Transcript 09 CARMEN MOLDOVAN

INTEGRAMplus
Integrated MNT Platforms and
Services
Europractice Service Project providing
Development Platforms for Integrated
Micro-Nano Technologies and
Products
Carmen Moldovan, Bogdan Firtat
IMT-Bucharest
1st MEMSCON Event
07/10/10, Bucharest
IMT Bucharest
Laboratory of Microsystems for
Environmental and Biomedical
Applications
Carmen Moldovan – Head of Laboratory for Environmental and
Biomedical Applications –15 years of experience in MEMS
technologies
 Associate professor
 Coordinator and partners of more of 25 national projects and 10
EU projects
 Former NEXUS Steering Committee member
 ISTAG group member within DG - INFSO, EC
Bogdan Firtat – Scientific Researcher, 10 years experience in
MEMS technologies: design, simulation and modelling for
mechanical, chemical and biological microsensors and FEM
microfluidic modelling.
INTEGRAMplus
- FP6 Integrated Project
Europractice Service Project providing Development Platforms for Integrated Micro-Nano
Technologies and Products
Carmen Moldovan, IMT Bucharest
INTEGRAMplus - Integrated MNT Platforms and Services
Aim: Highly integrated microsystems combining smart Si functionality
with polymer platforms in a multi-domain environment
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Address and stimulate future market needs via higher levels of integration in stable, manufacturable MNT
processes enabling nano via micro
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Emerging markets: biomedical & healthcare; pollution & security; comms (RF & optical)
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Multi-domain integration: bio-optical-fluidics, MEMS and/or electronics; mixed process technologies
(silicon-polymer)
Stimulate take up of smart (integrated) MNT products
Reduce barriers to MNT access

training and standardisation
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provide development platforms and standard modules
Provide low cost MNT prototyping services
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enable virtual manufacturing based on Design for Manufacture principles
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Silicon MEMS and polymer prototyping
Provide seamless service across the MNT supply chain
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from concept to production
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10 partners from 7 countries + extended supply chain network
PARTNERS
QinetiQ Ltd., Malvern, UK
Coventor sarl, Paris, France
Lancaster University, UK
CSEM, Alpnach, Switzerland
Epigem Ltd., Redcar, UK
National Institute for R&D
in Microtechnologies,
Bucharest, Romania
Institut für Mikrotechnik,
Mainz, Germany
Institute of Electron
Technologies, Warsaw, Poland
Silex, Sweden
Yole Dévelopment, Lyon, France
INTEGRAMplus Organisation
CAD TOOLS & VIRTUAL MANUFACTURE
IMT
(Biointegration &
microfluidic design)
Coventor
(Multi-domain software &
Design for Manufacture)
ITE
(Electronics &
microfluidic design)
DESIGN SERVICES, PROTOTYPING & LOW VOLUME MANUFACTURE
IMM
(polymer)
CSEM
(polymer, silicon)
QinetiQ
(silicon)
VOLUME MANUFACTURE
EPIGEM
(polymer manufacture)
