Transcript Flynn-Power Electronics - The University of Texas at Austin
2012 Advisory Panel
Power Electronics Mark Flynn Center for Electromechanics The University of Texas at Austin 12/4/2012
Outline
• • • • •
Introduction Recent/current work Capabilities Vision for future Summary
Introduction
• • •
Power electronics is
multi-disciplinary
–
Semiconductors, circuit theory, electromagnetics, control theory, software, machines, simulation, signal processing, power systems, thermal, structural Power electronics is
rapidly developing
Success requires
– –
Wide breadth of personnel capabilities Equally wide support infrastructure
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Vision/leadership to invest in strategic development of personnel and infrastructure capabilities
Introduction
•
Innovation
and
customization
are what separate power electronics R&D from commercially available solutions
–
Electrical (e.g. power, voltage, topology)
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Controls (very end user specific)
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Packaging (e.g. size, cooling, application)
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Cost
Challenge – Maturing an Emergent CEM Core Technology
• • • • • •
CEM excels in power electronics innovation and customization Traditionally power electronics at CEM
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Ad hoc, supporting role rather than core technology
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Exception: controllers Recent growth in power-electronics-support of sponsors
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Smart technologies
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Higher efficiencies Targeted, concurrent growth of CEM facilities capabilities in P.E.
Prompted natural transition of P.E. to Center-wide focus Proper development of P.E. into core technology is key challenge
Outline
• • • • •
Introduction Recent/current work Capabilities Vision for future Summary
What we have done and are doing in the area
• •
Sampling of recent power electronics projects Highlighted active projects
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Silicon Carbide Switch Development
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2 MW ARCP Soft Switching Converter
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60 kW Bidirectional DC-DC Converter
Sampling of Recent Power Electronics Projects Multiphase, Bidirectional DC-DC Converter Algal Cell Lyser Pressure Tolerant Subsea Inverter
Sampling of Recent Power Electronics Projects ARCP Soft-Switching Converter Bidirectional, Solid State Marx Generator DC Inline Fault Generator
Sampling of Recent Power Electronics Projects 5.6 kV, 3-Level Inverter Silicon Carbide Switch Development Motor Controllers
SiC SGTO Switch Development and Failure Investigation
ARL SGTO Pulse Test Results Polyimide Damage ANSYS Conduction Current Coupled Simulations Thermal Imaging Experiments EMAP3D Semiconductor Physics Simulations SiC Device Design Improvements 11
2 MW ARCP Soft-Switching Converter
2MW “ARCP” converter (Auxiliary Resonant Commutated Pole) 10 kW tabletop test-bed converter with advanced ARCP topology
Soft-Switching Research at CEM
• • • • •
Largest (2MW) ARCP converter in the world, to the best of our knowledge A new, modified technology is under investigation via a 10 kW test prototype The 2MW converter to be upgraded to new technology Full characterization of prototype is expected by Spring 2013 Upgrade of 2 MW unit to start in Summer 2013
60 kW 3-Phase Bidirectional DC-DC Converter
High-Performance Controller
Max and Min Inductor Current vs. Inductance V Hi = 750 V, f s = 3 kHz, P batt = -40 kW -50 -100 -150 150 100 41 0 50 0 22 0 41 0 220 Imax Imin 410 220 410 220 410 220 -200 200 400 600 800 1000 1200 Inductance ( H) 1400 1600 1800 2000 V IN 220 – 410 V V OUT 700 – 850 V > 97 % Efficient < 0.2 % ripple
Outline
• • • • •
Introduction Recent/current work Capabilities Vision for future Summary
Define the CEM Niche
• • • •
Analysis and Design: Electrical, Thermal, Magnetic, Structural Solid modeling Controllers Fabrication
Detailed Electrical Simulations
IGBT Model Diode Model
Thermal Analysis of Complete Systems
Magnetic Analysis
Compute stray inductances
Stress Analysis of Bus Bar
Stress concentrations result in 26 ksi VM stress Deflection due to load
Solid Modeling Capabilities
• • •
Optimize electrical performance Optimize thermal management Optimize ergonomics
Solid Model Assembly Real World Hardware
Embedded Controllers
• • • • • •
Customized to demand Circuit design, capture PCB layout, assembly SMT, TH soldering Software, controls Numerous licenses to partners Controller
Verified Pressure Tolerant Controller
• • •
Monitors 2 IGBT junction temperatures in real-time Tested to 4200 psi hydrostatic pressure 16-bit processor
Outline
• • • • •
Introduction Recent/current work Capabilities Vision for future Summary
How we Plan to Develop this Field
• • • • •
Vision for CEM and power electronics Who might our partners be Near term steps to achieve the vision Key challenges Longer term considerations
Vision for CEM and Power Electronics
• •
To achieve and maintain a high level of expertise in the design, construction, and operation of all aspects of power electronic assemblies Offer development, integration, and testing of power-electronic/electromechanical systems with world-class competency
Who Might our Partners be
• • • • • • • • • •
ARL Coda Energy, Inc.
