Slide 1

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 2

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 3

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 4

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 5

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 6

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 7

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 8

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 9

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 10

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 11

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 12

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 13

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 14

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 15

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 16

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 17

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 18

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 19

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!


Slide 20

Unlocking the Mystery of
Circuit Board Failures
A Case Study
Presented By:
Alaa Arif
EDTC 560
January 15, 2007

Terms & Definitions
 Board: Printed Circuit Board (PCB).
 ESD: Electro-Static Discharge.
 It is the release of a build up of charge, similar to the
shock some people experience when touching a metal
surface or another person.

Terms & Definitions
 FPY: First Pass Yield.
 The percentage of boards that pass the test during the
first trial.

 NDF: No Defect Found failure.
 Failure without any apparent cause.

Problem Statement
 Boards Failures:
 For the first time in the company’s history, a newly

released product failed to reach FPY goals.
 Quantity of boards failures exceeded all
expectations.

Analysis
 Analysis revealed that 2 types of failures

are mainly responsible for the low FPY:
 ESD Failures
 NDF Failures

40
35
30
25
ESD
NDF

20
15
10
5
0
August, 06

October, 06

November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - ESD
 ESD Failures:
 Caused by unsafe
ESD practices.

40
35

 ESD could

30
25

damage sensitive
components on
the PCB.

ESD
NDF
VF

20
15
10
5
0

 Increased over the
first 3 months.

August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Analysis - NDF
 NDF Failures:
 Caused by

40

operator

35

error.

30

 Malfunction

25
20

of test

15

equipment.

10

 Decreased
over the first

3 months.

ESD
NDF
VF

5
0
August, 06

October, 06 November, 06

Solution - ESD
 Addressing ESD Failures at each level:
 Work station.
 Operators.

Solution - ESD
 Work Station:
 Properly ground the
work station.
 Coat floor with
ESD-safe material.

 Cover workbench
with ESD-safe mat.

Solution - ESD
 Operator:
 Wears ESD-safe
smock.
 Uses ESD-safe wrist
strap.

 Cover shoes with
ESD-safe heel straps.

Solution - NDF
 Addressing NDF at each level:
 Test Equipment.
 Operator.
 Procedures.

Solution - NDF
 Test Equipment:
 Train maintenance
technicians.
 Increase frequency of
preventive

maintenance.
 Provide ample quantity
of spare parts.

Solution - NDF

40
35
30
25
ESD
NDF
VF

20
15

 Operator:

10
5
0
August, 06

 Share with operators the test
results.
 Explain the consequences of the
excessive amount of boards

failures.
 Train and re-train operators.

October, 06

November, 06

Solution - NDF
 Procedures:
 Document test procedure.
 Add illustrations to test procedures.
 Make test documents easily accessible.

Results
 December test data showed improvement:
40
35
30
25
ESD
NDF

20
15
10
5
0
Aug. 06

Oct. 06

Nov. 06

Dec. 06

End of the Presentation!