U. Lanc.
(PATENT)
CUSTOMER SUPPORT
Silex Microsystems
(Silicon / glass manufacture)
Yole Developpement
(Strategic Marketing)
SUPPLY CHAIN PARTNERS
X-Fab
(CMOS manufacture)
AMIS
(CMOS manufacture)
MCE
(packaging)
C-MAC
(volume assembly)
DELTA
(packaging)
AML
(bonding)
Micronit
(glass manufacture)
Expert Consultants
(PATENT-DfMM
members)
Hymite
(packaging)
The INTEGRAMplus Partners’ Technology Portfolio
European partners in micro and nanotechnologies with complementary expertise in:
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Silicon, polymer, glass, hybrid solutions
Multi-domains (optics, fluidics, MEMS, bio, chemical, electronics)
Multi-level integration (material, electronics, functions and system)
Development and production along the supply chain
FLEXIBLE INTEGRATION
Combined integration
Polymer & Silicon
Bio-Integration
Polymer & electrodes
DEVICES AND COMPONENTS
Microfluidics
MicroOptics
Biodevices
Physical
sensors
Power
sources
Electronics
Memory
DSP/µC
Comms
MATERIALS AND FABRICATION TECHNIQUES
Metal
deposition
Micromachining
Polymer
Silicon
Moulding
Glass
Surface
Functionalisation
Bonding
Embossing
Milling
CMOS integration
CAPABILITIES FOR WHOLE PRODUCT LIFE CYCLE
Design &
simulation
Prototyping
Testing
Low and high
volume production
Packaging
Macrosystem
integration
INTEGRAMplus offer
Customers
Customers
Customers
Productisation
Customers
Fabrication
Services
Design
Services
Prototyping
Services
Consultancy
Courtesy IMM
Courtesy Epigem
Products /
Production
Courtesy Epigem
Prototypes
Devices &
Components
Processing
Design &
Simulation
Functional
Modules
Service Offerings
Currently 3 Prototyping Platforms:
1. QinetiQ Silicon MEMS Prototyping Service
2. Epigem Modular Microfluidic Prototyping Service
3. IMM Rapid Prototyping Service for Lab-on-a-chip
Multi-domain Integration - Technological issues
Issues being addressed
Fabrication of chips with electrodes
Competencies needed
Fabrication of polymer parts with electrical leads
(injection molding, lithography, …
(Si) chip fabrication
Fabrication of microstructured gaskets (casting,
laser cutting, punching, …)
Fabrication of polymer parts (micromachining,
casting, embossing, injection molding, …)
Microchannel fabrication
Optical components
Electric contacts between chip and leads (flip-chip,
solder bumps, wire bonding, …)
Surface functionalization
Hybrid bonding technologies (surface activation,
thermal bonding, …)
Channel sealing
Hollow waveguides (fabrication, sealing, integration)
Microfluidic interfacing
Adhesive bonding technologies (glues, double sided
sticky tapes, …)
Optical interfacing
Surface functionalization (biochemistry,
nanopatterning, …)
Electrical interfacing
Connections to macro world (fluid ports &
reservoirs, electrical contacts, light contacts)
Substrate
Fabrication of silicon/SOI parts (DRIE, anisotropic
wet etch, chemical vapour etch, …
Integration of silicon into polymer
Fluid
Chip
Underfill
INTEGRAMplus multi-domain
multi-technology platforms
Si chip scale package with
polymer microfluidic chip and
electrical connections
Epigem microfluidics
chip with integrated
electrodes and pcb
headers mounted
Hollow waveguide
 Advanced optical circuit
modules
 Combined fluidic and
optical modules
Innovative silicon-polymer integration technology for chips onto
substrates with fluid access opening using flip-chip bonding
INTEGRAMplus Summary

Provides industry with a world-leading facility to stimulate take-up and
accelerate time-to-market of smart mixed-technology components and
solutions.
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A consortium offering tried and tested micro and nano technology expertise
from10 partners operating across 7 European countries.
A design and prototyping service with route to volume manufacture for highly
integrated microsystems.
High degree of flexibility to address the need for increased complexity in
microsystems without sacrificing the requirement for manufacturable
processes.
A flexible customer interactive approach ensures access to INTEGRAMplus
at any stage in the product lifecycle.
Web-sites: www.integramplus.com
www.QinetiQ.com/mems
Email:
[email protected]
Tel:
+44(0)1684896262
Mission and main activities
The Laboratory of Microsystems for Biomedical Applications is doing research, focused on development
of microsensors and sensors integration such as:
- chemosensors (O2, pH, NO2, NOx, CO, CO2, humidity etc.);
- biosensors (enzymatic, immunosensors, biomicrosensors array);
- nanowire based ISFET
- microprobes for recording of electrical activity of cells and tissues,
- microfluidic platforms,
- signal processing and data acquisition for microsensors array, technologies for sensor integration, data
processing, transmission and acquisition.
The Lab is running services for industry in design, simulation, technology, testing and data acquisition,
processing and transmission and education in the field of mixed technologies.
The Laboratory was involved in several FP6 projects in the area of technologies for sensors integration,
microfluidics and software and hardware development for data acquisition.
