Transcript Fujitsu Corporate Profile 2005

Business Update
Fujitsu Microelectronics America, Inc.
April 14, 2009
Agenda

FMA Overview
 FMA Revenue and P&L
 FMA BG Update
 Summary
04/14/2009
2
© Fujitsu Microelectronics America, Inc. 2009
Fujitsu Microelectronics America Overview
Fujitsu N. A. Headquarters in Sunnyvale, CA
 1976
 1979
 1980
 2001
 2003
 2008
 2008
04/14/2009
FMA (Bldg E) In Fujitsu N.A. Headquarters in Sunnyvale, CA
Predecessor to Fujitsu Microelectronics, Inc. (FMI) formed under Fujitsu America, Inc.
FMI formed as a subsidiary of FAI, headquartered in Santa Clara, CA
FMI became a wholly owned subsidiary of Fujitsu Limited
Fujitsu Microelectronics America, Inc. formed
FMA moved headquarters to the Fujitsu North America headquarters in Sunnyvale, CA
FMA became a wholly owned subsidiary of Fujitsu Microelectronics Limited
ISO 9001: 2000 certified in July 2008
3
© Fujitsu Microelectronics America, Inc. 2009
ISO 9001:2000 Certified
04/14/2009
4
© Fujitsu Microelectronics America, Inc. 2009
Quality Policy Statement
Fujitsu Microelectronics America, Inc. (FMA) is a leader
in the semiconductor business. We seek to meet and
exceed our customers' expectations through the on-time
delivery of innovative, highly reliable products and solutions.
We will grow our business by continually improving our
processes, recognizing the contribution of all our
employees, and creating a winning atmosphere at FMA.
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
FMA Organization and Focus
FMA
SMS – Semiconductor
Manufacturing Services
Business Groups (Includes
Sales)
Automotive
SoCDeC – SoC Design
Engineering Center
EPS – Embedded Platform
Solutions
Administration & Support
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© Fujitsu Microelectronics America, Inc. 2009
Fujitsu Microelectronics America, Inc.
Management Team
Shinichi James Machida*
President and Chief Executive Officer
(CEO)
Fujitsu Japan
Keith Horn
Chief Operating Officer
(COO)
Steve Della Rocchetta
Vice President
SMS Business Group
Sales and Marketing (21)
Phil Hughes
Sr. Director
Automotive Business Group
Sales and Marketing (15)
Keith Horn
Acting
Embedded Platform Solutions
Sales and Marketing (16)
Sandy Blanckensee
Director
Sales Operations and
Quality (9)
Alice Huang
Director
Finance and
Accounting (6)
Mike Moore
Vice President
General Counsel
Legal (3)
Emi Igarashi
Director
Corporate Services
MarCom, IT, HR (6)
Wenhua Zhao
Director
SoCDEC
FMA Total Headcount (4/7/09)
Executives
SMS
Auto
EPS
SoCDEC
Operations/Quality
Finance/Accounting
Legal
Corp Services (IT,HR, MarCom)
Total
* FML assignee
04/14/2009
7
2
21
14
16
29
9
6
3
6
106
Interconnect
Technology
© Fujitsu Microelectronics America, Inc. 2009
FMA Locations (Headcount)
FMA Headquarters
R&D and Design Centers
Sales / Customer Support Offices
1
9
Boston Sales Office
Detroit Automotive
Business Group
Headquarter
88
FMA Headquarters
Sunnyvale, CA
Headquarter Sales
Sunnyvale Sales Office
2
NJ Sales Offices
Headquarter Engineering/
Design Center
2
TN Automotive Solutions
Office
2
1
San Diego Sales Office
1
Atlanta, Sales Office
Dallas ASIC Customer
Support Office
FMA Total Headcount: 106
(As of April 7, 2009)
04/14/2009
Outsourced Logistics
8
© Fujitsu Microelectronics America, Inc. 2009
Semiconductor Industry Outlook
FMA Revenue Update
Global Economy Outlook

Global GDP is expected to contract by 1.7% in 2009





First global GDP decline on record
High-income countries: -2.9% (from +0.8% in 2008)
Developing countries: +2.1% (from +5.8% in 2008)
World trade in goods and services to drop by 6.1%
Modest recovery in 2010 possible, but uncertain

Global GDP could increase by 2.3%
• Pace of decline in investment to moderate
• Postponed demand for durable consumer goods to catch up
• Monetary and fiscal stimulus to take effect


