic asynchronous handshaking significantly reduces test time by removing
any dependency on host controller to manage the switch/measure sequencing
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Connectors
Mec hanic al
• 1.2” Center spacing permits use of larger components, and more robust,
ergonomically friendly connectors
6
x 6 RF matrix (18 GHz) in two slots
(20)
SPST 30 A relays in one slot
(144)
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2-wire crosspoint, 2 A switched relays in ½ slot
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Larger Components = Robust Designs
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Flexible Remote Control
The VXIbus c an attribute its longevity in part to its ability to adapt to
newer c ommunic ation bus arc hitec tures for remote c ontrol without
affec ting bac kward c ompatibility.
PCI-VXI
USB 2.0-VXI
PCIe-VXI
GPIB-VXI
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IEEE1394-VXI
LXI-VXI
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A Platform that Unites
 VXI adapts many platforms via c arriers in a single mainframe
 Can eliminate need for multiple mainframes within a system
VM
E
PXI
VXI
VXI
PXI
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Module within a module platform
The VXIbus spec ific ation permits multiple ‘sub-modules’.
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Eac h c an be treated as an independent instrument with disc rete
logic al address.
Enables very high-density, flexible system
6.5
Digit DMM
200 MHz Dual Channel Counter/Timer
50 MSa/s AWG
6
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unique functions in two slots
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(8) SPDT, 20 A
Dual 1 x 24, 1000 V Mux
5
- 2V
SMP1200
(10) channel SP4T, 1.3 GHz
12 channel SPDT, 16 A
5U
12 x 12, 2 A 2-wire 300 V matrix
12 x 12, 2 A 2-wire 300 V matrix
80 channel SPST, 2 A
Prototyping/Breadboard
VM2710A
VM2616
6.5 Digit DMM
16-ch. 100kSa/s digitizer
VM2164
2
VT4101A
3
+5V
-5.2V
4
VOLTAGE MONITOR
-24V
+24V
+12V
-12V
+5V STBY
VXIbus Capability in Small Footprint
VM9000
200Mhz 2-ch C/T
VM3618
VM3640A
16-ch. level detector
8-ch. isolated DAC
50MSa/s AWG
EX2500A
0
LXI Class A – VXI bridge interface
0
1
1
VM4016
SYSTEM DEFINITION, 6-slot VXI Mainframe (5U)
Host Communication Interface, LXI-VXI bridge
16 channel 100 V threshold detector/interrupter
8 channels, independent, isolated DAC, 32 V dc/0 – 20 mA
50 MSa/s Arbitrary Waveform/Function Generator
6.5 Digit DMM
16 channel 16-bit independent 100 kSa/s ADC (40 V)
Dual Channel 200 MHz Counter/Timer
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(80) SPST, 300 V/2 A relays
Prototyping breadboard
12 x 24, 300 V/2 A matrix (two modules)
(10) SP4T 50 Ohm Coaxial Trees, 1.3 GHz
(12) SPDT, 16 A, 300 W dc relays
(8) SPDT, 20 A, 600 W dc relays
(2) 1 x 24 1000 V multiplexers
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Interfacing DUTs to VXI Instrumentation
A Test Receiver…
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Brings all of the instrument and switching I/O out to
a common interface panel
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ICA= Interface Connector Assembly
Or
Receiver
Permits use of multiple adapters to map into the I/O
of a unit being tested
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ITA= Interface Test Adapter
Or
ID = Interface Device
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When to use a receiver
When using a common tester to test…
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Multiple products
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Multiple assembly levels of the same product
 Assembled unit vs. PCB
 LRU vs. SRU in military terms
To minimize failures of instrument contacts
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Reduces wear/tear directly on instrument

Receiver contacts have higher insertion counts/easier to repair
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When a receiver is not needed
Single-Purpose Test Systems may not require a
Receiver
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Dedicated connectors on VXI
chassis
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Dedicated connectors on
external panel
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Direct Connect or Hinged
Direct Connect shortens cables, reduces capacitance, path
resistance
Hinged Assembly provides service loop
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VXI Bus Consortium 2008
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VXIbus Consortium owns, develops and promotes the VXI
standard
New Officers, Exec. Director, and members in last two years
Working on advances to the VXI Specification
 VXI 4.0 Technical Working Group
Four pillars of VXI messaging
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Well Conceived – Created by leading test and measurement companies,
the VXI bus is a well defined and open industry standard.
