Transcript Portable Audio – Customer Review

HT SUMMARY SLIDES
TI High Temperature Products
High Temperature
Two HT Product Types
• High Temperature (HT) 200°C parts
• -55°C to +210°C - 1000 hours
• Ceramic & KGD packaging
• 175°C Plastic Parts
• -55°C to +175°C operation
• Plastic surface mount packaging
 Complete High-Temp (HT)
signal-chain solutions for
harsh environments
 Unique Die and Packaging
optimized for HT
 Thermal shut-down removal
 HT products offerings:
 HT Plastic -55C to 175C
 HT Ceramic -55C to
210+C
The are 3 areas TI has developed expertise to
guarantee reliability on our released HT products
•
•
 HT Die -55C to 210+C
•
Initial qualification of process, package and silicon
across temperature
Silicon, Package Material set and Process
modifications
On-going production quality monitors
TI Enhanced Industrial Packaging
Complete signal chain solutions
Smallest
Footprint
Widest Package
Type Options
Ruggedized
Packages
Hermetic
Packages
Up to 150°C Plastic
Packaging
Up to 175°C Plastic
Packaging
• Smallest size
• Ruggedized Applications
• Ruggedized Applications
• Extreme Applications
• Most Integration
• Enhanced Qualification
• Enhanced Qualification
• HT Qualification
• Multiple options
• Extended Temperature
• Extended Temperature
• Extended Temperature
• 25°C tested wafers to
• Up to -55°C to 150°C
• Up to -55°C to 175°C
• Up to -55°C to 210°C
• -55°C to 210°C Known Good
• Multiple Package types
• Multiple Package types
• Multiple Package types
• Special High Temperature
• Most rugged hermetic
Material Sets
material option
Bare Die/Wafers
Solutions
Die (KGD)
• Broad portfolio
Up to 210°C Ceramic
Packaging
High Temperature Offering
Interface
Down Hole
Signals
Signal
Conditioning
Temperature
Pressure
Position
Speed
Flow
OPA2333-HT
OPA211-HT
INA129-HT
INA333-HT
INA271-HT
THS4521-HT
OPA820-HT
A to D
ADS1278-HT
ADS1282-HT
ADS1243-HT
ADS8320-HT
ADS8509-HT
ADS6142-HT
Resistivity
Memory
Rock Density
SM28VLT32-HT
SN65HVD233-HT
SN65HVD11-HT
SN65HVD1040-HT
ISO7221-HT
DSP/MCU
Power
TPS76901-HT
TPS62000-HT
TPS62110-HT
TPS40200-HT
TPS40210-HT
TPS50301-HT
TPS7H1201-HT
TPS54363-HT
REF5025-HT
SM470R1B1M-HT
SM320F2812-HT
SM320F28335-HT
MSP430F2619-HT
OMAPL137-HT
Legend
150/175C Plastic
210C Ceramic/KGD
TI High Temperature Products
HT Webpage: http://www.ti.com/ht
TI HiRel Contact:
Mont Taylor
[email protected]
(903) 868-6316
Comments/Feedback
Please Visit : www.ti.com/ht
Full TI High Temperature
Products Presentation
7
HiRel Business Segments
Enhanced Products
Space
High Temperature
Bare Die
 Commercial-of-the-shelf
(COTS) plastic solution for
long life-cycle applications
 Complete signal chain
solution for Space
environments
 Complete High-Temp (HT)
signal-chain solutions for
harsh environments
 Ability to support complete
signal chain solutions in die
form
 Controlled baseline,
traceability
 QMLV-certified wafer fabs
 Unique Die and Packaging
optimized for HT
 Full Known-good die (KGD)
for military, space and high
temp applications
 Extended Product Change
Notification (PCN)
 Extended Temperature (-55C
to 125C)
 Additional test coverage and
characterization
 RHA certification
 Radiation hardening IP
 TID/SEE testing on products
 Thermal shut-down removal
 HT products offerings:
 HT Plastic -55C to 175C
 HT Ceramic -55C to
210+C
 HT Die -55C to 210+C
 Tested die (TD) for
commercial applications
 Wafer support and small
quantity waffle pack support
TI HiRel Advantage
Commitment
• 30+ years of experience working with HiRel customers
• Largest dedicated organization in the industry
• Worldwide sales and support infrastructure
Leading-edge technology and manufacturing
• HiRel approved fabs (certified by Defense &
Aerospace standards)
• Access to latest process technologies (HPA07, BiCom, etc.)
• Broad packaging capabilities
As short as
9 months
As long as
30 years
Product
Consumer
Life Cycle
HiRel Products
Life Cycle
Intro
Growt
h
Maturity
Declin
e
Phase
Out
Extended product life cycles
Longevity
Assured
• Obsolescence mitigation
• Supply beyond commercial availability
• Product resurrection
Market expertise
• Baseline control and qualification per unique
market requirements: TID, SEU, high-temp,
ceramic, QML –Q/V, EP, die solutions, etc.
High temperature and harsh environments
markets
Down hole
Avionics
• Drilling
• Logging
• Well monitoring
Medical
• Autoclave
• Sterilization
• Jet Engines
• Brakes
Heavy Industrial
Geothermal
• Chemical
Processing
• Sensors
• Actuation/
Control
• Drilling
• Well
monitoring
Market requirements
• Ruggedized packages
• Small size
• Low power
• Qualified operation >150°C
10
TI HiRel High Temperature Products
Two HT Product Types
• High Temperature (HT) 200°C parts
• -55°C to +210°C - 1000 hours
• Ceramic & KGD packaging
• 175°C Plastic Parts
• -55°C to +175°C operation
• Plastic surface mount packaging
11
HT Reliability
• There are 3 areas TI has developed expertise to
guarantee reliability on our released HT products
1. Initial qualification of process, package and silicon
across temperature
2. Silicon, Material set and Process modifications
3. On-going production quality monitors
Parametric Characterization done for each
HT Release
• Functionality
•
•
•
•
AC and DC Parametrics
Speed / Performance
Leakages & Power Analysis
IO Peripheral timing / performance
Operational Mode Idd in mA vs. T emp
340
330
320
310
300
Vmin in Volts Core DSP 150Mhz vs. T emp in DegC
290
1.9
280
270
1.8
260
1.7
250
240
1.6
Mean
StdDev
Min
Max
Q3
Q1
1.5
25
249.3034
4.0199
243.8160
255.9840
252.8040
246.4630
125
254.0111
3.4564
248.9640
258.9500
257.2870
251.6250
160
259.4265
4.2324
253.4000
266.4850
262.3755
256.1458
185
265.0004
3.7693
260.4060
270.3570
267.6970
261.5813
220
279.1381
4.9385
273.5630
287.7660
281.8740
274.8520
250
296.3656
23.7235
259.7050
339.9770
306.9300
280.7270
1.4
1.3
1.2
Mean
StdDev
Min
Max
Q3
Q1
25
1.5000
0.0000
1.5000
1.5000
1.5000
1.5000
125
1.5333
0.0500
1.5000
1.6000
1.6000
1.5000
160
1.5778
0.0667
1.5000
1.7000
1.6000
1.5000
185
1.6111
0.0333
1.6000
1.7000
1.6000
1.6000
220
1.6111
0.0333
1.6000
1.7000
1.6000
1.6000
250
1.6750
0.0707
1.6000
1.8000
1.7000
1.6000
13
High Temperature 210°C Quality and
Reliability
