Transcript Slide 1

July 17, 2015
TNO - Holst Centre - Herman Schoo
Open Innovation Centre for Autonomous Microsystems
and Systems-in-Foil
July 17, 2015
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Overview of Holst Centre
Wireless Autonomous Transducer Solutions (WATS)
Systems-in-Foil (SIF)
Holst Centre Business Model
< 3
Holst Centre
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Joint centre of TNO (4500 fte, Netherlands) and IMEC (1300 fte, Belgium)
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Created in 2005, co-funded by government and industry
Critical mass of 130 + 60 fte; 220 + 100 fte planned in 2010
Aimed at international excellence
Partnering worldwide and employing 18 nationalities
Introducing Holst Centre
< 4
Holst Centre: Concept
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Creating generic technologies, time to market 3..10 years
Partnering with industry and universities
Open innovation through precompetitive shared programs
Results are shared between partners
Wireless
Autonomous
Transducer
Solutions
Technology
Integration
© Holst Centre
Introducing Holst Centre
Systems
in
Foil
< 5
Open Innovation at High-Tech Campus Eindhoven
 8000
m2
cleanroom
OLED Device
Processing
Thin Film
clean room
Electronic
measurement
Life Sciences
facilities
Materials Analysis
Photonics
cleanroom
EMC lab
Reliability lab
Holst
Offices
Holst
R2R lab
Equipment
Engineering
Electronic
Prototyping
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HTC initiated by Philips, now housing >50 companies
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Growing from 5000 to 8000 researchers
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Sharing of lab facilities (www.miplaza.com)
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New Open Innovation Research Centres (such as Holst Centre)
Introducing Holst Centre
< 6
Introducing Holst Centre
July 17, 2015
1.
2.
3.
4.
Overview of Holst Centre
Wireless Autonomous Transducer Solutions (WATS)
Systems-in-Foil (SIF)
Holst Centre Business Model
< 8
Wireless Autonomous Transducer Solutions
Programs
Strategic programs:
windows on application areas, guiding
choices in the technology programs
Technology programs:
Development of key
technologies
Ultra Low Power Wireless
Ultra Low Power DSP
Micro Power
Sensors & Actuators
Integration & Implement.
Introducing Holst Centre
Medical &
Lifestyle
(Human++)
Infrastructure
Monitoring
(Asset++)
< 9
Applications in Medical & Lifestyle domain
Introducing Holst Centre
< 10
Wireless Autonomous Transducer System
Non
Electrical
World
S
10mW
A
10mW
Front
End
20mW
mP
20mW
DSP
20mW
Radio
20mW
Micropower System -100mW
Thermal, Vibrational, RF, Light, Bio-chemical
Introducing Holst Centre
< 11
EEG, ECG, EMG read out at Ultra Low Power
EEG
ECG
EMG
Introducing Holst Centre
< 12
Medical Settings serving as Demonstration Lab
Introducing Holst Centre
< 13
Device Miniaturization
2002
2010
Reduce power
& size
Increase
functionality
300 cm3
1 cm3
140 mW
100 μW
Introducing Holst Centre
< 14
Pulse Oxymeter powered by Thermal Energy
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+
Introducing Holst Centre
< 15
WATS – SIF integration
• Many smart autonomous sensor devices in various shapes,
networked together…
Introducing Holst Centre
July 17, 2015
1.
2.
3.
4.
Overview of Holst Centre
Wireless Autonomous Transducer Solutions (WATS)
Systems-in-Foil (SIF)
Holst Centre Business Model
< 17
Systems-in-Foil: Sensing and Acting Foils/Films
Introducing Holst Centre
< 18
Systems-in-Foil: Programs
Strategic programs:
windows on application areas, guiding
choices in the technology programs
Technology programs:
Development of key
technologies
Large Area Printing
Electrodes and Barriers
Foils Integration
Printed Structures on Foil
Organic Circuitry
Lithography on Foil
Introducing Holst Centre
Printed
Organic
Lighting &
Signage
Smart
Bandage
Smart
Blister
< 19
Why Flexible?
