Transcript Engineering 45 Materials of Engineering Introduction to MS&E

Engineering 45
Materials of Engineering
Lecture 1
- Introduction
to MS&E -
Carlos Casillas, PE
19-Jan-12
Licensed
Chemical
Engineer
Spring 2012
Subtitle
or main
author’s name
[email protected]
Hayward, CA
Engr 45 - Materials of Engineering
Lecture Notes
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Course No:
Instructor:
Email:
Lecture No:
Lecture Title:
Date:
Engineering 45
Mr. Casillas
[email protected]
1
Chp1: Introduction to MS&E
19-Jan-12
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Engineering 45- Materials of Engineering
Carlos Casillas, PE
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Engineering 45 Materials of
Engineering - Outline • R1: Background
• Roll Call
• Course Syllabus
– Goals
– Labs, Field Trips
– VSME
• R2: Course Overview – Materials Science &
Engineering
• Next Week: Chp 2: Atomic Structure & Bonding
– C&R Chp 3: Structure of Crystalline Solids
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Instructor’s Background
School
Stanford University
Major
Degree
Year
Engineering
A. A.
1981
B. S.
1983
M. S.
1985
Chemical
Engineering
Certificate
Field
Year
Engineer-in-Training (EIT)
General Engineering
1983
Licensed Professional Engineer (PE), State of CA
Chemical Engineering
1996
Summer Internship
Position
Year
Dow Chemical Co.
Jr. Engineer
1982
Mobil Chemical Co.
Summer Engineer
1983
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Instructor’s Background, con’t
Employer
Novellus Systems, Inc.
Watkins-Johnson Co.
#
People
Industry
Position
#
Years
70
Nanotechnology Startup
Process Engineer/
Materials Scientist
~6
>8,000
Magnetic Data Storage
Manufacturing Engineer,
Thin-Film Head Process
4.5
>5,000
Semiconductor Process
Equipment Manufacturer
Process Engineer
4
60
Polymer Membrane
Separations Startup
Research Engineer
~5
>2,000
Semiconductor Process Process Engineer/ Member
Equipment Manufacturer
of Technical Staff
3
>8,000
Semiconductor
Manufacturer
Project Engineer
~1
30
LED Manufacturer
Startup
Process Engineer
1.5
(Engr-45 day-1 roll-call/class distribution)
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Engineering 45- Materials of Engineering
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E45_Sp12_Lec01_Introduction
Welcome to the Wide World of MS&E!
• ALL of
Engineering
is impacted
by Materials!
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Instructor’s Background, con’t
Some items for show and tell (later on):
Nanostructured Materials
Au Nanoparticles, Si Nanowires (Gecko effect)
II-VI Nanocrystals (Fluorescent), Flat-Panel LCDs
Flash-Memory (Nano), Nano-Transistor
Nano-Aerogels (JPL/NASA)
Semiconductor Thin Film – Si, III-V
Magnetic Data Storage, Thin-Film R/W Head, HDD
Advanced Thermal Insulators & Conductors
Cu Heat Pins – PECVD Al Showerhead
Specialty Ceramics, Ferromagnetic Fluids
Polymer Membranes Gas Separation
Spiral-wound, hollow-fiber modules
Smart Materials – Shape Memory NiTinol Wire
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Engineering 45- Materials of Engineering
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Engr 45 Course Logistics- Syllabus Review
• Text:
• “Materials Science and Engineering
–An Introduction” 8th Edition,
William D. Callister and David G.
Rethwisch, John Wiley & Sons (2010)
• 3.0 Units:
• PreReq’s:
• Chemistry 1A
• Physics 4A
• Engineering 25
• 2-hr Lec (Th 1-2:50pm), Rm 3902
• 3-hr Lab/Field Trip (M 4:30-7:20pm),
Rm 1612
• Lab teams 2-3 students, switch teams
every two labs, switch roles every lab
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E45_Sp12_Lec01_Introduction
Engr 45 Course Syllabus Review, con’t
• Lecture notes, homework solutions, etc will be
sent by email and posted at the Chabot
Engineering webpage:
http://www.chabotcollege.edu/faculty/bmayer/
• Communication will be mainly by e-mail, through
the CLPCCD GroupWise/Novell Web Access email system.
• Office hours will preferably be right after lecture
or lab. Other times can also be arranged if
needed.
