Transcript Bluetooth 2001: Enabling the Star Trek Generation Kjell Westerlund February 15, 2001

Bluetooth 2001:
Enabling the Star Trek Generation
Kjell Westerlund
February 15, 2001
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
AGENDA
 Overview
 Uses & Benefits
 Competing Technologies
 Target Markets & Applications
 Roll-out of Products & Forecast
 Roll-out of Silicon & Forecast
 Summary
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
What is Bluetooth?
 Short-distance wireless technology
–Open, global specification for voice and data
communication
–Nearly worldwide 2.4GHz ISM band
–Short-range radio (2.402-2.480GHz, 1Mhz ch.width)
 Some companies also considering 5GHz ISM band for future
technology
 Frequency hop spread spectrum
 Physical layer and low-level communications protocol:
Circuit & packet switching
 Supports point-to-point & point-to-multi-point
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
What is Bluetooth?
A radio system (not a radio)...
– Hardware description
– Software framework
– Interoperability requirements
…which links mobile information appliances
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Bluetooth Network Topology
 Radio Designation
– Connected radios can be master or slave
– Radios are symmetric (same radio can be
master or slave)
S
P
M
M
 Piconet
– Master can connect to 7 active and 200+
parked slaves per piconet
– Each piconet has maximum capacity (1
S
shared Mbps)
 Unique hopping pattern/ID per piconet
sb
P
P
sb
S
S
 Scatternet
– High capacity system
 Minimal impact with up to 10 piconets
within range
– Radios can share piconets!
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COMMUNICATION COMPONENTS AND MODULES
Basic Uses of Bluetooth
Landline
Cable
Replacement
Data/Voice
Access Points
Personal Ad-hoc
Networks
EUS/KM 01/16.01 Kjell Westerlund
And More!!
COMMUNICATION COMPONENTS AND MODULES
Basic Specs
 30 feet (10 m) proximity (Class3), with mobility allowed
–0 dBm nominal part (low-cost, low-power solution)
–Receiver sensitivity: -70dBm (many vendors >-70)
 300 feet (100 meters) with amplification (Class1)
–20dBm version (PC Cards, cordless phone bases, data access
points, printers)
–Receiver sensitivity: - 85dBm
 1Mbps symbol rate (next generation 2 - 12Mbps?)
 Connect w/standard interfaces: USB, RS-232, UART,
PCMCIA (PC Card)
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Profiles overview
.
Fax Profile
DT Terminal
Gateway
Dial-up Networking
Profile
DT Terminal
Gateway
Headset Profile
Audio GW
Headset
Synchronization Profile
IrMC Client IrMC Server
File Transfer Profile
Client
Server
Object Push Profile
Push Client Push Server
Intercom Profile
Terminal
Cordless Telephony
Profile
Terminal
Gateway
LAN Access Profile
DT Terminal LAN Acc P
Based on
AT Commands
Generic Object Exchange
Profile
Client
Generic Access Profile
(MANDATORY)
A-Party
B-Party
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Serial Port Profile
Device A
Device B
Server
Service Discovery
Application Profile
Bluetooth
Profiles
Local Dev Remote Dev
RFCOMM
SDP
TCS Binary
L2CAP
L2CAP
L2CAP
Bluetooth
Protocols
COMMUNICATION COMPONENTS AND MODULES
Bluetooth defined Profiles
.
Profile dependencies
Generic Access Profile
TCS-BIN-based Profiles
Service Discovery
Application Profile
Cordless Phone
Profile
Intercom Profile
Serial Port Profile
Dial-up Networking
Profile
Fax Profile
Headset Profile
LAN Access Profile
EUS/KM 01/16.01 Kjell Westerlund
Generic Object Exchange
Profile
File Transfer
Profile
Object Push Profile
Synchronization
Profile
COMMUNICATION COMPONENTS AND MODULES
Who Started Bluetooth?
