Transcript 幻灯片 1
Серверы Huaweiпроизводительность и надежность www.huawei.com [email protected] Содержание 1 История развития 2 Обзор серверной линейки 3 Основные преимущества Huawei Cloud Congress 2013 2 История развития серверного направления в компании Huawei 11 лет назад... 1. Массовые внедрения 1G T8000 2. Начало разработки 2G 8000 Начало разработки 1-го поколения блэйд серверов Начало продаж блэйд серверов 1го поколения Т8000 Платформа ATCA (telecom) Более 1000 сотрудников занимающаяся разработкой и производством серверов Более 100 патентов и участие во многих организациях по стандартизации Богатый исследовательский и технический опыт в телеком,датаком сфере . Широкое сотрудничество с производителями оборудования и ПО, такими как Intel, AMD, SUSE и Redhat в технических областях, в том числе проектирования систем,разработки чипов и дизайна операционной системы 2002 2004 2005 1. Запуск 2го поколения T8000 2. Начало разработки rack серверов. 2006 2007 2.Массовые инсталляции 2G T8000 2 Запуск сервера RH1120 3 Начало разработки собственных серверных компонентов 2008 2010 2009 1. Запуск серверов RH1280 and RH2280 2. Начало производства сервеных компонентов таких как сетевые карты, SSD и комплекты памяти Huawei Cloud Congress 2013 1. Запуск E6000 RH1285/2285 2G 2. Новое поколение серверных компонентов и начало предоставления заказчикам высоко производительных датацентр решений 3 Запуск Х6000 серверного решения для облачных вычислений 2. Запуск X8000 1. Постоянные инновации, предложение более конкурентоспособной продукции Мир изменяют данные 40 2% Data Generation Total amount of Data of 40ZB in 2020 Total power consumption of data centers 80% 65% Data Transfer Increase of unstructured data X86 servers with virtualization supported Data Compute and Storage The huge amount of data created is the largest challenge to data center network, storage, and servers. Huawei Cloud Congress 2013 4 Проблемы серверного оборудования <30% High Power Consumption Low Utilization Per Rack power is limited Average Utilization Rate 50% 2.5 Source:The Green Grid 77.7% Internet users are worried about security issues Increase in Total Amount of Data 40ZB 2020 Global Data Big Data Analytics OPEX as a percentage of total (Source:Michael Bell, IT spending research vice president at Stamford) Traditional Servers Data Center PUE 50% Rapid Expansion 3KW Rapid Expansion Low Reliability Source:IDC Huawei Cloud Congress 2013 5 68% Enterprises will experience 6 cases of stolen data От Compute Centric к Data Centric Data Centric Compute Centric Multiple Storage Media Tiered Storage Input CPU Output Lower TCO Higher Performance Memory Hard Drive Magnetic Tape • Depends on compute power • Data stored on memory hierarchy • Compute is far away from data, result in long latency and small bandwidth Huawei Cloud Congress 2013 CPU CPU CPU Converged Switching Technology CPU Data CPU Low Latency IO, supports virtualization acceleration CPU Just Enough Computing Just enough Compute power for each application CPU CPU • Distributed compute nodes for computation • Compute is closer to Data, which reduces latency • Compute capability depends on location of data, types of data storage, and appliation 6 Процессор более не основной компонент Super Computer CISC Mini Computer RISC X86 Servers Micro Servers C P U System z BS2000 Power7 Memory SPARC T4/T5 Itanium Ethernet Reduce Latency Increase BW 100GbE iSCSI, FCoE RRAM Racetrack PCM MRAM InfiniBand QDR/FDR/EDR Cluster Interconnect 500ns PCIe Shared IO 25ns QPI 1Gbps Huawei Cloud Congress 2013 ARM Cortex Storage