Transcript ExoMars mission phase A KO presentation

Integrated Science Payload for
the Solar Orbiter Mission
Final Review
ESTEC– June 29th 2004
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SolO ISP Study – FR - ESTEC – 29 June 2004
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Study overview
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Study challenges and main steps
1. To reduce the mass budget by 25% in order to recover the payload mass
assumption made for the system assessment study.


Mass reassessment of instruments as described in PDD shows opposite conclusion!
Clarification/homogeneisation/relaxation of resolution requirements




1 arcsec spatial resolution / 150 km pixel targetted for all high resolution instruments
Allows to reduce instruments size from 1.5 m to 1 m length
Allows to come back within mass specification
Allows to better deal with solar flux
2. To deal with the SolO mission challenge of a complex suite of instruments for
an ambitious journey toward the sun, at a cost in line with an ESA flexible
mission.



First system level iterations indicates that S/C for shortest cruise missions were too heavy
Instrument size reduction


allows to design more compact spacecrat
Now mass compatible with shortest cruise mission, using SEP and direct Venus transfer
Remote sensing and in-situ Instrument I/F clarifications/consolidation
 Allows to initiate system studies with consolidated data
 Allows to promote I/F standardisation, to pave the way for an efficient development
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Study team organisation
SolO Integrated Science Payloads
Study Manager
Eric MALIET
Frederic
FAYE - Astrium SAS
Contractual officer
Christine DURAND - Astrium SAS
Mission & Integrated Science
Payload (ISP) engineering
Eric MALIET
Frederic
FAYE - Astrium SAS
Electrical - functional
architecture & technologies
Instruments
assessments
Payload Technology & Subsytems
planning and cost analysis
Dominique DUBET - Astrium SAS
Eric MALIET
Frederic
FAYE - Astrium SAS
In-situ instruments consultancy
Jean-André SAUVAUD - CESR
Luc PLANCHE - Astrium SAS
ISP support & Bepi heritage
Independent Scientific consultant
Solar and heliospheric m issions
Marc STECKLING
Christian
STELTER - Astrium GmbH
Pr Rainer SCHWENN
Radiations & EMC assessment
Remote-sensing instruments consultancy
Wolfgang KEIL - Astrium GmbH
Peter R. YOUNG - RAL
Unionics assessment
AndyEMAM
CROSS - Astrium Ltd
Omar
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Study logic
Kick Off
PM 1
WP 1
Instrument Performance
& System Assessment
Mission & spacecraft
assessment
MTR
WP 2
PM 2
Instrument resource
reduction options
Trades -off, and
identification of
preferred approach
WP 3
WP 4
Conceptual design of
Resource Efficient IPS
Technology development
plan & cost analysis
WP 5
Shared payload
P/L
subsystems
development plan
& cost analysis
Final Review
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Study schedule
24/09/2003
ISP for SolO
WPA
Management & Expertise
WP1
WP4
WP5
Instrument Performance & System Assessment
110 Mission & Spacecraft assessment
120 Instruments performance & system assessment
130 Radiation & EMC assessment
Instrument Resource Reduction
210 Resource reduction synthesis
220 Sensor architecture & technologies
230 Mechanical-thermal architecture & technologies
240 Electrical-functional architecture & technologies
250 ISP support & Bepi heritage
Conceptual design of Rrsource efficient payload
310 ISP system engineering
320 Sensor architecture & technologies
330 Mechanical-thermal architecture & technologies
340 Electrical-functional architecture & technologies
Payload technology planning & cost analysis
Shared payload subsystems planning & cost analysis
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SolO ISP Study – FR - ESTEC – 29 June 2004
WP2
WP3
M1
KO
M2
M3
PM1
M4
M5
WM
MTR
M6
PM2
FP
SOP-HO-ASF-023
Environment analyse
Space enviromnent
Contamination guidelines
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Environment Analysis
 Source Term: Mission Solar Proton Fluence
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Environment Analysis
 Total Dose (Cruise + Mission)
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Environment Analysis
 Source Term: Solar Wind
– Solar wind carry considerable kinetic energy, typically ~1 keV for protons and ~4 keV
for He++. This can result in sputtering from exposed surface materials
– Flux ~ 1.3 E+9 particles/(cm² s) (average), Momentum flux ~ rv² very high >1E+16!!
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Environment Analysis
Radiation Effects and Consequences on SOLAR ORBITER P/L

Degradation of electronic components, detectors due to ionising dose
– No significant problem for shielded (4mm) electronics and sensors (14 krad)

Non ionising absorbed dose (displacement) due to protons
– Displacement in bipolar devices is an issue but generally negligible below about 3E+10 p/cm² (50 MeV)
– Displacement on optical devices (optocoupler, APS, etc.) very critical
=> Solutions on parts level (hardening technology) and on system level (intelligent shielding is efficient),
=> APS remain problematic

Galactic Cosmic Ray induced effects (single event phenomena SEP)
– no further problem for SOLO compared to missions at 1AU w/o geomag. Shielding

Solar event (proton and ion) induced upsets (single event phenomena SEP)
– A factor of ~25 higher at 0.2 AU than in GEO
– Measures in order to cover the problem: mainly on electronic design level

(filtering, EDAC, TMR, etc.)
Interference with detector operation (background produced by secondary nuclear reactions)
– Thorough analysis on proton interaction with materials (surface material, shielding structure) and evaluation
of activation effects (spallation, neutron, gamma emission)

Radiation induced outgassing (radiolysis) and following contamination
– Selection of non polymeric with non-halogenic content materials

Solar Wind Effects
– Evaluation of solar wind degradation effects (sputtering) on surface materials (change of a/e, surface
roughness, etc.)
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Environment Analysis
 Meteroid fluence on Solar Orbiter
– Design parameters: v=45 km/s, r=2 g/cm³, impact angle 45°
SOLAR ORBITER Meteoroid Fluence
9y extended mission duration, r=2g/cm³
1,00E+06
1,00E+05
1,00E+04
1,00E+03
Fluence [#/m²]
1,00E+02
1,00E+01
1,00E+00
1,00E-01
1,00E-02
1,00E-03
1,00E-04
1,00E-05
1,00E-06
1,00E-07
1,00E-06
1,00E-05
1,00E-04
1,00E-03
1,00E-02
1,00E-01
1,00E+00
Diameter [cm]
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Environment Analysis
 Solar Dust exposure
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Cleanliness Analysis
INSTRUMENT/UNIT
EMC
 EMC Control requires
„normal“EMC measures
on S/C level
 EMC program/working
group requested by RPW
Plasma Package
SWA (EAS, PAS,
HIS)
Field Package
RPW
CRS
MAG
Particle Package
EPD
DUD
NGD
Remote Sensing
Instruments
VIM
EUS
Ref.
PDD Iss. 2
PDD Iss. 2
S/C wide EMC
program, as
outlined in the
separate EMC
doc
N/A
No special
requirement for
EMC but for
magnetic
cleanliness
EMC doc
requested!
Magnetic
cleanliness plan
(TBD)
PDD Iss. 2
Not specified
Not specified
None special
PDD Iss. 2
TBD
Not stringend
Not stringend
COR
STIX
High Priority
Augmentation
DPD
NPD
Not specified
None special
SolO ISP Study – FR - ESTEC – 29 June 2004
REMARK
Normal S/C, not
sensitive
EUI
RAD
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EMC
REQUIREMENT
Normal S/C
equipment levels
Normal S/C
equipment levels
PDD Iss. 2
Not specified
Surface of
detector (TBC)
N/A
SOP-HO-ASF-023
Cleanliness Analysis
Magnetic Cleanliness
 MAG requires magnetic
cleanliness plan (TBD),
but according to Science
Teams response (SciA/2004/069/AO, 9/6/2004)
no anticipated problems
stated.
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INSTRUMENT/UNIT
Plasma Package
SWA (EAS, PAS,
HIS)
Field Package
RPW
CRS
MAG
Particle Package
EPD
DUD
NGD
MAGNETIC
REQUIREMENT
Ref.
PDD Iss. 2
not specified
PDD Iss. 2
Not specified
N/A
< 1 nT
Magnetic
cleanliness plan
(TBD)
PDD Iss. 2
Not specified
TBD
No strong B-field
near operating
unit
Remote Sensing
Instruments
VIM
EUS
TBD
Not stringend
EUI
Not stringend
COR
STIX
High Priority
Augmentation
DPD
NPD
RAD
Not specified
None special
SolO ISP Study – FR - ESTEC – 29 June 2004
REMARK
B-field could
affect PMT ( field
strength TBD)
PDD Iss. 2
Normal S/C
equipment levels
Normal S/C
equipment levels
PDD Iss. 2
TBD
Not required
N/A
SOP-HO-ASF-023
Cleanliness Analysis
INSTRUMENT/UNIT
Particulate/Organic
Cleanliness
 Cleanliness and
Contamination Control follow
ECSS-Q-70-01A
Particulates:
 Cleanroom conditions, e.g.
CLASS 10 000 for PWA at all
times
Organic Cleanliness:
 Materials not to be used:
– polymeric materials with high
outgassing potential
– polymeric materials with low
particle radiation stability
(radiolysis)
– Halogenated polymeric materials
Plasma Package
SWA (EAS, PAS,
HIS)
Field Package
RPW
SolO ISP Study – FR - ESTEC – 29 June 2004
Class 10 000
cleanroom at all
times
Not specified
CRS
MAG
Particle Package
EPD
N/A
No special req.
DUD
Not specified, Dry
N2 purging during
ground operation
None special
NGD
Remote Sensing
Instr.
VIM
EUS
EUI
COR
STIX
High Prior.
Augment.
DPD
NPD
RAD
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PARTICULATE
REQUIREMENT
Not specified, Dry
N2 purging during
ground operation
MOLECULAR
REQUIREMENT
REMARK
PDD Iss. 2
MCPs very
Purging through
sensitive (water,
testing and in
hydrocarbon, etc.) fairing highly
desirable
PDD Iss. 2
Not specified
Electric antennas
can produce
some particulates
during
deployment
N/A
No special req.
PDD Iss. 2
Not specified,
Avoid acids,
organic liquids
(exception
ethanol),
Not specified
None special
PDD Iss. 2
TBD
BOL 85 ppm
EOL 150 ppm
BOL 85 ppm
EOL 150 ppm
Dust free, avoid
light scattering
from optics
None special
Not specified
Class 10 000
cleanroom (TBC)
N/A
TBD
Open vs filter has
impact
BOL 5.0E-8 g/cm² SOHO levels
EOL 1.0E-7 g/cm² required
BOL 5.0E-8
SOHO levels
g/cm²- Level: A/20 required
EOL 1.0E-7 g/cm²
Organic free
avoid photopolymerisation
None special
PDD Iss. 2
Not specified
Not specified
N/A
Cleanliness as
for other
instruments
SOP-HO-ASF-023
Conclusions on environment and cleanliness

