Transcript ppt

ESE370:
Circuit-Level
Modeling, Design, and Optimization
for Digital Systems
Day 31: November 23, 2011
Crosstalk
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Penn ESE370 Fall2011 -- DeHon
Today
• Crosstalk
– How arise
– Consequences
– Magnitude
– Avoiding
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Capacitance
• There are capacitors everywhere
• Already talked about
– Wires as capacitors
– Capacitance between terminals on
transistor
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Miller Effect
• For an inverting gate
• Capacitance between
input and output must
swing 2 Vhigh
• Or…acts as doublesized capacitor
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Capacitance Everywhere
• Potentially a capacitor between any two
conductors
– On the chip
– On the package
– On the board
• All wires
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–
–
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Package pins
PCB traces
Cable wires
Bit lines
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Capacitor Dependence
• Decrease with conductor separation
• Increase with size
• Depends on dielectric
A
C   r 0
d
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Parallel Wires
• Parallel-plate capacitance between
wires
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Wire Capacitance
• Changes in voltage on one wire
may couple through capacitance to another
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Consequences
Qualitative First
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Driven Wire
• What happens to a driven wire?
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Driven Wire
• Can this be a problem?
• Victim
– Clock line
– Asynchronous control
– Non-clock used in synchronous system
• Outputs sampled at clock edge
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Undriven Wire
• What happens to undriven wire?
• Where do we have undriven wires?
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Clocked Logic
• CMOS driven lines
• Clocked logic
• Willing to wait to settle
• Impact is solely on delay
– May increase delay of transitions
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Magnitude
Quantitative
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How large is the noise?
• V1 transitions from 0 to V?
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How large is the noise?
• V1 transitions from 0 to V
I  CdV /dt
C1(d(V1 V2 )/dt)  C2 (dV2 /dt)

C1(dV1 /dt)  C1  C2 (dV2 /dt)
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Noise Magnitude
C1(dV1 /dt)  C1  C2 (dV2 /dt)
C1V1  C1  C2 V2
 C1 
V2  
V1
C1  C2 
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SPICE C1=10pF, C2=20pF
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Good (?) Capacitance
• High capacitance to ground plane
– Limits node swing from adjacent conductors
 C1 
V2  
V1
C1  C2 
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Driven Line
• What happens when victim line is
driven?
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Driven Line
• Driven line
– Recovers with time constant: R2(C1+C2)
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Spice: R2=1K, C1=10pF,
C2=20pF
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Magnitude of Noise
on Driven Line
• Magnitude of diversion depends on
relative time constants
 t1, t2
 t1<< t2
• full diversion, then recover
 t1>> t2
• Charge capacitor faster than line 1 can change
– little noise
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Magnitude of Noise
on Driven Line
• Magnitude of diversion depends on
relative time constants
 t1, t2
 t1<< t2
 t1>> t2
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Spice: C1=1pF, C2=2pF
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Simultaneous Transition
• What happens if transition in opposite
directions?
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Simultaneous Transition
• What happens if transition in opposite
directions?
– Must charge C1 by 2V
– Or looks like 2C1 between wires
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Where Arise
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Cables and PCB Wires
Source; http://en.wikipedia.org/wiki/File:Flachbandkabel.jpg
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Printed Circuit Board
Source: http://en.wikipedia.org/wiki/File:Testpad.JPG
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Interconnect Cross Section
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ITRS 2007
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IC Metalization
Source: http://en.wikipedia.org/wiki/File:Silicon_chip_3d.png
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Standard Cell Area
All cells
uniform
height
inv nand3
Width of
channel
determined
by routing
Cell area
Identify the full custom and standard cell regions on 386DX die
http://microscope.fsu.edu/chipshots/intel/386dxlarge.html 33
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Wires
• Will be capacitively
coupled to many
adjacent wires of
varying degrees
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bit lines, word lines
wordline
bitline
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Source: http://techon.nikkeibp.co.jp/article/HONSHI/20071219/144399/
Addressing
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What can we do?
• How can we reduce?
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What can we do?
• Orthogonal routing layers
– Avoid parallel coupling vertically
• Widen spacing between wires
– Particularly critical path wires
• Limit length two wires run in parallel
• Separate with power planes
• Separate with ground/power wires
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Admin
• HW6 Out by time return from break
• Next week
– Project 3 out
– Lecture Monday and Wednesday
– Lab on Friday
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Idea
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Capacitance is everywhere
Especially between adjacent wires
Will get “noise” from crosstalk
Clocked and driven wires
– Slow down transitions
• Undriven wires voltage changed
• Can cause spurious transitions
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