Transcript No Slide Title

IPC/JEDEC
INDUSTRY MAPPING
Agenda Item 6.2
4th JIC meeting Regensburg, Germany June 17, 2003
Minimum IPC Standards Tool Kit
Design
2221 Generic
2222 Rigid
2223 Flex
2224 PCMCIA
2225 MCM-L
2226 HDI
2227 Discrete wiring
Materials
SM-840 Solder mask
FD-2231 Flex material
FD-2232 Coated material
MF-150 Copper foil
CF-148 Coated copper foil
CC-830 Conformal coating
SM-817 Adhesive
4101 Rigid materials
4104 HDI materials
Minimum Tool Kit
Performance
6011 Generic
6012 Rigid
6013 Flex
6014 PCMCIA
6015 MCM-L
6016 HDI
6017 Discrete wiring
Component Mounting
7071 Generic
7072 Through-hole
7073 Standard SMT
7074 Fine pitch
7075 Array product
7076 Chip scale
7077 Chip wire bonding
7078 Flip chip
Workmanship
A-600 Printed board
A-610 Printed board assembly
R-700 Modification and repair
Quality Assessment
TM-650 Test methods
SPC 9190
9191 Generic
9192 Base materials
9193Board
9194 Assembly
Attachment
J-STD-001 Soldering requirements
J-STD-002 Solderability testing of parts
J-STD-003 Solderability of boards
J-STD-004 Solder Flux
J-STD-005 Solder paste
J-STD-006 Solid solder
IPC STANDARDS MAP
IPC STANDARDS MAP (cont.)
ASSEMBLY
• J-STD-001
Soldering Electrical and Electronic Assemblies
• IPC-HDBK-001
Handbook & Guide to Supplement J-STD-001
• IPC-9261
In-Process DPMO and Estimated Yield for PWAs
• IPC-7912
Calculation of DPMO & Manufacturing Indices for Printed
Board Assemblies
ACCEPTANCE
• IPC-DRM-40
Through-Hole Solder Joint Evaluation Desk Reference Manual
• IPC-A-610
Acceptability of Electronic Assemblies
• IPC-9191
General Guidelines for Implementation of Statistical Process
Control (SPC)
• IPC-DRM-SMT
Surface Mount Solder Joint Evaluation Desk Reference Manual
SOLDERABILITY
• IPC-WP-001
Soldering Capability White Paper Report
• J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs,
Terminals and Wires
• J-STD-003
Solderability Tests for Printed Boards
• IPC-WP-005
PWB Surface Finishes
• IPC-TR-461
Solderability Evaluation of Thick & Thin Fused Coatings
• IPC-TR-462
Solderability Evaluation of Printed Boards with Protective
Coatings Over Long-Term Storage
SOLDERABILITY (cont.)
• IPC-TR-464
Accelerated Aging for Solderability Evaluations
• IPC-TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
• IPC-TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability
Test Results
• IPC-TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
• IPC-TR-466
Wetting Balance Standard Weight Comparison Test
ADVANCED
•
•
•
•
•
•
•
•
IPC-TR-001
An Introduction to Tape Automated Bonding Fine Pitch Technology
IPC-WP-003
Chip Mounting Technology
J-STD-012
Implementation of Flip Chip and Chip Scale Technology
J-STD-013
Implementation of Ball Grid Array & Other High Density Technology
J-STD-026
Semiconductor Design Standard for Flip Chip Applications
J-STD-028
Performance Standard for Construction of Flip Chip and Chip Scale
Bumps
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
IPC-MC-790
Guidelines for Multichip Module Technology Utilization
WIRE HARNESS
• IPC-WHMA-A-620
Requirements & Acceptance for Cable & Wire
Harness Assemblies
OPTOELECTRONICS
• IPC-0040
Optoelectronic Assembly and Packaging Technology
ASSEMBLY SUPPORT
• SMC-WP-002
Solderability Tests for Component Leads, Terminations, Lugs,
Terminals and Wires
• IPC-DRM-18
Component Identification Desk Reference Manual
• IPC-DW-426
Specification for Assembly of Discrete Wiring
• IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study
• IPC-TA-722
Technology Assessment Handbook on Soldering
• IPC-TA-723
Technology Assessment Handbook on Surface Mounting
• IPC-CM-770
Component Mounting Guidelines for Printed Boards
ASSEMBLY SUPPORT(cont.)
• IPC-SM-780
Component Packaging and Interconnecting with Emphasis on
Surface Mounting
• IPC-SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount
Attachments
• IPC-S-816
SMT Process Guideline & Checklist
• IPC-AJ-820
Assembly & Joining Handbook
• IPC-TP-1115
Selection and Implementation Strategy for A Low-Residue NoClean Process
• IPC-1720
Assembly Qualification Profile
ASSEMBLY SUPPORT(cont.)