Environment assessement
– Major care shall be taken against:
·
·
·
·
Displacement due to Proton (in particular with APS systems)
Solar events (protons and ions) induced upset
Solar wind effects (sputtering on thin layers)
Material selection (radiolysis)
– No major concerns arise from total radiation dose and GCR

Contamination assessement
– Cleanliness plan are needed for all payloads, covering
· EMC cleanliness
· Magnetic cleanliness
· Particulate organic cleanliness (outgassing)
– This will drive the allowable material list

At system level, an evaluation of Suitability of an Integrated Shielding
System (Thermal, MM Dust, Radiation) deserves consideration
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Remote sensing instruments
VIM
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Visible-light Imager and Magnetograph (VIM)
Overview
 Measurement of:
– velocity fields using Doppler effect
– magnetic fields using Zeeman effect
 Magnetograph : imagery in narrow (5 pm FWHM )
spectral bands around a visible spectral line
at different polarisation states
 line of sight (LOS) velocity
 magnetic field vector
 Time resolution : 1 minute (5  x 4 polarisations)
 Spatial resolution :
– 0.5 arc-sec with 0.25 arc-sec sampling :  250 mm (PDD)
– 1 arc-sec with 0.5 arc-sec sampling :  125 mm (new baseline)
 Field : 2.7° (angular diameter of sun at 0.21 AU)
 Split in 2 instruments : HRT for resolution and FDT for field
 Stringent LOS stability: 0.02 arc-sec over 10 s (differential
photometry)  internal Image Stabilisation System
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Visible-light Imager and Magnetograph (VIM)
Functional block diagram
HRT: High Resolution Telescope
visible filter
FO: Filtergraph Optics
focus and
image stabilisation
mechanism PMP : Polarisation
Module Package
Fabry Perot in
collimated beam
selection
mirror
detector
aperture door
mechanism
mechanism drive
electronics
FDT: Full Disk Telescope
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collimator
front end
electronics
camera
limb sensor
back end
electronics
SOP-HO-ASF-023
28 V
VIM configuration, volume and mass
resolution relaxation
 volume and mass reduction
PDD
new design
HRT resolution
sampling
field
diameter
0.5 arc-sec
0.25 arc-sec
8.5 arc-min
250 mm
1 arc-sec
0.5 arc-sec
8.5 arc-min
125 mm
FDT resolution
field
diameter
9.5 arc-sec
4.75 arc-sec
2.7°
26 mm
19 arc-sec
9.5 arc-sec
2.7°
13 mm
focal planes
2k x 2k
1k x 1k
volume
1300 x 400 x 300
800 x 400 x 300
mass*
30 kg (PDD)
35.4 kg (Astrium)
30 kg (Astrium)
(with 20% margin)
* excluding window, enclosure & radiators
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Critical items and proposed alternatives
 Critical technologies and alternatives
– Polarisation Modulation Package : 10-3 polarisation accuracy, tuning1s
e
L
· Liquid Crystal Variable Retarders:
behaviour under radiations
· alternative: wheel mechanism with polarisers
Zerodur
– Fabry Perot: FWHM = 5 pm, FSR = 150 pm, 1s
· LiNbO3 solid state etalons with spectral
Silica
tuning achieved by high voltages:
cte = 5 10-6
behaviour under radiations
· alternatives: vacuum with piezo
or thermal deformation, gaz with pressure control
350
– proposed demonstrators in technological plan
 Proposed VIM design modifications :
300
250
200
– Narrow band entrance filter to minimize heat
– Off-axis optical configuration for HRT
( to avoid strong obturation by heat stop)
or refractive system
150
100
50
0
-100
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-50
0
50
100
150
200
SOP-HO-ASF-023
Remote sensing instruments
EUS
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EUV Imager and Spectrometer (EUS)
Overview

High resolution slit spectrometry of sun disk
 Three spectral bands
– 17 – 22 nm
– 58 – 63 nm
– 91.2 – tbd nm








Spatial resolution = sampling = 0.5 arc-sec (PDD)  1 arc-sec (new)
Diameter = 120 mm ( 60 mm) not driven by diffraction effects but by flux
 optics transmission is a key parameter (2 telescope options)
Spectral resolution = 1 pm/pixel (PDD)  2 pm/pixel (new)
Spectrometer concept: single element : toroidal varied line-space (TVLS)
grating
Field of view = 34 arc-min driven by detector array size (4k  2k)
Spectral range = 4-5 nm driven by detector array size (4k  2k)
Internal raster mode
Internal LOS control system from VIM data (tbc)
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EUV Imager and Spectrometer (EUS)
Functional block diagram
proposed
EUV filter
telescope
single mirror
or Wolter II
relay optics
with disperser
slit as
field stop
detector
raster mode
& LOS control
by mirror tilting
shutter
mechanism drive
electronics
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front end
electronics
back end
electronics
SOP-HO-ASF-023
28 V
EUV Imager and Spectrometer (EUS)
Recommandations
 Normal Incidence System (NIS)
for the telescope
 EUS requires a large diameter
entrance aperture (120 mm),
leading to large solar heat loads,
above 400 W at 0.21 AU
 Entrance EUV filter
with radiative grid recommended
 Al foil filter well adapted for two bands
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EUV Imager and Spectrometer (EUS)
Radiative grid on Al foil
 A radiative grille (black painted) parallel to Sun flux is conductively
coupled to the metal filter, and allow to radiate the absorbed flux.
The global emissivity of the filter assembly is highly increased.
High coupling
with cold
space
240 mm
Visible and UV
are mainly
reflected
VDA for absorption
limit
4.5
mm
0.5 mm
EUV is
transmitted
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Alu
radiator
sunshiel
d
Alu foil 0.3
micron
0.3 mm
substrat
SolO ISP Study – FR - ESTEC – 29 June 2004
Satellite
structure
SOP-HO-ASF-023
EUS configuration, volume, mass
resolution relaxation
 volume and mass reduction
PDD
new design
sampling
field
diameter
spectral
0.5 arc-sec
34 arc-min
120 mm
1 pm / pixel
1 arc-sec
34 arc-min
60 mm
2 pm / pixel
focal
4k x 4k
2k x 2k
volume
1600 x 400 x 300
800 x 140 x 150 *
Mass(1) (2)
25 kg (PDD)
31.8 kg (Astrium)
15.2 kg (with
(1)
: increase pixel to 8 µm would lead
to a volume of about 960 x 240 x 180
(2) : ancillary equipment, thermal cover
not yet accounted for
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EUS with relaxed resolution
Thermal issue
 Proposed EUS design with relaxed resolution  60 mm pupil
diameter  re-opening of entrance filter trade-off
 Option 1 : pupil on mirror
700 mm
33.6 W on baffle
entrance
diameter 67 mm
114 W
10% to 20%
absorbed
80.4 W on mirror
80% to 90%
reflected
5 W inside spectro
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mirror radiator
8 to 16 W
to be rejected
SolO ISP Study – FR - ESTEC – 29 June 2004
59 to 67 W absorbed
by heat stop
pupil on mirror
diameter 60 mm
heat stop radiator
59 to 67 W
to be rejected
SOP-HO-ASF-023
EUS with relaxed resolution
Thermal issue
 Option 2 : pupil at instrument entrance
 Advantage: reduced heat load on baffle
 Drawback: oversized primary mirror,
mirror radiator
8 to 16 W
to be rejected
optical design to be reassessed
700 mm
11.3 W on baffle
entrance
diameter 60 mm
91.7 W
10% to 20%
absorbed
80.4 W on mirror
80% to 90%
reflected
pupil at entrance
diameter 60 mm
5 W inside spectro
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59 to 67 W absorbed
by heat stop
mirror diameter
67 mm
heat stop radiator
59 to 67 W
to be rejected
SOP-HO-ASF-023
EUV Imager and Spectrometer (EUS)
Critical points and open issues
 Option with entrance filter
– obturation of filter radiator : impact on throughput
– EUV filter  thermal issue is solved
– breadboard in technological plan
 Option without entrance filter (with reduced pupil)
– thermal control critical: heat rejection of heat stop; thermo-elastic deformations
typical tolerance 10µm / 100µrad  5°C on SiC structure, some tenths of °C
on mirror gradients
– primary mirror multilayer coating behaviour with high thermal flux to be
assessed
 EUV Detectors
– 2 k x 2 k format back-thinned CMOS with 5 µm (tbc) pixels
– breadboard in technological plan
 Toroidal varied-line gratings: studies in US and Italy; maturity of
technology ?
 Coatings from 17 to 100 nm: multilayer, gold, SiC ; 2 or 3 bands ?
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Remote sensing instruments
EUI
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EUV Imager (EUI)
Overview