FC 2us Intel Atom AMD Opteron IO Interconnect Latency 20us Intel Xeon 40Gbps 100Gbps 7 128Gbp s BW Просто добавь вычислений Generic CPU + Application specific CPU = Heterogeneous CPU Processors are moving toward specialization Heterogeneous CPUs can be more flexible, higher cost performance, and high power performance • First used by storage systems • Internet server begin small scale deployment from 2013~2014 • Enterprise server application still lag behind 3~5 years • Performance per Watt is becoming more important Huawei Cloud Congress 2013 8 Рост твердотельных накопителей Another level in the memory hierarchy 1 CPU Clock 7 20 60 100uS 10mS 100mS 100S Huawei Cloud Congress 2013 64K D&I Buffer L2 Cache Shared L3 Cache Main Memory (Electrical) Solid-State DiskDisk (PCIE) Solid-State (PCIE) Solid-State Disk (SATA) Hard Disk (Magnetic) Hard Disk (Magnetic) CD DVDCD Blu-ray (Optical) DVDROM Blu-ray ROM (Optical) Tape (Magnetic) Tape (Magnetic) 9 Random Access Memory 256K 20M 1.5T 2.5T 4T Serial Access Memory 125G 5T Конвергенция –будущее сетей Ethernet supports DCB Ethernet supports RDMA Convergence of FC and Ethernet to FCoE Converged Switching of Infiniband, Ethernet, and FC: SwitchX Infiniband bandwidth still leads Ethernet, but the amount of lead is reducing, while FC is lagging far behind. Ethernet is absorbing many new features from other IO technology, and a Ethernet based converged network is forming. Huawei Cloud Congress 2013 10 Немного о виртуализации 65% WW workloads Virtualized Tier 1 Apps being virtualized NFV being promoted by Telcos More Memory per Server Higher Network BW per Server Huawei Cloud Congress 2013 11 Автоматизация –путь к снижению TCO VM Sprawling, IT Management 65+% of IT Spending IT Automation critical to lower TCO Support for IT Automation: Stateless Computing – Physical Server Agentless Server Status Monitoring Bare metal Server Deployment Automation Huawei Cloud Congress 2013 12 Content 1 История развития 2 Обзор серверной линейки 3 Основные преимущества Huawei Cloud Congress 2013 13 Стратегические направления Huawei Server 16S ~ 64S RH8XXX 8S RH5885 2S RH22XX 4S RH5885 E9000 Scale up Mission-critical enterprise applications, virtualization, and midrange computer migration HPC Private cloud Appliance Virtualization Converged SSD card Massive data processing X8000 Web 2.0 application Public cloud Scale out Data compression card iNIC Application acceleration card Huawei Cloud Congress 2013 X6000 14 Cloud server Полный набор технологий в одном вендоре The only global server vendor who develops chips, boards, cards, and builds up servers by oneself Node Controller, BMC, etc. ASICs Indigenous R&D Huawei Server I/O Accelerator Interconnect Architect Huawei Cloud Congress 2013 I/O Acceleration cards, help improve full system performance High performance interconnect technology for server products System level architecture design to improve performance and reliability 15 Серверное портфолио «Решения» PCIe SSD card E9000 Блейд сервера 12U, 8/16 лезвий 2S HW blade CH121 2*CPU(E5-2600) 24*DIMMs 2*2.5’’ HDDs 1*PCIe x8 FHHL E6000 8U, 10 лезвий N2000 NAS 12*3.5”+2*2.5”HDDs Supports CIFS, NFS, iSCSI, etc. Windows Storage Server 2012 800GB 1.2TB 2.4TB 2S FW blade CH221 CH220 2*CPU(E5-2600) 24*DIMMs 2*2.5’’ HDDs 4*PCIe x8FHHL 2*CPU(E5-2600) 24*DIMMs 2*2.5’’ HDDs 2*PCIe x16FHFL 2S blade BH621 V2 BH620 V2 2*CPU(E5-2400) 12*DIMMs 4*2.5’’HDDs Exchange Appliance 600users(3GB/user) 1200users(3GB/user) 3000users(5GB/user) 2*CPU(E5-2600) 24*DIMMs 15*2.5” HDDs 1*PCIe x8FHHL 2*CPU(E5-2400) 12*DIMMs 