Photolithography Machine Control System
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Transcript Photolithography Machine Control System
Photolithography Machine
Control System
Ben Conrad and Mark Edwards
Projects in Computer Engineering II
December 9, 2003
System Overview – Solitec 8360
Used in the photolithography process to
evenly apply chemicals to wafers
25 200mm wafer capacity
Main components: Wafer input cartridge,
wafer output cartridge, spin chuck, bake
chuck, system tray
Wafer Input
Cartridge
(25 wafers)
Spin Chuck
Vacuum
Tube
Bake
Chuck
Vacuum
Tube
Wafer Output
Cartridge
(25 wafers)
System Overview – Solitec 8360
Wafer Load
Processing on Spin Chuck
Bake on Bake Chuck
Multipass Mode Check
Wafer Egress
System Overview – Solitec 8360
System Controller
Provides an interface between the operator
and the control unit.
Formats data for display to the user
Interprets and forwards user requests and input
to the control unit
Function: DEV1
RCP#:
3
DEV1
Time: 25.2
Speed: 256
PREWET
RINSE
Program
End of Recipe
SEC
RPM
N2
1
4
7
Run
Inter Lock
2
5
8
0
3
6
9
ESC
SCH STOP
Inter lock
ENTR
System Controller Cont’
Control the system’s mode of operation
Three operating modes
Service: manual system operation
Program: writing and editing of recipes
Run: recipe execution/system calibration
Recipe Commands
Seven Executable Commands
PREWET: Dispense de-ionized(DI) water
Dispense DEV#1: Dispense developer solution
RINSE: Dispenses DI water to clean wafer
N2: Dispenses Stream of Nitrogen (N2)
SPIN: Spin Dry the wafer
WAIT: Static delay option.
Parameters
Time: .1 – 999.9 sec. (.1 second resolution)
Speed: 0-7,999 RPM
Ramp: 0 – 40 KRPM/s
Motivation
Old controller was corroded; less
elements in our design -> more reliable
Cost savings to customer, Dr. Raisanen,
associate director of RIT’s fab
Our design ~$350, vs. $3k-$15k
Feasibility
Motor Control Board will be reused – no
digital controller need be implemented
Other than 3 analog, all I/0 are TTL
digital logic, no conditioning needed
Sensors have been tested and
functionality for most is verified
Timing Budget: Asynchronous System
System Design- High Level
The STD Bus will be replaced with a
HC12-s microcontroller
A HC11 will be connected to the HC12
via SPI protocol to handle UI
Custom Circuits are created to multiplex
numerous I/0 lines to the HC12’s limited
pins
System Design – High Level
HC12
A/D
Servo
Board
2 8-bit DACs
S
HC 11
Keypad
and
LCD
P
1 16-bit serial in, parallel out shifter
50 Pin
Out
Cable
B
2 16-bit parallel in, serial out shift
registers for input
= 32 input bits
A
3 16-bit serial in, parallel out shift
registers for output
= 48 output bits
50 Pin
Input
Cable
System Controller Hardware
Input
4x4 Matrix keypad
Interrupt driven
SPI bus
Three wire interface to digital controller
Used to communicate status and display information
System Controller H/W Cont’
Output
40x4 Character LCD display
SPI bus
Forwards user input the control unit.
Status Lights
Run mode
Program mode
End of Processing
Interlock
System Controller H/W Cont’
Processing unit
Motorola 68HC11
512 bytes RAM, 512 bytes EEPROM
Synchronous peripheral interface (SPI)
Real time interrupt circuit
Data aggregation
Distribute workload
System Controller Schematic
U3
43
45
47
49
44
46
48
50
OSC
KBM
OE
74C923
R1
10M
8MHz
VCC
47k
C5
27pf
VCC
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
XT
EX
E
19
2
17
51
52
18
R6
PA3
PA4
PA5
PA6
PA7
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
8
7
Y1
IRQ
MODB
RST
VRL
VRH
XIRQ
26
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
VDD
VCC
PD0
PD1
PD2
PD3
PD4
PD5
R2
1k
R3
47k
C3
.1uf
31
30
29
28
27
LCD(E2)
LCD(E1)
LCD(R/W)
LCD(RS)
42
41
40
39
38
37
36
35
SPI(MISO)
SPI(MO SI)
5
9
10
11
12
13
14
15
16
MODEB
VCC
LCD(data 0)
LCD(Data 1)
LCD( data 2)
LCD(data 3)
LCD(data 4)
LCD(data 5)
LCD(data 6)
LCD(data 7)
C12
1uf
20
21
22
23
24
25
U2
13
8
4
3
6
11
10
VCC
1
AS
MODA
R/W
1uf
J2
MC68HC11E9
VCC
2
C4
27pf
PA0
PA1
PA2
R5
47k
R4
47k
VCC
C2
1uf
C1
1uf
1uf C9
C8
1
3
4
5
2
6
C10
MODEA
1uf
J1
C11
1uf
16
14
34
33
32
R1IN
R2IN
VCC
C7
10*C6
DA
U4
13
T1IN
T2IN
C1+
C1C2+
C2V+
V-
R1OUT
R2OUT
T1OUT
T2OUT
GND
C6
??
