IDT QUALITY SYSTEM OVERVIEW James Shih Vice President, Corporate Quality and Reliability Research and Development IDT© IDT CONFIDENTIAL Accelerated Thinking SM Corporate Overview FOUNDED WORKFORCE HEADQUARTERS 3,100 San Jose, California WAFER FABRICATION Hillsboro, Oregon ASSEMBLY /
Download ReportTranscript IDT QUALITY SYSTEM OVERVIEW James Shih Vice President, Corporate Quality and Reliability Research and Development IDT© IDT CONFIDENTIAL Accelerated Thinking SM Corporate Overview FOUNDED WORKFORCE HEADQUARTERS 3,100 San Jose, California WAFER FABRICATION Hillsboro, Oregon ASSEMBLY /
IDT QUALITY SYSTEM OVERVIEW James Shih Vice President, Corporate Quality and Reliability Research and Development 1 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Corporate Overview FOUNDED WORKFORCE HEADQUARTERS 2 1980 3,100 San Jose, California WAFER FABRICATION Hillsboro, Oregon ASSEMBLY / TEST Penang, Malaysia IDT© IDT CONFIDENTIAL Accelerated Thinking SM A Global Force in Semiconductor Solutions 3100 EMPLOYEES Ottawa Hillsboro San Jose Headquarters Italy Atlanta Shanghai Penang Singapore Design Engineering Center Sales & Marketing Headquarters Wafer Fabrication Facility Assembly / Test 3 IDT© IDT CONFIDENTIAL Sydney Accelerated Thinking SM Revenue Mix by Geography 2002 2003 2004 $379.8 Million $343.9 Million $346.0 Million 18% 37% 48% 14% 20% 4 30% IDT© IDT CONFIDENTIAL 14% 33% 20% 19% Americas Japan Europe APAC 31% 16% Accelerated Thinking SM Quality Organization JAMES SHIH Vice President Quality MARY VESEY Director SRAM / FCM / IPC 5 IDT© IDT CONFIDENTIAL BIMLA PAUL QA Manager SSD / TSD / Telecom PS TOW Director Corporate QA & Reliability Assembly & Backend MIKE LAZUR QA Manager Hillsboro Wafer Fab PETER SONG QA Manager Penang Operation Accelerated Thinking SM Quality Certification Milestone ISO 9001 / 9002 – Salinas, Santa Clara, Penang 1993 1994 STACK 0001 ISO 9001 – Oregon ISO 9002 – Manila 1997 1998 ISO 14000 – All Facilities Certified 1999 / 2000 STACK Self-Audit Certification 2000 / 2004 STACK Supplier Award ISO 9000 Corp. – All Facilities Certified 2000 TS16949 Compliance 2001 2005 ISO 9000, Rev2000 Transitional QML Certification (MIL PRF 38535) 6 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Membership in Industry Associations and Councils EIA / JEDEC – Electronic Industries Association Joint Electronic Device Engineering Council 14.1 Reliability Test Methods for Packaged Devices 14.2 Wafer Level Reliability 14.3 Silicon Devices Reliability Qualification and Monitoring 7 IDT© IDT CONFIDENTIAL Accelerated Thinking SM IDT Compliance to JEDEC or Industry Spec Cross Reference 8 IDT TEST METHOD / PROCEDURE JEDEC OR INDUSTRY SPEC • Auto Clave (aka SPP) EIA / JESD22-A102 • Bake and Ball Shear Test • Coplanarity for PSMC EIA / JESD22-B116 JESD22-B108 • Corrective Action Requirements • Die Shear Test EIA / JESD671 Mil-Std 883 Method 2019 • Dry Package Procedure • ESD-CDM IPC / JEDEC J-STD-033,EIA/JEP 124 JESD22-C101 • ESD-HBM • ESD-MM Mil-Std 883 Method 3015.7 EIA / JESD22-A115 • ESDS Handling and Control Program • External Visual Inspection JESD625, EIA-471 JESD22-B1081 • Failure Mechanisms and Models • Failure Mode and Effect Analysis JEP122 JEP131 • Failure-Mechanism-Driven Reliability Monitor JESD659 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Supplier Quality Management • Supplier Audit, Supplier Rating • SCIP Teams: Supplier Continuous Improvement Process – Silicon – Chemical – Gases – Photomask – Assembly Raw Materials – Assembly Subconcontractor – Burn-in Boards 9 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems IQC – Incoming Quality Control and Supplier Certification Fab Material • Silicon, Gases, Chemicals, Reticles, Targets… Assembly Material • Lead Frames, Mold Compounds • Die Attach, Wires, BGA Substrates Backend Material • Burn-in Boards • Test & Measurement Equipment 10 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems • Calibration Support – Recall and Services • Material Review Board – Product / Process • Non-Conforming Disposition • Corrective Action – Quality Alerts – Internal Corrective Action – Customer Complaints – Quality Improvement Teams 11 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Internal Audit Program Responsibilities • Ensure compliancy of IDT systems to ISO-9000, ISO-14000, Military, STACK and other customer specifications • Detect minor, but recurring problems that need attention • Monitor compliancy to all IDT Quality Systems • Ensure that corrective actions are implemented in a timely and effective manner • Provide IDT management with audit results, trends and recommendations 12 