Imaging of the sun disk in EUV
Resolution/sampling = 0.5 arc-sec (PDD)  1 arc-sec (new)
Field of view = 2.7° (sun angular diameter at 0.21 AU)
Field/resolution = 20 000 (10 000)  split in 2 instruments
– HRI for resolution: 0.5 arc-sec ( 1 arc-sec) in 34 arc-min field
(4k x 4k  2k x 2k detector array)
– FSI for field: 4.75 arc-sec ( 9.5 arc-sec) in 5.4° field
(4k x 4k  2k x 2k detector array); field of FSI is twice the sun angular
diameter to account for HRI depointing
 HRI spectral bands: 13.3 nm, 17.4 nm, 30.4 nm
 3 different HRI telescopes optimised for each spectral band
 FSI spectral bands: tbd in 17.1 – 30.4 nm  single telescope
 Diameter of HRIs and FSI = 20 mm driven by radiometry and not
diffraction  could be reduced to 10 mm with relaxed resolution
 Internal LOS control system from VIM data (tbc)
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EUV Imager (EUI)
Functional block diagram
EUV filter
baffle
telescope
relay optics
field stop
detector
aperture
door
mechanism
LOS control
by mirror tilting
mechanism drive
electronics
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front end
electronics
28 V
back end
electronics
SOP-HO-ASF-023
EUV Imager (EUI)
Bafflage and EUV filter
HRI
7 W absorbed directly by baffle
2.7 W absorbed after reflection on foil
10 W
3 W reach foil filter
0.3 W absorbed by
foil
2.7 W reflected back
towards baffle
0.3° field
1500 mm
entrance pupil
diameter = 20 mm
FSI
foil filter
diameter = 35 mm
9 W absorbed by baffle
after reflection on foil filter
10 W
entrance pupil
diameter = 20 mm
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1190 mm
SolO ISP Study – FR - ESTEC – 29 June 2004
10 W reach the foil
filter
2.7° field
spread on 66 mm
1 W absorbed by foil
9 W reflected back
towards baffle
foil filter
diameter = 133 mm
SOP-HO-ASF-023
EUV Imager (EUI)
HRI and FSI configurations
 FSI :
– baffle decoupled from
optical bench
– filter supported by baffle
 HRI :
– single structure ("optical bench")
for all 3 telescopes
– baffles thermally decoupled from
the "optical bench" to minimise
heat-flux and thermoelastic
distortion
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EUV Imager (EUI)
Evolution of design
resolution relaxation
 volume and mass reduction
PDD
new design
HRI sampling
field
diameter
0.5 arc-sec
34 arc-min
20 mm
1 arc-sec
34 arc-min
10 mm
FSI sampling
field
diameter
4.75 arc-sec
5.4°
20 mm
9.5 arc-sec
5.4°
10 mm
focal plane
4k x 4k
2k x 2k
volume
3 x 1800 x 450 x 150
1800 x 440 x 250
900 x 110 x 130
940 x 250 x 190
mass*
42.6 kg (PDD)
42.5 kg (Astrium)
14.6 kg
* excluding window, enclosure & radiators& other ancillary equipment
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EUV Imager (EUI)
Critical points and open issues
 Heat rejection of EUV filters and baffles
 EUV Detectors ( as EUS)
– back-thinned CMOS
– 4 k x 4 k  2 k x 2 k format with 9 µm pixels
– alternative detectors : Diamond or GaN/AlGaN
 credible in large format ?
 Cooling of CMOS detectors at – 80°C
 Telemetry: huge compression or data selection required
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SolO ISP Study – FR - ESTEC – 29 June 2004
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Remote sensing instruments
COR
Page 39
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Coronograph (COR)
Overview
 Observation of sun corona between 1.2 and 3.5 radii
 Coronograph
– needs of occulters to mask the sun disk
– optical design with field stop and Lyot stop
 Spectral bands
– 450 – 600 nm
– 121.6  10 nm
– 30.4  5 nm (optional)
 Field of view = 9.2° (corona angular diameter at 0.21 AU)
 Spatial resolution = spatial sampling = 8 arc-sec driven by 4 k x 4 k
detector array  16 arc-sec with 2 k x 2 k
Page 40
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Coronograph (COR)
Functional block diagram
EUV/VIS
dichroic
achromatic
UV filter
polarimeter
wheel
relay
mechanism
optics
image
internal
occulter
external
occulter
entrance
pupil
EUV detector
sun disk
rejection
mirror
pupil
Lyot stop
COR pointing
mechanism
mechanism drive
electronics
Page 41
SolO ISP Study – FR - ESTEC – 29 June 2004
VIS detector
aperture
door
mechanism
telescope
28 V
front end
electronics
back end
electronics
SOP-HO-ASF-023
Coronograph (COR)
Overall configuration
COR volume not in line with other remote
sensing instruments
 recommandation : decrease distance external
occulter to pupil with related decrease of pupil
diameter (at constant vignetting)
PDD
new design(*)
sampling
field
diameter
8 arc-sec
9.2 °
33 mm
16 arc-sec
9.2°
16.5 mm
focal
4k x 4k
2k x 2k
volume
1200 x 400 x 300 (PDD)
1400 x700 x 370 (Astrium)
800 x 400 x 250
mass*
21.8 kg (PDD)
40.7 kg (Astrium)
20 kg
* To be assessed on science grounds
Page 42
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Coronograph (COR)
Critical points and open issues
 Recommandations:
– Mass and volume not in line with other remote sensing instruments
recommandation : reduction of sampling distance  shrinkage of
instrument by factor 2
– removal of pointing mechanism  COR off during offset pointing)
 duty cycle
– whole design to be worked out further
 Critical points and open issues
– Heat rejection of external occulter
– Design of sun disk rejection mirror
– EUV coating of mirrors compatible with visible light
– Feasibility of the EUV/VIS dichroic (visible light reflected, EUV get
through)
– EUV detectors : see EUS & EUI
Page 43
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instruments
STIX
Page 44
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Spectrometer Telescope for Imaging X-rays (STIX)
Overview
 Imagery of sun disk in X-rays
 Spectral bands: hard X-rays = 4 – 150 keV ; 8 - 310 pm
 Use of X-rays techniques:
– pseudo imaging by grids
– X-ray position/energy detectors : CdZnTe
 Spatial resolution = sampling = 2.5 arc-sec
 Field of view
– FWHM imaging field of view = 24 arc-min
– Spatially integrated spectroscopy field of view = 3°
 Energy resolution = 2 to 4 keV in 16 energy levels
Page 45
PDD
Reduction objective
volume
1500 x 70 x 70
1000 x 70 x 70
mass
5 kg
5 kg
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Spectrometer Telescope for Imaging X-rays (STIX)
Functional block diagram
filter
Fresnel lens
aspect system
VIS detector
X-ray
detector
aspect system
rear grid
front grid
front end
electronics
28 V
back end
electronics
Page 46
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Spectrometer Telescope for Imaging X-rays (STIX)
Critical points and open issues
 Good level of maturity in general
 Becomes the longest remote sensing instrument following
reduction exercise on all other instruments
– Length reduction down to 1 m should be investigated, in line with
dimensions of all other remote sensing instruments.
– This may require to reduce the grid pitch if resolution needs to be kept
– Will avoid to constrain the S/C design snowball impact on structure
mass at S/C structure level, on orbiter and on propulsion module
 Aspect system design to be investigated further
 Detector CdZnTe : space qualified prototype but design to be
adapted to STIX
Page 47
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Synthesis for remote sensing
instruments
Page 48
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Why integration of payloads is not practical for
Solar Orbiter ?
Common telescope with shared focal plane : ex Hubble, JWST, Herschell
astronomy of faint objects + very high resolution  large pupil
reduced spectral range ; Hubble = visible, JWST = IR, Hershell = submillimeter
small instruments with respect to collector
flux collector
Solar orbiter :
reduced collector diameter (sun at 0.2 AU)
large instrument dimensions ; from visible to X-rays
very specific instruments: coronograph
no possibility and no interest to share optics
 conclusion : no suite  only individal instruments
inst 2
inst 1
inst
3
Page 49
inst
4
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instruments geometrical IRD
 From the mechanical configuration, IRD are updated
– Overall volume including bipodes
– Electronic not included. Sizing based on DE boards
– Volume for connectors, closure box not included
PDD
Updated
Length
Width
Height
Length
Width
Height
VIM
1300
400
300
800
400
300
EUS
1600
400
300
800
140
150
3 x HRI
1800
450
150
900
110
130
FSI
1800
440
250
940
250
190
COR
1200
400
300
800
400
250
STIX
1500
70
70
1000
70
70
Page 50
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instruments mass budget
Hypotheses for remote sensing intruments mass estimate
 Filter outside instruments not included
 Enclosures for protection against pollution/contamination not included


Aperture doors for LEOP and may be SEP phases
Instrument internal covers or enclosures for AIT, LEOP and outgassing phases
 Electronic masses not challenged
Note: Ancillary equipment / instrument enclosures not yet accounted for
initial PDD design
Page 51
design with
resolution
PDD
Astrium
STIX
5.0
5.0
5.0
VIM
30.0
35.4
30.0
EUS
25.0
31.8
15.2
EUI
42.6
42.5
14.6
COR
21.8
40.7
20.1
Total
124.4
155.4
107.5
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instruments data rate
raw data and processing needs
allocation
VIM
Raw data rate: Frame 1k x 1k, 3.2 s, 12 bits = 3.75 Mbit/s
After processing by FPGA: computation of 5 parameters
max: 1k x 1k, 3 parameters, 300 s, 4 bits  40 kbit/s
peak: 1k x 1k, 3 parameters, 60 s, 4 bits  200 kbit/s
20 kbit/s
EUS
Raw data: frame 2k x 2k, 1.27s frame, 12 bits: 38 Mbit/s
After selection and processing:
6 lines, 3 line profile parameters, length 1000 pixels,
1.27 s frame, 12 bits, compression 1/10: 17 kbit/s
17 kbit/s
EUI
HRI raw data: 3 HRI, frame 2kx2k, 10 s, 12 bits = 14.4 Mbit/s
Wavelet compression with factor 48  300 kbit/s (baseline);
compression / selection scheme to TBD
FSI raw data: frame 2k x 2k, 4800 s, 12 bits = 10 kbit/s
20 kbit/s
COR
Raw data: frame 2k x 2k, occultation 0.5, 600 s, 16 bits,
factor 1.5 (UV=1, vis=0.5) = 80 kbit/s
Lossless compression with factor 3: 26.7 kbit/s;
additional lossy compression of 5 required
5 kbit/s
STIX
raw data: 64 pixels, 16 energy channels, 8 Hz, 16 bits = 130 kbit/s  1 hour
storage in a 64 Mbyte rotating buffer after processing: total count on 8 bits
+ 64 relative values on 4 bits + 56 bits miscellaneous = 320 bits/image
x 1800 images/h (6 mn flare, 0.5 Hz, 10 energies)
+ 25% other data = 720 kbit/hour = 0.2 kbit/s
0.2 kbit/s
Page 52
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instruments thermal aspects
PDD
VIM
EUS
EUI
COR
STIX
Page 53
2 options : with and without
heat stop in optical beam
end of ISP study
narrow band filtering entrance window
M1 radiator with radiative coupling
suggested off axis optical configuration
radiator
M2 screenwith radiative coupling
optical bench thermal control
Al foil with radiative grid proposed at
heat stop at primay focal plane
possibility of adaptive optics Open instrument back in the picture
surface
long baffles with vanes + EUV filter
sun-disk rejection mirror
thermal washers to decouple
structure
opaque sunshade: 1 mm of carbon
thin reflective coating on grids
SolO ISP Study – FR - ESTEC – 29 June 2004
unchanged
low emissivity conical shapes on
radiator coupled to sun-disk rejection
unchanged
SOP-HO-ASF-023
Remote sensing instruments review outcomes