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Syllabus Review, con’t
• Grading - Weight Function & Policy *
Class/ Field Trip
Participation
MiniQuizzes
Labs/ Field Trip
Reports
HW Assignments
MidTerm Exam-1
MidTerm Exam-2
Final Exam
1%
90%-100%
80%-89.99%
70%-79.99%
60%-69.99%
<60%
3%
14.5%
16.5%
21%
21%
23%
A- to A+
B- to B+
C- to C+
D- to D+
F
* Instructor reserves prerogative to adjust
based solely on his professional judgment
of class performance
• Exams: During class, dates shown in schedule in Syllabus
• Open-text & single, hand-written SRS allowed, TB turned in
• Academic honesty is expected (assigned seating)
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Engr-45 Lecture Tentative Schedule
Textbook Reading Assignment
Mtg
Day
Date
1
R2
19-Jan-12 Chp1: Intro to Materials
2
MLb 23-Jan-12 Chp2: Atomic Bonding; Chp3 p-1: Xtal Structure
R1, R2 26-Jan-12 Chp3 p-2: Crystallography; Ch4-4.9-4.11 Microscopy
3
R1, R2 2-Feb-12 Chp4: Solid Imperfections
5
R1, R2 9-Feb-12 Chp5: Diffusion
7
R1, R2 16-Feb-12 Chp18: Electrical Properties; Metals, Semiconductors
9
R1, R2 23-Feb-12 Chp18: Dielectric Properties; Chp19: Thermal properties
10
R1, R2 1-Mar-12 Chp20: Magnetic Properties; Chp21: Optical Properties
12
R1, R2 8-Mar-12 Chp6: Metal Mechanical Properties - 1 & 2
14
R1, R2 15-Mar-12 Chp6: Metal Mech Props - 3; Chp7: Dislocations & Strengthening - 1
16
R1, R2 22-Mar-12 Chp7: Dislocations & Strengthening - 2; Chp8: Mech Failure - Fracture
18
R1, R2 29-Mar-12 Chp8: Mech Failure - Fatigue/Creep; Chp9: Phase Diagrams - 1
20
R1, R2 5-Apr-12 Chp9: Phase Diagrams - 2; Chp10: Phase Xforms - 1
22
R1, R2 19-Apr-12 Chp10: Phase Xforms - 2; Chp11: Metals Applications - 1
24
R1, R2 3-May-12 Chp11: Metals Applications - 2; Chp12: Ceramics
28
R1, R2 10-May-12 Chp13: Ceramic Applications; Chp14: Polymers
30
R1, R2 17-May-12 Chp15: Polymer Applications; Chp16: Composites
32
Note: Read Chapter Assignments BEFORE class
• HW Assignments are due at the beginning of class on due date in Syllabus
• Lowest-score two HWs will be thrown out. All problems will be graded.
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E45_Sp12_Lec01_Introduction
Engr-45 Labs & Field Trips
Tentative Schedule
Lab Reading & Field Trip Assignments
Mtg
Day
Date
4
MLb
30-Jan-12 Lab1: Metallurgical Microscope
6
MLb
6-Feb-12 Lab-L2: Prep for R(T) Lab at SJSU
8
MLb
13-Feb-12 FT1: Tour of GE Nuclear (Reactor Training Center SJ)
11
MLb
27-Feb-12 Lab2: Electrical Resistivity (Rm 1616 or 1612)
15
MLb
12-Mar-12 Lab3: Thermal Specific Heat (Rm 1616 or 1612)
17
MLb
19-Mar-12 FT2: @SJSU - MATE-153 SJSU-L6
19
MLb
26-Mar-12 FT3: Lab Tour at Testing Engineers, Inc.
21
MLb
2-Apr-12 Lab4: Mech Properties - Brinell Hardness
23
MLb
16-Apr-12 FT4: Lab Tour at Anamet, Inc.
25
MLb
23-Apr-12 Lab5: Composite Beam, Pure Material
27
MLb
30-Apr-12 FT5: Tour of Union Sanitation Treatment Plant
29
MLb
7-May-12 FT6: Tour of ThermoFusion Heat Treating
31
MLb
14-May-12 Lab6: Composite Beam, Sandwich Material
Note: Read Lab Assignments and Research the FT Organization BEFORE the dates shown
• Sixth Lab Report and Sixth Field Trip Report are both extra-credit
• Attendance to all Labs and Field Trips is mandatory
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E45_Sp12_Lec01_Introduction
Engr-45 Course Goals
• Understand the fundamental concept of
Materials Science & Engineering:
– “There is a direct relationship between a
material’s synthesis & processing (postmanufacture), and its internal microstructure
and observable physical properties and
engineering performance”
• Materials are ENGINEERED Structures
• NOT Black Boxes
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• Class Q: Materials Engineering &
Technology → What is it?
