Transcript Document

SST Subsystem
Preliminary Design Review
Davin Larson, Thomas Moreau,
Ron Canario, Robert Lee, Jim Lewis
UCB
THEMIS Instrument PDR
1
UCB, October 15-16, 2003
Overview
Solid State Telescope (SST)
•
•
•
Requirements and Specifications
Block Diagram
Mechanical Design
–
–
–
–
–
–
•
Electrical Design
–
–
–
•
•
•
Detectors
Collimation
Magnets
Attenuator (aka shutter, door)
Detector placement / FOV issues
Mass estimates
AFE – (Analog Front End)
ADC board (aka: DAP)
Power Estimates
(aka: DFE)
Testing and Calibration
Schedule
Issues
THEMIS Instrument PDR
2
UCB, October 15-16, 2003
Science Requirements
•
•
•
•
•
•
SST-1: The SST shall perform measurements of the tailwardmoving current disruption boundary speed using the finite
gyroradius technique (4.1.1.2, 4.1.1.5).
SST-2: The SST shall measure the time-of-arrival of superthermal
ions and electrons of different energies emanating from the
reconnection region to determine the Rx onset time (4.1.1.3,
4.1.1.5).
SST-3: The SST shall compute the partial energy moments due to
the superthermal ions and electrons in the magnetotail plasma
sheet (4.1.1.3, 4.1.1.6, 4.1.1.7, 4.1.1.9, 4.1.1.10).
SST-4: The SST shall obtain measurements of ion and electron
distribution functions with one spin time resolution (<10sec
required) (4.1.1.2, 4.1.1.3).
SST-5: The SST shall measure energetic electron fluxes as close
to Earth as 6RE geocentric, at all local times. (Radiation belt
science- tertiary objective – achieved by nominal design).
SST-6: The SST shall measure energetic ions in the solar wind, at
the magnetopause and in the magnetosheath (Dayside science –
secondary objective – achieved by nominal design).
THEMIS Instrument PDR
3
UCB, October 15-16, 2003
Performance Requirements
•
•
•
•
•
•
•
SST-7: The SST shall measure energetic particles over an energy
range of 30-300keV for ions and 30-100keV for electrons found in
the magnetotail plasma sheet (SST-1, SST-2).
SST-8: The SST energy sampling resolution, dE/E, shall be better
than 30% for ions and electrons (SST-1, SST-2).
SST-9: The SST shall be capable of measuring differential energy
flux in the range from: 10^2 to 5x10^6 for ions; 10^3-10^7 for
electrons (keV/cm2-s –st- keV) whilst providing adequate counts
within a 10 second interval. (exact values TBD) (SST-1, SST-2)
SST-10: The SST shall measure over 90o in elevation with a
minimum resolution of 45o (SST-1, SST-2, SST-3, SST-4).
SST-11: The SST shall have an azimuthal resolution of 45o (SST1, SST-2, SST-3, SST-4).
SST-12: The SST shall supply the high energy partial moments at
one spin time resolution (SST-3)
SST-13: SST calibration shall ensure <20% relative flux
uncertainty over the ranges defined above (SST-1, SST-2).
THEMIS Instrument PDR
4
UCB, October 15-16, 2003
Block Diagram
IDPU
Sensor
Unit
(2 DFEs)
Sensor
Unit
SST
DAP
Board
(aka: ADC)
ETC
Board
DCB
(2 DFEs)
THEMIS Instrument PDR
5
UCB, October 15-16, 2003
Sensor Units
Each sensor unit is a:
•
•
Dual-double ended solid state telescope
Each double ended telescope (1/2 sensor) has:
– Triplet stack of silicon solid state detectors
– Foil (on one side)
– Filters out ions <~350 keV
– Leaves electron flux nearly unchanged
– Magnet / Open side
– Filters out electrons <300 keV
– Leaves ion flux nearly unchanged
– Mechanical Pinhole attenuator
– Reduces count rate during periods of high flux
– Reduces radiation damage (caused by low energy
ions) during periods of high flux
– Collimators
– Preamplifier / shaping electronics
THEMIS Instrument PDR
6
UCB, October 15-16, 2003
Sensor Unit Schematic
Foil Detector
Thick Detector
Open Detector
Lexan/Al
Foil
Collimator
Magnet
THEMIS Instrument PDR
7
Attenuator
