Transcript Cryo insulation March 2005

CTD
CryoCoat™ UltraLight™
Insulation
presented by:
Michael L. Tupper
COMPOSITE TECHNOLOGY DEVELOMENT INC.
1505 Coal Creek Drive
Lafayette, Colorado 80026
January 2001
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD

The Innovation of UltraLight™
UltraLight™ is a high integrity, low density material...
that is not a foam!




Mechanical integrity of a syntactic foam
density & thermal conductivity of a
chemically expanded foam
Material lighter than 5 PCF has been fabricated
Meet the requirements for insulating the space shuttle
external tank
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
The Systems Approach

Layered, Cryogenic Insulation System

Incorporates CTD’s expertise:
Adhesives
Thermal Insulation
Protective Coatings

Each layer can be optimized
 gives best system performance
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
CryoCoat™ UltraLight™
Cryogenic Insulation
Protective Coating
Moisture Barrier &
Flame Retardant
Ultra light Insulation
Density less than 5 lbs/ft3
Adhesive Layer
Low Density
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Advantages

Light weight

Dimensional stability

Easily machined or modified

Field repairable

Consistent manufacturing process

Easy to apply

Tailorable properties

Low cost
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Thermal Conductivity Range
Thermal Conductivity:
CTD UltraLight™ UL31xx
80
70
Thermal Conductivity
[mW/m-K]
60
50
40
30
20
Esti mate
10
0
88.5
144
200
297
366
450
Temperature [K]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Helium Flow Test
Thermal Time History for Approximately 1 1/2” of
Cryocoat™ UltraLight™ UL79 insulation
on 4” Diameter Inconel Tube
Insulat ion Thickness Approx. 1 1/2"
100
Temperature [°F]
0
LN2 Pre-Cool
T1 - Tube Bot tom
-100
T2 - Tube Top
T3 - Insulation Outer (Sout h)
T4 - Insulat ion Out er (North)
-200
Test Dat e: Nov 20, 1997
-300
Chang e to LHe
-400
Stop LHe Flow
-500
0
50
100
Elapsed Time [Minutes]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
150
CTD
Apparent Thermal Conductivity UL79
betw een liquid nitrogen and room temperature
as a f unction of vacuum pressure
preliminary data from NASA Kennedy
Apparent
Thermal Conductivity
[mW/M-K]
30
24.4
25
19.2
20
15
10
~12
12.8
13.3
0.14
1
10
7.1
5
0
0.0002
100
Vacuum [Torr]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
760
CTD
Tensile Cryoflex Data
S T R E S S D IS T R IB U T IO N
OUTER EDGE
O F IN S U L AT IO N
S U B S T R AT E S ID E
O F IN S U L AT IO N
IN S U L AT IO N
T H IC K N E S S
IN S U L AT IO N
G R IP A R E A
SU B ST R AT E
Substrate
Aluminum
Aluminum
Carbon Composite
Carbon Composite
Temperature
[K (°F)]
Maximum
Substrate
Strain []
77 (-320)
4 (-454)
77 (-320)
4 (-454)
>10,000
9,000
>6500
~5000
Comments
Substrate Yielded
No Failure
Insulation Cracking
Insulation Cracking
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Tension Test Results
Material
# of
Specimens
at LN2 Temp
Strength
(psi)
Modulus
(Ksi)
Strain to
Failure
(microstrain)
CryoCoat™
620T
PW 28
2
4,111
1,093
3,800
2
2,080
548
3,800
PW 30
1
520
338
1,600
PW31
3
1,585
308
4,500
UL79
2
111
8
12,000
at
Room
Temp.
PW31
3
195
14
26,000
UL79
1
92
7
17,000
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Moisture Barrier Coating
85% Relative Humidity at Room Temperature
3.5
Absorption [%]
3
2.5
Uncoated
2
1.5
LM-lVC
1
LM-lllC
0.5
LM-llC
LM-lC
0
0
5
10
15
20
25
30
35
40
Time [hours]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
45
50