 The Bluetooth Special Interest Group (SIG): 9-member
promoter Group
–Ericsson, Nokia, IBM, Intel & Toshiba (Founders) 1998
–3Com, Lucent, Microsoft and Motorola 2000
 Now over 2,164 members
–All of the industry segments are represented: Semiconductors,
telecom, Computing & Peripherals, Consumer, Networking,
Automotive & Industrial
 Many working groups with special focus automotive,
instrumentation, sensors, medical, etc.
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Benefits of Bluetooth: Business
 Increases value & functionality of their products
 Replace multiple ports with one Bluetooth port, lowering
costs
 Potential to increase air time used for mobile data
transfer by making it easier
 Has the potential for creating other recurring revenue
streams via consumer access points
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Benefits of Bluetooth: Consumer
 Offers customers increased value, flexibility, and
functionality of everyday communication
–Information exchange w/o cords
–Automatic data synchronization w/o cords
(remove items from your to-do list)
–Leave cables/cords behind (can’t be lost, stolen, broken, or
forgotten)
 Mobile while connected (not with IrDA)
 Communicate through solid objects (not with IrDA)
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Target Markets
Initially,
 The road warrior
 Other mobile workers
 High-End Consumer
 Early adopter
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Target Applications
 Portable & Handheld devices
–Cellular/PCS phones, digital cordless phones
–Notebook PCs, HHPCs, Palm Companies
–Digital Still Cameras
Adapters, Dongles, PC Cards
 Headsets
–Cell phone, cordless phone, PBX
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Target Applications
 Desktop PCs & Peripherals
–Desktops
–Printers and fax equipment
–Other PC peripherals
Voice & data access points
–Home PSTN access point
–Business LAN access point
–Home networking equipment
–Airports, shopping malls, other public locations
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Target Applications
 Automotive
–Audio
–Communication devices: Mic and speakers for hands-free
operation
 Wearable devices
–Senior assisted living applications
–Penal system applications
–Monitoring of children
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Target Applications
 Industrial
–Manufacturing plants, monitor processes
–Reduce wiring/ease installation
–Power metering, home and businesses
 Medical
–Hospital & other medical applications
–Cord-free monitoring/measuring
–Administration, duty rosters
 Security
–Computer, banking, government, purchase transactions
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Roll Out of Products
 The 1st Wave: Adapters/dongles, high end mobile phones,
notebook PCs, headsets, desktop PCs, access points
 The 2nd Wave: mid-range mobile phones, HHPCs/Palm
companions (integrated), cordless phones, home
networking, auto, industrial
 The 3rd Wave: Lower-end mobile phones & portable
computing, Internet applications, STBs
 Future: Smart appliances and ???
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Bluetooth-Enabled
Equipment Forecast
 About 1.4 Billion
Bluetooth-enabled
products
1.4
1.2
1
–Largest Market:
Digital mobile phones
–2nd largest:
Desktop PCs
–3rd largest: Portable
Computing Devices
–Primary Catalysts:
Mobile phones & notebooks
EUS/KM 01/16.01 Kjell Westerlund
0.8
B Units
0.6
0.4
0.2
0
2001 2002 2003 2004 2005
COMMUNICATION COMPONENTS AND MODULES
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Equipment Roll-Outs
 WIDCOMM: Bluetooth-ConnectTM (fits Visor’s Springboard
slot) design kit
–USB/serial adapter & PC Card SDKs
 Acer NeWeb: Manufacturing Blue-Connect, MSRP <$100,
& USB dongle
–PC adapter, other palm computing & cell phone device adapters
will follow
 TDK: +20dBm version PCMCIA Type II card, USB adapter,
& CompactFlash card
–Combo LAN/Bluetooth PC Card, GSM mobile phone kits, LAN
