Transcript Hervé Lebbolo, François Rossel , Aurore Savoy-Navarro LPNHE-Universités de Paris 6&7/IN2P3CNRS TOPICS: Main parameters of the Si-Envelope Front-End Issues: Long shaping time Proposed F.E schema Digitization on.

Hervé Lebbolo, François Rossel , Aurore Savoy-Navarro
LPNHE-Universités de Paris 6&7/IN2P3CNRS
TOPICS:
Main parameters of the Si-Envelope
Front-End Issues:
Long shaping time
Proposed F.E schema
Digitization on detector F.E
DAQ & Trigger: very preliminary ideas
Amsterdam, 1st to 4th April 2003
The Si-Envelope components:due to their location the functions of
each piece of the Si-envelope may (slightly) differ
SET
Si-FCH
SIT
FTD
As in AMS Si-tracker, we propose
to build long ladders made of
N sensors bonded to each other
F.E. electronics
connector
The Si-envelope components in a few numbers:
Si-envelope Component
Items
Total Number
Si-FCH (XUV)
Nb of layers
Nb of ladders , 4 sensors
Nb of ladders, 5 sensors
Nb of ladders, 6 sensors
Nb of RO channels/endcap
Power dissipation
4 XU + 2 VV
192
480
288
983,000
393 Watts
SET
Nb of layers
Nb of ladders
Nb of RO channels
Power dissipation
2 1-sided + 1 2-sided
4480
2,293,760
920 Watts
SIT
Nb of layers
Nb of ladders
Nb of RO channels
Power dissipation
2 2-sided
38 + 94 =132
270,336
110 Watts
The Front-End Electronics issues
Starting point: the AMS electronics R.O. System
Proposed Front-End design: the basics
The Long shaping time
Power consumption: main goal = passive cooling
Tracking any possible way to spare power
dissipation in the electronics on-detector
=> Look for power cycling of electronics
Digitization on the detector F.E. ?
Starting point: the AMS Si-tracker Readout system
(With particular thanks to G. Ambrosi, Ph. Azzarello, W.Lusterman and
the ETH-Zurich, Geneva U.& Peruggia U. AMS teams for their support)
Tracker Front-End
Input Capa =
33 –72 pF
VA_hdr/AMS64:
64 charge ampli+
CR-RC shaper+
S&H +
64 ch connected to
voltage-current output buffer by
analog mux seq. RO@ up 10 MHz
Measured ENC=
(350+4/pFxC) electrons
at 6 µsec peaking time
For ladder of 116 or 232 cm, input C=
1.4 pF x 116 or 232  N=350 + 4xC….
Tracker Data Reduction
12 bit low power A/D
(CLC949), as need:
large dynamic range
+/- 100 MIPs
dig. @ 5 MHz
A/D coupled to DSP via
FPGA (Xilinx XC4013)=
buffer for up to 3 evts &
sequencer for FE timing
signals and synchro data
transfer.
16 bits-DSP @30MHz for
calib and data compression
AMS2 : new improved Readout system
By courtesy of G. Ambrosini
New Front End:
New hybrid: VA_hdr9a, 0.8µ
Internally generated biases, internal calib capa
Nominal gain 1.4 µA/fC
Nominal peaking time 6 µsec
ENC=(300 + Cdet x 5/pF)e Good gain stability & small pedestal spread
New readout scheme:
Simplified and HCC
(Hybrid Control Circuit)
Minimize digital cable line
Control daisy chain of VA
Increase system reliability
Follows space rules
Long ladder prototype
Lab test bench:
@LPNHE-Paris
A long ladder made of 7 AMS sensors
has been built at Geneva U. (assembling
& mounting), bonded at CERN (ETHZ),
allowing a variable length for test :
L = N[1, 2, 4, 8] x 28 cm long
This long ladder is ready by 2nd of April
equipped with AMS FE electronics (VA
Preampli) or direct access at the µcrostrip
output.
First complete test on lab test bench at
Geneva U. will be extensively pursued in Paris
Also starting simulation studies on
new FE+RO possible designs
(Ongoing similar studies at UC Santa Cruz,
on a 2 m long ladder)
Sensors:
70.0x40.1 mm2
300 µm depth
110µm/208µm
RO pitch
p(junction side)
n(ohmic side)
The prototyped
long ladder
Protyped ladder:
VFE electronics
Proposed F.E. Readout chain: very preliminary ideas
512 channels/ladder
2560 channels/drawer
A/D=0.35µtechno, 8 bits
1MHz clock, 1.2mW
Main concern: low noise and sparing power dissipation at each corner of on-detector electronics
Cooling studies
What infos do we need from the Si-tracker?
1) Detector occupancy?
Will be different according to the detector location
SET: preliminary studies  occupancy  1 %
SIT, FTD or Si-FCH should have higher occupancies
(higher backgrounds)
 SPARSIFICATION on detector F.E. ?
2) Double & Multiple hit rates ? Thus ambiguities must be estimated
3) Pulseheight info (Q) needed?
Yes if cluster centroid
( 8 bit A/D ?)
4) Timing information ? R.O both ends of the long ladder?
5) Pedestal substraction on board?
6) DSP-like processing for eventual cluster algorithm
and eventual fastrack processing algorithm
at what level in the electronic chain ???
7) Power dissipation studies: preliminary results  don’t seem to be a
major issue (more detailed ongoing studies)
All these issues must be studied with electronics and physics &/or detector
performance simulations and tests on the test bench (just starting . . .)
Output of the signals: very preliminary proposal
DAQ & intermediate ‘trigger’: very preliminary ideas
Based on the current experience with the trigger system related to
the tracking system in CDF, we are foreseeing to study a
Fastrack ‘trigger’ (or realtime processing) system that could be
used to
1) Do a fast clustering and determine in realtime the cluster centroid
2) Do a fast tracking for stiff tracks (above 1 or 1.5 GeV/c
momentum) with the overall Si tracking information, i.e.
starting with the SIT + SET and then linking to the µvertex
informations
And similarly in the forward region, perform a track
segment reconstruction in FTD and Si-FCH, separately and
possibly link them.
Concluding remarks
Our main efforts are currently focusing on developing the Lab test bench
and starting an extensive detailed study of the long ladder prototype with
variable length and different possible Front-Ends
The starting scheme = AMS FE and RO system
Also looking for compatibility with the general RO & DAQ frame of the
LC experiment
In parallel , both electronics and physics + detector performances
simulation studies are/will be undergoing for studying new FE and RO
schemes and algorithms to eventually include in the RO chain for more
sophisticated realtime processing of data (cluster centroid, fast tracking
etc…). Use of present CDF experience and ongoing LHC developments.
This work will be developed within SiLC (PRC submission in May)