Developing economies to outpace high-income economies with 4.4% and 1.6%
growth, respectively
GDP growth currently projected at 3.3% in 2011
(Economic data published by the World Bank, March 2009)
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
World GDP Growth Outlook
U.S.A.
4%
2008
3%
2%
2009
2010
2.0%
1.1%
2008
2%
1%
1%
0%
Euro Area
3%
2009
0.9%
0.7%
0%
-1%
-1%
-2%
-2%
-2.7%
-3%
-2.4%
-3%
Russia
10%
8%
6%
4%
2%
0%
-2%
-4%
-6%
2010
2008
5.6%
2009
2010
0.0%
-4.5%
4%
3%
2%
1%
0%
-1%
-2%
-3%
-4%
-5%
-6%
12%
10%
Japan
2008
2009
2010
1.5%
-0.7%
-5.3%
China
2008
9.0%
8%
2009
6.5%
2010
7.5%
6%
4%
2%
0%
8%
6%
6%
2008
2009
2010
2%
5.1%
3.2%
-2%
2%
0.5%
04/14/2009
(World Bank)
5.8%
4.4%
10%
2.3%
1.9%
1.6%
2.1%
India
2008
2009
8%
0.8%
0%
4%
0%
Real GDP Growth
4%
Brazil
8%
2008
2009
2010
6%
4%
2010
7.0%
5.5%
4.0%
-1.7%
-2.9%
-4%
World
High-Income
11
2%
Developing
0%
© Fujitsu Microelectronics America, Inc. 2009
Semiconductor Industry Outlook
Semiconductor market – Annual growth forecast (December 2008)
2008
2009
IBS*
▲1.3％
▲10.8％
Nomura
▲0.2％
▲11.0％
Gartner
▲4.4％
▲16.3％
* IC market
Industry has never seen minus growth in 2 consecutive years
04/14/2009
12
12
© Fujitsu Microelectronics America, Inc. 2009
Semiconductor Industry Outlook
Annual Revenue ($B) and Year-over-Year Change
IDC
Gartner
IDC YoY%
Gartner YoY%
$300
15%
267
256
250
256
$250
9.8%
8.6%
7.5%
7.3%
229
3.2%
3.1%
210
196
$200
230
243
10.3%
253
6.4%
10%
5%
209
195
0%
-2.1%
-4.1%
-5%
$150
-10%
$100
-15%
-20%
-21.6%
$50
-24.1%
-25%
$-
-30%
2007
2008
2009
2010
2011
2012
Sources: Gartner, Feb 2009; IDC, Feb 2009
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
FMA MTP
$234M
$240
$215M
$210
OFFSHORE
OTHERS
$174M
$180
$160M
$162M
$164M
FEI
NETWORKING
$150
$M
$120
ASSP OTHERS
FRAM
`
$90
ASSP BWA
MCU
$60
WFS
ASIC
$30
$0
FY2006
04/14/2009
FY2007
FY2008
FY2009
14
FY2010
FY2011
© Fujitsu Microelectronics America, Inc. 2009
FMA FY2008 Revenue Summary
1HFY08
Budget – 1QRF
Target – Based on 3QRF
FY08 Actual
Ref:
04/14/2009
2HFY08
FY08
$91.1M
$122.5M
$213.6M
$100.0M
$119.6M
$219.6M
$99.4M
$64.7M
$164.1M
1HFY07 =$75.7M
2HFY07 =$86.6M
FY07 = $162.3M
15
FY09
Budget
$174M
© Fujitsu Microelectronics America, Inc. 2008
2009
FMA Revenue – FY2008 Result
Fujitsu Microelectronics America, Inc.
Revenue Projection
FY2008
($M)
Budget
1H08
Q1 Act
Q2 Act
Actual
3QRF
2H08
Q3 Act
Q4 Act
Actual
FY08
Actual
SMS
ASIC
15.1
7.0
6.2
13.2
11.1
5.8
4.1
9.9
23.1
Wafer Fab
20.5
7.1
8.1
15.2
29.4
5.0
4.5
9.6
24.8
0.5
0.3
0.5
0.8
0.7
0.2
0.6
0.8
1.6
36.0
14.4
14.9
29.3
41.2
11.0
9.2
20.2
49.5
Wireless
ASSP BWA
0.6
0.3
0.1
0.4
0.6
0.1
0.0
0.2
0.6
ASSP Wireless (PLL, RF, GPS)
0.0
0.1
0.1
0.3
0.1
0.1
0.1
0.2
0.5
0.0
FRAM
10.0
5.9
6.0
11.9
13.2
7.0
3.9
10.9
Flash
Total Wireless
1.1
11.7
0.4
6.8
1.1
7.4
1.5
14.1
1.2
15.2
0.4
7.6
0.2
4.3
0.6
11.9
22.8
0.0
2.1
26.0
Embedded
MCU
13.1
8.9
8.0
16.9
16.9
6.7
5.4
12.1
29.0
Biometrics
2.9
(0.0)
0.1
0.1
0.2
0.1
0.0
0.1
0.2
FEI
3.2
1.1
2.1
3.1
3.5
1.5
0.6
2.2
5.3
ASSP Others (HSIO, LAN, GDC, CCD)
1.7
0.4
0.2
0.6
0.1
0.5
0.3
0.8
1.4
20.9
10.4
10.3
20.7
21.7
8.9
6.4
15.2
35.9
0.8
0.5
0.0
0.5
1.3
0.1
0.1
0.1
0.7
Total Local Revenue
69.5
32.0
32.6
64.6
79.3
27.5
20.0
47.5
112.1
Total Offshore Revenue
21.6
15.7
19.0
34.7
40.3
9.0
8.2
17.3
52.0
Total Revenue
91.1
47.7
51.7
99.4
119.6
36.5
28.2
64.7
164.1
45.8
40.8
86.6
162.3
APS
Total SMS
Total Embedded
Networking
Total Revenue for FY07
28.8
46.9
75.7
Note : Official budget is 1Q08RF. MCCA offshore revenue is FMA's internal forecast.
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2008
2009
FY08 Summary: Variances
Summary of variances between FY08 budget and actual
Amount
Reason
Broadcom
$ 10.2M
Mass production delay due to end-user’s adoption cycles
Lattice
$ 11.8M
Softening of market; 3 product tape outs delayed; RMA/yield loss for XP2
Insilica
$ 2.8M
FineArch leakage issue; Missed opportunity window with Samsung
Marvell
$ 1.8M
Design and GDS hand off delayed; Initial yield lower than comparable part from
TSMC
eASIC
$ 1.3M
N1X design program development budget not funded
Ingram Micro
$ 3.8M
Exited biometrics Business
Non-Fujitsu Products
$ 5.6M
Business with forecasted customers did not materialize – taking longer to
penetrate these customers (Hitachi, Yazaki, Sumitomo)
Networking
$ 2.9M
Softening of market leading to demand reductions from retailers
Denso
$ 2.7M
Demand reductions from GM and market downturn
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
FMA FY2009 Revenue Budget – Structure
FMA contribution to
Overseas business
- Revenue recognized in Asia
$174M
160
140
Offshore
$52M
FMA local logic business
- Key metric for FML
120
JMA
$23M
100
Flash
$0.4M
FEI
$5.9M
Act-On
$0.5M
80
60
40
LOCAL
LOGIC
$92M
20
0
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
FMA FY2009 Revenue Budget
(Onshore Logic with Local Account)
$2.7M
$92M
$3.6M