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Internal Audit Program Audit System Flow • A thorough annual internal audit is performed at every manufacturing facility based on the 20 ISO qualitysystems guidelines • Re-audit of every discrepancy is conducted to assure that the agreed corrective actions has been implemented • Six-month follow-up is conducted of every discrepancy to assure that the agreed corrective action has remained in place and is effective 13 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Document Control – Corporate Standardization • Process / Product / Procedure Documentation – Manufacturing controls – Flows, materials, procedures – General operating procedures – Design, quality, purchasing, training, marketing • DCN – Document Change Control Management – Facilitate specification changes world-wide – Electronic signoff from all facilities • Electronic Spec Distribution on Intranet – DC Web-Site locally - Offshore through DC Department – Paperless Specifications in Wafer Fab IV and Santa Clara / Salinas 14 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Product Change Notice and Product Discontinuance Notice • 90 Day Customer Notification of Change – JESD 46 Compliance – Changes that affect Form, FIT, Function – All customers with 2 years ship history + current backlog – PCN will be issued with sample and qualification data ready • Product Discontinuance Notice – JESD 48 Compliance Notification – 1 year minimum notification for last time buy + 3 months shipment from date of last time buy • Electronic Notification – IDT web page (www.IDT.com) – Email notification – PCN / PDN link to datasheet 15 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems RMA – Customer Return Material Authorization • Closed-Loop RMA Flow – Customer complaint – Failure analysis (5/10 working day response time) – Corrective / preventative action (across affected manufacturing / process areas) – Customer feedback – Continuous monitoring • Management review of trends & corrective action – Trends – Defect Pareto • Critical return material requests – Fast turnaround on F/A and containment – Authorization # not required for critical or fast response 16 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Statistical Process Control (SPC) • Responsibilities – Each process engineering area is responsible for developing and tracking SPC – Formal SPC reports are generated monthly and discussed at production meetings. Informal reports are generated as needed – Corporate Statistician (QA department) provides overall coordination and guidance – Production operator is responsible for implementing and dispositioning “out of control” situations • SPC training – Introductory SPC for all operators – Engineering level SPC – Engineering level statistics and design of experiments 17 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Qualification 18 WAFER PROCESS • Technology • Process • Equipment • Material PRODUCT • Die revision • Major layer change • Fab site change ASSEMBLY / PACKAGE • Package technology • Assembly site • Equipment • Material BACKEND • Packing method • Packing material • Subcontractor test and burn-In IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Product Qualification Guidelines and Process Design Changes Stress Test Photo / Etch Diffusion Implantation Metallization PolySilicon Gate Dielectric Interlayer Dielectric Topside Glassivation New Fab Site Process Process Technology Transfer 1 PR OCESS MODULE X X X X X X X X X X 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 PEVAL WAFER SORT YIELD SEM AUGER ANALYSIS BALL SHEAR BOND PULL BIY BIM LIFE TEST DYNAMIC LIFE TEST STATIC HAST TC Latch-up ESD / HBM ESD / MM ESD / CDM Other Test SIMS EM HC TDDB QBD Soft Error Rate (ASER) X X X X X X X X X X X X X X X X X X (1) (4) X (1) (4) X X X X X (1) (4) X X X X X X X X X (1) X (6) X X X X X X X X (2) (6) (6) X X X X X (2) X X X X X X X (7) X (1) X 1. 2. 3. 4. 5. X (1) (4) X X (4) X X (4) X X X X X X X (1) X X X X X X X X X X (3) X (3) X X (3) X X (3) X X (3) X X (3) X X X X X X X For components built in hermetic packages Optional Design Rule change For Full Qualification, make sure that short term FIT goal is achieved, per QCC - 0025 X-ray adiology per Mil-Std-883, Method 2012, if bond pads relocated 19 IDT© IDT CONFIDENTIAL X X (3, 7) X X (3, 7) Fab Site Product Transfer Wafer Source (Supplier) X X X X X (6) (6) X X X X X X X X Wafer Dimension X (2) X X X X X X (3) X X X (3) X X X X 6. For Full Qualification: 1st lot must reach 1K hours dynamic lifetest; 2nd lot must reach 1K hours dynamic lifetest Long term and short term FIT goals must be