Transcript Outline

BEE2 Platform Update
Daniel Burke
23 June 06
1
Transitioning into RAMP…

Formal Board Support Package for BEE2/RAMP


Current Status


Modeled on current Xilinx development package content
BEE2 hardware, enclosure, OS, support
Initiate design of BEE3/RAMP2 platform
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
Early RAMP input
Scheduling issues
2
Completion Plan (3 month*)
TASKS
The minimum package will consist of:
 Fully tested BEE2 board with required power supply and cable set
 Stable Linux-based reference design (BSP) utilizing:
 Control FPGA -One or more user FPGAs -All DIMMs on those FPGAs
 One or more XAUI links
 Freestanding operation, i.e. No networked rootfs; implies 2GB CF usage
 Console access via USB keyboard and mouse, display on DVI
 Target externally available, unmodified rootfs, probably Debian
 Protective 2U enclosure
 User guide documenting BIST, system operation, ref design, sample build of hardware and
software, pre-built bitfiles and elfs, usage of scripts for DDR builds, etc.
*as envisioned in March
3
Timeline
TIMELINE
Hardware:
 BEE2 production is under the control of Ken, but I suggest the mid-point board delivery from
SAE, in anticipation of some local testing. [Week 8, 8 May]
 Cables are well understood; SAE could make those sets along with the boards.
 The Vicor power supply needs to be evaluated, then reconfigured slightly to fit the case. We
potentially could have that tested in original form by two weeks after delivery, and remounted in
another two weeks for the 2U case. I don’t know the expected delivery date, so I will
conservatively say [Week 3, 3 May]
Much of the reference design has been done by Andrew and Pierre, and is experiencing a
thorough evaluation by the Red Team. I suggest the mid-point for the finalized version [Week 11,
29 May]
Making the unit freestanding requires USB keyboard and mouse, and console redirect to DVI,
and mounting of a fairly full-featured rootfs on the CF. This work can proceed in parallel with the
ref design completion, and although is not strictly necessary (could continue with serial or export
window), is under investigation by a UCB undergrad. [Week 11, 29 May]
Merging the two is fairly trivial, and should be complete by [Week 12, 5 June]
Thus, the full BSP target date is early June, which allows some slippage.
4
Timeline (cont’d)
The 2U enclosure can be either a full-custom unit, or a slightly modified off-the-shelf unit. If we can
purchase a suitable box, fit our power supply, and
design custom front and rear panels to provide sufficient airflow, this might be the fastest path.
The first step is to obtain a generic 2U enclosure, and use it for fitting of the Vicor as well as
airflow evaluation. This has been done.
After the dimensions are confirmed, the mechanical design of the power supply can be finalized,
and the minor extrusion and mounting fixtures obtained;
the existing unit can be reassembled and tested same as item 1.) [Week 3, 3 April]
The front panel design consists of three tasks: specifying the proper cut-outs for the CF, USB,
and XAUIs; determining airflow requirements, fitting fans, specifying holes; and finally, designing
whatever control functions should be
visible and creating a PCB/display for that utility.
This work will start after the GSRC review; each task can be allocated one week: [Weeks 1, 2, 3
ending 3 April]
The rear panel will be a simplified version of the front, and can be specified in an additional week
[Week 4, 10 April].
Production can take an additional 4 weeks [Week 13, 12 June]
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Documentation
User guide:
Documenting the BIST is complete in rough form
System operation description should proceed over the next 5 weeks [Week 6, 24 April], then be
reviewed by Andrew and Pierre, and
others.
Reference design documentation should be derived from Andrew’s RAMP presentation with updated
information from the Red Team experience, and reviewed around two weeks later [Week 8, 8
May]
Sample builds of hardware and software will be in continuous evolution, and likely finalize around the
end of May [Week 11, 29 May]
Script usage should be prepared by Andrew and Pierre, around the third week in June [Week 12, 24
June] for independent review.
The full document should be assembled and reviewed by all team members starting the latter part of
May [Weeks 9-12, 12 June]
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BEE2 Development Plan
Tasks
BEE2 HARDWARE
PCB
Board Fab
Manufacture
MARCH
20
27
3
APRIL
10
MAY
17
24
1
8
15
22
29
5
JUNE
12
19
26
Power Supply
Vicor Eval
Cpmpact Design
Vicor module order
Extrusion order
Metal-cable fab
Assy+test proto
SAE fab
Test procedure
2U Enclosure
Design and signoff
Prototype fab
Parts order
External manufacture
Module anufacture
Cable designation
Assembly documention
Test procedure
BEE2 Software/Gateware
BSP
Linux kernel
bitfile
rootfs
console
scripts
Documentation
User Guide
Diagrams/Schematics
Review
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BEE2 500W Power Supply Design
BEE2 requires a substantial amount of power in a restricted form-factor.
The design being prototyped is 475W (5V 80A, 12V 5.25A) with integral
heatsink, cooling fans and plenum (not shown), line filtering and
regulation, based upon very high density modular components.
Depending upon requirements, potentially could upgrade to more 5V
current, but must revisit thermal analysis.
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2U Enclosure Design
Compromise between thermal density constraints and potential
use in rack-based system. Highest practical airflow through 3.5”
chassis, while still exposing all front and back connectors. Also
incorporates front panel display, remote management board, and
clock chains requested by SSL.
9
Thermal Analysis
Characterized assuming 25C ambient and 15C max temp rise. Airflow
conservatively meets requirements as well as LFM across DC-DC
converters.
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User Guide
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Status
Board Inventory - 22 boards back from manufacturing, 10 are RAMP
and undergoing checkout procedure. Board kit being assembled,
consisting of correct DIMMs, CF preloaded with bootable Linux and
diagnostics.
2U Enclosure – Rough enclosure for confirming airflow characteristics
being prepared at IL, ship to Berkeley 30 June. Finalize CAM files for
front/back panel following week; make beta chassis soon afterwards.
Power Supply – Allocation parts expected first of second week of July;
initial unit assembled and functional load tests mid-month; release
design for manufacturing (lead times uncertain with some
components).
Integration – Depending upon manufacturing schedule, decision will be
made regarding package assembly and delivery.
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