$1.0M
$0.2M
$0.5M
Projected
ASE
(in MTP)
Projected
ASE
(Other –
In MTP)
$82.8M
Projected
ASIC/COT
(7 designs,
In MTP)
In MP
04/14/2009
• Lattice
• Garmin
• InSilica
• FNC
• Techwell
• ORCA
• Syndiant
• Alphascale
$1.2M
$0.3M
New
New ASSP
New ASE Opportunities ASIC/COT
New
Opportunities (Identified – Opportunities
(From Pipeline)
ASIC/COT (Identified –
At
3/26
FML)
Opportunities At 3/26 FML)
(Identified –
At FML 3/26)
• Universal • Enphase (NRE) • Cubic
• Omnicell
Avionics • White (MP)
• Digikey (Won)
• Welch
Allen
• Covidien
• etc.
19
Pipeline;
• Novatel (Won)
• DeShaw v2.0
• Lexmark
• Cavium
• Open Silicon
• etc.
© Fujitsu Microelectronics America, Inc. 2009
FMA Top-10 Customers (FY05 – FY09)
($M)
04/14/2009
20
© Fujitsu Microelectronics America, Inc. 2009
FMA P&L
FY08 P&L Result
Fujitsu Microelectronics America, Inc.
PROFIT/LOSS STATEMENT
FY2008
(Unit: $M, except headcount)
Local Revenue
Offshore Revenue
Trade Revenue
% grow th from prior year
FY06
FY07
1H08
2H08
2H 08
FY08
F Y08
Actual
Actual
Actual
Actual
T a rge t
Actual
B udge t
138.0
22.2
160.2
11%
130.6
31.7
162.3
64.6
34.7
99.4
47.5
17.3
64.7
9 7 .9
10 6 .8
62.6
35.3
1%
112.1
52.0
164.1
1%
77%
18.0
182.1
166.1
47.6
2 13 .6
19.2
179.4
17.8
180.1
9.2
108.6
66%
8.7
73.5
21.3
0.8
22.0
17.1
2.1
19.2
8.0
3.2
11.2
5.8
1.6
7.4
M argi n % (l ocal revenue)
15.4%
13.1%
12.4%
12.2%
12 .0 %
12.3%
12 .7 %
M argi n % (total Trade Revenue)
13.8%
11.9%
11.3%
11.4%
9 .5 %
11.3%
11.1%
Operating Margin
41.2
37.0
20.5
16.1
Operating Expenses
40.4
38.1
20.3
17.8
% of budget/target
Service Funding
Total Revenue
Product Margin ( - MCCA Cost)
MCCA Margin
Net Product Margin
Operating Profit/(Loss)
0.8
(1.1)
0.2
(1.7)
8.9
7.5
1.8
9 .3
18 .2
20.3
13.8
4.8
18.6
36.6
38.1
( 2 .1)
(1.5)
17.5
2 3 1.2
21.0
2.7
2 3 .8
4 1.3
41.6
( 0 .3 )
0.2
1.8
0.1
(1.3)
0.1
(1.2)
Pre Tax Profit/(Loss)
1.1
0.7
0.3
(3.0)
( 2 .1)
(2.7)
Tax Provision
0.8
0.7
0.3
(1.8)
(0.3)
(1.5)
0.5
Net Incom e
0.3
0.0
0.0
(1.1)
( 1.8 )
(1.1)
( 0 .5 )
132
0.3
128
5.0
130
2.3
116
3.7
2.9
116
6.0
0.4
Other Inc/(Exp)
Regular Headcount
Capital Spending
136
0.3
0 .0
131
Note 1: FY08 actual include $1.3M severance package (non-operating expenses)
Note 2: FY07 $1.8M net other Inc/(Exp) includes the relief of 2H06 bonus accrual ($0.7M), m arcom accrual adjustm ent ($0.3M), SSD credits
($0.2M) and interest incom e ($0.6M).
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2008
2009
FMA P/L Structure
Net Pr oduct Ma r g i n
O ffs h o r e R e v e n u e
M a r g i n % (l o c a l r e v e n u e )
S e r v i c e Fu n d i n g
T otal Revenue
Pr oduct
O perati ng E x pens es
200
25.00%
187. 5
179. 4
178. 7
180
22. 2%
161. 5
160
22. 2
180
182. 1
31. 7
9. 9
52. 2
52
140
20.00%
119. 1
120
74. 2
135. 1
113. 1
116
111. 4
93. 5
103. 5
100
15. 6%
80
15. 2%
15. 4%
15.00%
60
13. 1%
12. 5%
40
23. 7
19. 5
17. 1
19. 2
17. 8
18
12. 4%
13. 4
20
21. 2
24. 1
21. 4
22
19. 2
18. 6
18. 4
F Y0 3
F Y0 4
F Y0 5
F Y0 6
F Y0 7
F Y0 8
F Y0 9 (B GT)
▲1.1
▲1.5
0
10.00%
0.7
04/14/2009
1.2
1.2
0.8
23
▲ 0.3
© Fujitsu Microelectronics America, Inc. 2009
Cost-cutting Measures
Cost Cutting Measures for 2HFY08 and FY09
Savings
 Christmas 2-day holiday shutdown
$0.1M
 Mandatory 10-day PTOs (4Q08)
$0.5M
 Mandatory FY09 PTOs (take all PTO time accrued in FY09) $0.8M (FY09)
 Headcount reduction (23)
$3.7M (FY09)*
 No cost-of-living adjustment for FY09
$0.5M (FY09)
 Marcom expense reduction (15% 2H08 expense)
$0.1M
 Dallas design center and Boston sales office closures $0.2M (FY09)
 Engineering design tool reduction
$0.05M
$1.0M (FY09)
 IT Infrastructure support-cost reductions
$0.3M (FY09)
 Termination of external sales representatives
$0.3M
$0.7M (FY09)*
Total savings – 2H08
Total savings – FY09
$1.05M
$7.2M
* Portion of savings will be redeployed or reallocated to strengthen sales force and other FMA functions
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
FY09 P&L Plan
Fujitsu Microelectronics America, Inc.
PROFIT/LOSS STATEMENT
FY2009
(Unit: $M, except headcount)
Local Revenue
Offshore Revenue
Trade Revenue
1Q09
2Q09
3Q09
4Q09
FY09
Budg
Budg
Budg
Budg
Budg
25.9
10.2
36.1
31.0
11.3
42.3
33.4
13.4
46.8
31.6
17.3
48.9
121.9
52.2
174.1
6.1%
3.3
39.5
3.3
45.7
3.4
50.2
3.4
52.2
13.4
187.5
4.1
4.6
4.9
4.8
18.4
% grow th from prior year
% of budget/target
Service Funding
Total (Revenue + Funding)
Net Product Margin
M argi n % (l ocal revenue)
M argi n % (total Trade Revenue)
12.4%
10.8%
12.0%
10.4%
12.0%
9.8%
12.4%
10.5%
Operating Margin
7.5
7.9
8.2
8.2
31.8
Operating Expenses
7.8
7.9
8.0
8.0
31.7
(0.3)
0.0
0.3
0.1
0.1
0.0
0.0
0.0
0.0
0.0
Pre Tax Profit/(Loss)
(0.3)
0.0
0.3
0.1
0.1
Tax Provision
(0.1)
(0.0)
0.1
0.1
0.0
Net Incom e
(0.2)
0.0
0.2
0.1
0.1
Capital Spending
0.7
Operating Profit/(Loss)
Other Inc/(Exp)
04/14/2009
13.6%
11.5%
25
0.8
0.0
0.1
1.7
© Fujitsu Microelectronics America, Inc. 2008
2009
P&L Comments

