THE EVOLUTION OF TECHNOLOGY SPACES

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Transcript THE EVOLUTION OF TECHNOLOGY SPACES

THE EVOLUTION OF TECHNOLOGY SPACES

Dave McGrath Director Business Development Construction, Facilities and Engineering Division

"The fatal conceit with managers is that tomorrow will look like today..."

Peter Druker © 2004 APC corporation.

Are we designing towards, or away from future problems?

© 2004 APC corporation.

More…

© 2004 APC corporation.

More…

© 2004 APC corporation.

High Density – today’s problem High Density Requirements

 Increasing power  Increasing need for cooling   Increasing runtime Increase need for redundancy

Blade Servers

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High-density is going to bite your customer

It’s not if, it’s when!

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“Catch 22” for IT managers None of the above Poor location Excessive facility cost Insufficient raised floor Insufficient power Excessive heat 0% 5% 10% 15% 20% 25% 30% 35%

 What is the greatest facility problem with your primary data center?

(Source: Gartner, 2006)

© 2004 APC corporation.

© 2004 APC corporation.

IT Facilities

How will it be solved

With a Clear and Concise language on Scalable, Modular datacenter design.

Rack, Power, and Cooling Infrastructure will be designed using pre-engineered modular components and configuration tools

© 2004 APC corporation.

Traditional Design Unable to Respond adequately to today’s growing power and heat loads

© 2004 APC corporation.

We must re-tool the design process

Power Cooling Service Engineering Space Improvements Racks

Thinking about Data Centers “by the square foot”

is obsolete

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Blade Server Power Draw Watts per Chassis by Blade Model

25,000 20,000 15,000 10,000 5,000 0 733 W/SF 500 W/SF 1 2 3 4 5 6 7 8 9 10 11

# of Chassis (Max to a 42U Rack)

12 13 14 IBM HP Dell Sun © 2004 APC corporation.

Density Power & Cooling Challenges 18kW 18 kW POWER 3 kW 18 kW COOLING 3 kW 3 kW 30-amp circuits 208 / 230 V 3 kW 3 kW 3 kW

( Assume dual-corded blade chassis)

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The Cooling Challenge 18kW 3 kW 3 kW 3 kW 2500 cfm 3 kW 3 kW 3 kW

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2500 cfm

Limits of Floor Tile Cooling

500-700 cfm

Additionally requires grate-type tiles 12

Perf tile Grate tile Typical Capability With Effort Extreme Impractical

10 Rack Power (kW) 8 6 that can be tile with this airflow 4 2 0 0 100 200 300 400 500 600 700 800 900 1000 [47.2] [94.4] [141.6] [188.8] [236.0] [283.2] [330.4] [377.6] [424.8] [471.9]

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Traditional Configuration

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Room-oriented cooling airflow patterns

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In Row Configuration (Coupled Cooling)

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Row-oriented cooling airflow patterns Predictable Performance

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Alternative cooling architectures Method Traditional room oriented raised floor cooling In-row In-row with hot aisle containment Application Low density Very flexible Medium density General use Very high density Targeted zones Assured redundancy Rack-coupled Density 1-5kW per rack 3-15kW per rack 10-25kW per rack Very high density specific racks Mix of very high and low density 20-45kW per rack

© 2004 APC corporation.

Why is it so critical to address during design?

Cooling problem Efficiency problem Rate of change problem © 2004 APC corporation.

In-row rack-coupled architecture

  

“Coupled” to adjacent IT racks

Up to 40kW rating today with efficient designs

Higher availability via N+1 standards Predictable performance Mix into existing legacy data center

InfraStruXure Cooling Distribution Unit

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IDC: Time to push ‘reboot’ button…

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“…it appears that it will be cheaper to build new datacenters to accommodate blades than to attempt to retrofit the existing ones…”

It is getting to the CEO’s plate…

“Power will be #1 design issue for many IT shops over next two to three years…” “RFG predicts that power and cooling costs will increase to more than one-third of the total IT budget. This will

elevate this cost element into a priority position for CFOs

, facilities managers, and IT executives.” “

Coordination

with facilities management is crucial to successful power and cooling planning” -Robert Frances Group, January 06 © 2004 APC corporation.

We must all pay close attention…

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Density is driving an unprecedented collision between IT, Facilities and vendors

 

We have a shared problem The traditional solutions won’t work, and the typical solution providers are either focused on making the problem worse or hoping it goes away

The shared problem is getting bigger and hairier by the minute

 

We need a shared language to promote learning Learning offers an opportunity for standardization, leading to lower costs, higher availability, and much greater productivity

Everyone has to decide if they are part of the problem or part of the solution

© 2004 APC corporation.

Network-Critical Physical Infrastructure (NCPI) Essential foundation of reliability

© 2004 APC corporation.

Rack Power

Implement designs with a completely scalable and modular approach at the rack level

Rack Power delivery must be scalable in response to density variation

 

Rack Power must be redundant (UPS N+1 or greater) Rack Power design must be completely flexible in configuration and voltage

The Rack is the Basic Building Block of any IT deployment.

© 2004 APC corporation.

Design the rack accordingly Rack Configuration:

 

Select rack IT actual loads reflected in design

Simulate 3 rd equipment party

 

Model power Model airflow

© 2004 APC corporation.

Scale & Manage Power at the Rack

1.4 kW - 12.5 kW, 15A - 50A, Horizontal or Vertical Mount

Control individual outlets

Turn unused outlets off

Recycle power to locked-up equipment

Monitor current

 

Avoid overloads Balance loads across phases

Sequence power-on

Avoid in-rush current

Switched Rack PDU

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Power high density racks

Multi-branch units supports 12.5kW

Fit up to 4 units in one rack

42 outlets on one strip

Manage at the Row / Room

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Rack Cooling

Eliminate the unpredictable nature of traditional cooling architectures in dense environments

Closely couple the IT load with cooling capacity

 

Increase Capacity per rack Increase Cooling Efficiency

Model the cooling requirements from day 1 and be prepared to adapt to change

Power In

equals

Heat Out

design in accordance with the dynamic nature of the load

© 2004 APC corporation.

CFD model of in-row with Hot Aisle Containment : Modeling failure of one CRAC

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Rack-by-rack airflow analysis for various failure conditions

in real time during design

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Integrate it all into Your Management Architecture Building Management System Integration

Manage critical building infrastructure from single system via modbus RTU

Enterprise Management System Integration

Forward SNMP traps to your preferred management system

Network Devices Network Manager Storage Manager Building Management System Enterprise Management System Server Manager Building Power Comfort Air Building Environment InfraStruXure® Manager Manage Network Critical Physical Infrastructure

Similar to server, storage and networking equipment.

Scalability

Manage up to 1000 APC networked devices

Cooling Devices Storage Devices Rack Devices Power Devices Server Devices

© 2004 APC corporation.

Summary “Man must sit in chair for very long time before roast duck fly in mouth…” Chinese Proverb Take Action …understand the Rack Level challenges and design accordingly!

© 2004 APC corporation.

© 2004 APC corporation.

For further information on these topics consult APC white papers at www.apc.com

 

#130 The Advantage of Row and Rack-Oriented Cooling

Architectures for Data Centers #131 Improved Chilled Water Piping Distribution Methodology for Data Centers

#125 Strategies for Deploying Blade Servers in Existing Data Centers #43 Dynamic Power Variations in Data Centers and Network Rooms

© 2004 APC corporation.