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Enhanced functionality for the end user: bendable, rollable, wearable
devices
But also
• Easy integration of foils in products
• Efficient large area production of foil devices (e.g. roll-to-roll)
• Low cost of substrate
Source: Dupont
Introducing Holst Centre
Source: Metsuo
< 20
Lighting Opportunities and Challenges
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Reducing power consumption
Thin, flexible, form freedom: enabling new product concepts
Tunable color
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Light output and efficiency
Lifetime (>displays) and reliability (e.g. encapsulation; shorts)
Large area deposition process
Extreme cost price challenge
Introducing Holst Centre
< 21
Flexible OLED’s for Lighting and Signage
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Challenges: ultrathin wet-processed layers
with very uniform thickness (a few %) and
without pinholes and with barriers that
meet OLED requirements
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Recent results: bottom-emitting and topemitting PLED devices 15x15 cm
demonstrated on flexible polymer and
metal substrates
Non-transparent barrier
Cathode Ba/Al (5 nm/100-400 nm)
80 nm LEP
100 nm PEDOT
100 nm ITO
Transparent barrier
100-200 μm Polymer foil
Bus bars
Introducing Holst Centre
< 22
Lighting Roadmap
LEP Material properties:
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Lifetime ↑: 5kh to 20 kh @103
cd/m2
Total cost of ownership
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Luminous efficiency ↑: 50 lm/W
[€ct/klm.h]
for green
Device architecture coupled to
to 120 lm/W for white
processes enabling high yield
5000
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Input power ↓ : 5W@102 cd/m2
to
R-2-R production
1W @103 cd/m2
of layers
Encapsulation/barrier on foil
5
€1000/m2
Shunt (auto)repair
methods
First niche markets
available
0.50
2006
Introducing Holst Centre
2007
2008
2009
In-situ monitoring
metrology
€80/m2
2010
2011
time
< 23
Homo-scan device 7
Sensor Device Arrays
1400
1200
1000
800
L (a.u.)
600
400
S31
S26
S21
200
S16
Introducing Holst Centre
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S1
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x (a.u.)
S6
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Recent results:
• 10x10 array structures – also used for singlepixel testing
• First printed photo diodes
• Device arrays for both LED’s and photo diodes
processed on PEN-foil
• Sensing of CO2, O2, Alcohol, ….
y (a.u.)
< 24
Increasing Complexity: Need for Modularity
Analyte
Transport
Flow
Analyte
Prep.
Light
Source
Light
Selective
Medium
User
Interface
Light
Detection Signal
User
Interface
Signal
Power
source
Memory /
Storage
Signal
Signal
Data
Processing
Data
Actuator
Introducing Holst Centre
Signal
Data
Transfer
Data
User
Interface
< 25
Creating a Smart Foils Integration Industry
Materials
suppliers
Manufacturers
of modular
functional foils
Equipment
Manufacturers
Introducing Holst Centre
Standardization
Functional foils
Integrated foil
device
manufacturers
End product
manufacturers
Equipment
Manufacturers
< 26
Smart Blister
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Addresses key health issue: medication noncompliance / non-adherence
Involving industries along value chain to realize
this innovation
Patient
Smart
blisters
Medical
devices
GSM/GPRS
wireless
network
Support
centre
DataGator
RFID/NFC
GSM/GPRS
wireless
network
Introducing Holst Centre
< 27
Smart Bandage
Recent outcome: flexible blood pulse
monitor on foil
A_ECG
D_Holst_pulse
bc_C_nellcor
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2
Signal [a.u]
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0
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-3
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Time (s)
Introducing Holst Centre
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10
< 28
Microvia Technology for Foil Devices
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Precision lamination of foils
making and filling microvia holes
at roll-to-roll speed
Introducing Holst Centre
< 29
Embedding Silicon in Foil
Thinning, handling, positioning and interconnecting silicon chips in
flexible devices
Embedded 25 micron thick chip between 2
polyimide layers, resulting in 60 micron
thick package (IMEC/UGent)
Introducing Holst Centre
< 30
Printing of Conductive Lines
Introducing Holst Centre
< 31
Printing Research
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Introducing Holst Centre