These qualification tests are typically preformed for each new 210°C HT
Ceramic product release
• Package Qualification
–
–
–
–
Bond Strength
Die Attach Strength
Mechanical Shock (1.5K g)
Constant acceleration (30K g)
–
–
–
–
Variable Frequency Vibration (20 g peak 20Hz to 2KHz)
Temperature Cycle (-65°C/+150°C 1000 cycles)
Hermetic test (Fine and Gross Leak)
Thermal Shock (-65°C/+150°C 100 cycles)
• Technology Verification
–
Electromigration Design Rule Verification
–
–
–
Voltage Box Characterization
Negative Bias Temperature Instability Rules Verification
Operational Characterization (from three lots)
• Life Test (1000Hours/200°C)
–
–
–
–
By technology node (function, wafer fabrication process, and feature size)
2,000 hours at 200°C, 1000 hours to release
Static (e.g., Analog) or Dynamic (e.g. DSP/MCU)
Sample size is 15 units minimum (3 lots) with no failures
14
New Leadform Packages
8-pin Ceramic FP
84-pin Ceramic QFP
Leadformed Releases
ADS8320SHKQ
Released
OPA2333SHKQ
Released
SN65HVD1040SHKQ
Released
OPA211SHKQ
Released
REF5025SHKQ
Released
INA271SHKQ
Released
INA129SHKQ
Released
TPS76901SHKQ
Released
SN65HVD233SHKQ
Released
INA333SHKQ
Released
THS4521SHKQ
Released
SN65HVD11SHKQ
Released
ADS1278SHKP
Released
SM470R1B1MHKPS
Released
175°C Plastic Packages
• There are several ways TI provides a ruggedized
plastic package for our 175C offerings
• We have a different material set than the
commercial/industrial devices to improve reliability
at temperature
• Special leadframe, mold compounds, and die attach to
withstand the stresses from CTE mismatch
• Special bonding wires and processes to minimize Kirkendall
voiding causing degraded bond strength
17
Differences in Flows
Commercial IC Flow
- Cost Driven
EP Flow
- Quality Driven
HT Plastic Flow
- Quality and Temp Driven
Wafer
Fab
Wafer
Fab
Wafer
Fab
One Wafer
Fab
One Wafer
Fab/HT Die
AT Site
AT Site
AT Site
AT Site
AT Site
Material
Set
Material
Set
Material
Set
Material Set
HT
Material Set
Commercial products can be built in multiple
FABs, AT sites and may use various
material sets for each product build
EP products are built
in one FAB, one AT site and
use one material set for product build
HT products are built
in one FAB, one AT site and
use one material set optimized for HT
175°C Plastic Package Qualification
The following high temperature plastic package qualification
test sequence is required for each pin/package and die
technology combination in addition to the EP standard
qualification requirements. Data can be combined from
different device types from the same pin/package and die
technology.
• Preconditioning (surface mount packages)
• HTSL (Bake): 2000 hours at TA = TJ, where TJ is the maximum
recommended operating temperature for the device type
• Temperature Cycle: 500 cycles at -65°C to +150°C
• Electrical Test: per datasheet at +125°C minimum with additional pin-to-pin
leakage testing.
• CSAM: 5 units/lot
• TSAM (PowerPad packages only): 5 units/lot
• Bond Pull: 5 units/lot - 15 wires/device
• Bond Shear: 5 units/lot - 15 bonds/device
• Cross section: 1 unit/lot - 1 bond/unit or 1 bump/pad
19
HT Plastic Qualification
Commercial plastic failing HT Qual
• Delamination
• Bond degradation
CSAM
Before
After
Bond Cross Section
Initial
X-Ray
Bond Pull
175°C Plastic Package Summary
• TI HT Plastic parts use special leadframes, mold
compounds, die attach, and bonding
• We have a material set different from the
commercial/industrial devices to improve reliability
at temperature
• Special leadframe, mold compounds, and die attach to
withstand the stresses from CTE mismatch
• Special bonding wires and pad processes to mimimize
Kirkendall voiding causing degraded bond strength
21
High Temperature Wafer Lot Qualification
• New qualification test performed on each HT wafer lot
• 45 units from every wafer lot used for HT products will be
subjected to:
– 210C burn in for 240 hours then,
– End point electrical testing at operating temperature of -55C t o
210C
– Requirement for all to pass standard HT tests
– Allows any parametric drifts to be observed
• Requirement for all new HT products beginning in 2Q’12.
• Allows HiRel to keep a tight monitor on all HT products to
control process variations that might affect performance
across temperature.
22
High Temperature Products
DC/DC
Controller
Power
FET
Point Of
Load
Power
HT Advantage & Qual
Voltage
Reference
Precision
Op-Amp
Analog to
Digital
Converter
Processor
Communication
Interface
H.E.A.T. EVM
Flash
Memory
Power
Driver
Digital To
Analog
Converter
Precision
Op-Amp
Power
FETs
or BJTs
TI HT Roadmap
High Temperature Qualified Data Converters
ADS1282-HT
Resolution (Bits)
ADS1243-HT
High Resolution ΔΣ,
250SPS to 4KSPS ADC
Octal Low Power
24-bit ΔΣ ADC
24
210
210
ADS1278-HT
Octal Simult. Sampling
24-bit, 128KSPS ΔΣ
175
DIE
DIE
210
175
DIE
PFLC
ADS8509-HT
16-bit 250kHz CMOS ADC
16
175
ADS8320-HT
16-bit 2.7V to 5V
µ-Power Sampling ADC
175
210
DIE
14
ADS6142-HT
PFLC
14-bit, 65 MSPS ADC w/
selectable outputs
210
DIE
175
DAC
Released
210
175
DIE
PFLC
210 °C Ceramic
175 °C Plastic
Die
Pre-formed lead ceramic
<1
Development
Planned
4K
100K
128K
250K
Sample Rate (SPS)
65M
High Temperature Qualified Instrumentation Amplifiers
INA271-HT
Voltage Output Wide
Common-Mode
Shunt Monitor
Input Offset (µV)
10K
210
DIE
PFLC
INA128-HT
Low Power Wide-Supply
Instrumentation Amp
50
210
25
210
175
DIE
PFLC
175
210 °C Ceramic
175 °C Plastic
Die
Pre-formed lead ceramic
130
INA333-HT
Released
Low Power Single Supply
Instrumentation Amp
Development
210
DIE
Planned
PFLC
200
500
Bandwidth (kHz) for G=100
1,000
High Temperature
Temperature Qualified
Qualified Amplifiers
Amplifiers
High
LM95172
13 to 16-bit Digital
Temperature
Sensor
Temperature
Sensors
210
THS4521-HT
Single-Channel
Rail-to-Rail Output
Differential Amp
Differential
Amplifiers
Standard
Op-Amps
210
175
DIE
PFLC
OPA2333-HT
OPA211-HT
Very Low Power
Zero-Drift Series
1.1nV/√Hz
45MHz +/-10V
210
175
210
150
DIE
PFLC
DIE
PFLC
OPA820-HT
Unity-Gain Low-Noise
Voltage Feedback
Op-Amp
210
DIE
PFLC
Released
210
175
DIE
PFLC
210 °C Ceramic
175 °C Plastic
Die
Pre-formed lead ceramic
Development
Planned
High Temperature
Qualified
High Temperature
Qualified
