Transcript Simple piezoresistive pressure sensor

Silicon wafer fabrication
•
Taken from
www.egg.or.jp/MSIL/english/index-e.html
Silicon wafer fabrication – slicing and polishing
•
Taken from www.egg.or.jp/MSIL/english/index-e.html
ECE 1406 PMOS Fabrication Sequence
Week 1
N-type Si wafer <100>
Pre-diffusion clean
Pad oxidation
SiO2
O2
Week 2
Spin photoresist
PR
Expose PR with
active area mask
and develop
Week 2
Etch Active Area
Week 3
Gate oxidation
O2
Deposit LPCVD polysilicon
Poly
Week 4
SiH4
PR/etch gate mask
Strip PR
SF6
O2
Ion implant BF2
+
P doped areas
Week 5
Pre-diffusion clean
Drive-in/oxidation
O2
H2O
PR/etch contact mask
Strip PR
Clean
Sputter deposit Al/1%Si
Week 6
Ar
Al/Si
PR/etch metal mask
Strip PR
Gate (contact not shown)
Anneal
Week 6
Source
Drain
Influenza Virus
50 nm Transistor
6 Level
Metallization
IBM 7-Level Cu Metallization
Micromachining Ink Jet Nozzles
Microtechnology group, TU Berlin
TI Digital Micromirror Device
MEMS Gyroscope Chip
J. Seeger, X. Jiang, and B. Boser
Single chip six-degree-of-freedom inertial
measurement unit (uIMU) designed by IMI
principals and fabricated by Sandia National Laboratories
Gene chips, proteomics arrays.
NEMS: TOWARD PHONON COUNTING: Quantum Limit of Heat Flow.
Roukes
Group
Cal Tech
Tito
Biological Nanomotor
What is a Microswitch?
Surface Micromachined
5-500 Micron Size
5-300 V Actuation
sourc e
gate
drain
sourc e
gate
drain
sourc e
gate
drain
sourc e
gate
drain
sourc e
gate
drain
Two-Contact Switch
Beam
Drain
Gate
Contact
MEMS
Microswitch
Contact
Contact
Contact
LPCVD Systems