IMT’s tasks in the project are: simulation and modelling of fluidics and temperature distribution inside the
microsystem channels, and computational modelling of the integrated multi-sensing system. Also IMT will be
developing the auxiliary sensors for monitoring the cell culture’s environment and will work on microfluidic
microsystem integration.
Resources: The Laboratory has 11 permanent researchers and 2 part time co-workers from a total of 170
employees (researchers and administration).
Sensors technology
Gold electrodes pesticide sensor
18
16
Silicon biochip in the microfluidic module, with
pumps and reservoir
14
C [nF], G[uS]
12
10
C[nF]
8
G[uS]
6
4
2
0
-2
0
5
10
15
Time [min]
20
25
Conductance and capacitance:
A – substrate injection,
B – inhibitor injection
NW ISFET sensor
Nanowire chip
LabView
interface
Fluid
Computer
interface
Enlarged view of the
reaction area
Reaction
area
* Cl. Moldovan, A. Dinescu, E. Manea, R. Iosub, C. Brasoveanu, B. Firtat, C. Moldovan, M. Ion, TECHNOLOGY OF A NANOWIRE
BIOFET DEVICE FOR BIOMOLECULES DETECTION , CAS 2009 Proceedings; ISBN: 978-1-4244-4413-7, Vol.2, pag.549-552
Sensors on glass and platform
Platform
Cfr. different buffers - 46 hours dynamic test - external reference electrode
0.4
40
0.35
y = 10.938x - 735.56
39.5
39
Temperature(C)
0.25
0.2
0.15
38.5
38
37.5
37
36.5
Series1
36
time
pH+ - ref - pH4 buffer
pH- - ref - pH4 buffer
pH+ - ref - pH5 buffer
pH- - ref - pH5 buffer
pH+ - ref - pH7 buffer
pH- - ref - pH7 buffer
pH sensor
2:36:28 PM
1:26:39 PM
9:57:11 AM
12:17:05 PM
8:47:39 AM
11:07:16 AM
7:37:52 AM
6:27:50 AM
5:18:18 AM
4:08:31 AM
2:58:29 AM
1:48:42 AM
12:38:40 AM
9:09:19 PM
11:28:53 PM
7:59:32 PM
10:19:06 PM
6:50:00 PM
5:40:28 PM
4:30:42 PM
3:20:55 PM
2:10:22 PM
1:00:36 PM
9:31:27 AM
11:50:48 AM
8:21:40 AM
10:40:59 AM
7:11:53 AM
6:01:51 AM
4:52:05 AM
3:42:18 AM
2:32:31 AM
1:22:45 AM
9:53:10 PM
12:12:58 AM
8:43:08 PM
11:03:11 PM
7:33:06 PM
6:23:35 PM
0.1
5:13:48 PM
voltage (V)
0.3
Linear (Series1)
35.5
35
70.45
70.5
70.55
70.6
70.65
70.7
70.75
70.8
70.85
70.9
70.95
Resistance(Ohm)
Temperature sensor
Microfluidic module with
the reference electrode
Auxiliary sensor - pH sensor
nanofiber polyaniline based
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The pH sensor is a solid state sensor based on
conductive polymers, miniaturized, developed
on silicon substrate
The sensor measurement is a voltage
measurement at zero current. The voltage is
measured between two electrodes: the active
electrode and the reference electrode (Ag/AgCl,
KCl 3M).

The gold electrode was deposited with a layer
of polyaniline conductive emeraldine base form
as seen in the SEM.
