Chapter 6 Test Compression - IC

Download Report

Transcript Chapter 6 Test Compression - IC

Chapter 6
Test Compression
EE141
VLSI
Test Principles and Architectures
1
Ch. 6 - Test Compression – P. 1
What is this chapter about?
Introduce the basic concepts of test data
compression
 Focus on stimulus compression and response
compaction techniques
 Present and discuss commercial tools on test
compression

EE141
VLSI
Test Principles and Architectures
2
Ch. 6 - Test Compression – P. 2
Test Compression
 Introduction
 Test
Stimulus Compression
 Test Response Compaction
 Industry Practices
 Concluding Remarks
EE141
VLSI
Test Principles and Architectures
3
Ch. 6 - Test Compression – P. 3
Introduction

Why do we need test compression?
 Test data volume
 Test time
 Test pins

Why can we compress test data?
 Deterministic test vector has “don’t care” (X’s)
EE141
VLSI
Test Principles and Architectures
4
Ch. 6 - Test Compression – P. 4
Test data volume v.s. gate count
Volume of test data (Gb)
70
60
50
40
30
20
Test data volume
increases with circuit size
10
0
1
2
4
8
16
32
Gate count (Mg)
64
(Source: Blyler, Wireless System Design, 2001)
EE141
VLSI
Test Principles and Architectures
5
Ch. 6 - Test Compression – P. 5
Test compression categories
 Test
Stimulus Compression
 Code-based schemes
 Linear-decompression-based schemes
 Broadcast-scan-based schemes
 Test
Response Compaction
 Space compaction
 Time compaction
 Mixed time and space compaction
EE141
VLSI
Test Principles and Architectures
6
Ch. 6 - Test Compression – P. 6
Architecture for test compression
Response
Stimulus
EE141
VLSI
Test Principles and Architectures
Core
Compactor
Low-Cost
ATE
Decompressor
Compressed
Stimulus
Compacted
Response
7
Ch. 6 - Test Compression – P. 7
Test stimulus compression
Code-based schemes
 Linear-decompression-based schemes
 Broadcast-scan-based schemes

EE141
VLSI
Test Principles and Architectures
8
Ch. 6 - Test Compression – P. 8
Test stimulus compression

Code-based schemes




Dictionary code (fixed-to-fixed)
Huffman code (fixed-to-variable)
Run-length code (variable-to-fixed)
Golomb code (variable-to-variable)
EE141
VLSI
Test Principles and Architectures
9
Ch. 6 - Test Compression – P. 9
Code-based schemes

Dictionary code (fixed-to-fixed)
EE141
VLSI
Test Principles and Architectures
10
Ch. 6 - Test Compression – P. 10
Code-based schemes

Huffman code (fixed-to-variable)
EE141
VLSI
Test Principles and Architectures
11
Ch. 6 - Test Compression – P. 11
Code-based schemes

Huffman code (fixed-to-variable)
EE141
VLSI
Test Principles and Architectures
12
Ch. 6 - Test Compression – P. 12
Code-based schemes

Run-length code (variable-to-fixed)
EE141
VLSI
Test Principles and Architectures
13
Ch. 6 - Test Compression – P. 13
Code-based schemes

Golomb code (variable-to-variable)
EE141
VLSI
Test Principles and Architectures
14
Ch. 6 - Test Compression – P. 14
Code-based schemes

Golomb code (variable-to-variable)
EE141
VLSI
Test Principles and Architectures
15
Ch. 6 - Test Compression – P. 15
Test stimulus compression

Linear-decompression-based schemes




Combinational linear decompressors
Fixed-length sequential linear decompressors
Variable-length sequential linear decompressors
Combined linear and nonlinear decompressors
EE141
VLSI
Test Principles and Architectures
16
Ch. 6 - Test Compression – P. 16
Linear-decompression-based schemes
EE141
VLSI
Test Principles and Architectures
17
Ch. 6 - Test Compression – P. 17
Linear-decompression-based schemes
EE141
VLSI
Test Principles and Architectures
18
Ch. 6 - Test Compression – P. 18
Linear-decompression-based schemes
EE141
VLSI
Test Principles and Architectures
19
Ch. 6 - Test Compression – P. 19
Linear-decompression-based schemes