PowerAmplifiers
Management
DC/DC
Controllers
TPS40200-HT
Wide Input, Low-pin
Buck Controller
210
175
DIE
PFLC
TPS40210-HT
4.5 to 52V Input
Current-Mode
Boost Controller
210
DIE
LM5116WG-HT
Wide Range 100V
Synchronous
Buck Controller
210
DIE
DRV8332-HT
Motor
Driver
Voltage
References
Motor
Driver
DIE
210
175
REF5025-HT
2.5V Precision
Voltage Reference
210
DIE
PFLC
DC-DC POL
Converter
TPS62110-HT
Adjustable,
Step-Down Converter
TPS50301-HT
3Amp, 3V to 7V
Step-Down SWIFT
DC/DC Converter
210
175
TPS54362-HT
1Amp, 48V Step-Down
SWIFT DC/DC
Converter
175
Released
LDO
TPS76901-HT
TPS7H1201-HT
Single-Output 100mA
Adjustable LDO
Single-Output 500mA
Adjustable LDO
210
175
DIE
PFLC
210
210
175
DIE
DIE
PFLC
210 °C Ceramic
175 °C Plastic
Die
Pre-formed lead ceramic
Development
Planned
High Temperature
Qualified
Amplifiers
High Temperature
Qualified
Processors
and Memory
Embedded
Controllers
MSP430-HT
16-bit Ultra Low Power
MCU
SM470R1B1M-HT
SM320F2812-HT
Digital Signal Controller
ARM 7 Microcontroller
Digital Signal Controller
210
150
DIE
DIE
Embedded
Processors
SM320F28335-HT
150
210
150
220
DIE
PFLC
DIE
OMAPL137-HT
C674x DSP + ARM9
Processor
175
DIE
SM28VLT32-HT
Memory
4MByte FLASH Storage
Device Memory
210
DIE
Released
PFLC
Development
Planned
Temperature
Qualified
Amplifiers
HighHigh
Temperature
Qualified
Interface
Products
SN65HVD233-HT
CAN
CAN Transceiver
with Diagnostic
Functions
SN65HVD1040-HT
Low-Power CAN
Transceiver with
BUS Wake-Up
210
175
210
DIE
PFLC
DIE
PFLC
ISO7221C-HT
Isolators
Dual High-Speed Digital
Isolator
175
SN65HVD11-HT
RS485
3,.3V RS485 Single HalfDuplex Transceiver
210
175
DIE
PFLC
Released
Development
Planned
Introducing the H.E.A.T. EVM
Harsh Environment Acquisition
Terminal (H.E.A.T.) EVM
Features and benefits
• Full high-temperature data acquisition system utilizing TI’s
comprehensive signal-chain product portfolio
• Eight Analog Input Channels
–
–
Six channels optimized for temperature, pressure sensors
and accelerometers
Two general-purpose channels (fully differential and
single-ended)
• Comprehensive set of TI components qualified for
–
–
Operating temperatures from -55ºC to 210ºC
Minimum 1,000 hours operating life
• Board is made with polyimide material, and incorporating
high-temperature rated passive components and solder
materials
• EVM is test oven ready and can withstand temperatures up
to 200°C for 200 operating hours.
H.E.A.T. EVM high-temperature components
• SM470R1B1M-HT –
ARM7 microcontroller
• OPA2333-HT – low power zerodrift series operational amplifier
• REF5025-HT – 2.5V
precision voltage reference
• ADS1278-HT – octal
simultaneous sampling
24- bit 128KSPS ADC
• INA333-HT – zero drift, low
power, single supply
instrumentation amplifier
• SN65HVD233-HT – CAN
transceiver
• OPA211-HT – low-noise
operational amplifier
• THS4521-HT – low-power fully
differential amplifier
• SN65HVD11-HT – RS485
transceiver
New HT Design Support for 2013
• H.E.A.T. Power Reference Design
– Demonstrating TI HT power solutions
– Sequencing
• TPS50301-HT POL Evaluation Board
– Standard temperature board and evaluation
– Spot for TPS7H1201-HT LDO when available
• HT FLASH EVM
• Generic HT Op Amp Board
PowerHEAT EVM w/ Voltage Sequencing
Sequencing Timing Diagram
•
•
•
•
•
•
Output Voltages:
3.3V uP
3.3V Adc ( Analog)
1.8V uP
1.8V Adc (Analog)
5.0V Adc (Analog)
+3.3V uP
POR
120msec
1.8V uP
1.8V Adc
TPS7H1201-HT
+5V Analog
Switched
+5V Analog
500 usec
+1.8V @ 250mA
+5V @ 250mA
+5V Analog
TPS40200-HT
Bias Voltage
Vin = 6V - 52V
Reverse
Bias
Protection
Generator
TPS40200-HT
Input Current
sense
Buck
+5V Bus
Input
Filter
INA271-HT
3.3V @ 100mA
3.3V uP
Buck Converter
Converter
+3.3V Adc
uP power
TPS40200-HT
Input
Filter
3.3V @ 100mA
3.3V Analog
Buck Converter
Sequencing logic
(using REF5025-HT
& OPA211-HT)
Analog Power
TPS40200-HT
Input
Filter
TPS76901-HT
Buck Converter
LDO
uP power
uP power
500 usec
1.8V @ 50mA
1.8V uP
+5.0V Adc
TPS50301-HT
Input
Filter
Buck Converter
1.8V @ 200mA
1.8V Analog
Analog Power
TPS40210-HT
6V Input
Input
Filter
-+8V @ 20mA
Boost
Converter
Input Current Sense signal
120msec
HIGH TEMP POL EVM
Optional
TPS7H1201-HT
+1.8V @ 250mA
LDO
PVin = 1.6V - 6.3V
TPS50301-HT
Buck Converter
Iout Max = 3A
With External Overload Protection
Vin = 3V - 6.3V
2.5V @ 3A
Generic HT Op Amp Board
• Unpopulated HT board for oven evaluations
• Options for multiple configurations
4MB HT Flash EVM Board
• Simple HT board allowing oven testing of 14-pin
ceramic package
TI High Temperature Products
HT Webpage: http://www.ti.com/ht
TI HiRel Contact:
Mont Taylor
[email protected]
(903) 868-6316
Comments/Feedback
Please Visit : www.ti.com/ht
HT PRODUCT ONE PAGE
OVERVIEW SLIDES
ADS1278-HT
Released
Octal Simultaneous Sampling 24-Bit 128KSPS ADC
• Simultaneous Sampling of 8 inputs up to
•
128KSPS Data Rate @ 103 dB SNR
Low-Power: 52 kSPS, 57 mW/ch
SPI or Frame-Sync Serial Interface
AC Performance:
• -96 dB THD
• 101 dB SNR (High Resolution Mode)
Linear Phase Digital Filter
Modulator Output Option (digital filter
bypass)
ENOB = 16.9 bits at 210C
•
•
•
•
•
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
•
•
•
•
•
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Selectable Operating Modes:
Mode
Data Rate
SNR
Power Diss.
High Speed
128kSPS
96dB
985mW
High Resolution
52kSPS
101dB
985mW
Low Power
52kSPS
97dB
455mW
Low Speed
10kSPS
98dB
120mW
• -55°C to +175°C (64-pin Plastic QFP (PAP) – 1Q13
• -55°C to +210°C (84-pin Ceramic QFP (HFQ) & KGD)
• -55°C to +210°C (4Ceramic Lead-formed FP (HKP))
ADS1282-HT
Released
Ultra-High Performance ΔΣ ADC with Low-Noise PGA
• Extremely High Resolution
• 122-dB SNR (250 SPS, High-Res. Mode)
• 119-dB SNR (250 SPS, Low-Power Mode)
• Ultra-Linear – THD: –101 dB, INL: 0.5ppm
• Flexible Data Rate: 250SPS to 4KSPS
• Onboard High Performance Digital Filter:
• SINC + FIR + IIR (selectable)
• Linear or Minimum Phase
• 0.5Hz to 7.5Hz High Pass
• Filter Bypass Mode
• Low Power: 56.1 mW (High-Res. Mode) and
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
AVDD
VREF
DVDD
46.1 mW (Low-Power Mode)
ADS1282
MUX
•
•
•
•
•
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
CLK
SYNC
PWDN
RESET
In1
PGA
In2
1 to 64
4th order
∆Σ
Mod.
