Transcript 1H 2009 Intel Public Roadmap

Intel® Public Roadmap
1H’ 2009
1
1H’09 Public Roadmap
Public Roadmap
Desktop Platform
1H’ 2009
2
1H’09 Public Roadmap
Desktop Processor: Roadmap
Consumer Platforms 1H’09
Q1’09
Q2’09
Intel® Core™ i7 Processor Extreme Edition
Codename: Tylersburg DT platform
Extreme
Intel® X58 Express Chipset
- 2x16 or 4x8 graphics
Intel® Core™ i7 Processor
Codename: Tylersburg DT platform
Intel® X58 Express Chipset
- 2x16 or 4x8 graphics
Intel® Core™2 Quad Proc.
Q9xxx &Q8xxx series
Codename: Boulder Creek platform
Best
Intel® G45 & P45 Express Chipsets
Intel® Core™2 Duo Processor
E8xxx & E7xxx series
Codename: Boulder Creek platform
Better
Intel® G45, G43, & P43 Express Chipsets
Intel® Pentium® & Celeron® Proc.
Good
Intel® G41 Express Chipset
Intel® G31/P31 Express Chipsets
1H’09 Public Roadmap
Intel Confidential—NDA Platform Roadmap
Desktop Platform: Roadmap
Business Platforms 1H’09
Q1’09
Intel® SIPP
Q2’09
Deploy 2008/2009 Platform**
Intel® vPro Tech. for 2009
Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2
Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM
Business Security:
Microsoft NAP, Access Monitor
Best
Proactive IT Care:
Intel® Standard Manageability plus: Fast Call for Help,
Remote Schedule Maintenance, Remote Alerts, DASH
Intel® Core™2 Duo Proc. E8000 series
Better
Upgradeable
Intel® Q43 Express Chipset w/ICH10D, Intel ® TPM
Intel® Standard Manageability
Intel® SIPP
Intel® Pentium® processor1
Intel® B43 Express Chipset w/ICH10D
- Manageability Upgrade Available
Intel®
Good
*
**
1
2.
3.
4
G41 Express Chipset
Intel® G31 Express Chipset
Qualification window begins at platform launch and continues for 3 months.
Deployment begins at the end of the Qualification window and continues for 12 months.
Intel® Pentium® dual-core proc not SIPP eligible.
Check the feature set reference table for vPro and SIPP CPU details.
Intel Std. Manageability and Intel AMT support WS-MAN and DASH
1H’09 Public Roadmap
Intel Confidential—NDA Platform Roadmap
Public Roadmap
Intel® Mobile Platform
1H’08-1H’09
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Consumer Mobile Platforms: Roadmap
1H’08-1H’09
1H’08
‘Santa Rosa Refresh’
Extreme
2H’08-1H’09
‘Montevina’
Intel® Core™2 Extreme
Intel® Core™2 Extreme
X9000
QX9300, X9100
‘Santa Rosa/ Santa Rosa Refresh’
‘Montevina’
Intel® Centrino® processor technology
Intel® Centrino® 2 processor technology
Featuring Intel® Core™2 Duo
T9500, T9300, T8300, T8100
Featuring Intel® Core™2 Quad Q9100, Q9000
Featuring Intel® Core™2 Duo T9800, T9600, T9550,
T9400, P9600, P9500, P8700, P8600, P8400
Intel® Core™2 Duo processors:
Low-Voltage and Ultra Low-Voltage
Performance
Entry
L7700, L7500
U7700, U7600
Intel® Core™2 Duo Small Form Factor processors:
Power-Optimized, Low Voltage, and Ultra LowVoltage
SP9400, SP9300
SL9400, SL9300
SU9400, SU9300, SU3300*
Mobile Intel® GM965, PM965 Express chipsets with ICH8M
or ICH8M-Enhanced
Mobile Intel® GM45, PM45 Express chipsets with ICH9M or
ICH9M-Enhanced
Intel® Wireless WiFi Link 4965AGN or AG, or 3945ABG
Intel® Wireless WiFi Link 5000 Series
‘Santa Rosa’
‘Montevina’
Intel® Celeron® processors
Intel® Celeron® processors
570, 560, 550, 540, 530
T1700, T1600, 585, 575, 723
Mobile Intel® GM965, GL960 Express chipsets with ICH8M
Mobile Intel® GM45, GL40 Express chipsets with ICH9M
*Intel® CoreTM 2 Solo processors are eligible for Centrino® branding only
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Business Mobile Platforms: Roadmap
1H’08-1H’09
1H’08
Q2’08
2H’08-1H’09
‘Santa Rosa Refresh’
‘Montevina’
Intel® Core™2 Extreme
Intel® Core™2 Extreme
X9000
QX9300, X9100
Deploy 2007 Platforms
Deploy 2008 platforms
Extreme
Intel® SIPP
Best
Better
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Intel® Centrino® with vProTM technology
Intel® Centrino® 2 with vProTM technology
Featuring Intel® Core™2 Duo
T9500, T9300, T8300, T8100