YoY revenue growing
 Expense is reducing, mainly headcount
 Overall profitability worsening, why?

Trend to Foundry
 Low margin

Trend to Overseas
 Share margin, lower margin

Trend to new style business
 e.g. Milbeaut/VPT 1% margin
04/14/2009
26
© Fujitsu Microelectronics America, Inc. 2009
FMA Business Groups
Business Update
Semiconductor Manufacturing
Services
Business Group
Fab Utilization Rates
Wafer Fab Utilization Rates
100%
93%
91%
90%
89%
93%
90%
89%
87%
90%
89%
86%
92%
90%
89%
91%
90%
89%
91%
91%
90%
89%
91%
90%
87%
180nm
130nm
90nm
65nm
88%
86%
85%
83%
81%
79%
78%
80%
76%
76%
73%
68%
73%
71%
67%
69%
68%
65%
62%
60%
62%
59%
58%
55%
Improved utilization rates drives COT business
improvement!
55%
55%
48%
51%
48%
51%
39%
38%
52%
40%
20%
0%
2008_01
2008_04
2008_07
2008_10
2009_01
Sources: Selantek, April 2009
04/14/2009
29
© Fujitsu Microelectronics America, Inc. 2009
Design Win Revenue Projection
FY2008 Design Win Sales Revenue Projection ($K)
$35,000
Nv_MINOS6-90
Ms_SSD
Au_A1400
$30,000
Credo
Vi_CN_B
Unity
$25,000
Lt_ECP3-150
Dt_Rodan
Dt_LV263
$20,000
Sy_SYL2060
Sy_ SYL2030
iS_AGE 100
CPhotonics
$15,000
Mv_Md200
Tw _2809
iS_Kodie
$10,000
As_AP90xx
Or_Jasmin
iS_tdTV
$5,000
Au_ASI1300
eL_2K4K
eL_HD72
$-
FY2009
04/14/2009
FY2010
FY2011
FY2012
30
FY2013
FY2014
© Fujitsu Microelectronics America, Inc. 2009
SMS FY09 Revenue
Onshore
Budget
Delta
Forecast
1HFY09
$24.46M
$25.80M
+$1.34M
2HFY09
$ 30.82M
$ 30.38M
<$.44M>
Sub-Total (A)
$55.30M
$56.18M
+$.90M
1HFY09
$16.18M
$16.18M
$0M
2HFY09
$21.88M
$21.88M
$0M
Sub-Total (B)
$38.06M
$38.06M
$0M
$ 93.36M
$ 94.24M
+$.88M
Offshore
World Wide Total FY09 (A+B)
04/14/2009
31
© Fujitsu Microelectronics America, Inc. 2009
Top SMS Customers – FY09
Customers
Revenues
Comment
WFS



Broadcom
Lattice
Insilica
$15.4M
$13.4M
$3.1M
GPS for Apple, RIMM, Tom-Tom
Management change/focus
Not winning programs; FCST down
FNC
DeShaw
Sonosite
$5.0M
$3.2M
$2.0M
Long-haul SONET
Super Computer application
Ultrasound
$19.3M
$8.4M
$3.7M
Netbooks; HP, White Box
LCOS viewfinders; Pico-Projectors
Ultrasound
ASIC



Offshore



04/14/2009
Via
Displaytech
Siemens
32
© Fujitsu Microelectronics America, Inc. 2009
Upsides/Risks to FY09 FCST
Upside to Logic Budget

NRE
Comments
$2.1M
Design win pipeline strength
 See design win prospect list

Production
$2.0M
Improving handset and FPGA sales
 Broadcom, Lattice
Risk to Logic Budget


Total
04/14/2009
NRE
Production
$0.5M
$1.0M
Insilica design program delays
Insilica production Fcst reduction
$2.6M
Net Upside Potential
33
© Fujitsu Microelectronics America, Inc. 2009
SMS Design Win Potentials – 1HFY09
Revenue
Sales
Person
Winning
Month
FY09 FY10 FY11 FY 12
Status
Enphase(3)
John
April
$0.5M $1.5M $3.0M $2.5M
In progress
Need solution on Op Amp/consider offchip
FNC MRMS
David
July
$1.0M $0.7M $2.0M $2.5M
In progress
Customer needs to release funding for project
Novatel RF
David
June
$0.8M $1.0M $1.2M $1.0M
In progress
Customer visit on 4/23 to discuss details
Quintin
May
$0.3M $0.8M $1.5M $2.0M
In progress
New ASIC(2nd generation) under planning for PP
Consentry
John
May
$1.0M $0.8M $1.0M $1.0M
In progress
Customer delay due to spec redefinition
3PAR Data
Ruben
May
$1.0M $0.8M $2.0M $2.5M
In progress
Debating to do SW vs. HW approach
Lattice(2)
Rich
Aug
$1.0M $1.8M $3.0M $6.0M
In progress
1 CMOS + 1 eflash
DisplayTech
Rich
July
$0.5M $2.0M $2.5M $2.5M
In progress
Being acquired by Micron
Open Silicon(2)
Dave
June-Sept
$0.8M $1.2M $4.0M $7.0M
In progress
6 RFQs fiscal year to date
Aurora(2)
John
June
$0.1M $1.0M $1.0M $1.0M
In progress
One packaging, One 0.13um
Ruben
Sept
$0.9M $2.5M $3.0M $3.5M
In progress
Early evaluation of embedding the FME ADC
Customer
Syndiant
JDSU(ADC based)
Comment
Design Win Goal : 10
04/14/2009
34
© Fujitsu Microelectronics America, Inc. 2009
North America Customer Pipeline
Prospects
Entropic (RF)
Cypress
Aleron (RF)
Marvell (RF)
Brocade ??
Seagate
Authentec
Finisar
Western Digital
Xerox
QLogic
Atmel-65 nm
NXP
Time Domain
MSSI
Aether Wire &
Locaitons
Parco Wireless
Ubisense
Aurora-PKG
Pre-Sales
Analog Devices
Novatel-Minos7
Sandisk
Cadence
JDSU 10G
Maxim (RF)
ECC (I)
PMC-Sierra
MXI
ViXS
SiGe (RF)
Validity
3Par Data
Airpointe
Ubicom
Huawei
AboundLogic
National
Fastrack
Kopin
Infinera (CHAIS)
Novatel ME4 RF
Ciena (CHAIS)
Nortel (CHAIS)
Aurora-ASI1400
ALU
Cavium
Quote
Rockwell (I)
Convergence
Centaur
Neterion
NA Odie (I)
Solarflare
SMSC
eSilicon
iChips-5 (I)
Enphase-Jay
FNC (MRMS) Enphase-Raven
Skyworks (RF) Enphase-Sparrow
Korea Odie 1 (I) Minos 6+
Korea Odie 2 (I) Kleer
Open Silicon
NavCom (I)
Lexmark-Crypto 3Par Data
ECC (I)-ASIC 2
Unity-64G
SandForce
STS
Techwell-65 nm
VLSI Standards
Consentry-LSP3
HP
Note: Blue indicates change in pipeline Red indicates no change in 4 weeks
04/14/2009
35
© Fujitsu Microelectronics America, Inc. 2009
North America Customer Pipeline
Design
Dothill (I)
eASIC
Orca (RF)
AlphaScale
eLCOS-HD1200
eLCOS-2KX4K
NextWave TDtv (I)
D E Shaw-Anton2
JDSU-10G link 1
JDSU-10G link 2
Kodak-Kodie (I)
Compound Photonics
Techwell-TW2809
Displaytech-Gigan
Credo-65nmHP
Lattice-ECP3 150
MOSAID
Displaytech-Rodan
Tape Out/
Prototype
iCHIPS-He (I)
FineArch-301 (I)
NextWave-SOC3(I)
Mavrix-MD200
Aurora-ASI1300
Techwell (Hawk1)
HelloSoft (I)
Garfield (I)
Techwell—TW2880
iCHIPS-Ne (I)
D E Shaw-Anton 1.1
Centaur-CN_B
Cavium-Taos 1 spin
Displaytech-LV263
Production
eASIC
Cisco
Broadcom Fortinet
White
Foundry
Aurora
Staccato
GDA
Lattice
Siemens
Syndiant
Consentry iCHIPS-Xe/Ar (I)
Displaytech NextWave-SOC2/3
Moschip (I)
Telairity
Orchid (I)
Optium
PLX
FNC
PMC (PAS5201)
Arris
Cavium-Taos1
Motorola
DE Shaw-Anton1
Nortel
Pinnacle
Pelco
Applause
Sonosite
Galazar
STK
Novatel 5/6 Emerson
Centaur-S3G
Note: Blue indicates change in pipeline Red indicates no change in 4 weeks
04/14/2009
36
© Fujitsu Microelectronics America, Inc. 2009
Competitive Sales Issues
 Competitive mask pricing for 65nm