Programmable
Digital Filter
& Calibration
SPI
3
Serial
Interface
I/O
Mod. Out
Over-Range
AVSS
• -55°C to +175°C (28-pin Plastic TSSOP (PW)) – Released
• -55°C to +210°C (28-pin Ceramic DIP (JDJ) & KGD) – Released
DGND
ADS1243-HT
Released
Octal Low Noise Low-Power 24-Bit ADC
• Multiple transducer signals can be easily
• 24-Bits No Missing Codes
sampled using the internal multiplexer
• Up to 8 Inputs Channels and Eight Data I/Os
• Allows user to measure input signals from
• Programmable 15SPS Data Output Rates
20mV (full-scale) to VDD
• Internal Input Buffer and PGA
• Allows user to easily correct for off-set
• 21-Bits Effective-Resolution (PGA=1)
errors by issuing a calibration command
• On-Chip Calibration
• Enables high accuracy measurements
• Highly linear (no linearity below 15ppm)
throughout entire input range
• Simultaneous 50 Hz and 60 Hz Rejection
• Excellent 50 and 60Hz Rejection
• Single-Cycle Settling
• Controlled Baseline
• External Differential Reference of 0.1V to 5V
• One Assembly/Test Site & Fabrication Site
• SPI Interface Compatible
• Extended Product Life Cycle
• 1ppm of full-scale Noise Performance
ADS1240/41
• Product Traceability
• 600 µW/ch power consumption
AVDD AGND
VREF+ VREF- DVDD DGND
• 20-pin Ceramic FP (SJD), KGD and PW packages
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
AIN1 / D1
AIN5 / D5
AIN6 / D6
BUF
PGA

ADC
SPI
Serial
Interface
SCLK
POL
DIN
1:128
DOUT
AIN7 / D7
• -55°C to +210°C – Released
• -55°C to +175°C – Potential
XOUT
DRDY
AIN3 / D3
AIN4 / D4
XIN
CS
AIN2 / D2
MUX
•
•
•
•
•
Clock
Generator
Offset
DAC
AIN0 / D0
RESET
AINCOM
Control
SYNC
PWDN
ADS8320-HT
Released
16-Bit High-Speed, 2.7 to 5V microPower Sampling ADC
• 16-Bit, 100kHz Sampling Rate
• MicroPOWER:
• <4mW at 100kHz and 2.7V
• Power-Down: <60 uW
• Serial SPI and SSI Interface
• 8-pin Ceramic FP (HKJ) Package and KGD
•
•
•
•
•
• Pin-out compatible with ADS7816 and
•
•
•
•
•
ADS7822
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +210°C (8-pin Ceramic FP (HKJ) and KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
ADS8509-HT
Released
16-Bit 250KSPS True Bipolar Serial ADC
• Pin Compatible With ADS7809
• Low Off-Set
• Very Low Off-set Drift
• Data can be read during device power-down
• Highly Integrated- with onboard reference,
• 250-kHz Sampling Rate
• 4V, 5V, 10V, ±3.33V, ±5V, ±10-V Input
•
•
•
•
•
•
•
Ranges
SPI Compatible Serial Output
Daisy-Chain (TAG) Feature
On board reference, reference buffer & Clock
Internal or External Reference
Low Power Dissipation at 250 KSPS
Simple DSP Interface
20-pin Plastic (DB) Package
•
•
•
•
•
•
reference buffer and conversion clock
Long-term stability from No Probing Laser
Trim
Controlled Baseline
One Fabrication and Assembly/Test Sites
Extended Product Life Cycle
Product Traceability
Selectable Operating Modes:
R/C-
SAR
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
SB/BTC-
4.9K
Serial Data
Out &
Control
R2IN
2.5K
10K
R3IN
PWRD
COMPARATOR
CS-
CAP
REF
• -55°C to +175°C – Released
BUSY-
CDAC
9.8K
Data
BUF
•
•
•
•
•
R1IN
Dataclk
4K
2.5V INTERNAL
REFERENCE
Clock
EXT/INT-
ADS6142-HT
Released
Low-Power High-Performance 14-bit, 65 MSPS ADC w/ Selectable outputs
• Highest performance 14-bit available gives
• 14-bit resolution with No Missing Codes
best performance in extended temperatures
• Maximum Sample Rate: 125 MSPS
• Selectable LVDS or CMOS outputs
• Better dynamic performance, Gain, and
• No External Decoupling required for Reference
programmability enables more margin
• 74.7 dBFS SNR, 95 dBc SFDR at 50MHz IF
• Low power enhances battery life and
• Internal coarse and fine gain settings
reduces thermal effects
• 73.5 dBFS SNR, 96 dBc SFDR @ 50MHz IF
• 70.4 dBFS SNR, 80 dBc SFDR @ 170MHz IF • Gain and other programmable settings
• Low power dissipation: 285mW (CMOS)
allow device to be optimized to your needs
• Programmable Output Clock Position and Drive • Controlled Baseline
Strength to Ease Data Capture
• One Fabrication and Assembly/Test Site
• 32-pin plastic package and KGD
• Product Traceability
• Extended Product Life Cycle
• Extended Product-Change Notification
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -40°C to +210°C KGD – Released
• -55°C to +175°C (Plastic) – RTM 2H13
LM95172
Released
13-Bit to 16-Bit 200°C Digital Output Temperature Sensor with 3-Wire Interface
• Analog and Digital Supply Voltage: 3.0V -5.5V
• Total Operating Supply Current: 400 μA (Typ)
• Shutdown −40°C to +175°C → 12 μA
• Shutdown −40°C to +200°C → 28 μA
• Temperature Accuracy:
• +175°C to +200°C → ±3.0°C (max)
• +160°C to +175°C → ±2.0°C (max)
• Temperature Resolution:
• 13-bit: 0.0625°C/LSB
• 16-bit: 0.0078125°C/LSB
• Conversion Time:
• 13-bit: 43 ms (Max)
• 16-bit: 350 ms (Max)
• 10-pin Ceramic Dual Flat-Pack Package
•
•
•
•
•
•
Down-Hole Drilling
Automotive high temperature applications
Heavy Industrial Power Controllers
Heavy Industrial motors, gear boxes
Geothermal instrumentation
High Temperature Test Equipment
• -40°C to +200°C
• Shutdown mode saves power yet wakes
•
•
•
•
•
•
•
•
up for one-shot temperature update
Integrated linear ΔΣ ADC produces high
accuracy, fast conversion rates and
extremely low output noise which
improves system performance
Universal SPI and MICROWIRE Bus
interface standards provides flexibility
High noise immunity of the Serial I/O
(SI/O) output is ideal for challenging
electromagnetic environments
Controlled Baseline
One Fabrication and Assembly/Test Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
INA129-HT
Released
Precision, Low Power Instrumentation Amplifiers
• Low Offset Voltage
• Low Drift:
1μV/C max
• Low Input Bias Current: 50nA max
• High CMRR:
110dB min
• Inputs Protected To 40V
• Wide Supply Range: 2.25V to 18V
• Low Quiescent Current:
2mA
• 8-pin Ceramic Dual FP (HKJ) and Ceramic
DIP (JDJ) Packages and KGD
• Ideal for Bridge, Thermo-couple, and
•
•
•
•
•
•
RTD Sensor, Amplifier and Data
Acquisition applications
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
Bridge Amplifier
