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Laser slotting of silicon for inkjet printer heads
Tuan Anh Maia, Delphine Perrottet*a, Max Wikia and Bernold Richerzhagena
aSynova SA, Ch. de la Dent-d’Oche, CH-1024 Ecublens, Switzerland
Paper Survey
Chin-Ting Lin
Institute of Mechanical Engineering
Date ﹕2011/05/30
Outline
 Introduction
 Conventional manufacturing procsses
 Water-jet-guided laser
 Damage-free laser slotting
 Conclusion
2
Introduction
Thermal Bubble Jet Technology
Figure 1: Basic principle of a inkjet-printer head.
Conventional Manufacturing Procsses
Sandblasting
Narrow slots below 150 microns.
 Etching
Slow and expensive
Require masks.
Water-jet-guided Laser
Figure 2: Basic principle of the water-jet-guided laser technology
Nd:YAG laser
Wavelength 532 nm
Cutting speed: 1.2 mm/s
Nozzle:100um
675um
Damage-free Laser Slotting
Figure 3: Slot end (broken after cutting)
Damage-free Laser Slotting
Nd:YAG laser
Wavelength 532 nm
Cutting speed: 1.2 mm/s
Nozzle:30um
Figure 5: Chip backside, free of chipping
Damage-free Laser Slotting
Nd:YAG laser
Wavelength 532 nm
Cutting speed: 1.2 mm/s
Nozzle:30um
Figure 4: Race track
Damage-free Laser Slotting
Nd:YAG laser
Wavelength 532 nm
Cutting speed: 5 mm/s
Nozzle:30um
Figure 6: Slot exit side
Conclusion
The water-jet-guided laser technology has proved its
capabilities of matching the requirements of silicon
slotting for inkjet-printer heads. After a short phase of
parameter optimization, the required quality and speed were
not only reached but also surpassed. The produced slots are
free of any length or depth limitations and the quality
remains constant over time.
Thanks For Your Attention!!!