Transcript Document
AMICSA 200
6 8
summary
02-sep-2008 AMICSA 2008 Slide : 1
AMICSA 2006 in numbers
•
48 51
participants • From
11 12
NO countries GR, F, UK, NE, D, IT , BE, USA, SWI, SWE , AT , FI, P, • From
26 27
different institutions/companies (more than half are new comers)
DUTH
, A2S ,
EADS Astrium ( UK & F)
,
E2V
,
ESA
,
CNES
,
National Semiconductor
, TRAD,
Aurelia
, NTUA,
STMicroelectronics
,
SODERN
, SRON,
Fraunhofer Inst IC
,
IHP
, IMST, NISR, TESAT, ETH,
SUPAERO
,
Saab
, IMEC, AAS,
Austria Space Research Inst
, Nucletudes , ISD , EST Tomar, Instituto de Telecomunicações, Silicon SW Systems, Nova U., VTT, TKK, Gamma Medica Ideas, U. Bergen, Nemerix, Humboldt U., Kayser-Threde, Chipidea-MIPS, SABCA.
•
17 19
answers presentations in
2
days, plenty of discussions, questions and 02-sep-2008 AMICSA 2008 Slide : 2
AMICSA 200 8 in numbers
•
48 49
participants • From
11 15
countries GR, F, UK, NE, D, IT , BE, USA, SWI, SWE , AT , FI, P, NO, E • From
26 36
different institutions/companies (more than half are new comers)
DUTH
, A2S ,
EADS Astrium ( UK & F )
,
E2V
,
ESA
,
CNES
,
National Semiconductor
, TRAD ,
Aurelia
, NTUA ,
STMicroelectronics
,
SODERN
, SRON ,
Fraunhofer Inst IC
,
IHP
, IMST, NISR , TESAT , ETH,
SUPAERO
,
Saab
, IMEC , AAS,
Austria Space Research Inst
, Nucletudes , ISD, EST Tomar, Instituto de Telecomunicações, Silicon SW Systems, Nova U., VTT, TKK, Gamma Medica Ideas, U. Bergen, Nemerix, Humboldt U., Kayser-Threde, Chipidea-MIPS, SABCA, INTA, Insilition, RUAG,CNM/U. Seville, Arquimea,CERN, Dutch Space, ACTEL .
•
17 19
presentations in
2
days, plenty of discussions, questions and answers 02-sep-2008 AMICSA 2008 Slide : 3
AMICSA’06 - Applications
•CMOS Image sensors readout •Video processing chain •ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband) •CAN 1553 transceivers •TM acquisition & data handling IO control •Magnetometer front end •Slow sampling high resolution •Power converters •LASER interferometer •AOCS •Environmental monitoring •X,Gamma ray spectroscopy •GNSS receivers Front End 02-sep-2008 AMICSA 2008 Slide : 4
AMICSA’08 - Applications
•CMOS Image sensors readout •Video processing chain •ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband) •CAN 1553 transceivers •TM acquisition & data handling IO control •Magnetometer front end •Slow sampling high resolution •Power converters •LASER interferometer •AOCS •Environmental (T, wind, humidity) monitoring •X,Gamma ray spectroscopy readout •GNSS receivers Front End 02-sep-2008 AMICSA 2008 Slide : 5
AMICSA – Technology (I/II)
PROCESSES
• CMOS • Bipolar • BiCMOS • Si / SiGe / SiGeC • bulk / SOI •1.0, 0.5, 0.35, 0.25, 0.18, 0.13 µm; • 90, 65nm 02-sep-2008
FOUNDRIES
• AMS (AT) • AMIS (B) • STMicroelectronics (F) • IHP (D) • Infineon (D) • XFab (UK) • UMC (Taiwan) • TSMC (Taiwan) AMICSA 2008 Slide : 6
AMICSA – Technology (II/II)
EDA tools, HDL & DK MPW programmes
• Tanner • Cadence • Calibre (Mentor) • Pspice / Hspice • ADMS (Mentor) • • VHDL-AMS / Verilog-A • proprietary simulators, optimizers: Astrium (UK), S3 (P) 02-sep-2008 • Europractice • CMP • MOSIS • vendor specific… •Multi-Layer Mask AMICSA 2008 Slide : 7
AMICSA – Radiation effects
Rad Threats
(TID, SEE)
• leakage currents • Vth shifts • parasitic transistors/ latch up • gate rupture • data corruption (bit flips) • transient pulses
Mitigation Techniques
(technology and function dependent)
• enclosed/bigger transistors, H-shape • guardband rings / STI / LOCOS • avoid diffusion resistors in favour of oxide R • epi layer / hetero-epi • buried-layers • low gain artificially provoked parasitic transistors • DRC isolation rules + waving to allow ELT • SOI • thinner field oxide, thicker gate oxide • hardened libraries (re-size, cell-topology) • ADC offset auto-zeroing (analog and digital correction) • architecture hardening (open vs closed loop) • redundancy and voting/comparing • self-powering functions (reducing SEL options) 02-sep-2008 AMICSA 2008 Slide : 8
AMICSA – Future Challenges
• Easier selection of process, foundry, design kit & tools, rad mitigation techniques, quality level – feasibility!
• Lower cost access to design kits, manufacturing services • Simulation tools. Characterising COTS (NPR,etc) • Supporting EU foundries in low volume market • Coordinating/reusing EU resources (e.g. rad tests, new libs/DK & IPs), preserving industry competition and individual commercial interests • Finding more resources (FP7?) and qualification. Sharing results !
for more tech/components evaluation •Maintaining good (better) communication channels (ESCC Working Groups, Harmonisation/Tech Dossiers) •
AMICSA 2010
02-sep-2008 AMICSA 2008 Slide : 9
AMICSA –
THANKS !
all participants sponsors
National Semiconductor, E2V, Nova University of Lisbon, ESA 02-sep-2008
organizers
Boris Glass
(ESTEC Microelectronics) and ESA Conference Bureau
João Goes
et al.(Faculty of Sciences & Tech / Nova University of Lisbon) AMICSA 2008 Slide : 10