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +210°C (8-pin Ceramic Dual FP (HKJ)) – Released
• -55°C to +210°C (8-pin Ceramic DIP (JD) & KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
INA129
INA333-HT
Released
Micro-Power, Zero Drift, Low Power, Single Supply Instrumentation Amplifier
• Low Offset Voltage:
15uV
• Low Drift:
0.2uV/C
• Low Input Bias Current:
2044pA max
• Input Voltage Noise:
55nV/rt-Hz, 1kHz
• Supply Current:
345uA max
• Wide Supply Range:
1.8V to 5.5V
• RFI Filtered Inputs
• 8-pin Ceramic Dual FP (HKJ), Ceramic DIP
(JD) Packages, KGD, and Plastic SOIC (D)
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
•
•
•
•
-55°C
-55°C
-55°C
-55°C
to
to
to
to
+210°C
+210°C
+210°C
+175°C
(8-pin
(8-pin
(8-pin
(8-pin
• Creates excellent accuracy
• Ideal for maximum power efficiency
• Easy compatibility for battery powered apps
• Great for high impedance applications
• Low Noise
• Enables high accuracy
• Enhances noise immunity
• Controlled Baseline
• One Fabrication and Assembly/Test Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
Ceramic Dual FP (HKJ)) – Released
Ceramic DIP (JD) & KGD) – Released
Ceramic Lead-formed FP (HKQ)) – Released
Plastic SOIC (D)) – Potential
INA271-HT
Released
Voltage Output High-Side Current Shunt Monitor
• -16V to 80V common-mode range
• Extended Bandwidth: Up to 130kHz
• Split stages for filtering
• Two gain option family
• INA270: 20 V/V (potential)
• INA271: 14 V/V
•
•
•
•
•
• Eliminates need for additional protective
•
•
•
•
•
•
•
components in the event of supply reversals
Buffered output with filtering for simplified
use in current control loops
Preserves buffered voltage output
Saves using an additional Op-Amp
Controlled Baseline and Product Traceability
One Fabrication and Assembly/Test Site
Extended Product Life Cycle
Extended Product-Change Notification
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +210°C (8-pin Ceramic Dual FP (HKJ) & KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
• -55°C to +175°C (8-pin Plastic SOIC (D)) – Potential
THS4521-HT
Released
One Channel RRO Ultra Low Power Fully Differential Amplifier
• Low Iq, Power-Down mode
• Bandwidth: 145 MHz, Slew Rate: 490 V/μs
• Low Input Voltage Noise
• Negative rail input & output Common-Mode
•
•
•
•
Control
RRO – Rail-to-Rail Output
Single, Dual and Quad options
2.5 to 5.5 (or ±1.25V to ±2.75) Supply
Operation
8-pin Ceramic Dual FP (SHK) and KGD
• Low quiescent current
• Delivers high accuracy for 24-bit conversion
• Allows easy DC coupling to ADC
• Larger outputs with low voltage applications
• Flexible supply for power sensitive apps
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
THS4521 Driving a 24-bit Delta Sigma ADC
•
•
•
•
•
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C (8-pin Plastic SOIC (D))
• -55°C to +210°C (8-pin Ceramic Dual FP (SHK) and KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
INA128-HT
Released
Precision, Low Power Instrumentation Amplifiers
• Low Offset Voltage
• Low Drift:
1μV/C max
• Low Input Bias Current:
30nA
• High CMRR:
120dB min
• Inputs Protected To 40V
• Wide Supply Range:
2.25V to 18V
• Low Quiescent Current:
2mA
• 8-pin Plastic SOIC (D) Package
• Ideal for Bridge, Thermo-couple, and
•
•
•
•
•
•
RTD Sensor, Amplifier and Data
Acquisition applications
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
Bridge Amplifier
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C – Released
INA128
OPA2333-HT
Released
Very Low Power Zero-Drift Series Operational Amplifier
•
•
•
•
•
•
•
•
Ultra-Low Quiescent Current: 80µA (max)
Low Offset Voltage: 26µV (max)
Offset Voltage Drift: 0.05µV/°C
Low Voltage Noise: 1.5 µVP-P
Bandwidth:
350kHz
Rail-to-Rail Input and Output
Single-Supply Operation
1.8V to 5.5V Supply Voltage
•
•
•
•
•
Down-Hole Drilling
High Temperature Environments
Vibration Analysis
Pressure Sensors
Acoustics
• Low Offset and Drift Removes Need for
•
•
•
•
•
•
•
•
Calibration in Application
RRIO Increases Dynamic Range
1.8V Supply Excellent for Battery Devices
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
• -55°C to +175°C (8-pin Plastic SOIC (D)) - Released
• -55°C to +210°C (8-pin Ceramic DIP (JD),
Ceramic FP (HKJ) and KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed
FP (HKQ)) – Released
OPA211-HT
Released
Lowest Power 1.1nV/√Hz 36V Operational Amplifier
•
•
•
•
•
•
•
•
•
•
•
Low Noise Bipolar Input: 1.1nV/√Hz at 1kHz
Low Offset Voltage: 260µV (max)
Low Offset Voltage Drift: 2µV/°C (max)
Low Quiescent Current: 7.5mA (max)
Wide Gain Bandwidth: 80MHz @ G=100
Wide Supply Range: ±2.25 to ±18V
Slew-Rate: 27V/μs
16-Bit Settling: 750 ns
Output Current: 30 mA
Rail-to-Rail Output (unique in industry)
8-pin Ceramic QFP (HKJ) Package and KGD
• Provides Minimal Signal Distortion
• Very High Signal Accuracy
• Very Wide Dynamic Range
• Spans 5V to Full Industrial Range
• Maximum Amplification at any VCC Range
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
4.5
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
50
• -55°C to +210°C (8-pin Ceramic QFP (HKJ) and KGD)–Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
OPA2211-HT
Development
Dual Lowest Power 1.1nV/√Hz 36V Operational Amplifier
• Provides Minimal Signal Distortion
• Very High Signal Accuracy
• Minimal Offset Change Over Temperature
• Lowest Power at this Noise Level
• Very Wide Dynamic Range
• Spans 5V to Full Industrial Range
• Maximum Amplification at any VCC Range
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Low Noise Bipolar Input
• Low Offset Voltage
• Low Offset Voltage Drift
• Low Quiescent Current
• Wide Gain Bandwidth
• Wide Supply Range: ±2.25 to ±18V
• Slew-Rate: 27V/μs
• Output Current: 30 mA
• Rail-to-Rail Output
• 8-pin Plastic SOIC (D) Package
4.5
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C
50
TPS40200-HT
Released
Wide Input, Low Pin Count Buck Controller
• 5.5V to 52V operation
• Voltage Mode Control with Feed Forward
•
•
•
•
•
•
•
Compensation
753mV Voltage Reference
Internal Under-Voltage Lockout
Programmable Frequency (35kHz-500 kHz)
