Transcript Innowacyjne produkty Innowacyjne technologie

Innovative products
Innovative technologies
www.semicon.com.pl
e-mail: [email protected]
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SEMICON Sp. z o.o.
 History:
1987 – foundation of SEMICON Sp. z o.o.
1992 – first signed distribution agreement: LEM
NORMA
1993 – 1996 – next distribution agreement:
Kontakt Chemie, Schurter, MultiContact
1997 – SMT assembly line launch
1998 – launch of an electronics store in Warsaw
(Wolumen)
2003 – implementation of the ISO 9001:2008
quality system
2009 – starting stencils laser cutting service
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SEMICON Sp. z o.o.
 Participation in EU Framework
Programmes:
2004-2007 – project: GreenRose (FP6)
2007-2008 – project: Tele-Ekg (FP6)
2009-2012 – project: Radi-Cal (FP7)
2010-2012 – project: ChipCheck (FP7)
2010-2013 – project: µBGA (FP7)
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SEMICON Sp. z o.o.
 Today:
Currently, the company employs over 50
people including headquarter, production
and shop.
Starting from 1st January 2013 we are
participating in a new national project Innovative advanced surface mount
technology (SMT) printed circuit boards.
Source: STATS ChipPAC
Source: code.google.com
Source: PCB-togo.com
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Certificates



ISO 9001:2008
ISO 14001
AQAP 2110
We only work with companies which
have UL certificates
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SEMICON Sp. z o.o.
- business areas
Distribution:
 Electronic components
 Electronic materials
 Measuring equipment and
accesories
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SEMICON Sp. z o.o.
- business areas
Subcontracting:



PCB assembly (THT, SMT)
Laser cut SMT stencils
manufacturing
Own production of laser modules
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
THT and SMT assembly
 More than 15 years experience in
electronics
 Customer support from design to
production
 Engineering consultancy
 Direct contact to supply chain
 ESD control
 IPC-A-610 trained employees
 Compliance with RoHS
 PCB Design possibilities
 Component supply possibilities
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Production capacity










4 SMT lines
prototypes, small, medium series
PCB size: max. 800 x 510 mm
Components: 01005 - 74 x 74 mm, PoP
PCB thickness: 0.2 mm - 4.0mm, flex PCB
assembly
Pitch: ≥ 0.20 mm
Selective conformal coating possibilities
Glue, solder paste possibilities
AOI inspection, functional tests, test
probes, BGA – X-ray measurements
Hot Bar technologies (flex, LCD)
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Źródło: JUKI Co.
- SMT assembly
Production capacity
- THT assembly
 Manual soldering
 Lead wave soldering
 PB-free wave soldering in
nitrogen
 1.2 mln THT components
monthly/1 shift
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Main customers







Medical
Defence
Automotive
Energoelectronic
Lighting
Telecomm
R&D
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Stencils laser cutting
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Źródło: LPKF Laser & Electronics AG
 High-speed cutting machine LPKF
Stencil Laser G6060
 Frame or frameless stencils
 Accuracy and repeatability: ±2µ
 Material: stainless steel, nickel
 Thickness: up to 600µm (oxygen
cutting)
 Engineering, modifications, e.g. glue
stencils
 Aperture inspection – high resolution
scanner
 Tension inspection
Optoelectronic equipment
manufacturing
 Laser modules

Wavelenghts: 405-850nm

Power input: 0,2 – 500mW

Pointers

Line and cross generators

Customization
 Laser displacement sensors:

Resolution: up to 10µm

Measurement range: up to 200mm

Measurement distance: up to 50m

System includes: laser module and
position detector
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Laser modules
applications







Pointers
Cross-hair pointers
Alarm systems, laser
barriers
Sensors
Positioning systems
Textile industry
Wood processing:





Wood cutting
Stone cutting
Metal cutting
Tire industry
Mining industry
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Miniaturization in
electronics
Passive Components
Source: pl.wikipedia.org
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Source: Amkor Technology, Inc
Miniaturization in
electronics - ICs
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
SMT challenges
 01005 components – paste screenprinting
 QFN, DFN components – lifting effect, voids
 Large and fine pitch BGAs – thermal balance,
voids, „head in pillow” effect
 PoP components – warpage, placing, BGAs
errors
 Large PCB assembly – bow and twist
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
3D package development
Source: Invensas Co
 Second generation: PoPs
Source: Amkor Technology, Inc.
World trends: higher density PoP
 Next generation: TMV PoPs, BVA PoPs
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Source: Amkor Technology, Inc.
 First generation: multi-level structures
PoP – Package on
Package
Why PoP?
Higher speed, lower energy consumption
Memory chips from different vendors
Different types of memory chips: speed, capacity, etc
Separate inspection of processor and memory chips
Lower junction temperatures (at least compared to stacked die)
Source: ElectroIQ





SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
PoP – Package on
Package
Source: Panasonic Co
 PoP stacking assembly options:
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
TMV PoP – Thru Mold Via
Package on Package
®
Source: Amkor Technology, Inc.
Dimension control vias reduces the
distance between the system memory
and the TMV after their assembly.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
TMV PoP – Thru Mold Via
Package on Package
®
 Improved warpage control and bottom package thickness.
 High density stacked (memory) interface.
 Increased die to package size ratio. TMV can provide over a
30% increase in maximum die size.
 Improved board level reliability.
 Improved fine pitch SMT process window.
 Supports Wirebond, flip chip devices (both area array solder
and fine pitch CuPillar), stacked die and passive components
integration.TMV could also be applied to FlipStack® (combo
FC+WB) and FC w/ TSV stacks.
Source: IMAPS.
Why TMV PoP?
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
BVA PoP – Bond Via Array
Package on Package
™
Why BVA PoP?
 The increase in the number of
connections to the logic
circuits from 300 to over 1000.
 Reduction of PoP total
thickness (lower than TMV
PoP).
Source: Invensas Co
Reducing the pitch (up to 0.2mm) of the
processor through wire leads increases the
number of possible connections in the POP
system.
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
BVA PoP – Bond Via Array
Package on Package
™
Copper wires, height of 400µm
pitch of 240µm.
Source: Invensas Co
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Perspectives for PoP
solutions
What
next?
Source: Gartner, Inc
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl
Thank you for attention!
Piotr Ciszewski
e-mail: [email protected]
www.semicon.com.pl
SEMICON Sp. z o.o. ul. Zwoleńska 43/43a, 04-761 Warszawa; tel. 22 615 64 31, 22 615 83 81; www.semicon.com.pl