Y1
Y2
Y3
Y4
Y5
19
18
17
16
15
15
6
7
DOA
DOB
DOC
DOD
DOE
1
1
2
3
4
5
KB(ROW1)
KB(ROW2)
KB(ROW3)
KB(ROW4)
KB(ROW5
X1
X2
X3
X4
2
12
11
9
8
KB(COL1)
KB(COL2)
KB(COL3)
KB(COL4)
MAX232
12
9
14
7
Serial(RX)
Serial(TX)
System Design – System I/O
Shows the
detailed HC-12
Control Unit
I/O connections
System Design – System I/O
Serial Out to HC12
B1
B0
Serial Out to HC12
U6
6
U5
SO
SI
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
CLK
HC12- B2
HC12- B4
HC12- B5
MODE
CS
B2
B4
B5
B3
4
6
SO
SI
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
2
CLK
5
1
MODE
CS
74F676
4
16 input Bits (16-31)
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
32 Input Bits
16 input Bits (0-15)
Ben Conrad, Mark Edwards
Schematic: Shift Register to HC12 Connections
2
5
1
74F676
HC12- B3
HC12-A2
HC12-A1
A2
A1
A0
HC12-A0
A6
HC12- A6
HC12- A7
A7
48 Output Bits
16 Bits to Cable (16-31)
U2
4
5
2
3
1
HC12- A3
SI
STCP
SHCP
R/W
CS
U2
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Q13
Q14
Q15
A3
SO
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
5
2
3
1
SI
STCP
SHCP
R/W
CS
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Q13
Q14
Q15
6
74F675A
A4
4
SO
74F675A
16 Bits to Cable (0-15)
U3
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
4
5
2
3
1
SI
STCP
SHCP
R/W
CS
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Q13
Q14
Q15
6
SO
74F675A
HC12-A4
A5
HC12-A5
U2
HC12 - P7
4
5
2
HC12 - P6
16 Bits to Cable (32-47)
3
1
SI
STCP
SHCP
R/W
CS
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Q13
Q14
Q15
SO
74F675A
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
6
8 Bits to DAC1
8 Bits to DAC0
7
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
6
System
Software
Design
Run mode flowchart
System Software Design
Task control block(TCB)
Tracks the processing of a single wafer
TCB
Field
RECIPE_START
CUR_CMD_ADDRESS
BAKE_TIME
CURRENT_BK_TIME
SPIN_TIME
SPIN_VELOCITY
SPIN_ACCELERATION
OPERATION
STATUS
CURRENT_SPEED
DAC_OUT
SENSOR_IN
SENSOR_OUT
Size (bytes)
2
2
2
2
2
2
1
1
2
1
2
4
6
Description
Address of the current recipe
Address of the current command being executed
Length of time to heat a wafer on heat chuck
Amount of time that the wafer on the heat chuck has been baking.
Amount of time the wafer has remaining on the spin chuck
Rotational velocity of the spin chuck for the current recipe step
Motor's acceleration up to the spin the chuck's spin velocity
actual recipe step
Program status flag
Actual speed of the spin chuck
Byte to be written to DAC
Storage for data read from input registers
Storage for data to be written to output registers
Already Completed
Parts ordered and received
Hardware schematics
Software flowcharts
Task control design
Sensor/System tests
Expected Difficulties
Unreliability of mechanical system
No ability to completely test system
Servo control board - analog signals
Overall system complexity