• IPC-7095
Design and Assembly Process Implementation for BGA's
• IPC-7525
Stencil Design Guidelines
• IPC-7530
Guidelines for Temperature Profiling for Mass Soldering (Reflow &
Wave) Processes
• IPC-7711
Rework of Electronic Assemblies
• IPC-7721
Repair and Modification of Printed Boards and Electronic Assemblies
• IPC-9701
Performance Test Methods and Qualification Requirements for Surface Mount
Solder Attachments
• IPC-9851
Equipment Interface Specification
ASSEMBLY MATERIALS
FLUX/SOLDER
• J-STD-004
Requirements for Soldering Fluxes
• J-STD-005
Requirements for Soldering Pastes
• J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed
and Non-Fluxed Solid Solders
• IPC-TP-1043
IPC Cleaning and Cleanliness Test Program Phase 3 Water
Soluble Fluxes Part 1
• IPC-TP-1044
IPC Cleaning and Cleanliness Test Program Phase 3 Water
Soluble Fluxes Part 2
ASSEMBLY MATERIALS (cont.)
ADHESIVES
• IPC-SM-817
General Requirements for Dielectric Surface Mounting
Adhesives
• IPC-CA-821
General Requirements for Thermally Conductive Adhesives
• IPC-3406
Guidelines for Electrically Conductive Surface Mount
Adhesives
• IPC-3408
General Requirements for Anisotropically Conductive
Adhesives Films
ASSEMBLY MATERIALS (cont.)
COAT/MASK
• IPC-CC-830
Qualification and Performance of Electrical Insulating
Compound for Printed Wiring Assemblies
• IPC-HDBK-830
Guidelines for Design, Selection and Application of
Conformal Coatings
• IPC-SM-840
Qualification and Performance of Permanent Solder
Mask
PCB / ACCEPTANCE
• IPC-DW-425A
Design and End Product Requirements for Discrete Wiring
Boards
• IPC-QE-605
Printed Board Quality Evaluation Handbook
• IPC-TF-870
Qualification and Performance of Polymer Thick Film Printed
Boards
• IPC-MC-960
Qualification and Performance Specification for Mass
Lamination Panels for Multilayer Printed Boards
• IPC-1710
OEM Standard for Printed Board Manufacturers' Qualification
Profile (MQP)
PCB / ACCEPTANCE (cont.)
• IPC-6011
Generic Performance Specification for Printed Boards
• IPC-6012
Qualification and Performance Specification for Rigid Printed
Boards
• IPC-6013
Qualification & Performance Specification for Flexible Printed
Boards
• IPC-6015
Qualification & Performance Specification for Organic Multichip
Module Mounting and Interconnecting Structures
• IPC-6016
Qualification & Performance Specification for High Density
Interconnect (HDI) Layers or Boards
• IPC-6018
Microwave End Product Board Inspection and Test
PCB / ACCEPTANCE (cont.)
• IPC/JPCA-6202
Performance Guide Manual for Single- and Double-Sided
Flexible Printed Wiring Boards
• IPC/JPCA-6801
Terms & Definitions, Test Methods, and Design Examples for
Build-Up/High Density Interconnect (HDI) Printed Wiring
Boards
• IPC-9191
General Guidelines for Implementation of Statistical Process
Control (SPC)
• IPC-9252
Guidelines and Requirements for Electrical Testing of
Unpopulated Printed Boards
• IPC-A-600
Acceptability of Printed Boards
COMPONENTS
• J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices
• J-STD-032
Performance Standard for Ball Grid Array Balls
• J-STD-033
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
• J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic
Components
COMPONENTS (cont.)
• IPC-9501
PWB Assembly Process Simulation for Evaluation of Electronic
Components
• IPC-9502
PWB Assembly Soldering Process Guideline for Electronic
Components
• IPC-9503
Moisture Sensitivity Classification for Non-IC Components
• IPC-9504
Assembly Process Simulation for Evaluation of Non-IC
Components (Preconditioning Non-IC Components)
CLEANING/ CLEANLINESS
• IPC-SC-60
Post Solder Solvent Cleaning Handbook
• IPC-SA-61
Post Solder Semi-Aqueous Cleaning Handbook
• IPC-AC-62
Aqueous Post Solder Cleaning Handbook
• IPC-CH-65
Guidelines for Cleaning of Printed Boards & Assemblies
• IPC-TR-468
Factors Affecting Insulation Resistance Performance of Printed
Boards
• IPC-TR-476
Electrochemical Migration: Electrically Induced Failures in Printed
Wiring Assemblies
CLEANING/ CLEANLINESS (cont.)
