Transcript atlas_talk
Andy Blue: on behalf of the Glasgow ATLAS upgrade group
• Replacing all the Silicon in the SCT • • Presentation will focus on the Si Strip detectors (also work at Glasgow on the upgrade to the pixel detectors) • Major changes previous modules • More Asics (now 20) • Will be reduced to 10 @130nmCMOS • • • • More Strips 20*128*2=5120/module However, no fan in/link between Si Hybrids now glued directly ON to the Si
• Taken from “Parameters of the phase2 ITK Draft 27.5.2012” • Layer 1: 28 staves (at r = 412) [Short @ 2.4cm] • • Layer 2: 40 staves (at r= 555) [Short @ 2.4cm] Layer 3: 48 staves (at r=698) [Long @ 4.8cm] • • • Layer 4: 60 staves (at r=866) [Long @ 4.8cm] Layer 5: 72 staves (at r=996) [Long @ 4.8cm] =248 Staves in total
The number of modules in stave = 26
• • • 6448 modules in 3 years (150 weeks) 42.986modules per week
8.597 modules per day for all module building groups
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Assumes 100% yield!
• • 1) Glue ASICS on to a FR4 strip (‘Hybrid’) • Wire bonds for ASIC-ASIC 2) Glue 2 Hybrids onto a Si sensor (‘Module’) • Wire bond from ASIC to Si Strips
• Goal is to accurately glue 20 Si CMOS chips on to a FR-4 based panel to make a Hybrid
• Place ASICs in holder (Machined acetal with metal top)
• Attach a vacuum jig to the holder
• Apply a stencil and spread glue evenly on back to leave 5 spots per asic
• Place vacuum jig on to FR4 board and apply a brass weight to cure the glue
• Goal is to glue to Hybrids (shown before) to a Silicon sensor
Frame is placed on a jig, then Silicon sensor placed in frame (held by small lip round edge of frame)
• • A cardboard stencil is placed on top of the Si sensor and glue is spread Glue used is an epolite epoxy
• 2 hybrid pick up tools are then attached to the module jig
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Hybrid Building
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Wire Bonding
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Readout
• • • • Bonding Purchased and installed Bondjet 820 Fully wire bonded our first hybrid panel Wire bonded 1 st half of module Successfully bonded trial of new pitch for modified module design
• • HSIO FPGA development board • Runs SCTDAQ software Can test • • • Hybrids Modules Stavelets (multiple modules)
• Testing both hybrids and modules now at Glasgow
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Test hybrids bonded at Glasgow
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Begin construction of Modules
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Test
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Begin QA and full assembly structure
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