IAR MakeApp presentation

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Transcript IAR MakeApp presentation

IAR MakeApp for the Bluetooth
protocol stack
A superior configuration and optimization tool!
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The importance of tool support
• Most stacks come with no tool support for
configuration and optimization
• Manual adaptations are needed to use the stack
on a new H/W or S/W platform
• Most stacks contain code for many features you
don’t use –> waste of memory space!
• Manual optimizations are needed to get a fast and
compact stack for your project
• You will need training courses or expensive
consultants
• You will suffer a heavy development cost and
time-to-market penalty!
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The IAR MakeApp tool
• IAR MakeApp is the most powerful Bluetooth
protocol stack optimization tool ever created!
• Advanced configurations are made within a few
seconds on a high abstraction level
• The tool generates optimized and adapted Bluetooth
protocol stacks in ANSI-C
• The stack becomes highly optimized for your H/W
and S/W platform in seconds
• You save development time, production cost, and
shorten time-to-market!
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MakeApp ”runtime” environment
- Superior GUI power and flexibility!
Add text or
drawings (like the
LEDs here) to
enhance clarity
Support a Bluetooth stack or other
configurable software blocks
Drag components
from the library
and drop in the
drawing editor
Support MCUs or
external devices
Component
drag & drop
Project explorer
Source code
generation output
log
Configure using
property lists
Feature highlights
•
Highly graphical, ”CAD-like” drawing
editor with drag & drop
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Optimizing code generator
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Built-in IAR Editor with source code
syntax coloring
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HTML report generator creates detailed
project reports with hypertext-links.
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Built-in HTML report viewer
•
XML based file formats
Component model
- Power and flexibility
•
MakeApp supports many types of components, that can be added to the
same project for configuration & code generation:
•
•
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Microcontrollers (8/16/32-bit, DSP)
External devices (Ethernet, LCD, USB, CAN, ASIC, FPGA)
S/W emulated peripherals (I2C)
S/W components (Bluetooth or TCP/IP stacks, Keyboard scan)
Unprecedented flexibility – MakeApp
becomes a code generation platform,
that can generate source code for the
complete embedded system!
Stack configuration
Environment
• H/W (Host CPU, Bluetooth device)
• S/W (RTOS, Compiler)
Stack features
• Core (HCI, L2CAP, RFCOMM, SDP, ...)
• Profiles (GAP, SDAP, SPP, ...)
• Other (TCI, Message logs, ...)
• Select API functions to implement
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Configuration controls code generation
Stack A:
Stack B:
Stack C:
GAP
SDP
SPP
GAP
SDP
SPP
Headset
GAP
SDP
SPP
Headset
(other settings)
MakeApp helps the user focus on the application
rather than MCU and stack internals!
ANSI-C code generation
Code adaptations
•
The stack source code is generated for the
selected H/W and S/W environment
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The generated stack source code only
implements the selected stack features
Code optimizations
•
Unused features and API functions are
removed from the stack implementation
•
Gives you a very compact stack = reduced
memory usage and faster execution!
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Code size affect production cost!
• The stack optimizer makes a ”vertical slice” of the
stack and removes unused code
• The resulting stack becomes very compact and
waste no ROM space
• Production cost is reduced as CPU and ROM
requirements are lower!
Application program
SPP
SDAP
GAP
RFCOMM
SDP
BMC
L2CAP
HCI
Unused stack parts are removed
Selected features are implemented
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Product life cycle
Fixed in time
Lost sales
Maturity
S
A
L
E
S
Planned
intro
Slip
Time
Source: McKinsey & Co.
Time to market is critical – delayed launch means lost market window and reduced sales.
Use good tools to shorten your time to market!
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Sensitivity of profits over life cycle
% diff. profit
ship 6 mths late
prod. cost 9% high
50% dev. cost overrun
0
-3.5 %
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No tool support
for stack
adaptation
-10
Stack uses too
much memory or
needs faster CPU
More expensive
development tool
-15
-20
-22 %
-25
-30
-35
-33 %
-40
-45
Source: McKinsey & Co.
IAR comments.This symbol gives examples of reason to failure
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Bluetooth Protocol Stack
technology from IAR Systems
Superior tool support
Timely arrival to market
Configurable stack
Optimal solution
Compact stack
Lower production cost
Shorter development
Lower NRE cost
RAD expertise
Increased human capital
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