Combinational linear decompressors
XOR
Network
XOR Network
MISR
EE141
VLSI
Test Principles and Architectures
20
Ch. 6 - Test Compression – P. 20
XOR network: a 3-to-5 example
s1 s2 s3
o1 o2
EE141
VLSI
Test Principles and Architectures
o3
o4
o5
21
Ch. 6 - Test Compression – P. 21
Linear-decompression-based schemes

Fixed-length sequential linear decompressors
EE141
VLSI
Test Principles and Architectures
22
Ch. 6 - Test Compression – P. 22
Linear-decompression-based schemes

Variable-length sequential linear decompressors
 Can vary the number of free variables
 Better encoding efficiency
 More control logic and control information
EE141
VLSI
Test Principles and Architectures
23
Ch. 6 - Test Compression – P. 23
Linear-decompression-based schemes

Combined linear and nonlinear decompressors
 Specified bits tend to be highly correlated
 Combine linear and nonlinear decompression together
can achieve greater compression than either alone
EE141
VLSI
Test Principles and Architectures
24
Ch. 6 - Test Compression – P. 24
Test stimulus compression

Broadcast-scan-based schemes





Broadcast scan
Illinois scan
Multiple-input broadcast scan
Reconfigurable broadcast scan
Virtual scan
EE141
VLSI
Test Principles and Architectures
25
Ch. 6 - Test Compression – P. 25
Broadcast-scan-based schemes

Broadcast scan
EE141
VLSI
Test Principles and Architectures
26
Ch. 6 - Test Compression – P. 26
Generate patterns for broadcast scan
 Force ATPG tool to generate patterns for
broadcast scan
EE141
VLSI
Test Principles and Architectures
27
Ch. 6 - Test Compression – P. 27
Broadcast scan for a pipelined circuit
 Broadcast scan for a pipelined circuit
EE141
VLSI
Test Principles and Architectures
28
Ch. 6 - Test Compression – P. 28
Broadcast-scan-based schemes

Illinois scan architecture
(a) Broadcast mode
(b) Serial chain mode
EE141
VLSI
Test Principles and Architectures
29
Ch. 6 - Test Compression – P. 29
Broadcast-scan-based schemes

Reconfigurable broadcast scan
 Reduce the number of channels that are required
 Static reconfiguration
– The reconfiguration can only be done when a new
pattern is to be applied
 Dynamic reconfiguration
– The configuration can be changed while scanning in a
pattern
EE141
VLSI
Test Principles and Architectures
30
Ch. 6 - Test Compression – P. 30
Broadcast-scan-based schemes
 First configuration is: 1->{2,3,6}, 2->{7}, 3->{5,8}, 4->{1,4}
 Other configuration is: 1->{1,6}, 2->{2,4}, 3->{3,5,7,8}
EE141
VLSI
Test Principles and Architectures
31
Ch. 6 - Test Compression – P. 31
Broadcast-scan-based schemes
 Block diagram of MUX network
EE141
VLSI
Test Principles and Architectures
32
Ch. 6 - Test Compression – P. 32
Broadcast-scan-based schemes

Virtual scan
 Pure MUX and XOR networks are allowed
 No need to solve linear equations
 Dynamic compaction can be effectively utilized
during the ATPG process
 Very little or no fault coverage loss
EE141
VLSI
Test Principles and Architectures
33
Ch. 6 - Test Compression – P. 33
Test response compaction
Space compaction
 Time compaction
 Mixed time and space compaction

