Transcript COMPANY PROFILE

Lee Laboratories & Electrofont
Lead-free/RoHS Roadmap
Lee Laboratories Pte. Ltd.
Our Company shall adopt an efficient, far-sighted and thorough (EFT)
Environmental Policy through six (LEELAB) key areas:
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Legislation and other requirements must be met
在法律条规与其他条件下符合要求
Encourage the use of more environmental-friendly
materials, equipment and technology
鼓励使用对环境更友好的材料，设备和技术
Ensure that activities does not create any nuisance to
our neighbours
确保操作状态不会给邻里造成任何不满
Lessen the quantity of pollutants discharged
减少污染排释量
Awareness must be promoted among employees,
suppliers, customers and the general public
促进员工，供应商，顾客和众对此项环保条例的悟解
Best practices are key ingredients to enhance our
company’s environmental image
最佳的实践是提高公司的环境形象的关键
Lee Laboratories Pte. Ltd.
New environmentally friendly materials will
be introduced to meet customer
requirements and demands of the European
Union Directive (2002/95/EC) on the
Restriction of the Use of Hazardous
Substances (RoHS)
Lee Laboratories Pte. Ltd.
LEE LAB
Electrofont
Managing Director
Lee Choo
Factory Manager
Jason Foo
SALES
Design &
Development
Design &
Development
Sample Build
Co-ordinator
QA & Product
Purchasing
Production
Crystal
Yang Zheng
Irene
Wern Pin/Nicholas
Yang Zheng
Sook Fung
Kwang Yiang – SMT
Bernie – COB
Eddie - FA
Lee Laboratories Pte. Ltd.
ROHS Project Time Schedule
Time Period
Action
a) April 2004 to May 2004
- Start ROHS plan discussion
- Decides on which project involves(Eg. 817, 994, 998, 999, etc)
-Vendor benchmarking for solder paste/solder wire/flux
-Vendor benchmarking for facilities(Eg. Lead-free soldering iron
-Discussion of materials used and facilities(Eg. AVL components and
SMT machine
- Discussion and preparation of ROHS Project documents(Eg. Bill of
b) May 2004 onwards
materials, Process Spec., QA insp. Spec., Design Testing Spec., etc)
- ROHS Compliance Components Request
Lee Laboratories Pte. Ltd.
Cont. May 2004 onwards
- Samples request for lead-free solder paste/solder wire/flux
-Compliation of components ROHS declaration/Temp. profile/Test
Report/Material Safety Data Sheet(MSDS)
- Compliation of lead-free solder paste/solder wire documents(Eg.
Reliability test report/Temp. profile)
-Reliability test on ROHS compliance samples(E.g 994, 998, 817, etc)
Lee Laboratories Pte. Ltd.
Sample Build Evaluation For Optrex Europe
Sample Build
a) Jan 2005
- A-994-03 & A-994-04 using MultiCORE lead-free solder past
paste
b) Jan 2005 - Feb 2005
- A-998-03,A-999-03 & A-1000-03 using ASAHI lead-free
solder paste
c) April 2005
- MG 817 AU-LA-01 using ASAHI lead-free solder paste
Mass Production
• July 2005
• Aug 2005
-A-994-04 ROHS Compliance PCBA shipment
-MG 817AU-LA-01 ROHS Compliance modules shipment
Lee Laboratories Pte. Ltd.
Sample Build Evaluation For Leica
a) Jun 2005
• MG 1089FU-SEW-01 using MULTI-CORE lead-free solder
paste
b) Jun 2005
• A-997-04 using ASAHI lead-free solder paste
c) Nov 2005 - Dec 2005
• Plan for sample build for MG 973 FU-SLY-7
Lee Laboratories Pte. Ltd.
Sample Build Evaluation For Optrex Japan
April 2005 to Nov 2005
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Manual soldering using SENJU lead-free solder wire for
project 1019, 1020, 1022, 1025, 1069, 1071, 1072, 1073,
1074, 1075, 1076, 1077, 1078, 1080, 1081, 1082, 1084 &
1085
Lee Laboratories Pte. Ltd.
Sample Build Planning For Other Customers(Sumitomo, Applera
Holdings, Eltech)
Nov 2005 - Dec 2005
-> Plan for sample build for:
• MG 978 (Sumitomo)
• MG 938 (Applera Holdings)
• MG 830 (Eltech)
Lee Laboratories Pte. Ltd.