& modem access points
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Equipment Roll-Outs
 3Com: PC card for notebooks, $100-$139
 Psion Connect: WIDCOMM PC Card & adapter
 Proxim: Combo HomeRF/Bluetooth PC Card, (later Home
RF-only card)
 Digianswer/Motorola: USB dongle & PC Card, auto
kit, accessory mobile phones
 Axis Communications: Access points
 Intel, WLPO: Access points & PC adapters
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Equipment Roll-Outs
 Socket Communications: CompactFlash CF+ card
Windows CE
 Dell & Compaq: Agreement w/Psion
 Toshiba: Tecra notebook line first $50,
Portege line later, PC Card for notebooks <$200
 IBM: PC Cards (Motorola & TDK)
 NEC: prototype notebook PC
 TROY: Printer/PC adapters, demo/develop product,
product, consumer later
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Equipment Roll-Outs
 Alcatel: OneTouch 700/500 GSM phones
 Ericsson: GSM mobile phones
–Tri-band: T36, R520
–Headset & Bluetooth adapter for T28, T28 World, $320 phones
–PC Card Type II
–Home Base prototype (mobile handset at home)
 Nokia: handset adapter, handset
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Other Roll-Outs
 Nomad Networks & HP
–BlueStreakTM TWA clubs & gate areas
 Red-M
–Wireless Internet Server
–Bluetooth environment
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Challenges
 Silicon availability
 Software availability
 Must be VERY easy for the user - must be ready out of
the box with no installation
 Convince mass consumers of the benefits & value to drive
demand
 Branding: Create demand as with the “Intel Inside”
campaign
 Version 1.0b & upcoming 1.1
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Roll-out of Bluetooth
Solutions
 Early 2001: Announcements continue
Increased focus on offering total solutions
& partnering
 Late 2001: Embed Flash into baseband
Single-chip solutions
Host processing of protocol stack
 2002: Some ROM
 2004: Average complete solution dips <$5
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Solution Challenges
 Reduce costs to enable ubiquitous integration into
products
 Antenna placement, Packaging
 Interoperability: Unplugfests
 Integration of radio and baseband
–CMOS, BiCMOS, SiGe Bipolar & SiGe
BiCMOS, SOI BiCMOS
 Partitioning - host processing
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Silicon Roll-Outs
 Alcatel Microelectronics
–CMOS single chip
 Atmel/TEMIC
–Radio, Class 1 PA
–BB controller
 Broadcom/Innovent
–Radio sample now, BB controller
–Single chip
 Broadcom/Pivotal
–Single-chip Radio & BB w/o control
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Silicon Roll-Outs
 Cambridge Silicon Radio
–Multichip Radio & BB
–Single chip
 Conexant/Philsar
–2-chip Radio & BB
–Single chip
 Ericsson radio & module, first to sample solution
 Hitachi
–H8S (16-bit MCU) next version optimized for Bluetooth
 Infineon
–Power Amps
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Silicon Roll-Outs
 Intel: Ambler module & software
 Lucent Technologies
–Radio limited production now, full production
–BB controller
 Mitel
–BB Controller
 Motorola
–Radio
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Silicon Roll-Outs
 National
–RF chip, now; Link Controller, now
–2 chip radio & BB
 OKI
–Radio
 Philips
–VWS2600x BB
–BGB100 & 110 TrueBlue Radio, Blueberry BB
–RF IC
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Silicon Roll-Outs
 SiGe Microsystems
–Power Amp
 Silicon Wave
–Radio, production
 ST Microelectronics
–Radio
–Single chip radio & BB
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES
Summary
 Ramp up for Silicon
–1Q2001 and 2Q2001
 Technology challenges
–Cost, Host processing partitioning, Integration
–Interoperability
 Ramp up for Bluetooth-enabled equipment
2Q2001 and 2H2001
 Tremendous opportunity: Equipment, silicon, other
services
 Convey benefits & value to mass consumers
EUS/KM 01/16.01 Kjell Westerlund
COMMUNICATION COMPONENTS AND MODULES