Established – With a 21 year history of success, VXI has established itself
as the most prevalent modular instrumentation bus.
Time Tested – VXI is the de-facto standard for applications that have long
life cycle requirements. The VXI bus provides system designers the
security of knowing that their test platform will outlive the device it was
originally designed to test.
Thriving – As significant investment in the new development on the
platform continues, VXI is thriving. Its flexibility allows VXI to play a key role
in hybrid systems that also PXI, LXI, and GPIB components.
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VXI Bus Consortium 2008
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Marketing Promotion of the VXI standard
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Website re-design and content renewal in last two years
(www.vxibus.org)
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VXI Newsletter
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VXI Panel at AUTOTESTCON 2008:
• VXI Current and Future Panel – 1:15-3:00 PM – Wed., Sept. 10th
– Moderator
• Bob Helsel, Executive Director –
VXIbus Consortium, PXI Systems Alliance, LXI Consortium
• Director of Services - IVI Foundation
– Panelists
• Charles Greenberg, Technical Working Group Co-Chair, VXIbus
Consortium (EADS)
• Fred Bloennigen, Bustec – representing Torsten Rissel, Technical
Working Group Co-Chair, VXIbus Consortium (Bustec)
• Tom Sarfi, President, VXIbus Consortium (VXI Technology, Inc.)
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VXI is alive and well!
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Promotion of >20 new VXI products in the last two years
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VXI Bus Consortium Officers
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President:
• Tom Sarfi, VXI Technology
Technical Working Group Co-Chairs:
• Charles Greenberg, EADS-NA Defense & Torsten Rissel,
Bustec
Executive Director & Marketing Working Group Chair:
• Bob Helsel, Bode Enterprises, LLC
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The Evolution To VXI 4.0
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Survey results: In January, 2007, the VXIbus consortium
surveyed all consortium members about some proposed
VXI enhancements. Fourteen member companies
responded:
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What Application Spaces Benefit from VXI 4.0?
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Digital Test: Need more power and throughput for today’s
high speed serial and parallel bus architectures
Data Acquisition: Need more cumulative throughput across
the communications bus
RF and Synthetics: Need more power and high speed paths
between measurement and processing blocks
Military Test Systems: New systems like eCASS need
existing VXI features plus hot-swap, more throughput and
power
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The VXI 4.0 Technical Working Group
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Technical Working Group was given the green light by the VXI board to
move forward with 4.0 development.
Agilent Technologies, Bustec, EADS NA, National Instruments and VXI
Technology all approved this motion
More participating companies are encouraged to participate. All have a
stake in the platform’s direction
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The Benefits of the Specification Update
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Protects Your Investments: A newly relevant
specification adds capability to VXI applications while
maintaining backward compatibility with previous
revisions
Provides a Future Path: Most powerful modular
instrument platform…period
Promotes VXI: The bus you can trust for solutions to
DEMANDING electronics test
Produces Solutions: Extends the VXI track record as
the primary test solution when:
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The price of failure is very high
The products that are being tested have a long life cycle
and need a test platform is not prone to obsolescence
Reduced size, open standard, interoperable, fast, and
cost-effective solution required
C-size VXI is the perfect card geometry
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Goals of VXI 4.0
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5-Row Connector
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VITA-41 (VXS)
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Compatible with Legacy VXI
Increases power capability and flexibility
Incorporates 2eSST for 320MB/s parallel transfer
Remain compatible with all Legacy VXI
Increase cumulative throughput to 48 GB/s (GenII)
Compatibility with cPCI, PXI & PXI Express with
simple adapters and VME for DSP/CPU, etc.
Optional VXS Live Insertion Compliance (Hot-Swap)
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VXI 4.0 Summary
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Proposed VXI enhancements would make VXI the
world’s most powerful instrumentation bus for many
years to come
It would be fully backwards compatible with existing
VXI modules
Transparent support for VITA-41 (VME), PXI and PXI
Express modules with no software changes
A high-end packaging solution for military/aerospace
test, high-speed digital, RF, synthetic, and data
acquisition applications
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