All instruments appear feasible
– Alternative solutions have been identified for all identified critical items
– Potential science impact of alternative solutions to be assessed by science
teams

Limiting the thermal flux inside instrument was a driver for our
assessement: Open issue limited to EUS entrance filter, for which TDA are
deemed mandatory + impact on science

PDD mass estimates are rather optimistic and not exhaustive (ancillary
equipment), resolution relaxation (to be accepted by science tyeam) is
proposed:
– to reduce volumes and masses
– As a side effect, to limit the solar heat flow to deal with

No show stopper for the mission, however payload mass/volume plays a
critical role in the context of Solar Orbiter Assessment, as larger mass
allocations imply longer cruise or mission profiles not in line with ESA flexi
budget
Page 54
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Solar Orbiter Remote Sensing instruments
Technology plan

EUV detector
– design and realisation of the basic technological elements for a large array ,
small pixel operating in visible and EUV
– performance and environment tests

Radiative grid for EUV filter
– trade-off on material
– manufacturing and integration of EUV filter and grid
– thermal test

Polarisation modulation package
–
–
–
–

trade-off on technologies
design of the package
breadboard manufacturing
environment tests
Fabry Perot package
–
–
–
–
trade-off on technologies
design of the package
breadboard manufacturing
environment tests
Page 55
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Solar Orbiter visible and EUV focal planes
visible
detectors
not blind EUV
detectors
blind EUV detectors
MCP
vis Si
EUV Si
GaN/diamond
vis Si
CMOS
CMOS
CMOS
CMOS
or
or
vis APS
monolithic
CMOS
R&T ESA
hybrid 18 µm
CMOS
Page 56
or
MCP
EUV APS
monolithic
vis APS
monolithic
C3PO
standard CMOS
technology
to be promoted
planned
R&T ESA
existing
all detectors of Solar Orbiter require CMOS
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Solar Orbiter visible and EUV focal planes
Today status
 Visible detector
– hybrid CMOS as baseline to optimise quantum efficiency x fill factor
– monolithic CMOS as back-up
– C3PO : requested ?
 Not blind EUV detector
– hybrid CMOS as baseline to make EUV optimisation easier
– EUV monolithic CMOS as back-up
 Blind EUV detector
– GaN hybridised on CMOS read-out circuit as baseline if technological
development successful
– Otherwise MCP with visible detector
 Assumptions for technology plan
– GaN / diamond ESA R&T is confirmed
– C3PO ESA R&T is confirmed
Page 57
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Solar Orbiter visible and EUV focal planes
Technology approach
 Statement for Solar Orbiter
– CCD not suitable because of irradiations
– CMOS is mandatory for all detectors of Solar Orbiter
– format : 2k x 2k or 1k x 1k with 10µm pitch
 CMOS development must be secured and commonalised (cost
reduction)
– selection of one CMOS technology (design rule, founders, CIS if
monolithic) according to performances and irradiations hardening
– evaluation and qualification of this CMOS technology for Solar Orbiter
– develop guidelines for design of CMOS function with respect to
irradiation hardening
 Transfer ESA R&T « hybrid CMOS » from 18 to 10 µm pitch
 breadboard
 Optimisation of hybrid CMOS technology from visible to EUV
 breadboard
 In parallel, development of EUV monolithic APS (RAL
development)
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SOP-HO-ASF-023
EUV filter with radiative grid
 Phase 1: 9 months
– trade-off on material for grid: major criterion:
manufacturing+ polishing capability
(optical surface for thin foil contact
 SiC good candidate
– manufacturing of the radiative grid
– assembly with foil (procurement)
High coupling
with cold space
240 mm
SolO ISP Study – FR - ESTEC – 29 June 2004
Alu radiator
VDA for absorption limit
4.5 mm
sunshield
0.5 mm
EUV is transmitted
 Phase 2: 12 months with 3 months overlap
– thermal test on solar vacuum facility
– challenge: simulate 25 solar constants
 afocal telescope to be developped
with cooling of secondary mirror
solar
– cold space simulated by shrouds
constant
 1m
– temperature of thinn foil
monitored with infrared camera
– test objectives: check foil temperature
+ correlate thermal model
– facility can be used to test other Solar Orbiter units
Page 59
Visible and UV are
mainly reflected
Alu foil 0.3
micron
0.3 mm
substrat
Satellite
structure
25 solar
constant
 0.2m
SOP-HO-ASF-023
Polarisation Modulation and Fabry Perot
packages
 Polarisation modulation package: 18 to 24 months
– trade-off on technologies (tests on Lyquid Crystal to Solar Orbiter
environment already performed)
– design of the package:
· 2 retarders + linear polariser
· oven with active thermal control
– breadboard manufacturing
– fonctionnal, optical and environment tests
 Fabry Perot package: 18 to 24 months
– trade-off on technologies (tests on Lithium Niobate to Solar Orbiter
environment already performed)
– design of the package
· 2 Fabry Perots + 1 interference filter
· oven with active thermal control
– breadboard manufacturing
– fonctionnal, optical and environment tests
Page 60
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
In situ instruments
Plasma package
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
SWA
 Composed of three types of sensors
– Electron Analyser Sensor (EAS),
– Proton Alpha particle Sensor (PAS)
– Heavy Ions Sensor (HIS).
 They are characterised by:
– Their large field of view requirements,
·
·
SWEA on Stereo (EAS)
EAS: Electrons coming from every directions
PAS & HIS: Particle incidence driven by magnetic field
– The need to operate below 40°C
 PAS and HIS have to Sun pointed
– Accommodated directly behind the Sunshield
– With a collector in direct Sun light
 Main issues
–
–



SWICS on Ulysses (HIS)
EAS accommodation: on P/F, boom or body mounted
HIS and PAS collector in Sunlight
Should be decoupled from rest of instrument,
Should be coupled to S/C structure for thermal control
Should «reasonably» not exceed 10 cm2 (i.e. 30 W load per head)
Triplet on Interball (PAS)
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
SWA EAS
 2 heads body mounted provides a quasi 4 p Sr coverage
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
SWA HIS and PAS in Sunlight
High conductance device candidates

Several type of light high conductance devices are possible candidates for coupling heat loaded
zone to cold radiators :
1. Mini fluid loop
Total mass = 80 g
Global conductance = 1 W/K
for up to 30 W
Distance Heat source / radiator
= up to 50 cm
Evaporator (25
mm x 19 mm)
Condensor (mounted
on a radiator)
Flight tested in 2003 and 2004
(COM2PLEX, Ariane5 ECA in
summer 2004)
2. Conductive strap
Copper or aluminium straps
Page 64
SolO ISP Study – FR - ESTEC – 29 June 2004
Graphite fiber thermal straps
SOP-HO-ASF-023
In Situ instruments
Field package
RPW
CRS
MAG
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
RPW
 Interface accommodation requirements mainly characterised by:
– The three 5 m long electric antennas, to be accommodated possibly in
Sunlight and orthogonal to each others,
· What is the material considered for the antennas?
– The loop magnetometers and the search coil magnetometers, to be
accommodated away from the spacecraft on deployable boom,
– The need to operate magnetometer sensors below 50°C, i.e. protected
from the direct Sun flux,
– A clean EMC environment although not yet quantified for operations.
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
CRS

Makes use of the spacecraft communication system,
– X band uplink
– Dual band X / Ka downlink

Possibly complemented by a lightweight Ultra Stable Oscillator

The physical accommodation constraints will then be limited to define a
proper compromise for the USO location between
– minimum harness length, thus close to TRSP
– clean and stable environment (thermal, EMC), thus far from TRSP.

Main issues
–
–
–
–
Found a suitable location inside location for USO
Define USO thermal control stability requirement
The reference mission profile does not provide actual solar conjunctions
Open question: radio science compliance with simultaneous TM downlink?
Page 67
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Sun-Spacecraft-Sun angle (deg)
CRS
Sun – spacecraft – Earth angle over the mission
180
165
150
135
120
105
90
75
60
45
30
15
0
0
500
1000
1500
2000
2500
Days from launch
Launch
Cruise
Nominal mission
Extended mission
Page 68
:
:
:
:
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
MAG
 Interface accommodation requirements characterised by:
– The need to implement the sensors away from the spacecraft body on
long deployable boom,
– The need to maintain the sensors below 57°C, i.e. protected from the
direct Sun flux,
– A clean EMC environment although not yet quantified for operations,
· Rosetta approach -characterisation only- seems not sufficient
· Cluster approach is too demanding and not compatible with Bepi euse
– The need to slew the spacecraft at several deg/s about the Sun
direction to regularly calibrate the fluxgate magnetometer.
Page 69
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
In Situ instruments
Particle package
EPD
DUD
NGD
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
EPD
 Includes five sets of sensors:
–
–
–
–
–
Supra-Thermal Electron detector (STE),
Electron and Proton Telescope (EPT),
Supra-thermal Ion Spectrograph (SIS),
Low Energy Telescope (LET)
High Energy Telescope (HET).
 Interface accommodation requirements:
– The large FOV requirements, requiring either
· rotating platform
· multiple sensor option,
– The need to operate below 30°C, i.e protected
from the direct Sun flux,

