Transcript Document 7922653

Corial 300
Equipment Control & Software
COSMA Software with:
 Edit menu for process recipe edition,
 Adjust menu for process optimizing,
 Maintenance menus for complete equipment control via
internet with VPN (Virtual Private Network).
CORS Software for:
 Data reprocessing (Measures and data comparison).
A Tool Organized in
Successive Levels
Server for
GUI
COSMA
Controller
Monitoring
Operator
Lots
Actions
COSMA
Supervisor
Remote GUI
Monitoring
Process
Controller
Embedded
control PU
Monitoring
Device
Controllers
Process
Actions
Embedded
control
function
Closed-loop
Physical
devices
Constructor
PC User
Diagram Modes
Stand-by
Mode
Production
Mode
Optimization
Mode
Normal
Step by step
Mode
Shut down
Mode
Errors
Operator
Production
Constructor
Mode
Maintenance
Constructor
A Communicant Tool
COSMA
GUI
WAN
VPN
ADSL
Fix IP
Firewall
Dedicated
Ethernet network
Customer Ethernet
Network
COSMA
Supervisor
Ethernet
Process Control
Unit (1)
Process
Control Unit (2)
Ethernet
Device Control
(1)
Device
Control (2)
Pumping System
Reactor
TV
TMP
Dry Pump
ADP 122
RIE Reactor
Bottom Electrode
Automatic
Match Box
RF Generator
Pump
Pumping grid
Reactor Features
New RIE designed to achieve highly uniform delayering for
300 mm wafer yield analysis:
 Symmetrical reactor design to reduce ion bombardment on
the powered electrode (cathode),
 Etching with thick insulator on the cathode to reduce ion
bombardment.
Real time access to the following plasma modes:
 High Pressure Reactive Ion Etching (Isotropic),
 Low Pressure Reactive Ion Etching (Anisotropic).
Some Process Specifications
Etch Rate
Selectivity Uniformity
(nm/min)
Process
Underlayer
Polyimide
Si3N4
200
>50
±5%
Si3N4
SiO2
120
3
±5%
SiO2
SiO2
40
1
±3%
Preventing Overetch
The latest submicron technology needs precise delayering:
 Automatic endpoint detection,
 CCD camera with magnification > 120 X,
 Laser beam diameter ≤ 20 m.
A CCD camera and laser diode, in the same measuring
head, enables simultaneous visualization of the die surface
and the laser beam impact on it. A laser spot, of diameter 20
µm, facilitates the record of interference signals.
Signal
Laser Endpoint Detection
Laser beam
Photodiode
Time
Interferences
Reflected beam 1
Interface 1
Reflected beam 2
Interface 2
Refractive Index = n
Underlayer
Interferences lead to a periodic signal having a l/2n period versus time
Laser Endpoint Detection
Laser beam
Laser beam
Laser beam
Si3N4
SiO2
Al
Si
SiO2
Al
Si
Al
SiO2
Si
Al reflects the
laser, there is no
interference
effect.
Recap of Corial 300 Features
 New RIE reactor to achieve highly uniform delayering for
300 mm wafer yield analysis,
 Wide process range from isotropic to anisotropic,
 Clean etching,
 Low metal erosion (low damage).