 The electrochemical deposited polyaniline has
an intrinsic nanowires structure of 100nm
diameter
SEM picture of electrochemical deposited
polyaniline conductive layer in the form of
nanofibers
Carmen Moldovan, Rodica Iosub, Radu Cornel, Eric Moore, Anna Paschero, Walter
Messina, Danilo Demarchi, Cecilia Codreanu, Daniel Necula, Adrian Dinescu, Bogdan
Firtat, Sensor system for on-line monitoring of cell cultures, CAS’09 (International
Conference on Semiconductors), IEEE catalog Number CFP09CAS-PRT, ISBN: 978-1-4244412-7; pp 263-267
Integration
Connections, signal processing, data acquisition, GUI
Labview interface
Automatic measuring set-up
The graphic user interface designed with the LabView. By the program we can
control: Acquisition time, Number of loops, Time between the loops, Flow rate
in the channels
Integration
Microfluidics
Visual results of the continuous flow simulation
(section through the z plane) – detail
Microfluidic set-up
The velocity of the fluid into the channel simulation has
been performed***
***B. Firtat, C. Moldovan, G. Boldeiu, FEM Microfluidic simulations for
microchannels – continuous and droplet-like flow; The 4M/ICOMM Conference, 2325 Sept. 2009, Karlsruhe, Germany; Proceedings, pp 205
CO2 GAS SENSORS
Metal
Membrane suporting
sensor
High dose boron is
implanted and diffused
followed by a boron doping
from solid source +
diffusion (1050C, 4 hours).
 the p-n junction, 12 m
depth, for anisotropical
stop etch
A CVD oxide is deposed
such as dielectric layer and
the contacts on polysilicon
layer are open
Cr-Au
deposition
configuration follow.
Polysilicon 4000 Å
CVD SiO2
Lift-off
mask
SiO2
5000 Å
Si3N4
2000Å
Si
n
<100>
B++
and
Si3N4
2000 Å
Scheme of the sensor chip
Electrodes
Ceramic gas sensor – integrated
heater
400
300
SP01
200
100
The heat distribution from the released21,5°C
heating element using FLIR 40
The heat distribution of a non- released
heater element as seen in figure
500
The input power
was 1,1 W and this
should
be
compared with the
non-released
heater element that
requires 2,4 W
input power of to
reach 490 C
400
Temp (°C )
500,0°C
500
300
200
100
0
0
1
2
3
4
Timefor
(s)the
The power-on curve
released heater element.
Non-released heater element
5
New developments
Flexible substrate – gas sensors, batteries
New developments
Ink Jet Technology – sensors on paper
for gases detection
 Integration: signal processing, GUI
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Modelling and simulation
activities
Design for Manufacture
(etch simulations)
Calibration of a new software application (Etch3D
– developed by Coventor, Inc.), designed for
anisotropic silicon etching simulations.

test structures were used, with different sizes
and shapes;
 the real test structures (etched in both KOH
and TMAH, with different temperatures,
concentrations and etch times) were compared
to the simulation results;
 the program’s internal parameters were
adjusted, in order to fit the lab results.
Design for Manufacture
(etch simulations)
SEM picture of the etched test
structure (TMAH, 25%, 80º C, 5 min.)
Simulation using default values of the
program parameters (for TMAH, 25%,
80º C, 5 min.)
Tuned values of the program parameters
(TMAH, 25%, 80º C, 5 min.).
Experimental and simulation results for the 4-crosses test structure (using TMAH)
Microfluidic modelling

Microfluidic simulations were performed, in order to analyse one fluid velocity
through a specific microchannel design. The simulations were used to observe the
flow speed and direction of the liquid passing through, and also dead spots in the
flow (zones with much slower velocity), for different fluid flow rates.
Microfluidic modelling
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Dead volume and cross contamination
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Model compatibility issues solved for different
platforms
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Several simulations performed:
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Continuous flow analysis (velocity, pressure, etc.);
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Slug-flow analysis (fluid bubbles through channels);
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Identification of fluids cross-contamination and deadvolumes.
Multi-domain modelling
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Modelling of a thin membrane silicon
pressure sensor
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Micro-mechanical simulation (membrane
deflection, stress induced);
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Electrical and piezoresistive simulation (for
determining the current change due to the
mechanical stress induced by the applied
pressure).
Conclusions
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Continuing technology development
 New technologies for platforms develop
 Offering services: sensors and platform
prototyping, simulation, training
Interest:
 New projects partnership
 Industry attracting, bringing inventions to
innovations
 Start-up development
THANK YOU!
[email protected]
[email protected]