• IPC-TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results
• IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study
• IPC-TR-582
Cleaning & Cleanliness Test Program for: Phase 3-Low Solids
Fluxes & Pastes Processed in Ambient Air
• IPC-TR-583
An In-Depth Look At Ionic Cleanliness Testing
• IPC-SM-839
Pre & Post Solder Mask Application Cleaning Guidelines
• IPC-9201
Surface Insulation Resistance Handbook
LAMINATE
FLEX
• IPC-FC-234
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed
Circuits
• IPC-4202
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
• IPC-4203
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible
Printed Circuitry and Flexible Adhesive Bonding Films
• IPC-4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible
Printed Circuitry
• IPC-4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for
Printed Circuit Boards
LAMINATE (cont.)
RIGID
• IPC-4101
Specifications for Base Materials for Rigid and Multilayer Printed Boards
• IPC-4103
Specification for Base Materials for High Speed/High Frequency Applications
• IPC-1730
Laminator Qualification Profile
HDI
• IPC-DD-135
Qualification Testing for Deposited Organic Interlayer Dielectric Materials
for Multichip Modules
• IPC-4104
Specification for High Density Interconnect (HDI) and Microvia Materials
• IPC-SM-840
Qualification and Performance of Permanent Solder Mask
LAMINATE (cont.)
FOIL
• IPC-CF-148
Resin Coated Metal for Printed Boards
• IPC-CF-152
Composite Metallic Materials Specification for Printed Wiring
Boards
• IPC-1731
Strategic Raw Materials Supplier Qualification Profile
• IPC-4562
Metal Foil for Printed Wiring Applications
FABRICATION
• IPC-DR-570
General Specification for 1/8 inch Diameter Shank Carbide
Drills for Printed Boards
• IPC-DR-572
Drilling Guidelines for Printed Boards
• IPC-OI-645
Standard for Visual Optical Inspection Aids
• IPC-TA-724
Technology Assessment Series on Clean Rooms
• IPC-PE-740
Troubleshooting for Printed Board Manufacture and Assembly
REINFORCEMENT
• IPC-4412
Specification for Finished Fabric Woven from "E" Glass for Printed
Boards
• IPC-SG-141
Specification for Finished Fabric Woven from "S" Glass for Printed
Boards
• IPC-A-142
Specification for Finished Fabric Woven from Aramid for Printed
Boards
• IPC-QF-143
Specification for Finished Fabric Woven from Quartz (Pure Fused
Silica) for Printed Boards
• IPC-1731
Strategic Raw Materials Supplier Qualification Profile
REINFORCEMENT (cont.)
• IPC-4110
Specification and Characterization Methods for Nonwoven
Cellulose Based Paper for Printed Boards
• IPC-4121
Guidelines for Selecting Core Construction for Multilayer Printed
Wiring Board Applications
• IPC-4130
Specification & Characterization Methods for Nonwoven "E" Glass
Mat
• IPC-4411
Specification and Characterization Methods for Non-Woven ParaAramid Reinforcement
ASSEMBLY
• IPC-D-279
Design Guidelines for Reliable Surface Mount Technology
Printed Board Assemblies
• IPC-D-326
Information Requirements for Manufacturing Electronic
Assemblies
• IPC-C-406
Design & Application Guidelines for Surface Mount Applications
Connectors
• IPC-C-408
Design & Application Guidelines for the Use of Solderless
Surface Mount Connectors
• IPC-SM-782
Surface Mount Design & Land Pattern Standard
INTERFACES
• IPC-D-310
Guidelines for Phototool Generation and Measurement Techniques
• IPC-A-311
Process Controls for Phototool Generation and Use
• IPC-D-350
Printed Board Description in Digital Form
• IPC-D-351
Printed Board Drawings in Digital Form
• IPC-D-356
Bare Substrate Electrical Test Data Format
• IPC-D-390
Automated Design Guidelines
INTERFACES
• IPC-2511
Generic Requirements for Implementation of Product Mfg.
Description Data & Transfer Methodology
• IPC-2531
Standard Recipe File Format Specification
• IPC-2541
Generic Requirements for Electronics Manufacturing Shop Floor
Equipment Communication (CAMX)
• IPC-2571
Generic Requirements for Electronics Mfg. Supply Chain
Communication - Product Data eXchange (PDX)
PCB
• SMC-WP-004
Design for Success
• IPC-2252
Design Guide for RF/Microwave Circuit Boards
• IPC-D-317
Design Guidelines for Electronic Packaging Utilizing High
Speed Techniques
• IPC-D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
• IPC-1902
Grid Systems for Printed Circuits
• IPC-2141
Controlled Impedance Circuit Boards & High Speed Logic
Design
PCB (cont.)