Main issue
– FOV blockage by S/C body in case of scan P/F
Page 71
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
DUD
 Interface accommodation requirements characterised by:
– the need to hard mount two small units on the spacecraft side
– and provide them with wide +/- 80° free FOV:
 One unit to be mounted in the orbital plane 90° off the S/C-Sun line
 The other perpendicular to the orbit plane
Page 72
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
NGD
 Interfaces accommodation requirements characterised by:
– Sun pointed instrument, below a shield window no thicker than 3g/cm2
– Sensors kept below 30°C, i.e. protected from the direct Sun flux.
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SOP-HO-ASF-023
In Situ instruments
Main issues
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
In situ instruments
Main issues
 Instrument design
– Low resources demands,excepted FOV
– Sensors rather well defined
– Sharing of electonics widely suggested
 Instruments accommodation
– All sensors but RPW electrical antennas and SWA PAS/HIS collectors to be
placed behind sun shield
 Instrument environments
– Most instruments deemed EMC sensitive, but no cleanliness specification
(apart RPW sensitivity) on the table to date
– « Good design practices » claimed to be sufficient
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SOP-HO-ASF-023
Instrument accommodation
Trade off overview
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Expected effects of resources reduction options
Resource reduction option
Technology
improvements
Standardisation
Resource
Communalisation of
functions
Development
centralisation
Mass


=
?
Power
consumption


=

Volume


=

Data storage and
data rate

=
=
=
Development cost




Development time



=
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SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Architecture options & trade off
Mechanical-thermal design
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SOP-HO-ASF-023
Opto mechanical alternatives
 No clear advantages of integrated design
 Preferred solution depends on relative weighting between mass
and integration
 Considering the major configuration differences between
instruments
 Individual instrument design kept as baseline
Page 79
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Accommodation at spacecraft level
Accommodation on
spacecraft
Con’s
•Launchaxis
constraint
•Weight
Sun direction
Sun direction
Launch direction
Pro’s
•Stiffness
•Alignment
Planeassembly
Pro’s
•Stiffness
•Alignment
Con’s
•Launchaxis
constraint
•Structure
driver
Payload module favoured
Pro’s
•Flexible
geometry
Launch directions
Centralcylinder
Polygonalshape
Con’s
•Stiffness
•Alignment
inter planes
Integrated design
• Mechanical accommodation to be addressed at spacecraft level
• No reason to impose a payload module in the frame of ISP study
Page 80
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Trade offs for steerable platform
 Need for steerable platform
Options
Rotating
platform
Multiple
body-fixed
sensor
heads
PROs
-
Minimisation of resources (mass : -6kg,
power : -7W, data rates, cost ?)
-
improved measurements angular
resolution
-
favors an integrated payload approach
-
best time resolution
CONs
-
Limited FOV clearance (2/3 of required FOV)
-
poor time resolution for 3D distributions
-
burdensome to other instruments (pointing
stability, electromagnetic noise)
-
severe increase of required resources
(mass, power, data rates)
-
might raise S/C accommodation problems to
satisfy all FOVs
 At ISP level, platform is the preferred solution
 Compatibility with pointing stability requiremnts to be confirmed at
spacecraft level.
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SOP-HO-ASF-023
Weight
Long cylinder
Short cylinder
U-shaped platform
No platform
Platform geometry options and trade off
1
1
3
1
1
1
2
1
1
1
2
0
-1
-2
0
1
1
2
0
-1
-1
-1
0
0
2
0
0
-1
2
2
-2
-2
-2
1
0
2
3
-1
-5
Scanning platform for HSIS suite
Long cylinder
Short cylinder
U-shape mounting
No ptlatform
Criteria
Accessible FOV
Instantaneous FOV
Mass
Harness
Data rate
P/F complexity
S/C I/F complexity
Total mark
Page 82
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
General thermal control principle
Remote sensing instruments
1.
Instruments are thermally controlled independently
2.
A maximum of Sun flux is stopped at the entrance of each instruments thanks to :
•
•
•
•
customised filters, (EUV, visible…),
heat stops (at intermediate focus point),
radiating baffles,
rejection mirror (for coronograph),
3.
Once the totality of the main part of Sun flux is stopped, telescopes and optical bench require
classical thermal control (several lines of heaters, thermistors, ON/OFF or PID law). They
benefit of radiators shadowed by the Sunshield (very stable environment).
4.
Detectors are independently thermally controlled. A dedicated radiator with a good thermal
coupling (flexible strap or fluid loop) is foreseen
5.
Location of instruments and their radiators (detectors, telescope, heat loaded areas) is to be
coupled with satellite configuration study (possible view factor with solar arrays and/or back
side if the sunshield).
In situ instruments
1.
When possible protected by thermal shield
2.
Minimise surfaces in direct Sunlight
3.
Ecouple Sun illumintaed surface from the rest of the instrument
Page 83
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instuments: PDD status for filters
VIM (*)
EUI
HRI
FSI
EUS
COR
STIX
Page 84
X
After primary
mirror
Remark
6
5
4 Before optics
3 Instrument entrance
2 S/C structure
1 Thermal shield
Outside instrument Inside instument No filter
described
X
(*) Preferred option
After baffle and vanes => limited flux
After baffle and vanes => limited flux
X
X
X
X
X
X
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Remote sensing instruments
Thermal issue recommendation

Recommendation is to try systematically to minimise unneeded heat load
inside instruments
 Implement filters
– Outside instruments,
– Coupled to S/C wall or sunshield
 Develop large EUV filters, in particular because EUV bandwidth is
marginal wrt heat flux

Thermal control becomes no more a critical
– For instruments
– For instruments/SC interfaces
 To be dealt with in dedicated instrument assessement studies
 This statement is reinforced with the smaller apertures resulting from the
revised resolution
Page 85
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Recommended filter implementation summary
VIM
EUI
(X)
HRI
X
FSI
X
EUS
X (1)
COR
STIX
Remark
6
Before
optics
4
X
No filter
After
5 primary
mirror
Instrument
entrance
Inside instument
3
2 S/C structure
1
Thermal
shield
Outside instrument
X(1)
X
X
Further heat stop between primary and
secondary mirror in an off axis
configuration
Baffles, vanes and Al foil thermally
decoupled from optical bench
Baffles, vanes and Al foil thermally
decoupled from optical bench
Trade off between stand alone radiative
grid and conductive grid coupled to
spacecrfat radiators to be carried out at
spacecraft level.
The external occulter and the Sun rejection
disk remains attached to the instrument
which is mounted on a mechanism to
compensate spacecrfat off pointing
required by narrow filed of view
instruments
As for VIM, it is recommended to
decouple the entrance filter from the
instrument and to couple it to the spaccrfat
structure
(1): depending whether an adequate filter material can be found for EUS
Page 86
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Instruments cover
 Covers needed
– To avoid contamination deposits and risk of polymerisation under UV flux
· Launch, LEOP, propulsion phases
– To avoid solar flux entry during slight offpointing (COR)
Page 87
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Need and possible location for Sun pointed
instruments covers
Instrument
Remark
Cover
Possible cover
needed position (from figure /
)
1
2
3
4
VIM-HRT
Y
X
-
X
X
Cover needed to protect entrance glass filter
VIM-FDT
Y
X
-
X
X
Cover needed to protect entrance glass filter
EUS
Y/N
X
X
X
X
Y : Needed in case of open telescope
N: Not needed with entrance thermal filter
EUI-HRI
TBC
X
X
X
X
TBC with Al foil filter on tip of entrance baffle
EUI-FSI
TBC
X
X
X
X
TBC with Al foil filter on tip of entrance baffle
COR
Y
X
X
X
X
Needed for the body mounted COR during off
pointing Sun observation sessions
STIX
N
X
-
-
-
Protection provided by the front grid
SWA-PAS
Y
X
-
X
X
Cover needed to protect detector
SWA-HIS
Y
X
-
X
X
Cover needed to protect detector
NGD
N
-
-
-
X
Protection provided by the Sun shield itself
Page 88
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
WP 200:
Architecture options & trade off
Pointing & pointing stability for remote sensing P/L
Page 89
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Pointing constraints

Pointing direction
– EUI/FSI, EUS, VIM/HRT and STIX need spacecraft off pointing to cover Sun disk
 VIM FDT off when VIM HRT operates
 EUI/FSI « oversized » to cope with off pointing
 COR needs:
 Option 1: mechanism
 Option 2: switch off and cover during off pointing

Pointing stability
– VIM requires a very high pointing stability
– EUI/EUS call for 0.1 arcsec/s class performance
 Not achievable using standard S/C systems
 Option 1: Instruments image stabilisation system
 Close loop system as VIM complex but OK
 Open loop system (EUI/EUS) questionable (S/C behaviour)
=> Option 2: Post processing on ground
 To be investigated
Page 90
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Alternatives to meet pointing stability requirements
Pointing stabilisation options
1
Each remote sensing
Instrument detects
pointing errors and
compensates with
its own image
stabilisation system
•Spacecraft with
low performance
AOCS and
simple DMS
•Complex instruments
with error detection
& Image stabilisation
systems
Page 91
2
One instrument (VIM)
provides
error stability signal
to other instruments
equipped with
their own image
stabilisation system
•Spacecraft with
low performance
AOCS and
inter P/L DMS
•Only VIM with
with error detection
& Image stabilisation
systems ; other
Instruments without
Image stabilisation
systems only
4
3
Two instruments
(VIM + STIX)
provides
error stability signal
to other instruments
equipped with
their own image
stabilisation system
One instrument (VIM)
provides
error stability signal
to spacecraft AOCS
which controls
attitude accordingly
5
Spacecraft
provides
pointing error signal
as required by
all instruments
excepted VIM
•Spacecraft with
low performance
AOCS and
interP /L DMS
•Spacecraft with
high performance
AOCS with
P/L in the loop
•Spacecraft with
high performance
AOCS and
simple DMS
•Two instruments
with error detection
& Image stabilisation
systems ; other
Instruments without
mechanism
•Only VIM with
with error detection
& Image stabilisation
systems ; other
Instruments without
mechanism
•Only VIM with
with error detection
& Image stabilisation
systems ; other
Instruments without
mechanism
SolO ISP Study – FR - ESTEC – 29 June 2004
6
7
Spacecraft
guarantees
high pointing stability
as required by
all instruments
including VIM
Image reconstructed
on ground
After post processing
Apart VIM provided
with its own closed
loop stabilisation system
•Spacecraft with
very high performance
AOCS and
simple DMS
•Spacecraft with
high performance
AOCS and
simple DMS
•Simple instruments
without pointing
systems
•Simple instruments
without pointing
systems (but VIM)
Systems
SOP-HO-ASF-023
WP 200:
Architecture options & trade off
Instrument data management
Page 92
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Partitionning drivers

Very high raw data rate
– Limited use of dedicated Gbps point-to-point links
– First stage of data reduction in the instrument front-end