Cree EE/ME departments General Electric Giant Magellan Telescope Horstman U.S. Air Force U.S. Navy Vycon, Inc.
Near term Steps to Achieve the Vision – Market vs. Competencies
• •
Examine and respond to market demand
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Understand present market requirements
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Identify upcoming technologies
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Maintain forward looking business model Identify desired CEM competencies
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Basic power electronic topologies: ac/dc, dc/dc, single pulse, dc/ac, etc.
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Enabling agents: controllers, software, analysis, assembly, etc.
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Capacity range: power levels: W to MW, voltage range: V to kV, etc.
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Etc.
Near term Steps to Achieve the Vision – Personnel and Facilities
• •
Match desired competencies to personnel
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Identify where resources are lacking
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Develop master plan to invest in training of personnel
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Establish metrics for on-going personnel development
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Hire personnel in needed areas as required/have funding Match desired competencies to facility
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Identify where resources are lacking/aging
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Develop plan to invest acquiring/maintaining equipment
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Establish metrics for training personnel on equipment
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Purchase/upgrade equipment in areas as needed
Near term Steps to Achieve the Vision – Methodology 1 of 2
• • •
Capture and employ CEM’s intellectual property
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Designs produced should be recorded and taught to targeted personnel as part of continuing education
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Develop CEM-standard designs/methods where possible
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CEM-standard controller is in development
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No need to re-invent converters for each project Eliminate unnecessary diversity in techniques
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Wasteful of time and sponsor funds
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Reduces benefit of Center-wide expertise Eliminate fiefdoms
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Leverage Center experts
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Adhere to strategic plan for developing personnel
Near term Steps to Achieve the Vision – Methodology 2 of 2
• •
Prepare timeline for execution of vision
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Compare employee/facility development to plan
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Commit to investing in personnel and facilities Leverage growth opportunities via projects
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Match potential employee development opportunities afforded by a given project to the master plan
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Require projects to grow Center capabilities along the direction of the master plan to the extent possible
Key Challenges
• •
Internal
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Tangible and implementable vision required
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Time/funds for personnel development
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Eliminate waste/increase Center collaboration
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Facilities improvements
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Power electronics not a traditional Center focus External/Marketing
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Reputation as world class player must be grown
Key Challenges – Attracting and Maintaining Sponsors
Expertise Presentation Reputation Client Entry
Longer term Considerations
• • • • •
Update and maintain vision according to market demands Commit to personnel and facilities investments Establish and verify metrics regularly Take on projects with a Center-wide focus
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Center leaders should pursue projects in cooperation to meet the demands of the master plan to achieve the vision desired
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Each project should permit extraction of some means of advancing the master plan Establish leadership positions to maintain accountability
Outline
• • • • •
Introduction Recent/current work Capabilities Vision for future Summary
Summary
• • •
Importance of power electronics
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Sponsors demand ever-capable and efficient solutions
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CEM seeks to leverage power electronics capabilities Strengths
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Technical skills: design, analysis, fabrication
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Intellectual property: internal libraries/designs
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Facilities: service power, supplies, tools Challenges
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Managing growth and direction of new department