met, per QCC-0025 For Limited Qualification:1st lot is shippable after 500 hours of lifetest 2nd lot is shippable after 500 hours of life test 3rd lot is shippable after 500 hours of lifetest and achievement of short term FIT goal per QCC-0025 7. Require only for die containing a significant amount of SRAM or DRAM Accelerated Thinking SM Quality Systems Failure Analysis Process / Capability • Wafer fabrication and assembly production yield improvement • Quality and reliability monitors • Die & process qualification • Package qualification • Customer return 20 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Failure Analysis Process Flow Quality Receives Units and Issues FA # Electrical Return Yes Product Engineering Analyzes the FA and Issues the Report Coordinate FA Activity with Analyst No No Corp F/A and Manufacturing F/A Groups Analyze the F/A and Issue the Report FA Report Accepted by Product QA? Issue Final FA Report (Corrective Action If Required) 21 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Quality Systems Defect Analysis Reporting / Continuous Improvement Plan • Defect Pareto analysis and feedback / continuous improvement • Systematic review of defects by engineering / QA • Management review of defect Pareto • Continuous yield enhancement / reliability improvement • Corrective action (if required) 22 IDT© IDT CONFIDENTIAL Accelerated Thinking SM IDT Quality System Continuous Improvements 23 © IDT CONFIDENTIAL Accelerated Thinking SM Manila – V/M RMA Profile # of RMA Events 9 + 9 Invalid 8 7 Damaged MBB PA56 Damaged MBB PJ28 6 5 4 Rough Plate DF80 Expose Phosphorous Copper PB32 PC20 Solderability PA56 Non Wetting PB44 Pkg Contam PB32 MBB Torn PV48 Solderability PC20 Burrs PB32 Solderability DF80 Solderability DF80 Solderability DF80 Solder Bridging PC20 Metal Shaving PV56 Solder Bridge PB32 Bent Leads PV48 Solder Flakes PB32 1 Unit Missing in Reel PC24l Bent Leads DF80 Lifted Leads DM80 Bent Leads PV48 Bent Leads DF80 Uniquest HK Solderability DF80 Bent Leads DM40 Lifted Leads DF80 Q1'03 Q2'03 Q4'03 Q1'04 Q2'04 Q3'04 Solderability PV56 3 2 1 0 24 IDT© IDT CONFIDENTIAL Q3'03 Wrong Top Mark PC16 Damaged Carrier Tape PV48 Broken Carrier Tape PJ28 Q4'04 Solderability PA48 Q1'05 Accelerated Thinking SM Penang – V/M RMA Profile # of RMA Events 11 10 9 8 7 6 5 4 3 2 1 0 Package Chip PL52 Oki Electric Crushed Solder Ball BF208 Fujitsu Package Swell PH44 Hitachi - Jyotsu Solderability PH44 Nihon Tektronix Solderability PF48 Sunrise Telcom Crack in Shoulder PL84 Nihon Shingou Bent Lead DH208 3 COM Wrong T&R Orientation BF64 Samsung Misoriented Mark PZ28 WPI – Askey Missing / Damaged Solder Balls BS304 Celestica Demarking Contrast PH44 Memec Non Wetting PK100 Celestica Solder Ball Damage BS304 Jabil Circuit Foreign Material on Lead PL68 Cytech-ZTE Part Not Sticking on PCB PS24 V-Tech Missing Solder Ball BG119 Axiowave Networks Bent Lead PK100 Solectron - Cisco Wrong Tray PK100 Memec Japan Tarnish Leads CS48 General Dynamics Bent Lead PK128 Microtek Lead Oxidation PF48 Sunrise Telecom Bent Lead PD48 Cytech - Huawei Device Not Bonded on PCB PS20 Schneider Elec Defect Solder Ball BB256 Locus Networks Wrong Device Mixed in One Order DP208 SHARP Broken Lead PH32 Glory Ltd Missing Solder Ball BX372 Uniquest Han Infocomm Missing SolderBall BX372 Avnet Sanmina Sun Carrier Tape Problem PF56 Micron Scratches & Bent Lead SB48 Avnet Bent Lead PK128 Arrow Electronic Bent lead PK100 Hitachi Jyotsu Bent Lead PZ28 Jabil Penang Wrong Part Shipped PK100 Avnet Wrong Part Shipped PK100 Arrow Elec Q3'03 25 “E” Dimension Failure PL84 Hitachi IDT© IDT CONFIDENTIAL Q4'03 Q1'04 Q2'04 Q3'04 Mold Flash on Gold Gate BB416 EDOM / Acard Q4'04 Q1'05 Accelerated Thinking SM 0.13um Product X Yield Distribution History % Wafers 40% Q4CY2003 Starts 35% Q1CY2004 Starts 30% Q2CY2004 Starts 25% Q3CY2004 Starts 20% Q4CY2004 Starts 15% 10% 5% 300 290 280 270 260 250 240 230 220 210 200 190 180 170 160 150 140 130 120 110 100 0% DPW Yield 26 IDT© IDT CONFIDENTIAL Accelerated Thinking SM Customer Recognition “This is an email I never thought I would get to write after what I have been through with other memory vendors. I would like to congratulate you for a part that is close to god-like as a part can get. We did a preliminary FIT rate calculation on the 4M part, and even though it is based loosely on RMA data, it came in at a 1 FIT rate. 1 board failure in 224,400 parts shipped. We should be increasing cut over to other products soon, if you have not heard…” KIRK KERCHELICH 27 IDT© IDT CONFIDENTIAL Accelerated Thinking SM THANKYOU QandA 28 IDT© IDT CONFIDENTIAL Accelerated Thinking SM