Instrument-specific high performance computation
– Hardwired implementation, not shareable, possibly expandable for size reasons

Compression
– Discrepancy between raw data volume achievable and downlink capability
requires to clarify compression schemes, duty cycles, or even instrument
concepts
– Standard implementation of a (multiple) data flow processing chain
– Flexible algorithms
– Communalised algorithms to be find out

Thermal Control
– Instrument led fine thermal control of inner hardware parts
– Best at front-end level for AIV reasons

Specific processing
– Case by case analysis
– High degree of flexibility, at least during the implementation phase
Page 93
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Partitionning baseline
(remote sensing instruments)
P/L
Front-end data processing
FEE output (PDD)
VIM
Computation of 5 physical magnitudes using FPGA
50 kbps (mode 1,3)
Computation of the pointing error at a frequency 100 100 kbps (mode 2)
500 kbps (mode 4)
Hz. Distribution to EUI and EUS may require a dedicated link.
2.4 Mbps (peak)
Synchronisation signal provided by spacecraft.
ICU gathering local control, including instrument thermal
control
EUS
Selection
170 kbps
Line parameters computing (need CPU ?)
Image differencing to be studied (raw data rate: 670
Mbps - 10mn cadence, 2000 steps, 200Mb/image)
Synchronisation signal provided by spacecraft.
ICU gathering local control, including instrument thermal
control
3 * 4.8 Mbps
EUI
HRI : None (baseline) – Acquisition freq may increase,
(HRI baseline)
leading to an ideal raw data rate of 3*560 Mbps (1680 Mbps)
requiring local processing like e.g. selection through image
4.8 Mbps
processing, image differencing (still to be studied) or even
(FSI peak from PDD)
wavelet compression (1:48).
FSI : None (baseline, one image required every 4800s) –
Potential image processing for HRI data selection
Synchronisation signal provided by spacecraft.
ICU gathering local control, including instrument thermal
control
220 kbps
COR None
Assuming 50% of images loaded every 600s/1200s (full
+
110 kbps
image: 270 Mb)
128 kbps
STIX Accumulation (2048 bits every 1/8 sec)
Page 94
SolO ISP Study – FR - ESTEC – 29 June 2004
FEE output (reduced
Back-end data processing
resolution)
(PDPU)
12.5 kbps (mode 1,3)
Lossless compression
25 kbps (mode 2)
Lossy compression
125 kbps (mode 4)
Very high compression rate (wrt
0.6 Mbps (peak)
scientific return)
Lossy compression
42.5 kbps
3 * 1.2 Mbps
(HRI baseline)
Lossy compression
HRI: Very high compression
rate (wrt scientific return)
4.8 Mbps
(FSI peak from PDD)
No change
No change
Lossless compression
Lossy compression
Specific processing: processing
power need not critical
SOP-HO-ASF-023
Partitionning baseline
(in-situ instruments and augmentation)
Instrument
SWA-EAS
Front-end data processing
None
SWA-PAS
None
SWA-HIS
FPGA based integration algos (heritage TBC)
EPD
Hardwired processing (accumulation, sample selection, etc.)
for all sensors STE, EPT, SIS, LET, HETn
DUD
NGD
Hardwired processing (TBC)
FPGA based data reduction (classification) (heritage TBC)
Mechanical collocation
Waveform dectection thru FFT & correlations for TNR and RAD
TBD processing for the 10 Mbps LFR data
ICU gathering all data processing with direct output to the SSMM.
None (raw data)
Mechanical collocation in HBIS electronics box
RPW
MAG
800 kbps burst
DPD
NPD
Specific reduction TBD TBC
None
RAD
heritage TBC
Page 95
FEE output
2 Mbps burst
200 kbps + 500
bps
256 kbps, from 5
sensors
50 bps x2
400 bps
up to 15kbps
Few kbps
6.5 kbps
Augmentation instruments
TBD
TBD
SolO ISP Study – FR - ESTEC – 29 June 2004
3.6 kbps
Back-end data processing (DPU)
Lossy compression
Data reduction
Lossy compression
Data reduction
Lossy compression
Data reduction
Specific processing: Data reduction
None
Lossy compression TBC
None
Data/events provided to other instruments (TBC and low
frequency)
Specific processing: low processing need assumed
Lossless compression
Low input rate assumed
Specific processing: low processing need assumed
Specific processing: processing power need not critical
SOP-HO-ASF-023
Architectural design drivers
Payload interface

Guideline
– One interface per instrument electronic module (FEE or MDE),
– Merging of science and control command data
– No SPF impacting more than one instrument

High rate links concentrators close to instruments to reduce harness

Science interface
– Standard Spacewire links (even if one way high rate only required)
– Bepi Colombo solutions promoted

Control command interface
– Based on SpW micro-remote terminal unit derived from ESA TDA
Page 96
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Traded solutions and recommended one
Platform
Platform
Platform
(TRSP)
Payload
Area
Payload
Area
P/L Processor
PacketWire (SpW)
SSMM
TFG
HICDS
SSMM
Payload
Area
Payload
Area
PDPU
Hi rate links (SpW)
SpW router
Hi rate links (SpW)
SpW router
I/O
TFG
Bus IF
Hi rate links (SpW)
SpW router
router
Spw
HICDS
PDPU
RTU
RTU
SpaceWire
Low rate science
bus (CAN)
Payload
Area
UIB
SpW router
RTU
SSMM
Can IF
RTU
SpW router
Spw
RTU
PDPU
RTU
PDPU
RTU Hi rate links (SpW)
SSMM
Can IF
Hi rate links (SpW)
SpW router
TFG
Hi rate links (SpW)
SpW router
router
Spw
Low rate science
bus (CAN)
SpW router
Hi rate links (SpW)
TFG
Bus IF
I/O
HICDS
System bus
HICDS
System bus
TFG
SSMM
Bus IF
I/O
System bus
HICDS
I/O
System bus (MIL-STD-1553B)
Bus IF
I/O
Bus IF
Platform
System bus
Platform
RTU
RTU
RTU
HICDS with I/Os+ bibus PDPU
HICDS with I/Os +
monobus PDPU
Fully centralized
HICDS with P/F I/Os
+ SpW-only PDPU +
µRTU for P/L
HICDS with P/F I/Os
+ bi-bus PDPU +
µRTU for P/L
Low rate science
bus (CAN)
Platform
Platform
Hi rate links (SpW)
Payload
Area
RTU
I/O
Hi rate links (SpW)
Hi rate links (SpW)
SSMM
System bus
PDPU
HICDS
SpW router
router
Spw
Low rate science
bus (CAN)
TFG
SSMM
TFG
Payload
Area
HICDS
SpW router
router
Spw
Bus IF
System bus
HICDS
Platform
I/O
Payload
Area
Hi rate links (SpW)
Low rate bus (CAN)
RTU
SpW router
RTU
SSMM
RTU
Can IF
TFG
Bus IF
System bus
RTU
SpW router
SSMM
Bus IF
Payload
Area
RTU
PDPU
RTU
RTU
HICDS
Can IF
TFG
RTU
Bus IF
RTU
PDPU
I/O
I/O
Can IF
SSMM
RTU
PDPU
Platform
Platform
Low rate science &
comand/control bus (CAN)
SpW router
Low rate science &
comand/control bus (CAN)
I/O
P/L
RTU
I/O
Hi rate links (SpW)
SpW router
CAN gateway
Payload
Area
RTU
PDPU
HICDS
TFG
Can IF
Bus I/F
I/O
Sensor
Bus I/F
…
RTU
…
HICDS + PDPU +
RTU for all I/Os
Page 97
HICDS with P/F I/Os
+ Generic PDPU +
P/L RTU
HICDS with P/F I/Os
+ multi-purpose
PDPU
SolO ISP Study – FR - ESTEC – 29 June 2004
HICDS with P/F I/Os
+ PDPU with CAN
HICDS + PDPU +
generalised µRTU +
sensor bus
SOP-HO-ASF-023
WP 200:
Architecture options & trade off
Instruments power distribution
Page 98
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Instrument power needs
Power
Need (W)
Instrument
Specific power supply
Mechanisms
In-Situ Instruments
SWA
11
RPW
CRS
6.4
3
MAG
EPD
1.5
8.3
NGD
DUD (x2)
DPD
NPD
4
1
3
2
30 kV
from +2.4 kV to +3.9 kV
from +8.6 V to +300 V
from -2.4 kV to -3.9 kV
from -15 V to -2 kV
Yes
Deployment
No
~4 kV
0-2.0 kV, 1.3 kV typical
from 100 V to 4 kV
No
Yes
No
No
Yes
TBD
Remote Sensing Instruments
Page 99
 2 kV
 20 V low frequency
VIM
34
EUS
25
Yes
EUI
COR
20
34
No
Yes
STIX
RAD
4
7.4
High voltage
SolO ISP Study – FR - ESTEC – 29 June 2004
Yes
No
Yes
SOP-HO-ASF-023
Alternative power design solutions
Power distribution alternatives
Distribution of
regulated primary power
Primary Power bus (28V)
Payload
Distribution Unit
LCL
LCL
LCL
Page 100
Secondary Power
supplies
Instrument X
power Supply
Unit
DC/DC
CV
Centralised distribution of
Primary and secondary power
Primary Power bus (28V)
Secondary Power supplies
Primary Power
bus (28V)
DC/DC
CV
LCL
To Inst. 1
LCL
Vn
SolO ISP Study – FR - ESTEC – 29 June 2004
LCL
Secondary Power
supplies
Instrument X power Supply Unit
Central Payload Power Supply
V1
Distributed standard converters
Standard Converter
LCL
To Inst. x
DC/DC
CV
SOP-HO-ASF-023
Traded power distribution solutions
Power bus from PDU to
switchable instruments
Individual protected
lines from PDPU to
switchable instrument
Page 101
Power bus from PDPU to
switchable instruments
Individual protected lines
from PDU to switchable
instrument
Individual protected lines
from PDU to non
switchable instruments
Individual protected lines
from PDPU to non
switchable instruments
Individual protected lines
from PDU to switchable
instruments grouped per
suite and location
Individual protected lines
from CPPS to non
switchable instruments
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Instrument accommodation
Recommended baseline
Page 102
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Possible accommodation for in situ payloads
Page 103
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Baseline electrical interface
Data management
HSPIS Electronics Box
HSIS Electronics Box
NGD FEE
STE FEE
SWA-PAS FEE
EPT FEE
SWA-HIS FEE
SIS FEE
Power distribution
LET FEE
RTU
HETn FEE
Payload Data Processing Unit
SWA-EAS FEE
SSMM
VIM Electronics Box
P/F common
DPU Core
(LEON)
Routing Unit
SpW router
SpW switch
RTU
VIM ICU
COR Electronics Box
VIM MDE
COR FEE
RTU
COR MDE
RTU
EUI Electronics Box
HBIS Electronics Box
EUI ICU
MAG FEE
EUI MDE
HOIS/STIX Electronics Box
RPW mags FEE
DUD FEE
RTU
RTU
SWA-EAS FEE
STIX FEE
EUS Electronics Box
RPW ICU
EUS ICU
RPW RAD
EUS MDE
RTU
RPW PWS
RTU
RPW ants FEE
Standardconverter
28 V regulated
LCL
LCL
On/Off command
PCDU
PDPU
Space Wire
CV
P/L or P/L suite
I/O,
TM/TC
Micro RTU
Standard electrical interface
Page 104
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
The scan platform for EPD sensors
 Characteristics
– Mass about 2 kg
– Power about 1 W
– 2 Mrpm over 6 years
– Encoder 1 deg accuracy
– 2 DE boards electronics
 Development
– 1 QLTM 1 PFM
– 28 months incl 6 months FB
EPD-EPT
Sensor common
Test
IF
PDFE
FPGA
LVPS
Standard CV
TEL 1
SRAM
CV
EPD-SIS
HVPS
Start
TOF
Stop
I/F,
Logic,
Misc
SRAM
LCL
28 V from S/C PCDU
I/F to fixed part
PHA
EPD-LET
VLSI
PHA
EPD-HET
SSD/4
SSD/4
SSD/4
SSD/4
P/F
drive
electronic
SpW
micro RTU
SpW with PDPU
I/F,
Logic,
Misc
SRAM
P/F body fixed part
Test
VLSI
PHA
EPD-STE
EPD MISC CPU
SRAM,
EEPROM
Test
I/F,
Logic,
Misc
SRAM
HK ADC
CSA/4
PHA/4
Detector
I/F
FPGA
SSD BIAS
SWA-EAS
Counter
HVPS
HVPS
HVPS
HVPS
Detector
I/F
FPGA
P/F mobile part
Page 105
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Overall payload mass budget
PAYLOAD
VIM
EUS
EUI
COR
STIX
Delta to spec
SWA-PAS
SWA-HIS
SWA-EAS
RPW
150,0
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
3
1
1
CRS
2
MAG
1
1
EPD-STE
1
EPD-SPT
1
EPD-SIS
1
EPD-LET
1
EPD-HETn
1
EPD-DPU/H-L-VPS
2
DUD
1
NGD
1
1
DPD
1
NPD
1
1
RAD
Payload support elements
1
Boom
1
EUS filter
1
VIM filter
1
Scanning platform
1
HOIS electronique
1
HBIS elec
Page 106
Optics
Electronics
Optics
Electronics
HRI (3)
FSI
Electronics
Optics
Electronics
Electronics
Sensor
Sensor
Sensor
Serach coil magnetometer
Fluxgate magnetometer
Electric antennas
Electronics
Electronics
Sensor
Electronics
Sensor
Sensor
Sensor
Sensor
Sensor
Electronics
Electronics
Sensor
Electronics
Electronics
Sensor
Electronics
Electronics
22,0
3,0
6,7
6,0
4,6
4,6
3,0
29,9
4,0
4,0
20%
20%
20%
20%
20%
20%
20%
20%
20%
20%
3,0
8,0
1,5
0,5
0,5
1,6
5,5
0,2
0,3
1,5
0,4
1,3
1,5
0,7
2,0
2,9
0,5
3,2
0,6
2,7
1,1
0,2
6,1
10%
10%
10%
10%
10%
10%
10%
5%
10%
10%
10%
10%
10%
10%
10%
10%
20%
10%
10%
10%
10%
10%
20%
26,4
3,6
8,0
7,2
5,5
5,5
3,6
35,9
4,8
4,8
0,0
3,3
8,8
3,3
0,6
0,6
5,3
6,1
0,2
0,6
1,7
0,4
1,5
1,6
0,7
2,2
2,6
1,2
3,5
0,7
3,0
1,2
0,2
7,3
2,0
0,5
0,6
2,000
3,000
1,500
20%
20%
20%
20%
20%
20%
2,4
0,6
0,7
2,4
3,6
1,8
11,5
Mechanism and structure
Electronique
Electronics
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Instrument assessment
The Unionics assessment
Page 107
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
WHY UNIONICS?