EE141
VLSI
Test Principles and Architectures
34
Ch. 6 - Test Compression – P. 34
Test response compaction
EE141
VLSI
Test Principles and Architectures
35
Ch. 6 - Test Compression – P. 35
Taxonomy of various response compaction schemes
Compaction Schemes
I
Space
Zero-aliasing Compactor
[Chakrabarty 1998] [Pouya 1998]

Parity Tree [Karpovsky 1987]

Enhanced Parity Tree [Sinanoglu 2003]

X-Compact [Mitra 2004]

q-Compactor [Han 2003]

Convolutional Compactor [Rajski 2005]
II
Time
CFS
III
CFI
Linearity
















OPMISR [Barnhart 2002]




Block Compactor [Wang 2003]




i-Compact [Patel 2003]



Compactor for SA [Wohl 2001]



Scalable Selector [Wohl 2004]

EE141
VLSI
Test Principles and Architectures

Nonlinearity


36
Ch. 6 - Test Compression – P. 36
Test response compaction

Space compaction





Zero-aliasing linear compaction
X-compact
X-blocking
X-masking
X-impact
EE141
VLSI
Test Principles and Architectures
37
Ch. 6 - Test Compression – P. 37
Space compaction

Zero-aliasing linear compaction
EE141
VLSI
Test Principles and Architectures
38
Ch. 6 - Test Compression – P. 38
An example of response graph
EE141
VLSI
Test Principles and Architectures
39
Ch. 6 - Test Compression – P. 39
Space compaction

X-compact
 X-tolerant response compaction technique
 X-compact matrix
 Error masking
EE141
VLSI
Test Principles and Architectures
40
Ch. 6 - Test Compression – P. 40
Space compaction

X-compact
EE141
VLSI
Test Principles and Architectures
41
Ch. 6 - Test Compression – P. 41
Space compaction

X-compactor with 8 inputs and 5 outputs
EE141
VLSI
Test Principles and Architectures
42
Ch. 6 - Test Compression – P. 42
X-compact Matrix
SC1
SC2
SC3
SC4
S= SC5
SC6
SC7
SC8
O1
O2
O= O3
O4
O5
M
EE141
VLSI
Test Principles and Architectures
T
X S = O
43
Ch. 6 - Test Compression – P. 43
Space compaction

X-blocking (or X-bounding)
 X’s can be blocked before reaching the response
compactor
 Can ensure that no X’s will be observed
 May result in fault coverage loss
 Add area overhead and may impact delay
EE141
VLSI
Test Principles and Architectures
44
Ch. 6 - Test Compression – P. 44
Space compaction
 Illustration of the x-blocking scheme
EE141
VLSI
Test Principles and Architectures
45
Ch. 6 - Test Compression – P. 45
Space compaction

X-masking
 X’s can be masked off right before the response
compactor
 Mask data is required to indicate when the
masking should take place
 Mask date can be compressed
– Possible compression techniques are weighted pseudorandom LFSR reseeding or run-length encoding
EE141
VLSI
Test Principles and Architectures
46
Ch. 6 - Test Compression – P. 46
Space compaction
 An example of X-masking circuit
EE141
VLSI
Test Principles and Architectures
47
Ch. 6 - Test Compression – P. 47
Space compaction

X-impact
 Simply use ATPG to algorithmically handle the
impact of residual x’s on the space compactor
 Without adding any extra circuitry
EE141
VLSI
Test Principles and Architectures
48
Ch. 6 - Test Compression – P. 48
Space compaction

Handling of X-impact
EE141
VLSI
Test Principles and Architectures
49
Ch. 6 - Test Compression – P. 49
Space compaction

Handling of aliasing
EE141
VLSI
Test Principles and Architectures
50
Ch. 6 - Test Compression – P. 50
Test response compaction

