Transcript Cross-talk induced noise and influencing factors

CROSS-TALK INDUCED NOISE
AND INFLUENCING FACTORS
Date: November 19th 2014
Page 1
Agenda
 Measurement Capabilities
 Demo
 System and process implications
 Simulation Capabilities
 Q&A
Page 2
Signal Integrity requirements and Cross-talk
Signal integrity requirements:
- over/under-shoot
- clock tCL/tCH
- clock monotonic
- Cross-Talk
- Clock Jitter
3
Data patterns and Cross-talk
RGB bars
Crosstalk pattern observed with
RGB bars test pattern
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Menu Screen
Crosstalk pattern observed with
Test Menu pattern
Data patterns and Cross-talk
Gray Scale pattern
Worst Case RGB Cross-talk test pattern
Internally developed
Worst-Case
cross-talk pattern
Crosstalk pattern observed with a
Gray Scale pattern
Vmin = -262 mV
Page 5
Crosstalk pattern observed with
A Worst-Case test pattern
Vmin = -308 mV 18% increase
Flex Cables and Cross-talk
Cluster Type 1 – RGB signals at display pins
With Shielded FFC
Cluster Type 2 – RGB signals at display pins
With Shielded FFC
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Cluster Type 1 – RGB signals at display pins
With Unshielded FFC
Cluster Type 2 – RGB signals at display pins
With Unshielded FFC
Flex Cables and Cross-talk
Cluster Type 1 - RGB bus Pinout for display
Crosstalk level function of bit location
GND
R5
R4
R3
R2
R1
R0
GND
Cluster Type 2 - RGB bus Pinout for display
RGB data minimum voltage [mV]
R1
0
-50
-100
-150
-200
-250
-300
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R3
R6
G1
G2
G3
B2
B5
B7
Cross-talk in other modules – display example
Evaluate crosstalk generated on RGB lines within the display 1, by injecting a square waveform
from signal generator directly into the display connector pin B2.
Crosstalk on B3 line (connector) +/-165 mV
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8
Johnson Controls
Injected signals measured at B2
Single PCB Cross-talk Simulation Capability
Manual Cross-talk evaluation using Hyperlynx 2 D
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Single PCB Cross-talk Simulation Capability
Perform simulations to minimize crosstalk between RGB traces
Cross-talk at connector - baseline
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Cross-talk at connector – optimized option
Cross-talk on DDR3 data bus
DDR3 noise observed during Read operation
Vpk-pk avg =181mV
due to random
DQ4 transitions
DQ0 - Measured crosstalk during
data read
Vpk-pk=10 mV
DQ0 – Simulated crosstalk in Hyperlynx 2D due to DQ4 transitions
Vpk-pk=199 mV – error under 10 %
DQ0 – Simulated crosstalk in Hyperlynx 2D due to DQ4 transitions
with coupling model of iMX6 between DQ0 and DQ4 (TDR)
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Cross-talk on DDR3 data bus
 Proper simulation of crosstalk on DQ0 line during Read required use of the TDR to
create an s-parameters model of coupling between DQ0 and DQ4
DQ0
DQ4
S-parameter model of coupling between DQ0 and DQ4
pins of iMX6 Solo extracted with TDR
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Summary: Cross-talk sources and influencing factors
Cross-talk sources and influencing factors:
1. Coupling between signals on PCB
2. Coupling between signals on interconnected PCBs
3. Coupling within cables or IC packages
4. Signal rise time
Outside our “design” control
5. Data pattern
6. Cross-talk is a system level phenomenon
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Cross-talk sources and influencing factors
Q&A
Page 14