Memory - 2 10/27/08 ECE 561 - Lecture 13 Memory 2 Memory • The internal structure of the ICs • ROM Types and RAM 10/27/08 ECE.
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Memory - 2 10/27/08 ECE 561 - Lecture 13 Memory 2 1 Memory • The internal structure of the ICs • ROM Types and RAM 10/27/08 ECE 561 - Lecture 13 Memory 2 2 Memory Types • How a ROM works 10/27/08 ECE 561 - Lecture 13 Memory 2 3 A 128 x 1 ROM • The basic structure 10/27/08 ECE 561 - Lecture 13 Memory 2 4 Larger Array Sizes • Arranged in blocks 10/27/08 ECE 561 - Lecture 13 Memory 2 5 Commercial ROM Types • Table 9-5 – Type Tech ReadCyc WrCyc Comments – – – – – – – – – Write once, low pwr 10/27/08 MASK ROM NMOS 10-100ns CMOS MASK ROM Bipolar <100ns PROM EPROM EEPROM 4 weeks 4 weeks Write once, h pwr low density Bipolar <100ns 10-50us/byte Write once, h pwr NMOS 25-200ns 10-50us/byte Reusable, low pwr CMOS NMOS 50-200ns 10-50us/byte 10,000 to 100,000 writes per location ECE 561 - Lecture 13 Memory 2 6 EPROM • Erasable Programable Read Only Memory 10/27/08 ECE 561 - Lecture 13 Memory 2 7 EPROM • Uses a floating gate for the FET at each bit location • User uses a programming voltage that causes a temporary breakdown in the dielectric between the gate and the floating gate to charge it. • When programming voltage is removed the charge stays • How long? EPROM manufacturers “guarantee” properly programmed bit has 70% of charge after 10 years. • Use UV light to erase 10/27/08 ECE 561 - Lecture 13 Memory 2 8 EEPROM • Electrically Erasable PROM • Like the EPROM only electrically erasable in circuit. • Many times referred to a “flash” programmable memory • Very slow on writes so not a substitute for RAM 10/27/08 ECE 561 - Lecture 13 Memory 2 9 General Block Diagram • xROM 10/27/08 ECE 561 - Lecture 13 Memory 2 10 General Timing • General timing parameters 10/27/08 ECE 561 - Lecture 13 Memory 2 11 The timing parameters • • • • • Access time from address – tAA Access time from chip select - tACS Output-enable time - tOE Output-disable time - tOZ Output-hold time - tOH 10/27/08 ECE 561 - Lecture 13 Memory 2 12 R/W Memory • Memory to store and retrieve data when more than F/Fs • A few types • Static RAM – SRAM – As long as power is maintained data is held 10/27/08 ECE 561 - Lecture 13 Memory 2 13 SRAM • The data storage 10/27/08 ECE 561 - Lecture 13 Memory 2 14 A static RAM chip • Internal – an arrangement of storage sturctures 10/27/08 ECE 561 - Lecture 13 Memory 2 15 SRAM Timing • Timing for write similar (see Fig 9-23) 10/27/08 ECE 561 - Lecture 13 Memory 2 16 DRAM • Next step in memory is Synchronous SRAM which has a clocked interface for control, address and data. • Then comes DRAM – dynamic ram Bit line • In DRAM data is stored Word line • in a semiconductor • capicator. 10/27/08 ECE 561 - Lecture 13 Memory 2 17 DRAM Read • A read sees the bit line precharged to high. • The word line is then activated • If cell stores a 0 then there is a small drop on the voltage on the bit line • This is monitored by a sense amp which provides the value stored • Value must be written back after the read. 10/27/08 ECE 561 - Lecture 13 Memory 2 18 DRAM Refresh • Charge stored leaks off over time • Must restore the values stored – A 4096 row DRAM – refresh every 64ms – Thus each row every 15.6 usec • Larger DRAMs are banks of smaller 10/27/08 ECE 561 - Lecture 13 Memory 2 19 DDR SDRAM • Double data rate SDRAM • Double the data transfer rate of an SDRAM by transferring on both edges of the clock • Access and setup times are the same as SRAM • Increased data thruput as data is transferred in blocks. 10/27/08 ECE 561 - Lecture 13 Memory 2 20