Cryo insulation March 2005
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Transcript Cryo insulation March 2005
CTD
CryoCoat™ UltraLight™
Insulation
presented by:
Michael L. Tupper
COMPOSITE TECHNOLOGY DEVELOMENT INC.
1505 Coal Creek Drive
Lafayette, Colorado 80026
January 2001
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
The Innovation of UltraLight™
UltraLight™ is a high integrity, low density material...
that is not a foam!
Mechanical integrity of a syntactic foam
density & thermal conductivity of a
chemically expanded foam
Material lighter than 5 PCF has been fabricated
Meet the requirements for insulating the space shuttle
external tank
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
The Systems Approach
Layered, Cryogenic Insulation System
Incorporates CTD’s expertise:
Adhesives
Thermal Insulation
Protective Coatings
Each layer can be optimized
gives best system performance
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
CryoCoat™ UltraLight™
Cryogenic Insulation
Protective Coating
Moisture Barrier &
Flame Retardant
Ultra light Insulation
Density less than 5 lbs/ft3
Adhesive Layer
Low Density
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Advantages
Light weight
Dimensional stability
Easily machined or modified
Field repairable
Consistent manufacturing process
Easy to apply
Tailorable properties
Low cost
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Thermal Conductivity Range
Thermal Conductivity:
CTD UltraLight™ UL31xx
80
70
Thermal Conductivity
[mW/m-K]
60
50
40
30
20
Esti mate
10
0
88.5
144
200
297
366
450
Temperature [K]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Helium Flow Test
Thermal Time History for Approximately 1 1/2” of
Cryocoat™ UltraLight™ UL79 insulation
on 4” Diameter Inconel Tube
Insulat ion Thickness Approx. 1 1/2"
100
Temperature [°F]
0
LN2 Pre-Cool
T1 - Tube Bot tom
-100
T2 - Tube Top
T3 - Insulation Outer (Sout h)
T4 - Insulat ion Out er (North)
-200
Test Dat e: Nov 20, 1997
-300
Chang e to LHe
-400
Stop LHe Flow
-500
0
50
100
Elapsed Time [Minutes]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
150
CTD
Apparent Thermal Conductivity UL79
betw een liquid nitrogen and room temperature
as a f unction of vacuum pressure
preliminary data from NASA Kennedy
Apparent
Thermal Conductivity
[mW/M-K]
30
24.4
25
19.2
20
15
10
~12
12.8
13.3
0.14
1
10
7.1
5
0
0.0002
100
Vacuum [Torr]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
760
CTD
Tensile Cryoflex Data
S T R E S S D IS T R IB U T IO N
OUTER EDGE
O F IN S U L AT IO N
S U B S T R AT E S ID E
O F IN S U L AT IO N
IN S U L AT IO N
T H IC K N E S S
IN S U L AT IO N
G R IP A R E A
SU B ST R AT E
Substrate
Aluminum
Aluminum
Carbon Composite
Carbon Composite
Temperature
[K (°F)]
Maximum
Substrate
Strain []
77 (-320)
4 (-454)
77 (-320)
4 (-454)
>10,000
9,000
>6500
~5000
Comments
Substrate Yielded
No Failure
Insulation Cracking
Insulation Cracking
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Tension Test Results
Material
# of
Specimens
at LN2 Temp
Strength
(psi)
Modulus
(Ksi)
Strain to
Failure
(microstrain)
CryoCoat™
620T
PW 28
2
4,111
1,093
3,800
2
2,080
548
3,800
PW 30
1
520
338
1,600
PW31
3
1,585
308
4,500
UL79
2
111
8
12,000
at
Room
Temp.
PW31
3
195
14
26,000
UL79
1
92
7
17,000
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
CTD
Moisture Barrier Coating
85% Relative Humidity at Room Temperature
3.5
Absorption [%]
3
2.5
Uncoated
2
1.5
LM-lVC
1
LM-lllC
0.5
LM-llC
LM-lC
0
0
5
10
15
20
25
30
35
40
Time [hours]
COMPOSITE TECHNOLOGY DEVELOPMENT INC.
45
50