UCB, October 15-16, 2003
Sensor Units
THEMIS Instrument PDR
8
UCB, October 15-16, 2003
Mechanical Design
Block Diagram Overview
Sensor Components
•
•
•
•
•
Detectors (& Associated Electronics)
Attenuator (aka shutter, door)
Detector Placement / FOV issues
Collimation
Magnet
Other Stuff
•
•
Cables
ADC Board
Mass Estimates
THEMIS Instrument PDR
9
UCB, October 15-16, 2003
Detector Pixelation
Detectors similar to STEREO/STE
•
Produced at LBNL/Craig Tindall PI
Active area
5 mm
Guard ring
10 mm
THEMIS Instrument PDR
10
UCB, October 15-16, 2003
Detector Stacking
Current Design
+35 V
~200 A
Dead Layer
n
Open
p
Thick{
Foil
Pixelated side ~1200 A Dead Layer
THEMIS Instrument PDR
11
UCB, October 15-16, 2003
Mechanical Presentation
Robert K. Lee
THEMIS Instrument PDR
12
UCB, October 15-16, 2003
SST Mechanical Design
Solid State Telescope (SST)
•
•
Mechanical Requirements
Mechanical Design
– SST Sensor Unit
– Attenuator Actuation
– Attenuator Control
•
•
•
•
Electronics and Cabling
Sensor Orientation Relative to Spacecraft Bus
Thermal Summary
Mass Summary
THEMIS Instrument PDR
13
UCB, October 15-16, 2003
SST Mechanical Design
Mechanical Requirements
•
•
•
SWALES Mechanical Verification Specification 1c
Radiation shielding thickness driven by dose depth curve
Total subsystem mass < 1.2 kg
– Two SST sensors
– DAP electronics board with shielding
– Harness
•
•
•
Nitrogen purge required
Attenuator actuation must complete motion < 1 minute
Attenuator used approximately 20 times per day
THEMIS Instrument PDR
14
UCB, October 15-16, 2003
SST Mechanical Design
SST Sensor Unit
•
•
•
•
•
•
DFE Detector Board Subassembly
Magnet-Yoke Subassembly
Attenuator-Actuator Subassembly
Collimators
Support Structure
Bi-Directional FOV
Attenuator Actuation
•
•
Linear Actuators
Position Switches
Attenuator Control
Electronics and Cabling
•
•
DAP Board
Harness
Sensor Orientation Relative to Spacecraft Bus
Mass Estimate
THEMIS Instrument PDR
15
UCB, October 15-16, 2003
SST Mechanical Design
DFE Detector Board
Subassembly
Detectors (4)
Spring Clamp (2)
BeCu Gasket (3)
Spring Plate (2)
AMPTEK Shielding
PEEK Spacer (3)
Kapton Flex-Circuit (4)
Detector Stack Composition (exploded view)
THEMIS Instrument PDR
16
UCB, October 15-16, 2003
SST Mechanical Design
Typical Electrical Connection Between Detector and
Flex-Circuit
Wirebond
(not shown to scale)
Kapton Flex-Circuit
Detector
(pixelated side)
THEMIS Instrument PDR
17
UCB, October 15-16, 2003
SST Mechanical Design
DFE Detector Board Subassembly Relative Positions
(2 per sensor)
Detector Stack
Subassembly
Multi-Layer Circuit Board
(62 mil thickness)
AMPTEK Shielding
THEMIS Instrument PDR
18
UCB, October 15-16, 2003
SST Mechanical Design
Magnet-Yoke Assembly
Co-Fe Yoke (2)
Sm-Co Magnet (4)
Aluminum Magnet Cage
THEMIS Instrument PDR
19
UCB, October 15-16, 2003
SST Mechanical Design
Attenuator Assembly
Actuator Yoke (2)
Attenuator (4)
Cam (2)
Sapphire Bearing (2)
THEMIS Instrument PDR
20
UCB, October 15-16, 2003
SST Mechanical Design
Actuators and Position Switches
Honeywell SPDT Hermetically
Sealed Switch (2)
NANOMUSCLE SMA
Actuator (2)
THEMIS Instrument PDR
21
UCB, October 15-16, 2003
SST Mechanical Design
Two Collimators Per Side
Ion Side
Electron Side
THEMIS Instrument PDR
22
UCB, October 15-16, 2003
SST Mechanical Design
Four Collimators Per Sensor
Ion Side
Electron Side
Electron Side
Ion Side
THEMIS Instrument PDR
23
UCB, October 15-16, 2003
SST Mechanical Design
Support Structure (back section)
Housing (back section)
Electrical Connector
Bottom Closeout Panel
THEMIS Instrument PDR
24
UCB, October 15-16, 2003
SST Mechanical Design
Support Structure (front section)
Housing (front section)
THEMIS Instrument PDR
25