Featuring Intel® Core™2 Duo T9800, T9600, T9550,
T9400, P9600, P9500, P8700, P8600, P8400
Intel® Core™2 Duo processors: LowVoltage and Ultra Low-Voltage
Intel® Core™2 Duo Small Form Factor processors:
L7700, L7500
U7700, U7600
SP9400, SP9300
SL9400, SL9300
SU9400, SU9300
Mobile Intel® GM965 & PM965 Express Chipsets with ICH8M–
Enhanced
Intel® Wireless WiFi Link 4965AGN or AG
Intel® 82566MM Gigabit Network Connection
Intel-optimized adv. management & security solutions with
Intel® AMT v2.5 & VT
Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M Enhanced
Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced
Intel® 82567LM Gigabit Network Connection
Intel® Wireless WiFi Link 5000 Series
Intel® AMT 4.0, Intel® Anti-Theft Technology, Intel® Virtualization
Technology (VT-x, VT-d), Intel® Trusted Execution Technology
Intel® Centrino® processor technology
Intel® Centrino®2 processor technology
Featuring Intel® Core™2 Duo processors
Featuring Intel® Core™2 Duo processors
Mobile Intel® GM965, PM965 Express Chipsets with
ICH8M or ICH8M-Enhanced
Mobile Intel® GM45, PM45 Express Chipsets with
ICH9M or ICH9M-Enhanced
Intel® Wireless WiFi Link 4965AGN or AG, or 3945ABG
Intel® Wireless WiFi Link 5000 series
Power-Optimized, Low Voltage, and Ultra Low-Voltage
Public Roadmap
Intel® Server Platform Group (SPG)
2009
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•
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across
different processor families. See www.intel.com/products/processor_number for details.
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Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications
enabled for virtualization technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and
software configurations. Virtualization technology-enabled BIOS and VMM applications are currently in development.
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“Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel® Turbo Boost Technology
performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system
delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost.”
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Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset,
BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details
on which processors support HT Technology, see here
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Lead-free: 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU
RoHS exemptions for lead may apply to other components used in the product package.
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Halogen-free: Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine.
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* Other names and brands may be claimed as the property of others.
Copyright © 2008, Intel Corporation.
Risk Factors
Intel’s Roadmap Update presentations may
contain forward-looking statements.
All statements made that are not historical facts
are subject to a number of risks and
uncertainties, and actual results may differ
materially.
Please refer to our recent Earnings Release and
Form 10-Q for more information on the risk
factors that could cause actual results to differ.
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Server Platform Roadmap
Mission Critical (MC) Platform 2009
Q1 ’09
Q1 ’09
Q2 ’09 Q2 ’09 Q3 ’09
Q3 ’09
Intel® Itanium® Platform
Mission
Critical
Boxboro-MC Platform (Mid ‘09)
Intel® Itanium® processor 9100
series
Tukwila-MC processor
Intel®E8870 chipset — 400FSB,
Intel®82801DB (ICH4), 82546GB
Boxboro-MC Chipset
Technologies
Technologies
FSB 667, DDR2-667, Dual-Core, HyperThreading Technology,
Intel® Virtualization Technology, Intel®
Cache Safe Technology. IA-64, Demand
Based switching, Core Level Lockstep
Q4 ’09
Q4 ’09
Quad-Core, Intel® QuickPath Interconnect, Dual Integrated Memory
Controllers
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without
notice.