2*2.5’’HDDs 1*PCIe x8 Сервера высокой плотности 2U, 2/4 ноды XH310 V2 1U 2S RH1288 V2 Стоечные сервера 2*CPU(E5-2600) 24*DIMMs 4*3.5’’HDDs or 8*2.5’’HDDs Huawei Cloud Congress 2013 1*CPU(E3-1200 V2) 4*DIMMs 4*2.5’’HDDs 2U 2S RH2285 V2 2*CPU(E5-2400) 12*DIMMs 12*3.5’’+2*2.5’’ HDDs or 8*2.5’’ HDDs or 26*2.5’’ HDDs 4S blade BH640 V2 2*CPU(E5-2600) 24*DIMMs 2*2.5’’HDDs XH311 V2 1*CPU(E3-1200 V2) 4*DIMMs 1*3.5’’HDD 4*CPU(E5-4600) 48*DIMMs 8*2.5” HDDs or 4*2.5” HDDs + 1*PCIe x16FH3/4L BH622 V2 1S HW node X6000 4S FW blade CH240 CH222 4*CPU(E5-4600) 24*DIMMs 2*2.5’’HDDs RH2485 V2 2*CPU(E5-2600) 24*DIMMs 12*3.5’’+2*2.5’’ HDDs or 8*2.5’’HDDs or 26*2.5’’HDDs 4*CPU(E5-4600) 48*DIMMs 8*2.5’’HDDs 16 CX seres GE, 10GE, FCoE, FC, Infiniband QDR/FDR Switch series NXseries 1GE, 10GE, FC 2S HW node XH320 V2 2S FW node XH621 V2 2*CPU(E5-2400) 12*DIMMs 4*2.5’’HDDs 2*CPU(E5-2600) 24*DIMMs 8*2.5’’HDDs 2U 4S RH2288 V2 Switch module 4U 4S RH2488 V2 4*CPU(E7-4800) 32*DIMMs 6*3.5’’HDDs 8U 8S RH5885 V2 (4S) RH5885 V2 (8S) 4*CPU(E7-4800) 64*DIMMs 10*2.5’’HDDs 8*CPU(E7-8800) 128*DIMMs 16*2.5’’HDDs HUAWEI Tecal ES3000 Высокопроизводительная карта SSD PCIe Емкость Тип памяти Интерфейс шины Карта SSD PCIe HUAWEI Tecal ES устраняет ограничения системы ввода/вывода и позволяет раскрыть потенциал любых серверов стандартной архитектуры. ES3000 поможет значительно сократить эксплуатационные затраты и TCO, вместе с тем ускорив работу ваших приложений. Huawei Cloud Congress 2013 800 ГБ MLC PCIe 2.0 x8 Максимальная 2,2 ГБ/с проп. способность при чтении IOPS при чтении 570,000 granule MLC (стабильное Flash Form factor Full-height, half-length значение, 4 КБ,Bus interface PCIe 2.0 x8 Maximum read bandwidth 2.2 GB/s 100% случайно) Read IOPS (Stable value, 4 KB, 570,000 100% random) IOPS при чтении 600,000 Read IOPS (Maximum value, 600,000 (максимальное4 KB, 100% random) 49 µs значение, 4 КБ,Read latency Maximum write bandwidth 1.2 GB/s 100% случайно)Write IOPS (Stable value, 4 KB, 120,000 100% random) Задержки при 49 us Write IOPS (Maximum value, 330,000 чтении 4 KB, 100% random) 260,000 Write latency Mixed IOPS (4 KB, R/W: 7/3) 8 µs (R/W: 180,000/80,000) IOPS при записи 120,000 20 W to 35 W Power consumption (стабильное Weight 300g Power-down protection значение, 4 КБ, Yes Granules failure protection Yes 100% случайно) Supported trim Yes IOPS при записи 330,000 (максимальное значение, 4 КБ, 100% случайно) Задержки при 8 us записи 17 1,2 ТБ MLC PCIe 2.0x8 2,4 ТБ MLC PCIe 2.0 x8 3,2 ГБ/с 3,2 ГБ/с 760,000 1.2TB 2.4TB 760,000 MLC MLC Full-height, half-length Full-height, half-length PCIe 2.0 x8 3.2 GB/s PCIe 2.0 x8 3.2 GB/s 760,000 760,000 770,000 770,000 49 µs 49 µs 1.8 GB/s 2.8 GB/s 180,000 240,000 480,000 630,000 400,000 8 µs 430,000 8 µs (R/W: 300,000/130,000) 25 W to 50 W 25 W to 60 W 350g 350g Yes Yes Yes Yes Yes Yes 770,000 49 us (R/W: 280,000/120,000) 180,000 770,000 49 us 240,000 480,000 630,000 8 us 8 us Content 1 История развития 2 Обзор серверной линейки 3 Основные преимущества Huawei Cloud Congress 2013 18 Полно управляемое решение 1 Server Device Manager 2 Server Performance Server resource Management; Remote maintenance, batch configuration deployment; Alarm system Reporter Server performance monitor; Analyze performance bottleneck, system optimization Device Management platform Enterprise management platform Centralized device management Life Cycle 3rd party software eSight IT Infrastructure Storage Network Server Operation Management Service Remote control Firmware Upgrade Installation deployment Incident response Performance monitor