Modular Design
– Can utilise a common modular design approach – replicated across nodes.
– Semi-mass production – reducing cost and schedule.
– One type of module – one type of test set-up.
– Seemless transfer of functions across nodes without having to shutdown.

Simple High Speed Interconnect
– High speed “Space wire” – currently 200Mbit/s projected 3.5Gbit/s.
– A number or off the shelf “Space Wire” routers are now available.
– Can form redundant connections – and easily isolate faults.
– Can by pass faulty nodes and re-route data and commands.
– Well established protocols and routing software.

DSP21020 (software option)
– DSP MCM mature space qualified design – used on INM4
– Current MCM can operate at speeds of 14MHz achieving 20MIPs
– Built in “space wire” interfaces.
– Mature software – for multi-tasking across a network of DSPs.
– Software able to reconfigure network of DSPs and redistribute run time programs as necessary.

FPGA (hardware option)
– Large (1Mgate) – very high speed space qualified FPGAs are now available.
– Can be used as a pre-processor and dedicated interface to DSP21020 MCM.
– Proven IPs are now available: “Space Wire”, 1553, ...etc)
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How Can UNIONICS Apply to SOP?

SOP – Multiple instruments
– Potentially similar front end electronics interfaces.
– Distributed system with instruments spread over the platform.

SOP – Very high throughput of raw data
– Requiring data processing and compression, closely related to the front end node.
– Need for high speed links between node (including Mass Memory).

SOP – Require accurate pointing information
– Observation and attitude control are closely inter-related.
– Can use UNIONICS concept to extend the payload data processing and. overlap with attitude
monitoring and control by including them as additional nodes.

SOP – Requiring Mass Memory (MM)
–
–
–
–
Space qualified MM of up to 800Gbits are being manufactured by ASTRIUM.
MM access speed of up to 400Mbit/s can be achieved.
Interface to MM can be easily adapted to be compatible with “Space Wire”
MM can effectively appear as a UNIONICS node in the system.
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Assumptions for SOP payload DPU (Cont.)

Centralised Box
 Advantages:
– Can be specified prior to completion of payload instruments definition.
– Independent of payload instruments’ design, manufacture and test.
– Oversized generic design which could be reused on other platforms.
– Internal modular design so that DPU can be down sized if necessary.
– Standard multiple but duplicate SpW I/Fs.
– Integrated power conditioning (reduced packaging and power losses).
– Integrated mass memory (reduced packaging and interconnect requirements).
 Disadvantages / Problems:
– Harness and connectors’ mass may be large.
– Harness routing may be problematic.
– Accommodating a large mass and volume unit on a small platform.
– Maintaining low temperatures for a small unit volume dissipating high power.
– Existing mass memory module mechanical design may have to be modified.
– Existing power conditioning module mechanical design may have to be modified.
– NOTE: A distributed system where data processing and compression is done at the
payload level may reduce the interconnect data rate requirements, but it will not
have any of the advantages of the centralised DPU unit approach listed above.
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Assumptions for SOP payload DPU

Space Wire (SpW) Interconnect
 Advantages:
– Industry standard interface, approved and supported by ESA.
– SpW is an inherently reliable and fault tolerant interconnect architecture.
– Already base lined for SOP and Bepi-Columbo.
– Availability of Space qualified ASICs, IPs and other building blocks.
– Availability of generic routing software.
– Availability of UNIONICS software which utilises SpW.
– Availability of of the shelf prototyping and test equipment and software.
– Good EMC performance.
– High data throughput, >200Mbit/s.
 Disadvantages / Problems:
– Four-core differential interconnect, higher g/m than some other alternatives.
– Not as efficient in terms of Bitrate/MHz/W as some alternative dedicated links.
– Continuos token and clock required on active interfaces.
– Point-to-point interconnect requiring the overhead of:
– “Switching Matrix(s)”
– Complete set of redundant interconnects (doubling the required number of
cables and connectors).
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Assumptions for SOP payload DPU (Cont.)

Centralised 300Gbits SDRAM Mass Memory
 Advantages:
– Based on 100Gbit (2 x 50Gbits independent banks) Module, a DC/DC converter and a Chip
Set for Mass Memory control with high fault coverage.
– Already manufactured for Pleiades.
– File management capability.
– No software required for SSR control.
– Design can withstand cosmic radiation dose of up to a 100Krad.
– High latchup LET threshold (TBC – awaiting final test).
– Low SEU susceptibility (TBC – awaiting final test).
– At the maximum scrubbing rate a LEO SEU rate as low as 10^-17 error/bit/24h (TBC).
– Small volume per module (13x250x250 mm) and Low mass (1.2kg).
– Dual power rail design, requiring 2.5 and 3.3V +-10% regulated supply
– Low power consumption:
– Standby (scrubbing and refreshing only): 1.5W per bank.
– Simultaneous write and read at 16MHz: 3W per bank.
– Simultaneous write and read at 40MHz: 5W per bank.
 Disadvantages:
– Works as a "tape recorder" storing and retrieving data serially, no random access.
– The chip set for MM control require modification to include random data access capabilities.
– Current design does not have a SpW interface.
– Uses commercial 64Mx 8bit SDRAMs in non-hermetically sealed plastic packages.
(The above two-die per package SDRAMs have only been space qualified for LEO)
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Assumptions for SOP payload DPU (Cont.)