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Server Platform Roadmap
Efficient Performance(EP) Platform 2009
Q1 ’09
Q2 ’09
Q3 ’09
Q4 ’09
Tylersburg-EP Platform
Nehalem-EP Processor
Tylersburg -36D , -24D Chipset
Technologies
Quad-Core / Dual Core
Efficient
Performance DDR3 1333/1066/800 memory
Two Socket
Intel® Turbo Boost Technology, Intel® VT
Intel® QuickPath Interconnect (QPI)
Intel® Hyper-Threading Technology
Lead and halogen free platform kit1
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to
change without notice.
1. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.
Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to
other components used in the product package.
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Server Platform Roadmap
Expandable Platform (EX) 2009
Q1 ’09
Q2 ’09
Q3 ’09
Q4 ’09*
Caneland Platform
Intel® Xeon® processor 7400 series 45 nm 6-core (Dunnington)
(shipping)
Intel® Xeon® processor 7300 series
Intel® Xeon® processor 7200 series
Expandable
Intel® 7300 Chipset
Enabled chipsets -4P/8P+ platforms
Technologies
Quad-Core, Dual-Core, Intel® Core™ MicroArchitecture, FBD Memory, Intel® VT,
Next Generation Intel® I/O AT, Snoop Filter
* Nehalem-EX processor on Boxboro-EX
platform targeted for production in Q4 ‘09
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
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Server Platform Roadmap
Entry Platform (EN) 2009
1H ‘09
2H ‘09
Tylersburg-EN Platform
Nehalem-EN Processor
Tylersburg -24D Chipset
Technologies
Quad-Core / Dual Core, DDR3 memory, Turbo Mode, Intel ® VT, Intel® QuickPath interconnect, Intel® HyperThreading Technology (SMT), Lead and halogen free platform kit1
Entry
Two Socket
Cranberry Lake Platform
Intel® Xeon® processor 5400 series
Intel® Xeon® processor 5200 series
Intel® 5100 Chipset (San Clemente);
Bensley-VS Platform
Intel® Xeon® processor 5400 series
Intel® Xeon® processor 5200 series
Intel® 5000V Chipset (Blackford)
2009 Platform*
Garlow Platform
Intel®
Intel®
Intel®
Intel®
Xeon®
Xeon®
Xeon®
Xeon®
processor
processor
processor
processor
3300
3100
3200
3000
series
series
series
series
Lynnfield Processor
Ibex Peak Chipset
Intel® 3210/3200 Chipset
Entry
One Socket
Technologies
Dual-Core/Quad-Core Intel® Core™ Microarchitecture,
Lead and halogen free processors starting in 2H’08
(3300/3100 series)
* Lynnfield processor based platform production targeted for 2H ’09
1 Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.
Lead free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.
Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006.
Some E.U. RoHS exemptions may apply to other components used in the product package.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to
14 without notice.
change
Server Platform Roadmap
Workstation Platforms (WS) 2009
Q1 ’09
Q2 ’09
Q3 ’09
Q4 ’09
Tylersburg-WS Platform
Nehalem-EP Processor
Tylersburg -36D Chipset
Technologies
Workstation
Two Socket
Quad-Core / Dual Core, DDR3 1333/1066/800 memory, Intel ® Turbo Boost Technology, Intel® VT,
Intel® QuickPath interconnect, Intel® Hyper-Threading Technology , Lead and halogen free platform
kit1
Tylersburg-WS Platform
Nehalem –EP Processor
Tylersburg -36S Chipset
Technologies
Intel® QuickPath interconnect Lead and halogen free platform kit1
Garlow-WS Platform
Intel® Core™2 Extreme QX9650
Intel® Core™2 Quad Q9000
Intel® Core™2 Duo E8400
Intel® X38 Chipset
Workstation
Technologies
Quad-Core, Dual-Core, 1333 FSB Intel® Core™ Microarchitecture;
One Socket
1. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.
Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006.
Some E.U. RoHS exemptions may apply to other components used in the product package.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are
subject to change without notice.
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