Recent result: software (neural network)
and database to support ink formulation
using solvents database
< 32
Roll-to-Roll Equipment
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IGT F1 test unit flexo and gravure printing
R2R coating / print line:
 Slot die unit, flexo unit, gravure unit
 Lamination, drying, curing
 Length 10 m, width foil 300 mm, speed 10..50 m/min
 Printing LEP, Pedot and conductives
 Clean room facility including R2R cleaning line
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R2R vacuum deposition line being specified now
Introducing Holst Centre
< 33
Barriers and Encapsulation
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Barrier materials: SixNy, SixOyNz
Applied by PE-CVD; PEN substrate
Decoupling of pinholes by organic planarizing
layers
Achieved: intrinsic WVTR 10-6 g/m2·d
Passed 540 hrs Calcium test: no black spots
(Fraunhofer)
cathode
Introducing Holst Centre
< 34
Organic Circuitry
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0.0020
10nA
0.0015
100pA
0.0010
1pA
0.0005
10fA
-20
Introducing Holst Centre
0
VG [V]
0.0000
20
1/2
1µA
SQRT(IDS) [A ]
IDS [A]
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Transistor technology
 Reliable process for circuits &
demonstrators
 Introduction of printing
processes
Devices
 Memory
 UHF rectifying diodes
 Sensors
Circuits and demonstrators
 OLED backplane
 Digital & analog circuits
< 35
Organic Circuitry
Recent results:
• 64 bit organic RFID at 13.56
MHz, >400 organic transistors
integrated
• First organic rectifier at >400
MHz, enabling more simple
antennas and longer-distance
read-out
Introducing Holst Centre
< 36
Lithography on flexible substrates
Patterning technology for manufacturing electronic circuitry on flex substrates:
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Metrology and foil characterization
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Foil handling
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Lithographic processing
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(Sub-)micron patterning
Introducing Holst Centre
From batch-wise towards
roll-to-roll lithography
< 37
Lithography on flexible substrates
(Sub-)micron patterning on
flexible substrates
2 mm
1 mm
Foil characterization
Introducing Holst Centre
0.4 mm
Example:
transistors on
PEN foil
July 17, 2015
1.
2.
3.
4.
Overview of Holst Centre
Wireless Autonomous Transducer Solutions (WATS)
Systems-in-Foil (SIF)
Holst Centre Business Model
< 39
Closed Innovation
Research
Development
Company boundaries
Research
projects
Markets
Source: Chesbrough, 2003
Introducing Holst Centre
< 40
Open Innovation
Research
Development
New Markets
Company boundaries
Research
projects
Markets
Source: Chesbrough, 2003
Introducing Holst Centre
< 41
Open Innovation through Shared Programs
R&D budget
fixed % of
revenues
Total
Company
Revenue
R&D costs grow
faster than
revenues: due to
increased
R&D
complexity
Budget
• Mechanics
• Physics
• Electronics
• Software
• Materials
• Bio / Life sciences
• ……
Introducing Holst Centre
Shared
R&D
Leverage:
1. Sharing ideas
2. Sharing of facilities
Exclusive
R&D
3. Shorter time to
market
4. Leverage of R&D
budget
Shared
R&D
< 42
A Key Component: Industrial Residents
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Employed by the industrial partners of Holst Centre
Taking part in the research programs at Holst Centre
Enabling fast transfer of results to industrial partners
When co-inventing, industrial partner becomes co-owner of IP
Introducing Holst Centre
< 43
IP Model Enabling “Open Innovation”
1. Background of Partners: remains
theirs
2. Entrance fee: Non-exclusive
license on program background
3. Participation fee: Non-exclusive
license on program results
Partner D
Program
Background
4. Co-inventing by Industrial
Residents: co-ownership of IP,
sublicensing rights
5. Non-Generic improvements of
“Provided Background”: ownership,
exclusive in domain
6. Exclusive Programs: ownership
of IP
Introducing Holst Centre
< 44
Business Model
Company Y:
entrance fee +
participation
fee
Company X:
participation
fee
Holst
background
research
Exclusive
R&D
Precompetitive
programme
•shared IP
Access to relevant
Holst background IP
Continuous program adaptation and growth
Introducing Holst Centre
< 45
Industrial Partnerships
Introducing Holst Centre
< 46
Reaching out to Partners in Open Innovation
Herman Schoo
Technology Manager Holst Centre
mail: [email protected]
telephone: +31 40 277 4025
mobile: +31 6 538 919 68
Introducing Holst Centre