• Investigating the Structures & Properties
of Materials and Correlating these with
the Design or Engineering or Technology
Objectives
Structural Feature
 Basic Material
Structure Has
Many
Dimensions
Dimension (m)
Atomic Bonding
<10-10
Missing/Extra Atoms
10-10
Crystals (Ordered Atoms)
10-10 - 10-1
Second Phase Particles
10-8 - 10-4
Crystal Texturing
>10-6
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E45_Sp12_Lec01_Introduction
Classes of Materials
• From Chem1A Recall The Periodic Table of Elements
Polymers
Ceramics
SemiConductors
Metals
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E45_Sp12_Lec01_Introduction
Metals
• May be Pure or Compounds (Alloys)
– Along with Polymers The Most Common
Everyday Material
– Typically from the 1st Row of Transition Metals in
Periodic Table (Fe, Cu, Ni, etc.)
– Have LARGE Numbers of NonBound Electrons
• Makes them Good Electrical & Thermal
CONDUCTORS
– Strong but Deformable (Ductile)
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E45_Sp12_Lec01_Introduction
Ceramics cont.
• Some Typical Properties
– HARD & BRITTLE
– HIGHEST Temperature Resistance
• Thoria (Thorium Oxide) Max Temp  3000 K
– Llttle Temperature-SHOCK Resistance
– Corrosion Resistant
– Electrically Resistive (Insulative)
– Difficult to Join
• Do Not Weld
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Engineering 45- Materials of Engineering
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E45_Sp12_Lec01_Introduction
Ceramics cont.
• Some Typical Properties
– HARD & BRITTLE
– HIGHEST Temperature Resistance
• Thoria (Thorium Oxide) Max Temp  3000 K
– Llttle Temperature-SHOCK Resistance
– Corrosion Resistant
– Electrically Resistive (Insulative)
– Difficult to Join
• Do Not Weld
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Engineering 45- Materials of Engineering
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E45_Sp12_Lec01_Introduction
Polymers cont.
• Some Typical Properties
– Very LightWeight
– Very Corrosion Resistant
• Best of ANY Class of Material
– Little, if any, Hi/Lo Temperature Resistance
– Little Structural Strength
– Very Deformable (ductile/flexible)
– Lowest $-Cost:Volume Ratio for Any
Class of Material
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Engineering 45- Materials of Engineering
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E45_Sp12_Lec01_Introduction
SemiConductors
• May be made CONDUCTIVE or
INSULATIVE (or Something inbetween) by the Addition of Miniscule
Amounts of IMPURITIES
– Current Techniques Allow Precise Control
over the AMOUNT and LOCATION of the
Impurities
• Semiconductors are Very Important
Electronic Device Materials
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E45_Sp12_Lec01_Introduction
Semiconductors cont.
• Most SOLID STATE (no moving parts)
Electronic Devices are Semiconductors
• Major applications for Semi Transistors
– Voltage Amplifiers
– On/Off switches
• Additional Advantage: Semiconductor
Electronic Devices can be constructed at
Extremely SMALL Scales
• SILICON is the Most Widely Used
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Composites
• Materials that Consist of
More than One Material Type
– Goal is to Combine the Best
Features of Multiple Materials
• Some Examples
– FiberGlass = Glass (ceramic) +
Polymer
• Strength + Flexibilty
– ReInforced Concrete = Steel +
Concrete
• Tension-Strength +
Compression-Strength
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E45_Sp12_Lec01_Introduction
BioMaterials
• Defined as Those Materials Which
Are compatible with Human Tissue
– Classic Example = Stainless Steels
used For Bone repair (Screws,
Staples, Plates, Hip-Joints)
• At least a few of ALL other
Classes of Materials are
BioCompatible
– Including Silicon
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Engineering 45- Materials of Engineering
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Smart Materials
• Smart Materials  Materials That
Can Sense Changes in the
Environment and Respond with a
Material Shape/Property Change
– Example: "smart" materials that can be
attached to, or embedded in, structural
systems
• enable the structure to sense disturbances,
process the information and through
commands to actuators, to accomplish
some beneficial reaction
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Engineering 45- Materials of Engineering
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[email protected]
E45_Sp12_Lec01_Introduction
Ceramics
• Basic Composition is the
MINERAL Form of a Metal
– Very Few Metals Exist in
PURE Form in Nature
• Most That Do are Very Rare, e.g., Gold
• Ceramics are Compounds of Metals and
– Oxygen → Oxides (most Ceramics)