Expensive as compared to competition
• $800K vs. $600K(for 6LM)
 Lack of competitive IP pricing for 65nm

In particular ARM and other commodity IP
• Short-term versus long term revenue (NRE fees - Product Revenue)
 USB Family & SERDES


Lack of multiprotocol SERDES in CS200L
• Consentry, Qlogic, Brocade, SandForce, Lexmark, Emulex
Lack of availability of key IP(s) in CS200L
• USB2.0 OTG
 Transition of LCOS process from 0.18um to 0.13um

04/14/2009
High volume embedded pico-projectors
37
© Fujitsu Microelectronics America, Inc. 2009
Automotive Business Group
Automotive Group Business Plan
 OEM Focus



Significant focus and effort at “Detroit 3” OEM car makers
Promoting Fujitsu Technology, Product and Solutions
Goal is “Directed Sourcing Agreement” for Fujitsu




Growing and managing existing business
Pursuing and quoting new business opportunities
Promoting Fujitsu Technology, Product and Solutions
Goal is “Strategic / Platform Supplier” for Fujitsu


Transitioning non-Fujitsu product sales to US JMAs
Transitioning Fujitsu MCU sales from disti. To FMA




Pursuing representation agreement with Fuji Electric
Pursuing cooperative agreement with Optrex America, Inc.
Continuing cooperation with Sharp Microelectronics America, Inc.
Targeting closer working relationship with Microsoft
 Tier 1 Focus
 FEI Customer Development
 Partner Development
04/14/2009
39
© Fujitsu Microelectronics America, Inc. 2009
Automotive Market Trends
 Customer Side Trends




US OEM’s situation – Ford is strong, GM will likely declare bankruptcy and shrink,
Chrysler will likely merge with Fiat
Due to financial condition of OEM’s, price has become their #1 concern. To win business
you really must have lowest price.
US Tier-1’s situation – Delphi remains in Bankruptcy, Visteon is considering bankruptcy,
JCI, Lear and TRW are in better condition
Same issue for Tier-1’s, price is most important factor
 Competition Trends


Freescale is being very aggressive with their new 32bit MCU family called Bolaero. They
are quoting below NEC pricing and are really focusing on Body Control Applications.
NEC continues to beat us on price by as much as 30 ~ 40%. They also continue to
announce new product families and variants at a rapid pace. They have biggest share
now of the automotive body control MCU market.
 Technology Trends




04/14/2009
Media processing applications like Ford “Sync” driving need for dual core and high
performance DSP type devices. Freescale, Intel, Renesas well suited for this
More and larger color TFT displays in car and in cluster, this is driving GDC demand and
can benefit Fujitsu
OEM’s trying to reduce the number of BCM and ECM control modules in the car, this
drives need for higher performing multi-core MCU’s – Freescale, TI, Renesas as well
position with product for these areas
SW support becoming more of a requirement than an option. This is especially true in
the area of graphics applications.
40
© Fujitsu Microelectronics America, Inc. 2009
Automotive Group Opportunities

Opportunity Pipeline



1HFY09 Design In Win Targets



32 opportunities currently engaged in between Lead and RFQ status
Opportunities tracked and reviewed in Sales Pipeline report weekly
10 GDC
4 MCU
Potential Revenue


04/14/2009
$35M open opportunities
$15M design win target opportunities
41
© Fujitsu Microelectronics America, Inc. 2009
Automotive Opportunity Pipeline
Lead / Customer Contact
IIStanley
Panasonic
Delphi - Radio
Pre-Sales
Denso (5)
TRAM
Continental (2)
Fiat
Delphi
G.M. (3) – BCM, Cluster
BHTC – Chrysler HVAC
JCI – Ford Cluster
G.M. - HUD
RFQ - Quote
Denso
Yazaki
JCI (4)
Continental (3)
Magneti Marelli - Cluster
TRW – Ford Touch Panel
Delphi – Toyota Cluster
Note: Blue indicates change in pipeline Red indicates no change in 4 weeks
04/14/2009
42
© Fujitsu Microelectronics America, Inc. 2009
Automotive Opportunity Pipeline
Design-In
JCI – Ford Cluster
Delphi – Toyota Cluster
BHTC – Pacaar HVAC
Ford - Cluster
Prototype
Production
Denso (2) - Cluster
IIStanley
Alpine
TRW – Ford Touch Panel
Visteon – Ford Cluster
Continental (2)
Note: Blue indicates change in pipeline Red indicates no change in 4 weeks
04/14/2009
43
© Fujitsu Microelectronics America, Inc. 2009
Strategic Opportunity – FMA WIN!