Programmable Over-current Protection
Frequency Synchronization
Closed Loop Soft Start
Integrated Driver
• Many Applications w/ Wide input range
• Voltage feed forward – great line regulation,
•
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C (8-pin Plastic SOIC (D))–Released
• -55°C to +210°C (8-pin Ceramic FP (HKJ) and
KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed
FP (HKQ)) – Released
VIN
1
RC
2
SS/SD
3
COMP
4
FB
TPS40200
•
•
•
•
•
•
•
•
fast transient response
Programmability allows frequency, overcurrent protection under voltage lockout
Softstart enables smooth controlled power up
Minimal external components needed
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
VIN
8
ISNS
7
Rsense
GDRV 6
GND
5
VOUT
TPS40210-HT
Released
4.5 to 52V Input Current Mode Boost Controllers
•
•
•
•
•
•
Soft Start
Enable function
Externally compensated
Low ISENSE threshold (150mV)
Supports Boost, Flyback, and SEPIC topologies
10-pin Ceramic DFP (HKK) Package, KGD, and
Plastic TBD
• Prevents inrush current
• Enables use of small ISENSE resistors with
•
•
•
•
•
•
•
lower power dissipation
Design and implementation flexibility
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
VIN = 4.5V52V; UVL
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
Soft
Start
prevents
inrush
current;
has
time-out
timer
when in
OCP
Freq adj.,
35KHz1MHz
N-channel
FET gate
driver;
500mA
drive
current
ENABL
E for
on/off
control
External
compensatio
n for design
flexibility
• -55°C to +210°C – Released
• -55°C to +175°C (Plastic TBD) – Potential
Provides current
feedback in the
control loop; detects
an OC based on
150mV threshold
Senses switch current
and sets OC threshold;
low Isense threshold
enables use of small
resistor, and lower
power dissipation
LM5116WG-HT
Development
Wide Range 100V Synchronous Buck Controller
• Emulated peak-current mode
• Reduces PWM circuit noise sensitivity found
• Wide Input Operating Range up to 100V
in peak-current mode controllers - allowing
• Low IQ shutdown (<10µA)
reliable control of very small duty cycles
• Programmable Soft Start
• Supports high-voltage or wide-varying input
• Free-run or synchronous operation: 50kHz-1MHz supply applications
• Optional diode emulation mode
• Provides Low standby mode “dark current”
• Drives standard or logic level MOSFETs
• Enables smooth well controlled power-up
• Robust 3.5A peak gate drive
• Slow Switching-Frequency allows higher
• Programmable output from 1.215V to 80V
efficiency and smaller duty-cycles while Fast
• Precision 1.5% voltage reference
Switching-Frequencies enable smaller space
• Programmable current limit
• Enables discontinuous mode operation for
• Programmable line under-voltage lockout
improved efficiency at light loads
• Automatic switch to external bias supply
• Controlled Baseline
• 16-pin Ceramic DIP (HKK), KGD, Plastic TBD
• One Fabrication and Assembly/Test Site
• Extended Product Life Cycle
• Product Traceability
• Down-Hole Drilling
• Extended Product-Change Notification
•
•
•
•
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• 57-55°C to +210°C – 16-pin Ceramic DIP – RTM 3Q13
DRV8332-HT
Development
Three Phase PWM Motor Driver
• Highest power integrated drive on the market
• Supply Voltage up to 50V (70V abs max)
• Output Current 8A RMS/13A peak/Bridge
• Advanced arch. with high efficiency up to 97%
• PWM operation frequency up to 500kHz
• Low RDSON MOSFETs (80mΩ)
• Intelligent gate drive and cross conduction
• High linearity of output signals to guarantee
•
•
•
•
prevention
•
• Short dead time (5ns)
• Spike voltage control to reduce overshoot •
• Integrated Protection Features
• Programmable cycle-by-cycle current limit
• Two stage thermal protection
• 44-pin plastic DDV Package
precise and smooth operation
No external snubber & schottky diodes
Unmatched on-chip protection reduces
design complexity and enables higher
system reliability
Controlled Baseline and Product Traceability
One Fab site and Assembly/Test Site
Extended Product Life Cycle
Extended Product-Change Notification
RESET_A
RESET_B
•
•
•
•
•
Down-Hole Drilling
Brushless DC Motors
Vibration Analysis
Pressure Sensors
Actuators and Pumps
• -55°C to +175°C – RTM 7/30/13
RESET_C
REF5025-HT
Released
2.5V Precision Voltage Reference
•
•
•
•
•
•
•
•
Low Noise
High Accuracy
Low Temperature Drift: 40 ppm/°C
High output Current: ±7mA
2.5V Voltage Output
Wide Supply: 3.25V to 18V
Thermal Shutdown Removed
8-pin Ceramic DFP (HKJ) Package, KGD, and
Plastic (DGK)
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• High Accuracy and Low Noise for High
•
•
•
•
•
•
•
•
Resolution Precision Applications
Minimize system error over temperature
Directly provide accurate voltage reference
to ADC without additional op amp buffer
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
• -55°C to +210°C (8-pin Ceramic DFP (HKJ) and KGD)–Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
• -55°C to +175°C (8-pin Plastic (DGK)) – Potential
TPS62000-HT
Released
Adjustable, High Temperature Step-Down Converter
•
•
•
•
•
•
•
•
2V to 5.5V input voltage range
High Efficiency
300-mA output current
Output voltage : adjustable(0.9V to 5V)
1.4-mA quiescent current (typ)
500 KHz switching frequency
Thermal Shutdown Removed
10-pin Ceramic DFP (HKK) Package and KGD
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +210°C
• Robust general purpose DC/DC converter
• Low quiescent current
• Supports low voltage DSPs and processors
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
TPS62110-HT
Released
17Vin, 700 mAOUT Step-Down Converter
•
•
•
•
•
•
•
•
High Efficiency
Input Voltage:
3.1V to 17V
Output Voltage:
1.2V to 16V(TPS62110)
Output Current:
700 mA
Low Quiescent Current
Switching Frequency: 1.0MHz
Thermal Shutdown Removed
16-pin Plastic TSSOP (PWP) Package
Wide Input
Voltage
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C
• Highest integration (FETs and Diode
•
•
•
•
•
•
•
•
integrated)
Smallest foot-print with only a small
Inductor needed
High efficiency and easy-to-use
functionality!