•
IPC-2221
Generic Standard on Printed Board Design
•
IPC-2222
Sectional Standard on Rigid Organic Printed Boards
•
IPC-2223
Sectional Design Standard for Flexible Printed Boards
•
IPC-2224
Sectional Standard of Design of PWB for PC Cards
•
IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and
MCM-L Assemblies
•
IPC-2315
Design Guide for High Density Interconnects & Microvias
•
IPC-2615
Printed Board Dimensions and Tolerances
JEDEC: IEC PAS ACTIVITY
• EIA/JESD22-B102C
– 47/1446/PAS IEC 62173 Ed. 1:
– Solderability test method
• JESD22-B106-B
– 47/1447/PAS: IEC 60749-15, Ed. 1:
– Resistance to soldering temperature for through-hole mounted devices
• EIA/JESD-22-B107-A
– 47/1448/PAS: IEC 62175, Ed. 1:
– Marking Permanency
– 47/1629/MCR: Published as part of IEC 60749-9, Ed. 1
• EIA/JESD22-B116
– 47/1449/PAS: IEC 62176, Ed. 1:
– Wire bond shear test method
– 47/1482A/RVD Withdrawal of 47/1449/PAS
JEDEC: IEC PAS ACTIVITY
• JESD22-A110B-B
– 47/1450/PAS: IEC 62177, Ed. 1:
– Highly-accelerated temperature and humidity stress test (HAST)
– 47/1627/MCR Published as part of IEC 60749-4, Ed. 1
• JESD22-A104-A
– 47/1451/PAS: IEC 62178, Ed. 1:
– Temperature cycling
• EIA/JESD22-A114-A
– 47/1452/PAS: IEC 62179, Ed. 1:
– Electrostatic discharge (ESD) sensitivity testing human body model (HBM)
• EIA/JESD22-A115-A
– 47/1453/PAS: IEC 62180, Ed. 1:
– Electrostatic discharge (ESD) sensitivity testing machine model (MM)
JEDEC: IEC PAS ACTIVITY
• JESD78
– 47/1454/PAS: IEC 62181, Ed. 1:
– IC latch-up test
• JESD22-A113-B
– 47/1455/PAS: IEC 62182, Ed. 1:
– Preconditioning of nonhermetic surface mount devices prior to reliability testing
• JESD22-A107-A
– 47/1456/PAS: IEC 62183, Ed. 1:
– Salt atmosphere
– 47/1633/MCR: Published as part of IEC 60749-13, Ed. 1
• JESD22-B105-B
– 47/1457/PAS: IEC 62184, Ed. 1:
– Lead integrity
JEDEC: IEC PAS ACTIVITY
• JESD22-A106-A
– 47/1458/PAS: IEC 62185, Ed. 1:
– Thermal shock
– 47/1631/MCR: Published as part of IEC 60749-11, Ed. 1
• JESD22-B104-A
– 47/1459/PAS: IEC 62186, Ed. 1:
– Mechanical shock
– 47/1630/MCR: Published as part of IEC 60749-10. Ed. 1
• JESD22-B103-A
– 47/1460/PAS: IEC 62187, Ed. 1:
– A vibration, variable frequency
– 47/1632/MCR: Published as part of IEC 60749-12, Ed. 1
• JESD22-A101-B
– 47/1461/PAS: IEC 62161, Ed.1:
– Test method A101-B – Steady state temperature humidity bias life test
– 47/1680/MCR: Published as IEC 60749-5, Ed. 1
JEDEC: IEC PAS ACTIVITY
• JESD22-C101
– 47/1462/PAS: IEC 60749-28, Ed. 1:
– Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing –
Charged device model (CDM)
• JESD22-B101
– 47/1463/PAS: IEC 62163, Ed. 1:
– Test method B101 – External Visual
– 47/1626/MCR: Published as part of IEC 60749-3, Ed. 1
• JEP118
– 47/1464/PAS: IEC 62164, Ed. 1:
– Guidelines for GaAs MMIC and FET life testing
• JEP110
– 47/1465/PAS: IEC 62165, Ed. 1:
– Guidelines for the measurement of thermal resistance of GaAs FETs
• EIA/JESD46-A
– 47/1466/PAS: IEC 62166, Ed. 1:
– Guidelines for user notification of product/process changes by semiconductor
suppliers
JEDEC: IEC PAS ACTIVITY
• EIA/JESD48
– 47/1467/PAS: IEC 62167, Ed. 1:
– Product discontinuance
• JEP 113-B
– 47/1468/PAS: IEC 62168, Ed. 1:
– Symbols and labels for moisture-sensitive devices
• IPC/JEDEC J-STD-033
– 47/1469/PAS: IEC 62169, Ed. 1:
– Standard for handling, packing, shipping and use of moisture/reflow sensitive
surface mount devices
• EIA/JESD59
– 47/1470/PAS: IEC 62170, Ed. 1:
– Bond wire modeling standard
• JEP114
– 47/1471/PAS: IEC 62171, Ed. 1:
– Guidelines for particle impact noise detection (PIND) testing, operator training
and certification
– 47/1681/MCR: Published as 60749-16, Ed. 1
JEDEC: IEC PAS ACTIVITY
• JESD22-A102-B
– 47/1472/PAS: IEC 62172, Ed. 1:
– Accelerated moisture resistance – Unbiased autoclave
• JESD22-A108-A
– 47/1474/PAS: IEC 62189, Ed. 1:
– Bias Life
• J-STD-020A (IPC/JEDEC)
– 47/1475/PAS: IEC 62190, Ed. 1:
– Moisture/reflow sensitivity classification for nonhermetic solid state surface
mount devices
– 47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749,
Amendment 2, Ed. 2 (2001-10) and IEC 60749, Ed. 2.2 (2001-12).