Ford Motor Company




Program
Product
Timing
Target Price
EAU
Annual Revenue
Total Win Value
Competition
-
“Build to Print” Cluster Architecture
MB86R01 GDC, “Jade LC”
MY2013 ~ 2016
$6.00 @ 105Y = $1.00
1000K pcs.
$ 6M
$24M
Freescale, Texas Instruments, NEC

How we won
-
1. Fujitsu GDC technology
2. FMA “Solutions SW/HW” support
3. Relationship with the customer
4. Met market pricing level




http://www.fujitsu.com/downloads/MICRO/fma/marcom/AvaDemo8.wmv
04/14/2009
44
© Fujitsu Microelectronics America, Inc. 2009
Cluster Animation
04/14/2009
45
© Fujitsu Microelectronics America, Inc. 2009
Strategic Opportunity – FMA Pursuing…

General Motors Corporation





Program
Product
Timing
Target Price
EAU
Annual Revenue
Total Win Value
Competition
-
“Global B” Body Control Module
MCU (TBD)
MY2015
$2.50 (Estimated)
2000K pcs.
$ 5M
$25M
NEC, Freescale

Needed to Win
-
1. Competitive pricing to NEC
2. Support to port NEC code at GM
3. Treat other Tier 1’s same as Denso
4. Convince Bosch, Conti, Delphi
to also propose Fujitsu solution to GM



04/14/2009
46
© Fujitsu Microelectronics America, Inc. 2009
Competitive Sales Issues

Needed to achieve targeted design wins:







04/14/2009
Must be price competitive to NEC and Freescale on MCU’s
Must have 90nm flash based product launch ASAP
Need to offer customer SW porting support for MCU
Need to get more 3rd party tool support for Fujitsu MCU product
Continue to grow “Solutions Group” resource to support GDC
opportunities
Better coordination between FML, FME, FMAL and FMA on SW
activities
Continued support for unique Fujitsu technologies like IDB1394 product
47
© Fujitsu Microelectronics America, Inc. 2009
Embedded Platform Solutions
Business Group
New Organization and Approach for FY09

Formed a dedicated team with the goal to increase locally
generated ASSP Business
EPS BG
Keith Horn
Acting
George Wu
Director
Marketing
 Marketing & Application
Engineering
Ion Furtuna
Senior Manager
OEM Sales
Dick Harlow
Senior Director
Channel Sales
 Sales to major Accounts
and prospects
 Management of channel
Partners (e.g. Disty),
EMS and value adding
partners (e.g. Atlabs)
 Products for immediate
revenue; MCU, GDC
TSC, WiMax, Analog
Milbeaut
04/14/2009
Davy Yoshida
Director
Business Development
 Business development for
products for future
revenue; e.g. H.264, USB3.0
 Collaborate with FML and
partners for marketing for
new product development
49
© Fujitsu Microelectronics America, Inc. 2009
Customers

Key Customers in FY09




Pre-Sales






04/14/2009
Ramtron – FRAM ($21M)
Vistapoint – Milbeaut ($3M – but forecast is higher)
Sony – MCU ($7M)
Lexmark
Roche
Whirlpool
Electrolux
UEI
Western Digital
50
© Fujitsu Microelectronics America, Inc. 2009
How to increase ASSP Revenue?

New initiatives in FY09

New channel strategy and sales approach
 ‘On-line’ distributor for demand creation - Digikey
 Expand Direct Sales capability





04/14/2009
Broaden Milbeaut promotion – Motorola, RIM, Apple
Initiate LPC MCU promotion, prepare for ARM MCU
Initiate Analog promotion
Expand Graphics Display Controller promotion outside
Automotive
Prepare for USB3.0 – SATA ASSP launch
51
© Fujitsu Microelectronics America, Inc. 2009
FMA Contribution to Fujitsu –
USB3.0 – SATA ASSP Business Development
USB
Organization
Fresco Logic
O/S
(Microsoft)
USB Host
Partner
FML
HDD
Subcontractor
CPU
(Intel)
HDD
Companies
04/14/2009
52
© Fujitsu Microelectronics America, Inc. 2009
Competitive Sales Issues
 Shift of FRAM production from Iwate to Mie seriously impacts Ramtron
business
 Accelerate development of new products for revenue growth in the U.S.


e.g.
 ‘Movie’ Milbeaut
 USB3.0-SATA Bridge
 ARM MC
Stronger commitment to win new opportunities e.g. Lexmark (FRAM),
aggressive ‘Sales’ oriented approach is needed at FML
Emphasize the development of complete solutions (hardware, software
and platform) rather than discrete products
04/14/2009
53
© Fujitsu Microelectronics America, Inc. 2009
SoC Design Engineering Center
(SoCDEC)
Status Update
SoCDeC – Design Activities
10/2008
11
12
1/2009
Cavium PureVu
2
3
4
5
6
7
8
9
TO
TO
TW 2809
65nm TC4
TO
TW2880-A2
TO
45nm TC31
TW2880-B1
TO
TO
Deshaw Anton 1.1
45nm TC32
TO
TO
DeShaw 45nm Anton2
PETA ICC CS200HP
TO
Snowbush PCS
Mavrix MD200
04/14/2009
TO
TO
55
© Fujitsu Microelectronics America, Inc. 2009
SoCDeC – IP Development plan
2008
10 11 12
Prism CS200HP SerDes
2009
1
2
3
4
5
TC4 TO ?
Technology transfer
Library & Test chip support: S.Kim, G.Fu
Prism CS300HP SerDes
6
7
2010
8
9
10
11
12
1
2
3
ICC TO
J.Liou, A.Toda
Venus rev.T TO
TC31 TO
Venus rev.A TO
TC32 TO
Technology transfer
Library & Test chip support: S.Kim, G.Fu
J.Liou, A.Toda
Prism PCS verification
PCIe gen2
A.Watanabe, S.Kim
IEEE802.3ap
A.Watanabe, S.Kim
FNC Muxponder (CS100A_LL)
6/18 Test chip TO
J.Liou, A.Toda, A.Watanabe, S.Kim, G.Fu
FLA SerDes (CS100A_LL)
Technology transfer & Customer support
J.Liou, A.Toda, S.Kim
04/14/2009
56
© Fujitsu Microelectronics America, Inc. 2009
FMA Contribution to Fujitsu –
PETA ICC ASIC


Program Name:
Technology:


Chip size:
Chip scale:
 PKG:
 HSIO:


ICC (Inter Connect Controller LSI )
CS200HP (65nm high performance process) 10 metallayer
18.244 x 18.244 mm^2 (102 Bump x 102 Bump)
49M gates + 11.7Mbits SRAM
FCBGA-2116 (47.5mm^2)
ToFu (6D-Torus): 6.25Gbps x 80ch
Venus Bus
: 6.25Gbps x 32ch
PCIe Gen2
: 5.0Gbps x 16ch
Special requirement
+ RTL hand-off
+ High reliability, target: 18FIT
+ Radiation Hardened FF (double-height)
+ 100% double cut vias
Schedule (Version A1)
03/31 RTL release
04/30 RTL ECO 4 big blocks
06/30 Bulk/Metal T.O
09/15 ES
04/14/2009
57
© Fujitsu Microelectronics America, Inc. 2009
FMA Contribution to Fujitsu –
PETA ICC ASIC
PCIe G2
6.25Gbps
Serdes
6.25Gbps
Serdes
04/14/2009
58
© Fujitsu Microelectronics America, Inc. 2009
Summary
We request strong support from FML to:

Achieve FY09 Revenue,
 Design Win, and
 P&L goals
04/14/2009
59
© Fujitsu Microelectronics America, Inc. 2009
Back-up Material
P/L
Fujitsu Microelectronics America, Inc.
PROFIT/LOSS STATEMENT
FY2003 to FY2008
(Unit: $M, except headcount)
FY03
FY04
FY05
FY06
FY07
1H08
2H08
FY08
FY08
Actual
Actual
Actual
Actual
Actual
Actual
Nov Fcst
Nov Fcst
Budget
159.2
134.5
9.9
144.4
138.0
22.2
160.2
130.6
31.7
162.3
64.6
34.7
99.4
59.6
30.6
90.2
166.1
47.6
213.6
8.6
98.8
124.3
65.3
189.6
17%
17.8
207.4
67%
-9%
11%
1%
23.7
119.1
19.5
178.6
17.1
161.6
19.2
179.4
17.8
180.1
9.2
108.6
21.2
24.1
21.4
22.0
19.2
11.2
9.2
20.4
23.8
22.2%
22.2%
15.2%
15.2%
15.6%
14.8%
15.4%
13.8%
13.1%
11.9%
12.4%
11.3%
12.6%
10.2%
12.5%
10.8%
12.7%
11.1%
Operating Margin
44.9
43.6
38.5
41.2
37.0
20.5
17.8
38.2
41.3
Operating Expenses
44.2
42.4
37.3
40.4
38.1
20.3
20.1
40.4
41.6
0.7
1.2
1.2
0.8
(1.1)
0.2
(2.4)
(2.2)
(0.3)
Other Inc/(Exp)
1.0
0.2
0.6
0.2
1.8
0.1
0.1
0.2
0.3
Pre Tax Profit/(Loss)
1.7
1.4
1.8
1.1
0.7
0.3
(2.3)
(2.0)
0.0
(0.3)
1.5
0.4
0.8
0.7
0.3
(0.3)
0.0
0.5
Net Income
2.0
(0.1)
1.4
0.3
0.0
0.0
(2.0)
(2.0)
(0.5)
Regular Headcount
157
0.0
151
0.3
126
0.0
132
0.3
128
5.0
130
2.3
134
2.8
134
5.1
131
0.4
Local Revenue
95.4
159.2
95.4
Offshore Revenue
Trade Revenue
% growth from prior year
Service Funding
Total Revenue
Net Product Margin
Margin % (local revenue)
Margin % (total Trade Revenue)
Operating Profit/(Loss)
Tax Provision
Capital Spending
04/14/2009
62
17.5
231.2
© Fujitsu Microelectronics America, Inc. 2009
マーケット – 半導体売上高予測（ＷＷ）
350,000
10.0%
300,000
8.0%
250,000
6.0%
200,000
4.0%
150,000
2.0%
100,000
0.0%
50,000
$M
-2.0%
0
-4.0%
04C Y
05C Y
08年春季（
金額）
06C Y
07C Y
08年秋季（
金額）
08C Y
09C Y
08年春季（
成長率）
10C Y
11C Y
08年秋季（
成長率）
（出展:WSTS 世界半導体市場 08秋季予測）
WW IC市場の予測。08年春季予測に比較して最新（秋季予測）はCY09のマイナス
成長およびＣＹ10以降の成長率も大幅に引き下げている
04/14/2009
63
© Fujitsu Microelectronics America, Inc. 2009
マーケット – 半導体売上高予測（ＷＷ）
半導体地域別 売上構成比
350,000
300,000
250,000
200,000
Asia Pacific
150,000
Japan
100,000
Europe
50,000
America
0
03CY
04CY
05CY
06CY
07CY
08CY
09CY
10CY
11CY
（出展:WSTS 世界半導体市場 08秋季予測）
成長は今後もアジアパシフィック地域により牽引されると予測。米市場は微減および横ばい。
ただし、今後とも北米は技術革新の発信地として重要な役割を負っていくと認識している。
04/14/2009
64
© Fujitsu Microelectronics America, Inc. 2009
中期売上計画（0次案）
( Unit : M$ )
300
OFFSHORE
250
Others(FEI)
200
Memory
ASSPs
150
FRAM
MCU
100
COT
50
ASIC
FY2008
FY2009
FY2010
FY2011
FY09年は経済情勢を鑑みて微増に留まる見込み。引き続きCOTのエリアでボリュームビジ
ネスを追求して売上を伸張させる。
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
（ご参考）北米自動車販売台数の推移
2008年 米国新車販売数の推移 （単位：台）
1,600,000
Porsche
Land Rover
Audi
2007年
1,400,000
Jaguar
Saab
Mercedes-Benz
1,200,000
Volvo
BMW
Volksw agen
1,000,000
Kia
Hyundai
800,000
ス ズキ
富士重工業
いすゞ 自動車
600,000
三菱自動車
マツ ダ
400,000
日産自動車
ホン ダ
ト ヨ タ 自動車
200,000
Chrysler
Ford Motor
0
General Motors
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
前年同月
FMAの顧客（Tire1様）によると09年度は引き続き低迷、10年回復傾向、11年に本格回復を予想
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
Where are we in the cycle? (2)

Closer to the bottom than the top

Utilization rates continue to fall in CY Q1 2009
 U-shape curve expected

Inventory purge still continuing

Desktop and Laptop PCs finally rolled over
 Other consumer segments significantly down the road of inventory correction
 Samsung aggressively pursuing 65nm volume
• TI, Nvidia and Qualcomm in MP
• Pursuing small and medium sized opportunities

Look for an Inventory replenishment event early 2009

Sometime between January 2009 and April 2009
 Unlikely to be sustainable

Earliest chance for improved fundamentals June/July of 2009

04/14/2009
Low inventory levels, global economic condition, 2H seasonality
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© Fujitsu Microelectronics America, Inc. 2009
P&L Negotiation


Current style





04/14/2009
Suggested Style

Negotiate margin for
each deal
Negotiate funding with
each GM – project by
project
FMA spend more time
negotiating with FML
than with the Customer –
a fact!
Adhoc - No view taken
for the entire FMA
Not satisfying IRS
guideline