6.0
Solder Paste Vendor
6.1 Process Spec. Requirement
Pre-heat
Time
Asahi Solder
Paste
100-150 Deg.C
50-80 secs
Multicore Solder
Paste
130-165 Deg.C
60-120 secs
Qualitek Solder
Paste
100-140 Deg.C
60-90 secs
Soaking
Time
150-207 Deg.C
30-80 secs
165-217 Deg.C
15-30 secs
140-170 Deg.C
60-90 secs
Reflow
Time
207 Deg.C
30-60 secs
217 Deg.C
30-45 secs
217 Deg.C
60-90 secs
Peak
Temp
Min:220 Max:235
Min:230 Max:250
Min:235 Max:249
Lee Laboratories Pte. Ltd.
7.0
7.1
SMT Process Guidelines
Paste Storage
Storage temp. : 5 to 10 deg. C.
7.2
Production Working Environment
Temp. : 20 to 25 deg. C.
Humidity : Less than 60% RH
7.3
Paste Preparation
Thawing time : 4 to 8 hrs.
Stirring Time : 60sec approx.
7.4
Paste Printing
Stencil Thickness : 6 mils (0.15mm)
Printing Speed : 20 to 150mm / sec
Squeegee Pressure : TBD.
7.5
Paste Printing Guidelines
Condition
Paste alignment to pad
Smeared paste
Insufficient paste
No paste
Solder paste height
7.6
preferred for fine pitch IC
Preferred
100%
0%
0%
Acceptable
<25% out
0%
Reject
>25% out
any smeared
75% coverage
< 75% coverage
6 mils
> 4.5 mils
Any
< 4.5 mils
Paste Printing Visual Inspection
Pls. refer to Judgment Criteria QA-JC-SMT-01.
Remarks
Not done at
the moment.
Lee Laboratories Pte. Ltd.
8.0
SMT Component Mounting
Condition
Parts loading
onto Feeder
Parts mounting
onto PCB
Parts mounting
onto pad
Paste slumping
Preferred Acceptable
Reject
Refer to SMT product loading list
Remarks
Refer to BOM / SMT product loading
list
100%
<25% out >25% out
> 0.3mm
min 0.3
mm
< 0.3 mm
Distance
between
two nearest
paste.
Lee Laboratories Pte. Ltd.
9.0 Reflow Process
Reflow oven temperature & conveyor speed setting will be determined
after profiling and will vary from product to product depending on the size
of the boards and complexity of the component mount upon it.
9.1
Reflow Profile
Condition
Ramp Up Rate
Pre Heat
Soak Time
Dwell Time (time above melting pt)
Peak Temp
Cooling Rate
Setting
1 - 3 C/sec
120 - 165 C (50-100 secs)
TBD
30 -90 secs
230 -250 C
2 - 4C/sec
Lee Laboratories Pte. Ltd.
9.2
Post Reflow Guidelines
Condition
Solder short
Insufficient solder
Dry solder
Solder balls
Preferred
NA
0%
NA
NA
Acceptable
NA
< 25%
< = 0.13mm ;
max.5/600mm2
Reject
Any
> 25%
Any
> 0.13mm ;
> 5/600mm2
No wetting
Dull solder
NA
NA
Any
Any
Solder crack
Component crack
NA
NA
Any
Any
Wrong/missing
component
Wrong
orientation/polarity
Alignment out
PCB warpage
PCB delamination
NA
Any
NA
Any
9.3
0%
NA
NA
< 25% out
Post Reflow Visual Inspection
Pls. refer to Judgment Criteria QA-JC-LFS-01.
> 25% out
Any
Any
Remarks
All solder balls
are entrapped or
encapsulated
with no clean
flux residue.
Reflow profile
not optimize.
Component not
suitable for high
temp.
Lee Laboratories Pte. Ltd.
10.0 Manual Soldering Visual Inspection
Pls. refer to Judgment Criteria QA-JC-LFS-01.
11.0 Lead Free Label Indication
To differentiate for Lead free modules / PCB Assembly, we will indicate in our
date code label “YYWWxxx_LF” which means YY – Year, WW – Workweek,
xxx – Operator code, LF – Lead free.
At Outer Carton, under remark column “ROHS Compliance” will be indicated for
at least 1st 3 shipments.
Lee Laboratories Pte. Ltd.
Lee Laboratories
Business /
Customer Order
Admin
Support
Process
Order
Delivery
RFQ
Sales
Require
Design?
No
Customer
Requirement
Lee Laboratories / Electrofont
Internal Review
Yes
Process
Develop
Material
Control
Production
& Material
Planning
Product
Design
Manufacturing
Sourcing
Engineering
Support
No
Require
Manufacturing?
Customer
Electrofont
Yes