Hardware monitor Asset inventory Fault Management Fault response Fault alarm Fault prediction Provide 3rd party management software plug-in, to support a full management solution. Huawei Cloud Congress 2013 19 Производительность – 83 SPEC Benchmark Records • • High computing performance: 74 SPEC records in SPEC integer and floating-point computing performance Power-efficient: 9 records in the SPECpower_sj2008 benchmark Records increasing Huawei servers have refreshed 83 world records in the SPEC benchmark test by now. Huawei Cloud Congress 2013 20 Качество 200,000 carrier-class server blades have been delivered to telecom users. 500,000 servers in large-scale use Precise design Strict test High reliability Architecture design capability Laboratories with sufficient equipment Outstanding reliability in both components and 300,000 rack servers, blade servers, and high-density servers have been delivered to enterprise users. Board design, server design, and the test process meet Integrated Product Development (IPD) standards. 35 Reliability, Availability, and Serviceability (RAS) features are supported. 150 patents on reliability designs are obtained. Huawei's fault-tolerant architecture provides comparable reliability as RISC midrange computers. Huawei has the design capability for architecture with 99.999% reliability for high-end products. Supplier certification, component selection, and quality control EMC laboratory, vibration test laboratory, high temperature test laboratory, and safety regulation laboratory systems Huawei Cloud Congress 2013 21 Высококачесвенные компоненты Huawei servers utility strict telecommunication grade component derating during design phase, to make sure component will not fail under stress(electrical and thermal), also to delay component wear out, and extend component useful life. Component Type De-rating requirements Capacitor Operating voltage derating<0.6; Case temperature derating<0.8; Maximum voltage derating <rated voltage(mainly for aluminum electrolytic capacitor); Resistor Power derating<0.6; Voltage derating<0.75; Power derating for Precision wirewound resistors<0.5; Transistor Junction temperature derating<0.85; Voltage derating<0.7; Current derating<0.7; yes to safe operating area derating; Diode Junction temperature derating<0.85; Voltage derating<0.7; Current derating<0.7; Surge derating<0.6; Integrated Circuit Junction temperature derating<0.85; Crystal Oscillator Frequency precision derating<0.9; Power consumption derating<0.7; Ripple amplitude derating<0.5; Magnetics Operating temperature increase<30°C or 40°C; Hot spot temperature<110°C; Operating current derating<0.8; Huawei Cloud Congress 2013 22 Архитектура повышенной надежности Product design with consideration for high altitude, high temperature, high humidity, dusty, corrosive environments, Huawei is designing high reliability servers. Standard server operating temperature: 10℃~35℃ Huawei server operating temperature: 5℃~40℃ Huawei Cloud Congress 2013 Huawei Server can operate continuously at 5℃~40℃ 23 Энергоэффективный дизайн High efficiency thermal design OS energy management & performance optimization DEMT* Energy Efficiency High efficiency power supply design Power capping technology Hibernation & wakeup Note:DEMT(Dynamic Energy Management Technology)Huawei proprietary technology, reduce power consumption when system is under utilized Huawei Cloud Congress 2013 24 Thank you www.huawei.com Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved. The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.