– Carbon → Carbides
– Nitrogen → Nitrides
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Engineering 45- Materials of Engineering
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E45_Sp12_Lec01_Introduction
Basic Material Properties
Mechanical properties
Thermal expansion
General
Young’s modulus, E
Strain 
Stress 
 Tensile (fracture)

ts

Young’s
modulus, E
Strain 
Expense:
Cost/kg Cm, $/kg
Mechanical
Stiffness:
Young’s modulus E, GPa
Strength:
Elastic limit y , MPa

Fracture strength: Tensile strength ts , MPa
Brittleness: Fracture toughness KIc , MPa·m1/2
Expansion: Expansion coeff. , 1/K
Conduction: Thermal conductivity , W/m·K
Specific Heat (Capacity), cp or cv, J/kg·K
Electrical
Conductor? Insulator? Conductivity σ, S/m
Dielectric Capacity, F/m
Expansion
coefficient, 
Temperature, T
Thermal conduction
Thermal
Brittle materials
strength,
Density , kg/m3
Thermal strain 
Elastic limit,y
Weight:
T1
Area A
x
To
Q joules/sec
Heat flux, Q/A
Stress 
Ductile materials
o
Thermal
conductivity, 
(T1 -T0)/x
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Engineering 45- Materials of Engineering
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E45_Sp12_Lec01_Introduction
Material Properties
Property
Stimulus
Result
Mechanical
load
deformation,
stress, strain
Envt./Chemical
chemicals, temp
corrosion
Terms
“structural matls”
modulus/stiffness,
strength, toughness
passivity, pollution
(aqueous solution)
“electronic matl.s”
semiconductors,
resistivity, dielectric
magnets, hysteresis,
moments
Electrical
electrical field
conductivity
Magnetic
magnetic field
magnetism
Thermal
heat
conductivity
heat capacity,
thermal expansion
Optical
radiation
(em, light)
color,
transparency
index of refraction,
reflectivity
• Material performance depends on material properties
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E45_Sp12_Lec01_Introduction
Material Properties
• Density (g/cm3)
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Mechanical Properties, con’t
• Tensile Strength (MPa)
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E45_Sp12_Lec01_Introduction
Mechanical Properties, con’t
• Stiffness or Elastic Modulus E (GPa)
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Engineering 45- Materials of Engineering
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Mechanical Properties, con’t
• Fracture Toughness [MPa*(m)E0.5]
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E45_Sp12_Lec01_Introduction
Electrical Properties
• Conductivity (1/Ohm-m)
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E45_Sp12_Lec01_Introduction
Electrical Properties
Increase
resistivity of Cu
• by adding
impurities
• by mechanical
deformation
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Engineering 45- Materials of Engineering
Carlos Casillas, PE
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E45_Sp12_Lec01_Introduction
Processing  Structure  Properties (con’t)
• PROPERTIES depend on STRUCTURE
– e.g.; The HARDNESS vs STRUCTURE of Steel
(d)
600
Hardness (BHN)
500
400
Ferrite +
Cementite
(a)
G10380 +
w/ Pearlite
200
30m
100
0.01 0.1
Engineering 45- Materials of Engineering
30m
(c)
(b)
4m
300
30m
UNtempered
Martensite
Tempered
Martensite
PROCESSING can
change STRUCTURE
– e.g., STRUCTURE
vs Cooling-Rate
for Steel
1
10 100 1000
Cooling Rate (C/s)
Carlos Casillas, PE
[email protected]
34
E45_Sp12_Lec01_Introduction
Processing  Structure  Properties
• Recrystallization
Strength versus Structure
of Brass
and changes in
microstructure
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Engineering 45- Materials of Engineering
Carlos Casillas, PE
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E45_Sp12_Lec01_Introduction
• Thermal Properties
• low from ceramic oxide (structure and conduction
properties)
• changes due to alloying in metals (even though same
structure)
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Engineering 45- Materials of Engineering
Carlos Casillas, PE
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E45_Sp12_Lec01_Introduction
Processing  Structure  Properties (con’t)
• Optical
Properties
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Carlos Casillas, PE
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E45_Sp12_Lec01_Introduction
Effect of Temperature
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Engineering 45- Materials of Engineering
Carlos Casillas, PE
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E45_Sp12_Lec01_Introduction
Course Goals, con’t
• Materials are
ENGINEERED
Structures
• NOT Black
Boxes
39
Engineering 45- Materials of Engineering
Carlos Casillas, PE
[email protected]
E45_Sp12_Lec01_Introduction