Time compaction
 A time compactor uses sequential logic to
compact test responses
 MISR is most widely adopted
 n-stage MISR can be described by specifying a
characteristic polynomial of degree n
EE141
VLSI
Test Principles and Architectures
51
Ch. 6 - Test Compression – P. 51
Multiple-input signature register (MISR)
EE141
VLSI
Test Principles and Architectures
52
Ch. 6 - Test Compression – P. 52
Test response compaction

Mixed time and space compaction
EE141
VLSI
Test Principles and Architectures
53
Ch. 6 - Test Compression – P. 53
Industry practices
OPMISR+
 Embedded Deterministic Test
 Virtual Scan and UltraScan
 Adaptive Scan
 ETCompression

EE141
VLSI
Test Principles and Architectures
54
Ch. 6 - Test Compression – P. 54
Industry solutions categories

Linear-decompression-based schemes
 Two steps
– ETCompression, LogicVision
– TestKompress, Mentor Graphics
– SOCBIST, Synopsys

Broadcast-scan-based schemes
 Single step
– SPMISR+, Cadence
– VirtualScan and UltraScan, SynTest
– DFT MAX, Synopsys
EE141
VLSI
Test Principles and Architectures
55
Ch. 6 - Test Compression – P. 55
Industry practices

OPMISR+
 Cadence
 Roots in IBM ‘s logic BIST and ATPG technology
EE141
VLSI
Test Principles and Architectures
56
Ch. 6 - Test Compression – P. 56
General scan architecture for OPMISR+
EE141
VLSI
Test Principles and Architectures
57
Ch. 6 - Test Compression – P. 57
Industry practices

Embedded Deterministic Test (TestKompress)
 Mentor Graphics
 First commercially available on-chip test
compression product
EE141
VLSI
Test Principles and Architectures
58
Ch. 6 - Test Compression – P. 58
EDT (TestKompression) architecture
EE141
VLSI
Test Principles and Architectures
59
Ch. 6 - Test Compression – P. 59
TestKompress stimuli compression
EE141
VLSI
Test Principles and Architectures
60
Ch. 6 - Test Compression – P. 60
TestKompress response compaction
EE141
VLSI
Test Principles and Architectures
61
Ch. 6 - Test Compression – P. 61
Industry practices

Virtual Scan and UltraScan
 SynTest
 First commercial product based on the broadcast
scan scheme using combinational logic for pattern
decompression
EE141
VLSI
Test Principles and Architectures
62
Ch. 6 - Test Compression – P. 62
VirtualScan architecture
EE141
VLSI
Test Principles and Architectures
63
Ch. 6 - Test Compression – P. 63
UltraScan architecture
EE141
VLSI
Test Principles and Architectures
64
Ch. 6 - Test Compression – P. 64
Industry practices

Adaptive Scan
 Synopsys
 Designed to be the next generation scan
architecture
EE141
VLSI
Test Principles and Architectures
65
Ch. 6 - Test Compression – P. 65
Adaptive scan architecture
EE141
VLSI
Test Principles and Architectures
66
Ch. 6 - Test Compression – P. 66
Industry practices

ETCompression
 LogicVision
 Built upon embedded logic test (ELT) technology
EE141
VLSI
Test Principles and Architectures
67
Ch. 6 - Test Compression – P. 67
ETCompression architecture
EE141
VLSI
Test Principles and Architectures
68
Ch. 6 - Test Compression – P. 68
Summary of industry practices
MISR: multiple-input signature register
MUX: multiplexers
PRPG: pseudo-random pattern generator
TDDM: time-division demultiplexer
TDM: time-division multiplexers
XOR: exclusive-OR
EE141
VLSI
Test Principles and Architectures
69
Ch. 6 - Test Compression – P. 69
Concluding remarks

Test compression is
 An effective method for reducing test data volume
and test application time with relatively small cost
 An effective test structure for embedded hard
cores
 Easy to implement and capable of producing
high-quality tests
 Successfully as part of design flow

Need to unify different compression
architectures
EE141
VLSI
Test Principles and Architectures
70
Ch. 6 - Test Compression – P. 70