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VTS Sputter Roll Coater
VTS’s Sputter Roll Coater
Introduction
VTS’s Web/Roll Systems for the Converting Industry are individually
designed to meet each customer’s specific requirements.
The system presented in this brochure allows the user to develop
a process using state-of-the-art components and then go into
production.
VTS’s multi-process high vacuum Web/Roll Coating system is designed
to coat Polyimide Film, Mylar, foil and other thin plastic or metallic
materials
stored in continuous roll form.
Typical process stations within the high vacuum chamber can include
sputter sources, electron beam guns, thermal sources, substrate heat,
ion beam sources and Plasma Process Bar.
AWC-550 Sputter Roll Coater
Product Information
Technology
By AWC-550, metals will be deposited to one side of the film to form a multi- layer at high rate.
Ion beam source is equipped with gas inlet system for argon and reactive gases.
Equipment Technique
Multi-Chamber-System consisting of chambers for
winding, pretreatment, coating, intermediate pumping
One coating drum to cool the film during
the coating process
Cooling/heating equipment for coating drum
Pump equipment for short pump down with
turbomolecular pumps
Pre-treatment by Ion beam source
Up to four standard DC magnetrons for
metallic sputter processes
Electronically controlled winding system with 3 driving motors
Technical Data
Substrate
Roll diameter
Film Speed
Material
Width
Thickness
Plastic film (PET, PI, etc.)
up to 550 mm
25㎛ to 200㎛
max. 380mm
0.1 to 5 M/min
Linear Ion Beam Source
Product Information
VTS’s Linear Ion Beam Source Features / Benefits
No Filaments or Grids
70
Reactive gas compatible - I.e.100% oxygen Low temperature
60
Operates at Magnetron Pressures(0.1-5mTorr)
50
Size Free
No need for multiple power supplies-hence easy integration
High Energy
High Current Density
Stability of Beam Uniformity
2
Current Density (mA/Cm )
Truly production Worthy-low maintenance,
no consumables, low cost
40
30
20
120 sccm
80 sccm
40 sccm
10
0
0
10
20
30
40
50
60
70
Probe Position (Cm)
Current Density Distribution Profile
DC magnetrons Sputter Source
Product Information
2.2
2.0
VTS’s Linear Sputter Source Features / Benefits
Low temperature
Cu Thickness (㎛/min )
Truly production Worthy-low maintenance, no
consumables, low cost
1.8
Operates at Magnetron Pressures(0.8- 5mTorr)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
Size Free
4
6
8
10
12
14
16
18
20
22
Power (Kw)
High Power compatible
Power vs Deposition Rate
3500
High Deposition Rate
3000
Stability of Coating Uniformity
Cu Thickness (Å)
2500
2000
1500
1000
500
0
0
10
20
30
40
50
Position (Cm)
Position vs Deposition Profile
60
VTS’s Technical Data for FCCL
Copper
Fine Pitch
Polyimide
Film
PRODUCTION PROCESS OF FCCL
Web coating
PI film
Pretreatment
Tie
layer
Deposition
ElectroPlating
Patterning
VTS’s Technical Data for FCCL
Surface Modification of Polyimide film by ATEC’s Linear Ion Beam Source
Surface Energy ( mN/m )
90
80
Wetting angle ( q )
70
60
50
40
Gas A
30
20
Gas B
10
90
Gas C
80
70
Gas B
60
Gas A
50
Gas C
0
0
10
16
10
17
10
18
2
Ion dose ( /cm )
Wetting angle of polyimide with various
Doses by irradiated at ions
40
0
16
10
17
18
10
10
2
Ion Dose ( /cm )
Surface energy of polyimide with various
Doses by irradiated at ions
VTS’s Technical Data for FCCL
Surface Modification of Polyimide by ATEC’s Linear Ion Beam Source
0.9
Adhesion strength ( kg/cm )
60
Wetting angle (q)
Gas C
0.8
80
Low Current Density
40
20
0
16
10
17
10
Gas B
0.6
0.5
Gas A
0.4
0.3
0.2
0.1
High Current Density
0
0.7
18
10
0.0
2
Ion Dose (/cm )
Wetting angle of polyimide with different ion
current by irradiated at ions
Adhesion strength with different gases
by irradiated at ions
VTS’s Technical Data for FCCL
XPS Data of modified polyimide film by Ion Beam Source
Schematic drawing of the polymeric repeat unit
of PMDAODA.
