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Pin-plate micro assembly by integrating
micro-EDM and Nd-YAG
laser
莊學文
D95Z0201
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前言
 Nd-YAG 雷射具有加熱集中和迅速冷卻的有
利特性所以適合於微焊接。
 而micro-EDM適合建立細微部分。
 Micro-EDM 和Nd-YAG雷射特別用同一台機
器做結合。
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Fig. 1. (A): the stereography for the hybrid machine. (B):
the stereography for micro-EDM mechanism
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(C): the configuration of top view for three laser beams.
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Fig. 2. The sketch of WEDG.
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Fig. 4. A micro probe.
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Fig. 5. The relationship between gap, (D-d)/2, and the discharge voltage,
V, to make a hole on a 200 μm thick SUS 304 plate. Where D
and d represent the diameter of hole and pin respectively.
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Fig. 6. The procedures for pin-plate assembly under 3 laser fibers
radiation simultaneously.
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Fig. 7. The first spot fusion welding at ‘a’ region.
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Fig. 8. The sketch of the maximum notch depth via laser radiation
beam in accordance with Gaussian form.
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Fig. 9. Experimental result between laser radiation power and the
maximum notch depth. This material is SUS 304.
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Fig. 10. The tensile test configuration for pin-plate.
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Fig. 11. The microscopic photograph of pin-plate cross section after
tensile test.
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Fig. 12. Detective configuration for pin-plate PAT.
Fig. 12. Detective configuration for pin-plate PAT.
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Fig. 13. Detective results for the pin-plate PAT.
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Fig. 14. The operation flow chart to estimate the reproducibility and yield
for pin-plate assembly processes.
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Table 3
The reproducibility and yield that assembles the pin having
150 um in diameter to the 200 um thick plate
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Fig. 15. Two pins assembled into a thin plate.
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結論
 使用雷射熔焊的被凝聚力比其他裝配方法
強大。
 雷射發射焦點的高重複性。
 位置如果被確定，聚合重複非常高； 而且
雷射參數不需要再次被調整。
 結合micro-EDM，Nd-YAG被適合適用於準
確的微裝配過程。
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