Transcript Document 7763211

ABF介紹_前言
ABF介紹_構造
ABF介紹_製程
Preparation of innerlayer
circuit board
Predrying of boards
(Remove water absorption)
Lamination (temporal)
(place films onto patterns)
Preparation of role film
Temp: Cold -> R.T.
130 oCx30min.
Opening role
Using auto-cut laminator for DFR
Vacuum Lamination
Hot press
to flatten surface
Using vacuum applicator
(Nichigo-Morton、MEIKI)
100-110oC, 30s Vacuum, 30s Press,
+(0.5-0.7) MPa
Via formation
100-110 oC, 60s Press, 2-6kgf/cm2
Desmear
Removing of PET film
Remove when cooled down to
room temperature after lamination
Copper plating
Cure
Hot air oven SH , G ; 170degCx30min
GX：(90-120degCx30min)+(150-170degCx30min)
SH-9K：170degCx30min
Repeat for multilayered types
RCC;120degCx30min+170degCx30min
Pattern formation
Annealing
(Post-cure)
For RCC, Two step cure is necessary for resin curing
without voids or wrinkles.
Mechanical drilling or laser
Coating solder mask
Treatment with permanganate
Electroless copper plating
Electo copper plating
Subtractive method
Semi-additive method
Hot air oven
170 oC x 30-60min.
ABF介紹_數據
Test Condition
CTE x-y (25-150degC)
(tensile TMA)
CTE x-y (150-240degC)
(tensile TMA)
CTE z (25-150degC)
(tensile TMA)
CTE z (150-240degC)
(Z axis TMA)
Tg (tensile TMA)
Tg (DMA)
Young's modulus (GPa)
Tensile strength(MPa)
Elongation(%)
Poisson's ratio
Dielectric constant
(1MHz/1GHz)
Loss tangent
(1MHz/1GHz)
Water absorption
100degC,1h(%)
HAST@30um
(130degC,85%,3.3V)
HAST@30um desmear process
(130degC,85%,3.3V)
HAST@L/S=20/20um
(130degC,85%,3.3V)
Flame retardancy(UL94)
SiO2 amount
Organic filler
SH-9K
Halogen
free
GX
Low E,
CTE
GX-35
95
60
55
46
46
46
23
150
135
135
123
120
120
57
98
60
57
45
46
47
29
165
160
160
157
140
155
120
165
200
3
70
6.7
0.41
153
180
3.5
90
7.6
0.27
157
181
2.7
78
5.8
0.33
156
187
4.6
90
4.0
0.33
156
178
4.9
91
3.5
156
177
4.0
93
5.0
155
184
7.6
90
1.7
0.29
3.8/3.4
3.8/3.4
3.8/3.3
3.9/3.5
3.9/3.5
3.6/3.35
3.8/3.5
0.027
/0.022
0.017
/0.023
0.019
/0.018
0.017
/0.015
0.018
/0.019
0.016
/0.012
0.016
/0.010
1.3
1.8
1.8
1.2
1.0
1.1
0.7
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
>200h
V1
12
no
V0
18
no
≒ V0
18
yes
≒ V0
42
yes
≒ V0
40
yes
≒ V0
36
yes
≒ V0
<68
yes
Low CTE
GX-10
Improve peel
strength of code10
GX-11
GX-13
GX13/TH3
(10/30)
GX-TH3
Curing condition; 170degCx90min : SH-9K, GX, GX-10, GX-11, 180degCx90min : GX-35, GX-13, GX-TH3