Agree FMA’s goals for
revenue contribution,
development and others
e.g. strategic marketing
Agree the necessary
costs (mainly headcount)
to deliver against these
goals
Cover the cost (+ alpha)
 Alpha = profit required to
satisfy the IRS as well as
some allowance for local
investment e.g. to increase
Sales or AE capability
68
© Fujitsu Microelectronics America, Inc. 2009
FMA’s Focus
SMS (ASIC / COT)
ASSP
Semiconductor Manufacturing
Services with emphasis on
ASIC and Foundry Business
Sales and Marketing of MCU,
FRAM, GDC, and WiMAX
products and solutions
Automotive
Business Development
Engage Automotive OEMs and
Tier 1 Suppliers with MCU,
GDC and other ASSPs
Trial sales and marketing of
new products and solutions,
for example TV/STB, ISDB-T
and Milbeaut
To develop value adding
relationships with innovative
U.S. companies
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
Wafer Foundry Outlook
Wafer Foundry Revenue ($B) and Growth Forecast
$30
50.0%
Revenue
27.1
Growth
26.4
40.0%
37.4%
33.8%
$25
29.0%
21.6
$20
22.5
22.2
30.0%
25.6%
21.0
20.0%
17.5%
16.6%
18.8
18.7%
18.4
17.7
10.0%
1.2%
$15
2.8%
2.6%
13.7
0.0%
13.2
-2.2%
-10.0%
10.6
$10
-20.0%
-30.0%
$5
-40.0%
-41.1%
$-
-50.0%
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
Sources: Gartner, March 2009
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
FMA FY2008 Revenue –
By Product and Application
By Product
FEI (nonFujitsu)
5%
FRAM
20%
ASSPs
3%
FLASH
Memory
2%
By Application
Industry
4%
MCU
26%
Automotive
32%
Others
14%
Telecom
6%
Imaging
6%
ASIC
22%
04/14/2009
COT
22%
Data
Processing
9%
71
GPS / Navi
6%
FPGA
5%
TV
16%
FRAM COT
2%
© Fujitsu Microelectronics America, Inc. 2009
FMA Revenue and Product Margin
(2003-2008)
( Unit : M$ )
Offs hore
180
Others (FEI)
160
ASSPs
140
120
Dis play
100
Mem ory
80
FRAM
60
40
MCU
20
COT
0
FY03
Plasma
LCD
FRAM
MCU
COT
ASIC
FY05
FY06
FY07
FY08
FY03
FY04
FY05
FY06
FY07
FY08
23.5%
9.4%
8.2%
13.9%
12.4%
38.8%
16.9%
6.6%
5.7%
13.1%
7.9%
28.5%
8.4%
6.4%
5.5%
12.2%
6.5%
27.7%
6.5%
12.6%
6.5%
27.9%
6.0%
12.6%
7.4%
23.3%
5.4%
16.3%
6.5%
23.5%
1.2
0.8
▲1.1
▲ 1.5
(
04/14/2009
FY04
0.7
1.2
72
ASIC
FY09計 画
Product Margin of Major Products
▲ 0.1
)
 Operating Profit
© Fujitsu Microelectronics America, Inc. 2009
Customer Introduction: TechWell
 Publicly Traded Company on NASDAQ: TWLL
 Product:
 Market:
 Application:
Mixed signal integrated circuits for multiple digital
video applications
Security surveillance, automotive and consumer
Security surveillance systems, in-car LCD displays,
advanced TVs, multifunction LCD monitors, and DVD
recorders
 FMA’s Taped-out and Ongoing Projects
 Technology:
 Taped-out designs:
 On-going projects:
 Designs in pipeline:
04/14/2009
90nm (TechWell’s first engagement in 90nm)
Hawk1, TW2880-A1, TW2880-A2
TW2809
TW2880-B1, TW2881, TW2882, TW2890
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© Fujitsu Microelectronics America, Inc. 2009
FMA Revenue History / Trend
FMA Billing Actual (2003 - 2008)
180
160
Offshore
140
Others (FEI)
120
ASSPs
100
Display
Memory
80
FRAM
60
MCU
COT
40
20
0
Operating
Profit/Loss
($M)
ASIC
FY03
FY04
FY05
FY06
FY07
0.7
1.2
1.2
0.8
▲1.1
FY08 FY09 Bgt
▲1.5
0.1
 Withdrew from Memory and Display business since FY05
 Many ASICs have moved to Asia (2TP  Off-shore revenue)
04/14/2009
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© Fujitsu Microelectronics America, Inc. 2009
Revenue Plan
FMA Revenue Plan
( $M )
250
235
216
Offshore
64
200
162
150
174
164
32
70
ASSPs
Display
52
52
Others(FEI)
Memory
100
146
131
171
122
112
FRAM
MCU
50
COT
ASIC
-
Lattice
Broadcom
Unity
Insilica
Centaur (VIA)
Ramtron
Sony
Denso
Subtotal
04/14/2009
SMS
SMS
SMS
SMS
SMS
EPS
EPS
Auto
FY07
FY08
FY09(MTP)
FY10
FY11
21
3
8
19
13
12
76
13
3
5
12
22
10
9
74
12
10
10
15
21
7
11
86
18
11
4
12
20
10
10
11
96
24
1
20
13
25
5
7
11
106
75
Existing
New　Existing
New
Existing
Off-shore
Existing
Existing
Existing
© Fujitsu Microelectronics America, Inc. 2009
Automotive Business Group Organization
Philip Hughes
Sr. Director
Automotive Business Group
Michelle Mansell
Inside Sales Analyst
Akio Nezu
Sr. Manager
Automotive Marketing
Seiya Murakami*
Sr. Manager
Automotive Sales
Dan Landeck
Sr. Manager
Strategic Marketing
Waqar Saleem
Applications Engineer
Graphics Display Controller
Ryu Daiku*
Automotive Sales Manager
JMA Accounts
Isao Suetake
Field Applications Engineer
Software
Wade Holton
Automotive Sales Manager
OEM / Tier 1 Accounts
Cheyenne Wolford
Graphics Development
Technical Specialist
Seth Lacy
Field Applications Engineer
Hardware
Matt Taulbee
Automotive Sales Manager
OEM / Tier 1 Accounts
(TBD)
Open GL / VG
Technical Specialist
Tore Slotfeldt
GUI Devlopment
Technical Specialist
Auto total headcount – 14
* FML assignee
04/14/2009
Tore Slotfeldt
Strategic Marketing
Engineer
Rick Tewell
Sr. Manager
Solutions Engineering
76
© Fujitsu Microelectronics America, Inc. 2009