Leakage Power Analysis and Comparison of Deep Submicron Logic Gates
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Transcript Leakage Power Analysis and Comparison of Deep Submicron Logic Gates
A Class Presentation for VLSI Course
by : Fatemeh Refan
Based on the work
Leakage Power Analysis and
Comparison of Deep Submicron
Logic Gates
Geoff Merrett and Bashir M. Al-Hashimi
ESD Group, School of Electronics and Computer Science, University of
Southampton, UK
Integrated Circuit and System Design, Power and Timing Modeling, Optimization and
Simulation;
14th International Workshop, PATMOS 2004, Santorini, Greece
September 15-17, 2004
Outline
Background
Introduction
Design of Low Order Gates
Design of Higher Order Gates
Input Pattern Ordering
Background
Design styles :
COMP
Partitioned
CPL
TG
DCVSL
DPL
LP
Power Consumption
Leakage Current Estimation
Complementary CMOS (COMP)
NMOS pull-down & dual
PMOS pull-up
Complementary inputs
High number of
transistors (XOR : 12)
…
NAND
XOR
Partitioned Logic (NAND)
Breaks down a higher order gate into lower order
gates
Faster than a CMOS high order gate
Complementary Pass Logic (CPL)
Two NMOS logic
networks
Two small pull-up
PMOS transistors for
swing restoration
Two output inverters for
the complementary
outputs
Number of transistors
(10)
NAND
XOR
Transmission Gate (TG) XOR
An NMOS to pull-down
and a PMOS to pull-up
Solution to the voltagedrop problem
Based on the
Complementary
properties of NMOS and
PMOS
Low number of
transistors (4)
Differential Cascade Voltage Switch
Logic (DCVSL) XOR
Two NMOS logic
networks
Two small pull-up
PMOS transistors for
swing restoration
Differential logic and
positive feedback
Number of transistors
(8)
Double Pass Logic (DPL) XOR
Dual-rail pass-gate logic
Both NMOS & PMOS
logic networks are used
in parallel
High number of
transistor (12)
Low Power (LP) XOR
Using drivers to
complete the high
output logic when input
is “11”
Low number of
transistors (6)
Power consumption
Dynamic : switching
Short-circuit
Static:
Gate leakage
Sub-threshold leakage:
weak inversion current
Ptotal Pdyn Psc VS I leak
I leak I S I ox
Leakage Current Estimation
Number of stacked
transistors
Parallel or series
transistors
I S I 0 exp(
Vgs VTH
nVT
)(1 e
Vds
VT
)
I S1 I S 2 I S 3 ... I Sn
Introduction
Decreasing the Dimensions ?
Effects on power consumption
Solution and limitation
Leakage power reduction techniques:
Supply voltage reduction
Supply voltage gating
Multiple or increased threshold voltages
Minimizing leakage power consumption in
sleep states
Parameters Variation
Berkeley Predictive Technology Models (BPTM)
Basic gates : NAND, NOR, XOR
Three DSM process tech. : 0.07, 0.1, and 0.13um
Different design styles :
NAND, NOR : COMP, Partitioned, CPL
XOR : COMP, CPL, TG, DCVSL, DPL, LP
FAN-in : 2, 4, 6, 8
Input ordering
Design of Low Order Gates
(NAND/NOR)
The leakage power of a CPL gate is four times that of the COMP gate
There are no stacks
Extra leakage current is drawn through:
level-restoring
output-driving circuitry
The leakage power in a CMOS circuit increases as the technology
shrinks
Design of Low Order Gates (XOR)
LP (area, speed and
power):
The least leakage
power
Few transistors
Low delays
Low dynamic power
COMP
Low leakage power
Less than 30%
worse than LP
Design of Higher Order Gates
COMP gate consumes
less power
more transistors there
in the stack
Partitioned logic is
faster, for fan-in greater
than 6
Input Pattern Ordering
(2-input NAND)
leakage current in a
stack is ‘almost’
independent of ordering
for a constant number
of ‘off’ transistors
the leakage power is
the same for inputs
“0,1” and “1,0” at 0.35u
the difference
increases as the DSM
process shrinks
Input Pattern Ordering
(higher order gates)
The leakage power varied
considerably for patterns
containing only one ‘zero’
For NMOS stacks (NAND
gates):
a ‘zero’ closest to the
output gives the largest IS1
a ‘zero’ closest to ground
gives the smallest IS1
For PMOS stacks (NOR
gates):
a ‘one’ closest to the output
gives the largest IS1
a ‘one’ closest to Vdd gives
the smallest IS1