• J-STD-035
– 47/1476/PAS: IEC 62191, Ed. 1:
– Acoustic microscopy for nonhermetic encapsulated electronic components
– 47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749,
Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)
JEDEC: IEC PAS ACTIVITY
• JEP119
– 47/1506/PAS: IEC 62201, Ed. 1:
– A procedure for executing sweat
• EIA/JEP122
– 47/1507/PAS: IEC 62202, Ed. 1:
– Failure mechanisms and models for silicon semiconductor devices
• EIA/JEP128
– 47/1508/PAS: IEC 62203, Ed. 1:
– Guide for standard probe pad sizes and layouts for wafer-level electrical
testing
• EIA/JESD33-A
– 47/1509/PAS: IEC 62204, Ed. 1:
– Measuring and using the temperature coefficient of resistance to determine the
temperature of a metallization line
• JESD-A103-A
– 47/1513/PAS: IEC 60749-6 Ed. 1:
–
–
High temperature storage life
47/1628/MCR: Published as part of IEC 60749-6, Ed. 1
JEDEC: IEC PAS ACTIVITY
• EIA/JESD22-A105-B
– 47/1514/PAS: IEC 62206, Ed. 1:
– Test Method A105-B – Power and temperature cycling
• JESD22-A109
– 47/1515/PAS: IEC 62207, Ed. 1:
– Test Method A109 – Hermeticity
– 47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749,
Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)
• JESD22-A120
– 47/1595/PAS: IEC 62307
– Test Method for the Measurement of Moisture Diffusivity and Water Solubility in
organic Materials Used in Integrated Circuits
• JESD22-A118
– 47/1635/PAS: IEC PAS 62336:
– Accelerated Moisture Resistance – Unbiased HAST
IPC: IEC PAS ACTIVITY
• IPC-EIA/J-STD-012
– IEC/PAS 62084
– Flip chip and chip scale technology implementation
• IPC-EIA/J-STD-013
– IEC/PAS 62085
– Implementation of ball grid array and other high density technology
• IPC-2511
– IEC/PAS 62119
– Generic requirements for implementation of product manufacturing description
data and transfer methodology
• IPC-6202
– IEC/PAS 62123 Ed. 1.0
– Performance guide Manual for single- and double-sided flexible printed wiring
boards
• IPC-4130
– IEC/PAS 62212
– Specification and characterization methods for nonwoven "E" glass mat
IPC: IEC PAS ACTIVITY
• IPC-4411
– IEC/PAS 62213
– Specification and characterization methods for nonwoven paraaramid reinforcement
• IPC-6011
– IEC/PAS 62214
– Generic performance specification for printed boards
• IPC-1710
– IEC/PAS 62158 Ed. 1.0
– Manufacturers qualification profile (MQP)
• IPC-1720
– IEC/PAS 62159 Ed. 1.0
– Assembly qualification profile (AQP)
IPC: IEC PAS ACTIVITY
• IPC-1730
– IEC/PAS 62160 Ed. 1.0
– Laminator qualification profile
• IPC-6013 (with amendment)
– IEC/PAS 62249 /ED, 1,9
– Qualification and performance specification for flexible printed boards
• IPC-6012 (with amendment)
– IEC/PAS 62250
– Qualification and performance specification for rigid printed boards