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
TPS54362-HT
Released
1Amp, 48V Step-Down DC/DC Converter With Low IQ Buck Converter
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Wide Inp Voltage Range: 4.8V to 48V
60V Load Dump protection
Max. Load Current: 1A
Adjustable Output Voltage: 0.9V to 18V
Shutdown current: <5 μA typical
Adjustable Frequency 200kHz to 2.2MHz
Synchronization to external clock
Soft start controlled with external capacitor
Output Switch slew rate control
Reset function with de-glitch timer
Reset threshold and delay programmable
Over voltage detect – Programmable
Thermal Shutdown Removed
20-pin Plastic HTSSOP (PWP) Package
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C
• Low “dark current” in standby mode
• Wide input voltage range, no external
•
•
•
•
•
•
•
•
protection required
Integrated Voltage supervisor
Smaller LC Output filters
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
TPS50301-HT
Released
3V to 6.3V Input, 3Amp Synchronous Step-Down SWIFT™ Converter
•
•
•
•
•
Split Power Rail: 3V to 6.3V on PVIN
Integrated Power MOSFETS
Load Current of 3-A at 210°C
Monotonic Start-Up into Pre-Biased Outputs
Flexible Switching Frequency Options:
• 300kHz – 1MHz Adjustable Internal
Oscillator
• External Sync capability from 100KHz –
1MHz
• Sync pin can be configured as a 500KHz
output for Master/Slave applications
• Low 100-μA Shutdown Quiescent Current
• Adjustable Under voltage Lockout
• 20-pin Ceramic FP (HKH) Package
•
•
•
•
•
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +210°C – Released
• 90% Peak Efficiency; Optimized for Low
•
•
•
•
•
•
•
•
•
•
Output Voltages
Minimal external RCL components
Easy On/Off Control
Self-Protected from Fault Conditions
Supported by SwitcherPro™ Software tool
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
TPS76901-HT
Released
Single Output LDO, 100mA, Adjustable
•
•
•
•
•
100 mA output current
Adjustable output voltage
Vin up to 10V Max
Family includes numerous voltage options
Logic enabled shutdown puts the LDO in
standby and reduces supply current
• Thermal Shutdown Removed
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• Ultra-low quiescent current LDO
• Extends Battery Life and saves space in
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portable designs
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +175°C (5-pin Plastic SOT (DBV)) – Released
• -55°C to +210°C (8-pin Ceramic DFP (HKJ) and KGD) – Released
• -55°C to +210°C (8-pin Ceramic Lead-formed FP (HKQ)) – Released
Prev
MSP430F2619S-HT
Released
16-Bit Ultra-Low-Power MCU
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120KB+256B Flash Memory
4KB RAM
12-Bit ADC
Dual DAC
2 USCI
Thermal Shutdown Removed
64-pin Plastic QFP (PM) Package
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Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +150°C
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
SM320F2812-HT
Released
Digital Signal Controller
• Processor Performance
• 110-120 MIPS with Flash Acceleration Tech
• 150 MIPS out of RAM for time-critical code
• Memory
• 128Kw Flash
• External memory interface (XINTF)
supports systems w/ larger memory
models
• Control Peripherals
• PWM outputs interfaces for three
3-phase motors
• 12-bit ADC
• 172-pin Ceramic QFP (HFG) Package and KGD
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
Code security
128Kw Flash
+ 2Kw OTP
18Kw
RAM
4Kw
Boot
ROM
Event Mgr B
XINTF
Memory Bus
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +220°C
150MIPs C28xTM 32-bit DSP
32x32 bit
Multiplier
RMW
Atomic
ALU
32-bit
Timers (3)
Real-Time
JTAG
12-Bit ADC
Peripheral Bus
Interrupt Management
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Event Mgr A
Watchdog
GPIO
McBSP
CAN 2.0B
SCI-A
32-Bit
Register
File
SCI-B
SPI
SM320F28335-HT
Released
Digital Signal Controller
• Processor Performance
• 200 MFLOPS@100MHz, Single-cycle MAC
• 6-ch DMA support for EMIF, ADC, McBSP
• Memory
• Up to 512KB flash and 68KB RAM
• Configurable 16- or 32-bit EMIF
• Control Peripherals
• PWM outputs interfaces
• 6 High-resolution PWM outputs
• Highest-speed on-chip ADC
• Communications Ports
• Each McBSP configurable as SPI, CAN
2.0b with 32 mailboxes, I2C at 400 Kbps
Code security
512 KB
Flash
SM320F28335
68 KB
RAM
Boot
ROM
Memory Bus
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
TM
C28x 32-bit DSC
32x32-bit
Multiplier
32-bit
Timers (3)
Real-Time
JTAG
• -55°C to +210°C
6 CAP
DMA
Interrupt Management
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12 PWM
(6 HRPWM)
RMW
Atomic
ALU
32-bit
Floating
-Point
Unit
2 QEP
Peripheral Bus
• Development Tools
• Code Composer Studio™IDE
• 181-pin Ceramic PGA (GB) Package and KGD
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
12-bit ADC
88 GPIO
16/32-bit
EMIF
SPI
3 SCI
2 McBSP
I²C
2 CAN
SM470R1B1M-HT
Released
Arm 7 Microcontroller
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
Program
Flash
Peripheral
Library
Data
RAM
High End Timer
Oscillator
PLL
CPU Bus
CAN
J1850 Digital
Addr. Registers
System
Decoder
MibADC 10-bit
INC
Memory
Protection
Registers
Watchdog
RTI
Multiplier
Debug
Module
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Memory
16-bit Thumb
Instruction Set
Decompression
Plastic LQFP (PGE) Packages & KGD
• Open-Architecture w/ Full 3rd Party Support
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
JTAG Iinterface
• ARM7TDMI™ Compatible
• Thumb extension
• Debug module
• Multiplier with JTAG Interface
• Performance Enhancements
• ARM7 CPU Accelerator
• 60 MHz RISC Co-Processor
• High Performance DMA
• TMS470R1B1M
• 1024 HB Flash and 64 KB RAM
• 12-Channel ADC
• 16 Channel DMA
• 84-pin Ceramic QFP (HFQ) and 144-pin
SCI
I2C
Shifter
DMA
32-bit ALU
IEM
ARM7TDMI
SYSTEM Module
• -55°C to +220°C (84-pin Ceramic QFP (HFQ) and KGD) – Released
• -55°C to +175°C (144-pin Plastic LQFP (PGE)) – RTM 4Q’12
SPI
I/Os / EBM
ECP
OMAPL137-HT
Released
C674x DSP + ARM9 Processor
• Dual CPU Cores:
• ARM926EJ-S™ (MPU)
• C674x DSP Core
• Memory:
• ARM: 16K I$, 16K D$, 64K ROM
• DSP: 32K L1D, 32K L1P, 256K L2 Cache,
• Compatible with C6747 DSP
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
128K RAM and 1MB ROM
• Peripherals (1.8/ 3.3V IOs)
• 10/100 Ethernet MAC
• EMIF1–Supports 133MHz SDRAM 16/32-bit
• EMIF2–Supports Async/NAND Flash 8/16 bit
• USB 2.0
• UHPI, McASP (3), UART(3), I2C(2), SPI(2),
RTC, Timers (3)
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Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
ARM9
Subsystem
DSP
Subsystem
ARM
926EJ-S
CPU
300 MHz
C674x
DSP
Core
300 MHz
L1P 16K
L1D 16K
L1P 32K
L1D 32K
L2 256K
128KB
RAM
LCD
Controller
Switched Central Resource (SCR) / EDMA
Peripherals
UHPI
• -55°C to +175°C (176-pin Plastic QFP (PTP)) –
Released
• -55°C to +175°C (KGD)
OMAP-L137
DSP + ARM
Connectivity
USB
2.0
USB
1.1
Serial Interfaces
SPI
(2)
McASP
(3)
System
WD PWM
Timer (3)
EMAC
Program/Data Storage
I2C
(2)
UART
(3)
SDRAM
32-bit
Async
EMIF
16-bit
MMC/SD
SM28VLT32-HT
Released
4-Mbyte Flash Storage Device Memory
• 32-Megabit Flash Memory Device
• Serial Peripheral Interface (SPI) Compatible
• 3.3-V Supply for IO, 1.8 V for Core
• 2-M x 16-Bit Word Access
• Synchronous Read/Write/Erase Operations
• Sector Protection Through Programmable
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Hardware Locks
20-MHz Maximum Clock Frequency
Built-In-Self-Test (BIST)
Data Retention: 1000 hrs
