Transcript Murata RoHS & Lead Reduction Activities 23rd September 2004 Agenda Welcome & Introductions Background Lead Free Manufacturing The Legislation Manufacturing Issues Murata Activity & Direction Part Numbering Changes Distribution.

Murata RoHS & Lead Reduction Activities
23rd September 2004
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Agenda
Welcome & Introductions
Background
Lead Free Manufacturing
The Legislation
Manufacturing Issues
Murata Activity & Direction
Part Numbering Changes
Distribution Stock Rotation
Questions & Answers
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Background
Lead has been known to be a poison for many
centuries.
Despite this lead has been the primary constituent of
solder since the beginning of the electronics industry.
Recently environmental activists have been working
to eliminate lead from many products and ban the
dumping of equipment containing lead in land fill
sites.
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For Non Chemists
Common chemical symbols
– Copper
Cu
– Gold
Au
– Lead
Pb
– Nickel
Ni
– Palladium
Pa
– Silver
Ag
– Tin
Sn
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Lead Free Manufacturing
What is really meant by these terms?
– Lead free manufacturing
– Lead free terminations
– Lead free components
We see confusion and poor understanding in
the industry!
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Lead Free Manufacturing
The production of PCB’s using solder
containing no lead and components with lead
free terminations.
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Lead Free Terminations
In most cases when customers ask for lead free they
really mean lead free terminations.
This means components with terminations and/or
legs containing no lead.
– A typical replacement for lead would be tin although many others are
available.
Lead free solders have a higher melting point than
traditional solders and this places additional thermal
stresses on components.
– Termination and packaging materials?
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Lead Free Components
This is a much more difficult concept!
– Most ceramic materials contain some lead.
– Piezo electric components won’t work unless they contain lead!!
– Components containing glass and many plastics will also contain
some lead.
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The Legislation (1)
The WEEE Directive
By 13th August 2005
 Producers will be responsible for financing the collection, treatment, recovery and disposal
of Waste Electrical & Electronic Equipment (WEEE) from private homes and other users
By 31st December 2006
 Producers will be required to meet demanding recycling & recovery targets
 UK must achieve an average WEEE collection rate of 4kg per household By 31 st
December 2006
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The Legislation (2)
RoHS (Restriction of Hazardous Substances)
From 1st July 2006
 New electrical and electronic equipment will NOT contain lead, mercury,
cadmium, hexavalent chromium, polybrominated biphenyls or
polybrominated diphenyl ethers.
 Certain applications are exempt eg:
Certain military applications
Repair and refurbishment
Large stationary platforms
Lead in glass in electronic components
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Manufacturing Issues (1)
Solder
State
Temp (Celsius)
Tin-Lead (Pb)
Liquidus
183 degrees
Reflow
215 degrees
(~33oC above Liquidus)
Optimum ~
230 degrees
Pb free
Liquidus
217 degrees
Reflow
238 degrees
(~20oC above Liquidus)
Optimum ~
260 degrees
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Manufacturing Issues (2)
Lead-free manufacturing issues :
 Elevated solder temperatures
 Tin whiskers
 Lack of field data
…………………………. Reliability?
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Elevated Solder Temperatures
Murata fire our ceramic at a temperature far in
excess of the melting point of any solder!
– Termination materials
– Leaded components
– Dipped components
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Comparison Data - LQH32
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Comparison Data - LQP15
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Joint Reliability - LQH32
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Joint Reliability - LQH32
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Joint Reliability - LQP15
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Joint Reliability - LQP15
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Solderability Tests - MLCC
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Resistance To Soldering Heat
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Test Results
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Soldering Reliability
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Test Results
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Tin Whiskers
What are they?
Areas of concern
Growth mechanism
Prevention
Murata position
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What are they?
“A spontaneous columnar or cylindrical
filament of mono-crystalline tin emanating
from the surface of a plating finish.”
Not to be confused with “dendrites” which are
very different and much much smaller.
Tin whiskers can reach several 10’s of mm in
length.
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Areas Of Concern
Tin whiskers are not a new phenomenon!
Increasing use of tin (Sn) as a RoHS
compliant termination material has brought
tin whiskers to everybody's attention.
In extreme cases - especially in high density
PCB designs and when using ultra miniature
chip sizes (0603/0402/0201) - whiskers can
easily bridge PCB tracks!
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Causes & Growth Mechanisms
Constant Temperature Whiskers
– Produced by the internal stresses generated by the diffusion of
base metal in to the tin layer.
– Fastest growth at 50 Celcius.
High Humidity Whiskers
– Produced by the internal stresses generated by the oxidation of
the tin layer in high humidity (more than 85%RH) conditions.
Thermal Cycling Whiskers
– Produced by the internal stresses generated by differences in
coefficient of thermal expansion between the base metal/under
plating layer and tin layer.
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Countermeasures 1
Constant Temperature Whiskers
– These have been well known for over 20 years
– Countered by using nickel plating between the electrode and tin
surface plating
– Murata GR design: -
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Countermeasures 2
Humidity Whiskers
– Plating specification & quality
Thermal Cycling Whiskers
– Plating specification & quality
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Countermeasures 3
The PCB construction and/or soldering
process can also affect whisker growth.
This is outside of the control of the
component manufacturer……..and distributor.
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Murata’s Position
The vast majority of our products use tin
external electrodes to comply with RoHS.
– Some parts use silver or gold therefore posing no risk with regard
to tin whiskering.
Many trials have been conducted by Murata.
We are confident that, when used in
commercial, domestic and automotive
applications our plating specification is such
that tin whisker growth will pose no problem
for our customers during the expected life
time of such equipment.
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Official Murata Report #1
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Official Murata Report #2
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Murata Catalogues
For Lead Free: -
For RoHS: -
See data pack.
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Murata Position on Lead Free
All products that we wish to promote are
available with lead free terminations as of Dec
31st 2003.
Customers wishing to continue to take lead
containing parts are currently being
supported…but……
Ongoing development work to completely
remove lead where ever possible…..but this is
a long term project.
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Lead Elimination Example
Old: CSTCS_MX
(4.7 x 4.1 x 2.0mm)
New: CSTCG_V
(2.0 x 1.3 x 0.95mm)
Product size: Reduced by 93%
Content of lead compound: Reduced by 99%
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Murata Position on RoHS
All parts are available RoHS compliant with
the exception of: – High frequency power capacitors (DCxx Series P/No’s)
– Some piezo sounders (but alternatives available!)
– Some ceramic filters (but alternatives available!)
– Fly back transformers
– Switching power supplies
– Infra red sensors
– Ultra sonic sensors
– Rotary & magnetic sensors
– Electrical potential sensors
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Questions?
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