Binding Energy (eV)
XPS spectra of O 1s, N 1s, and C 1s from as-received
PMDA-ODA polyimide after peak deconvolution
Binding Energy (eV)
XPS spectra of O 1s, N 1s, and C 1s from PMDA-ODA
polyimide after irradiation by linear ion beam source.
VTS’s Technical Data for FCCL
SAM Data of modified polyimide film by Ion Beam Source
Raw Film
By Gas A + C
By Gas A
By Gas C
VTS’s Technical Data for FCCL
Surface Modification of Polyimide film by Ion Source
0.8
0.8
Peel Strength (Kgf/Cm)
0.6
0.5
High Current Density
Low Current Density
0.4
Peel Strength (Kgf/Cm)
0.7
0.7
Gas C
Gas A
0.6
0.5
0.4
0.3
0.3
0.2
0.2
1E16
1E17
1E16
1E17
2
2
Ion Doses (Dose/Cm )
Peel strength with various doses by
irradiated at ions
Ion Doses (Dose/Cm )
Peel strength with various doses
by irradiated at ions
VTS’s Technical Data for FCCL
Cu Thickness vs Peel Strength
Curing Test (150℃, 168h)
0.35
1.2
Peel Strength (㎏f/㎝ )
Peel Strength (Kgf/Cm)
0.30
0.25
0.20
0.15
0.10
1.0
0.8
0.6
0.4
0.2
0.05
0.0
1E16
1E17
2
Ion Doses (Dose/Cm )
Peel strength with various doses by
irradiated at ions
0
2
4
6
8
10
Cu Thickness (
12
㎛)
14
16
18
20
VTS’s Technical Data for FCCL
Chemical Test
P ee l
S tr e n g th
1. 2
1
2
3
1. 05
4
0. 9
Test Condition
Stress (k gf/c m)
0. 75
Sample Width : 3 ㎜
0. 6
0. 45
0. 3
Sample Position : MD C
Mean : 0.80 kgf/cm
0. 15
PI Thickness
: 38표면
㎛
원자재
0
0
20
40
60
80
10 0
12 0
14 0
15 0
S tro ke (m m )
Normal Temperature
Cu Thickness : 9 ㎛
Peeling mode : vertical(90˚)
P ee l
S tr e n g th
1. 2
1
2
Peeling Speed : 50 ㎜ / min
P ee l
3
1. 05
0. 9
S tr e n g th
1. 2
0. 75
2
3
Stress (k gf/c m)
1. 05
Stress (k gf/c m)
1
0. 6
0. 9
0. 45
0. 75
0. 3
0. 6
0. 15
0. 45
0
Mean : 0. 78 kgf/cm
0
20
40
60
80
10 0
S tro ke (m m )
ByHCL
GasTest
C
0. 3
Mean : 0.79
0. 15
0
0
20
40
kgf/cm
By Gas A + C
KOH Test
60
80
S tro ke (m m )
10 0
12 0
14 0
15 0
12 0
14 0
15 0
Conclusion
VTS’s Web/Roll Systems : State-of-the-art Equipment
VTS’s Linear Ion Beam Source : High Current Density
Stability of Beam Uniformity
Size Free
VTS’s Linear DC Magnetron Sputter Source : High Deposition Rate
Stability of Coating Uniformity
원자재 표면
Size Free By Gas A
Surface Modification of Pl by Gas C Ion : High Surface Energy
Fast Surface Modification
High Peel Strength
Ion Source of High Current Density : High Surface Energy
High Peel Strength
Curing Test : 0.32 kgf/㎝
Chemical Test : 0.78 kgf/㎝
By Gas A + C
By Gas C