14-pin Ceramic FP (HKN) Package
and KGD
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Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
General Data Collection Applications at
Extreme High/Low-Temperatures
• -55°C to +210°C
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
• Extended Product-Change Notification
SN65HVD233-HT
Released
CAN High-Temp Transceiver With Diagnostic Functions
• Bus pin short-circuit protection to ±36V
• ESD protection exceed 16kV
• Designed for signaling rates up to 1 Mbps
• High Impedance
• 3.3 V supply
• Glitch free power up & power down protection
• Thermal Shut-down removed
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Down-Hole Drilling
High Temperature Environments
CAN Data Bus
Industrial Automation
• Device is unharmed by shorts to these
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voltages
Compatibility with existing signaling
schemes
Up to 120 nodes on bus
Ideal for microcontrollers and DSPs
Hot pluggable without data Corruption
Loopback for Diagnostic Functions Available
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
• -55°C to +175°C (8-pin Plastic SOIC (D)) – Released
• -55°C to +210°C (8-pin Ceramic FP, Ceramic DIP
(JDJ), and KGD) – Released
ISO7221C-HT
Released
Dual High-Speed Digital Isolator
• Silicon Integrated SiO2 Dielectric Capacitor
• 0–25 Mbps and DC Signal Pass with Fail Safe
• 25 Mbps Signaling Rate
• TTL Inputs
• 1ns Skew, 1ns Jitter, 2ns Pulse Distortion
• Input Threshold, Noise Filter
• High Magnetic Immunity (1E6 > Inductive)
• 3-KV HBM ESD on All Pins
• 3.3V and 5V Supply Supported
• Estimate 3000-V Max Isolation
• 8-pin Plastic SOIC (D) Package
• Down-Hole Drilling
• High Temperature Environments
• Industrial Controls (PLC, Servo, Motor
Control, Sensors)
• Power Supply/Regulation Systems
• Industrial Automation (Fieldbus, Modbus,
Profibus, Device Net Data Buses, Smart
Distributed Systems (SDS), CAN, RS485, USB
• Automotive Electronics & Hybrid Vehicles
• -55°C to +175°C
• Proven Reliability of SiO2 Dielectric
• Low Skew, Jitter, & Pulse Width Distortion
• Filters Noisy Signals before Entering System
• High Immunity for Noisy Environments
• High Reliable in Harsh Environments
• Flexibility with Power Supplies
• Highly Reliable in Harsh Environments
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Extended Product Life Cycle
• Product Traceability
SN65HVD11-HT
Released
3.3V RS-485 High-Temp Single Half-Duplex Transceiver
• Based on ANSI TIA/EIA-485-A
• Operate with single 3.3-V supply
• Speed of 10Mbps
• Common-mode voltage range (-7V to +12V)
• 16-kV HBM Bus I/O ESD protection
• Failsafe receiver for open circuit, short circuit
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and idle-bus conditions
>41mV receiver input hysteresis
Glitch free power up & power down protection
Industry standard SN75176 pinout
Thermal Shut-down removed
8-pin Ceramic FP (HKJ), CDIP SB (JDJ), KGD,
and Plastic SOIC (D) offerings
• RS-485 standard versatile
• Ideal for use with DSPs
• Enables use in long cable networks
• Extended ESD level of protection
• Protected in all situations
• Rejects spurious noise signals and prevents
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false changes in the receiver output state
Hot pluggable without data Corruption
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Extended Product Life Cycle
Product Traceability
• Down-Hole Drilling
• High Temperature Environments
• Digital Motor Control
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-55°C
-55°C
-55°C
-55°C
-55°C
to
to
to
to
to
+175°C
+210°C
+210°C
+210°C
+210°C
(8-pin Plastic SOIC (D) Package – Released
(8-pin Ceramic FP (HKJ) Package) – Released
(8-pin Ceramic DIP SB (JDJ) Package) – Released
(Known-Good-Die) – Released
(8-pin Ceramic Lead-formed FP (HKQ)) – Released
SN65HVD1040-HT
Released
Low-Power CAN Transceiver with Bus Wake-Up
• Full compliant to the CAN standard
• 5μA Standby Mode With Bus Wake-Up
• Dominant time-out circuit
• Bus-Fault Protection Bus fault, pin short•
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circuit, cross-wire, overvoltage and loss of
ground protection from -27 to +40V
±12kV ESD on Bus, Split pins and very Low
Electro-Magnetic Emissions (EME)
1Mbps signaling rates meets ISO 11898-5
High 125mV of Hysteresis
Glitch-free Power-Up/Down protection
Thermal Shutdown Removed
8-pin Ceramic Dual FP (HKJ), HKQ, KGD, and
Plastic SOIC (D)
Down-Hole Drilling
High Temperature
Vibration Analysis
Pressure Sensors
Acoustics
• -55°C to +210°C – Released
• -55°C to +175°C – Potential
• Enables quick wakeup for transmission
• Prevents driver from blocking network
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communications during HW and SW failures
Device is unharmed by shorts to these
voltages and during these scenarios
Ensures high ESD protection and minimal
interference with improved EMI
Existing signaling scheme compatibility
Hot pluggable without data corruption
Controlled Baseline, One Fabrication and
Assembly/Test site
One Fabrication Site
Extended Product Life Cycle and Traceability
Extended Product-Change Notification
OPA820-HT
Released
Unity-Gain stable, Low Noise, Voltage-Feedback Operational Amplifier
• Small Signal Bandwidth: 240MHz, G = +2
• Slew rate: 240V/µs
• Offset Voltage: 4µV/˚C (max)
• Low Input Voltage Noise: 2.5nV/Hz
• Flexible Supply Voltage
• Dual ±2.5V to ±6V
• Single +5V to +12V
• Excellent DC accuracy
• ±750mV Input Offset Voltage
• ±400nA Input Offset Current
• Low Quiescent Current: 6.4mA (max)
• High Output Current (±110mA)
• Low Supply Current (5.6mA/Ch.)
• 8-pin Ceramic Dual Lead-formed FP, Plastic
SOIC (D) and KGD
• Enables the fast conditioning of high
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frequency signals with high linearity
Low initial offset eliminates calibration need
providing accuracy across full temp range
Enabling high dynamic range and gain
without distortion
Enables both single or split supply voltages
High DC accuracy for pulse amplifier apps
Extends battery life s and ideal for portable
applications
Provides large drive capability
Controlled Baseline
One Fabrication and Assembly/Test Site
Extended Product Life Cycle
Product Traceability
Extended Product-Change Notification
• Down-Hole Drilling
• High Temperature
• Vibration Analysis, Pressure Sensors
• -55°C to +210°C KGD – Released
• -55°C to +210°C (8-pin Ceramic Dual Lead-formed FP)
• -55°C to +175°C (8-pin SOIC (D)) – Potential
TPS7H1201-HT
Released
6.3V, 0.5A Low Drop-Out Regulator
• VIN = 1.5V to 6.3V
• Ultra Low Dropout: 200mV (Max) at
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500mA
• PMOS Pass Device
Device
2% Accuracy
Ultra Low Noise: (27x VOUT) μVRMS
TPS7H2101
PSRR: >45db up to 1 KHz
Programmable SoftStart
Programmable OCP, with current reading
Power Good Output (for Sequencing)
Temperature Range: -55°C to 210°C
Packaged in Thermally Enhanced 16-pin
Ceramic Flatpack and Known-Good-Die
(KGD) Packaged in Waffle Pak
• Power Management – LDO
• RF Components VCOs, Receiver, ADC’s
Amplifiers
• High voltage, high PSRR, low noise and
Clean Analog Supply Requirement
Applications
IQ
VIN
IOUT
VOUT
(V)
(μA)
PG
NR/SS
1.5 – 6.3
0.5
0.8 – 6.1
TBD
YES
YES
(V)
(A)
VDO
Enable
(mV)
YES
200
TI High Temperature Products
HT Webpage: http://www.ti.com/ht
TI HiRel Contact:
Mont Taylor
[email protected]
(903) 868-6316
Comments/Feedback
Please Visit : www.ti.com/ht