DSP21020 MCM building blocks
 Advantages:
– At least two different types of compact space qualified MCMs are available.
– MCM designed with modular architecture in mind.
– The Astrium MCM has built in three SpW I/Fs.
– The 3Dplus MCM built in all the necessary program PROM.
– UNIONICS software developed and based on DSP21020.
– Space flight heritage on ESA space programs.
– Low mass.
 Disadvantages:
– MIPs/W is not as high as other more recently available processors.
– MIPs/g may not be as high as other more recently available processors.
– Astrium MCM require external boot and program ROM.
– 3Dplus MCM require external SpW I/Fs adapter (can be modified – NRE cost).
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DS21020 MCM Options

Astrium DSP21020 MCM
 Advantages:
– Uses TSC21020F DSP, fully compatible with the Analogue Devices ADSP21020.
– Two memory banks for program and data (128k x 32-bit SRAM each).
– A processor peripheral controller ASIC.
– A 1355 protocol controller ASIC, driving 3xSpW I/Fs through a 8k x 32 DPRAM.
– Compact packaging design, 65g, 100 x 61 x 6mm.
– Solder-less (Interposer) interface between MCM and host assembly.
– A module design which can be populated with up to 8 x MCMs is available.
– A module populated with 4xMCM and 8 way SWM is used within Inmarsat4 DSP.
 Disadvantages:
– Operating speed limited to 14MHz.
– Require external boot ROM and program EEPROM.
– Require external glue logic for boot and program load.
– May require external shared RAM.
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Astrium DSP 21020 MCM and Module
DSP MCM
Generic 8 MCM Module (4 MCMs on each side)
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DSP21020 MCM Options

3D-Plus DSP21020 MCM Cube
 Advantages:
– Uses TSC21020F DSP, fully compatible with the Analogue Devices ADSP21020.
– Two memory banks for program and data (128k x 32-bit SRAM each)
– Three shared memory banks (512k x 32-bit SRAM each).
– 4Mbit FLASH and 2K x 48-bit PROM.
– A processor peripheral controller ASIC.
– Compact packaging design, 200g, 52 x 52 x 33 mm.
– Incorporated into ROSETTA, Mars’Epress and SMART-1.
 Disadvantages:
– Operating speed limited to 20MHz.
– Require external external SpW I/Fs adapter (can be modified – NRE cost).
– Pin Grid array connection to host board, may requiring mechanical support.
– Require a heat-sink arrangements.
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3D-Plus DSP 21020 MCM Cube
DSP MCM Cube
Typical implementation of a single cube module
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Overview of Payload DPU Architecture

DSP Array

SpW I/F Nodes’ Array

Mass Memory Array
 Connection to 16 DSP MCMs.
– Z=16 x DSP21020 MCMs.
– Each Each DSP has at least two SpW I/Fs.
– DSP MCM is can be individually switched on/off.
– Any DSP can be assigned as master controller.
– Payload processing requirements can be met using Y<15 DSPs.
– Z for Y redundancy arrangement, with N= Z-Y cold spared.
 Connection to 36 prime and 36 redundant SpW I/Fs nodes.
– 34 prime and 34 (cold) redundant external Payload Instrument nodes.
– 1 prime and 1 (cold) redundant external Spacecraft nodes.
– 1 prime and 1 (cold) redundant mass memory nodes.
– No single SpW I/F failure will reduce interconnect capacity.
 6 x 50Gbits Independent SDRAM blocks.
– Blocks connected together using proprietary internal reliable bus.
– Common external SpW I/Fs, one prime and one redundant.
– Each block can be individually switched on / off.
– Only one block is required to be in active mode while others can be in standby.
(This reduces the estimated total power as it assume a worst case of all blocks active)
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Overview of Payload DPU Architecture (Cont.)

SpW Switching Matrix Array
 Implemented using 22 x 8 way SMX devices, split into four sections.
– 8 x SMXs for prime SpW I/Fs nodes’ Array.
– 8 x SMXs for redundant SpW I/F nodes’ Array.
– 4 x SMXs for DSP array.
– 2 x SMXs for interllink between SpW I/F nodes Array and DSP array.
– Each SMX device can be individually switched on/off.
 DSP Array SpW interconnect.
– DSPs grouped into 4 groups each of which is associated with a single SMX.
– 4 additional liks are provided directly between 8 of the DSPs to improve reliability.
– Reliability of DSP SWM network is such that failure of any one SMX will not lose
more than 50% of the SpW link capacity to no more than two DSP nodes.
 SpW I/F Nodes’ Array SpW interconnect.
– SpW Nodes’ I/Fs grouped into 6 groups of 6 I/Fs each associcated with one SMX.
– The 6 SWM connect to 2 SWMs which provide 4 SpW links.
– An Identical SMX array is used to connect the redundant SpW I/F nodes.
 Interlink SpW SMX.
– Two (one prime and one redundant) SMX.
– The prime and redundant SWMs connects to the prime and redundant SpW I/F
nodes’ SWMs respectively.
– Each SWM connects to all four DSP SWM.
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Overview of Payload DPU Architecture
Spacecraft
DSP
1
Payload
1
S
M
X
DSP
2
Payload
2
68 Ports SpW Switching Matrix
Payload
34
DSP
16
3 meters
Data Processing Unit (DPU)
APS
Page 120
Mass Memory (MM)
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SMX for Data Processing Unit
5
9
1
S
M
X
S
M
X
2
3
4
S
M
X
10
5
S
M
X
6
7
S
M
X
S
M
X
S
M
X
S
M
X
S
M
X
S
M
X
P
R
I
M
E
S
M
X
Key
S
M
X
8-Way SpW
Switching Matrix
n
DSP21020 MCM
with 2 SpW I/F’s
8
13
1
9
S
M
X
S
M
X
10
11
12
S
M
X
14
13
S
M
X
14
15
16
S
M
X
2
Page 121
S
M
X
S
M
X
S
M
X
S
M
X
S
M
X
S
M
X
R
E
D
U
N
D
A
N
T
n
n
SpW I/F of the
nth DSP MCM
DSP MCM
number
SpW Link
External SpW
Connection
6
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
SOP DPU Mass and Power Budget
AVAILABLE SPECIFIC ACTIVE
16
10
8
16
10
8
72
64
32
SPECIFICATIONS
23
20
13
34
30
30
6
5
4
MAX
MAX
MIN
POWER
MASS
OFF
2
2
32
7
0
1
DSPs
2
DPU SUPPORT LOGIC
SpW TERMINAL LOGIC (assume 2 for 1 cold spared)
SpW MATRIX includes
>
1
PYLOADS
1
MM UNITS
1
MAX
96.0
8.0
5.8
18.0
127.8
SPEC
60.0
5.0
5.0
15.0
85.0
ACTIVE
48.0
4.0
3.3
12.0
67.3
W
W
W
W
W
ACTIVE DSPs
ACTIVE SpW
ACTIVE SpW MATRIX
ACTIVE MM
TOTAL DPU+MM POWER
36.0
63.9
32.0
42.5
16.0
33.6
W
W
ACTIVE SpW TERMINAL LOGIC
APS DISSIPATION
191.6
127.5
100.9
W
TOTAL DPU+MM+APS POWER
126.1 W INCLUDING
MAX
3.2
3.2
3.5
10.3
SPEC
2.0
2.0
3.0
9.0
18.8
21.8
3.6
9.6
16.7
19.4
3.0
6.4
73.9
61.5
76.9
MAX
20.1
Page 122
SPARE DSPs
S/C I/Fs (prime&redundant)
MM I/Fs (prime&redundant)
SPARE MM UNITS
25 % MARGIN
SPEC
16.0
53.8
45.5
kg
kg INCLUDING
DSPs
DPU SUPPORT LOGIC
SpW MATRIX
DPU+DSPs CASING + CONNECTORS
TOTAL DPU UNIT MASS
SpW HARNESS AND CONNECTORS
SpW TERMINAL LOGIC + CONNECTORS
MM UNITS
0.5 mm DSP-MCM case
APS
2 mm DPU case
TOTAL SUPPORT UNITS MASS
TOTAL DPU+MM+APS+HARNESS+PAYLOAD I/Fs MASS
25 % MARGIN
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
SOP DPU Mass and Power Budget (continued)
DPU PROC. RATE
MM CAPACITY
# PAYLOADS
POWER
PARAMETERS
MASS
Page 123
PROCESSING REQUIREMENTS
UNITS@
20 MIPS at
20 MHz
UNITS@
50 GBITS at
16 MHzx14bit/s=
160 MINIMUM TOTAL REQUIRED MIPS INDEPENDENT OF PAYLOADS
224 Mbit/s access rate
155.4 MAX TOTAL REQUIRED MIPS BASED ON NUMBER OF PAYLOADS
160
200
30
MIPS
Gbits
UNITS
6
0.5
0.5
0.25
3
W
W
W
W
W
3
27
85
3
200
200
300
150
600
50
m
g/cm3
g/m
g/DSP-MCM
g/DSP-MCM
g/DSP-MCM
g/payload
g/switch
g/50Gbit
g/W
DSP-MCM
DPU SUPPORT LOGIC
SpW TERMINAL LOGIC
SpW MATRIX
MM UNIT OF 50Gbits
75 % APS EFFICIENCY
DSP MCM Standby Power
DSP MCM Power / MHz
1.20 W dc
0.24 W/MHz
MM Unit Standby Power
MM Power / MHz
1.67 W dc
0.08 W/MHz
SpW max cable length
Density of Al
SpW cable
9 way MDM
DSP-MCM
DPU-MCM SUPPORT LOGIC
SpW TERMINAL LOGIC
SpW MATRIX
MM
APS
SolO ISP Study – FR - ESTEC – 29 June 2004
SOP-HO-ASF-023
Study conclusions
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Conclusion

Study demonstrates that 150 kg payload can be achieved
– Pending size reduction of remote sensing instruments and key effect on mass & thermal
– Thanks to relaxation of resolution to 150 km @ 0.21 AU
– Size reduction and mass containment pave the way for the shortest cruise «ESA Flexible» mission

The main system issue is the management of the data volume
– Manageable at spacecraft level
– Critical at system level due to space to ground telemetry bottleneck

Study allows to clearly highlight and recommend
– Instruments interfaces for accommodation on spacecraft
– Instruments issues resulting from overall system environment

Study should be seen as a way
– To get a common understanding ESA/science team/industry of
·
·
Instruments requirements
Mission, environment constraints
– To better prepare spacecraft and system design
·
·
Avoid overdesign
Issue required level of interface information
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