UCB, October 15-16, 2003
SST Mechanical Design
Bi-Directional Fields-of-View
THEMIS Instrument PDR
26
UCB, October 15-16, 2003
SST Mechanical Design
Attenuator Actuation – OPEN position
Honeywell Switch
(extended-position)
Honeywell Switch
(compressed-position)
THEMIS Instrument PDR
NANOMUSCLE Actuator
(extended)
27
UCB, October 15-16, 2003
SST Mechanical Design
Attenuator Actuation – CLOSED position
Honeywell Switch
(compressed-position)
Honeywell Switch
(extended-position)
THEMIS Instrument PDR
NANOMUSCLE Actuator
(retracted)
28
UCB, October 15-16, 2003
SST Mechanical Design
Attenuator Control – OPEN position
SST Sensor
PCB
PCB
+5V
Open
Attenuator
+5V
R~5W
NANOMUSCLE
GND
Close
Attenuator
GND
SPDT Switch
Monitor
THEMIS Instrument PDR
Monitor
29
UCB, October 15-16, 2003
SST Mechanical Design
Attenuator Control – CLOSED position
SST Sensor
PCB
PCB
+5V
Open
Attenuator
+5V
R~5W
NANOMUSCLE
GND
Close
Attenuator
GND
SPDT Switch
Monitor
THEMIS Instrument PDR
Monitor
30
UCB, October 15-16, 2003
SST Mechanical Design
Attenuator Control – Switch Activation
Switch Roller during compressed-position
Switch
Toggle/Transition
Cam Radius
Switch Travel Length
Switch Roller during extended-position
Cam Rotation Angle
Note: Sketch NOT drawn to scale
THEMIS Instrument PDR
31
UCB, October 15-16, 2003
SST Mechanical Design
Linear Actuators
•
•
NANOMUSCLE Shaped Memory Alloy (SMA)
Single direction 125 gram pull-force
–
•
< 40 gram required force => F.S. > 3.0
Operating temp range: -70°C to +75°C
Extended Position
Relative Size
THEMIS Instrument PDR
Retracted Position
32
UCB, October 15-16, 2003
SST Mechanical Design
Position Switches
•
•
•
•
Honeywell miniature hermetically sealed switches
Single-Pole-Double-Throw circuitry
Operating temperature range: -65°C to +121°C
Exceeds MIL-S-8805 shock and vibration requirements
Roller
Extended Position
THEMIS Instrument PDR
Compressed Position
33
UCB, October 15-16, 2003
SST Mechanical Design
Sensor Orientation Relative to Spacecraft Bus
•
FOV is still being resolved
THEMIS Instrument PDR
34
UCB, October 15-16, 2003
SST Mechanical Design
Thermal Summary - Heat Transfer
Power Dissipation
•6 Amptek 225s = 72 mW per sensor.
•Steady state shadow temperature of -61 °C
Conduction
•Corner panel reaches –60 °C in long eclipse
•Isolated from corner panel with 1/8 inch G10 spacers.
Radiation
•All surfaces covered with low ε VDA tape
•Apertures and collimators dominate the heat leak
THEMIS Instrument PDR
35
UCB, October 15-16, 2003
SST Mechanical Design
Thermal Summary - Temperature Limits
Survival (°C)
Predictions
(°C)
Eclipse-Op
Science-Op
-65
-55
40
+65
Margin
(°C)
Cold
Hot
Cold
Hot
-61
35
4
5
•Steady state predictions from UCB based on corner panel temperatures from Swales
•Cold prediction from 3 hour eclipse orbit
•Hot prediction from hottest orbit and attitude
•Average operating temperature around 25 °C
•Better predictions await more complete instrument thermal models
THEMIS Instrument PDR
36
UCB, October 15-16, 2003
SST Mechanical Design
Temperature Monitoring and Control
•Modified Interface Monitoring
•Probe Bus will monitor the SST temperature on one of the SSTs
•Instrument Monitoring
•IDPU will process thermistors near the detectors
•Heaters
•No operational heaters are required
•Survival heaters will keep SST above Eclipse-Op limits
•Two heater services provided by the probe bus
•Primary service thermostat closes at –58
•Secondary service thermostat closes at -63
THEMIS Instrument PDR
37
UCB, October 15-16, 2003
SST Mechanical Design
Nitrogen Purge Connection
•
•
Nitrogen line is connected to SST purge fitting during pre-flight
operations to purge instrument interior
Gas supplied at 5 psig
–
Regulated and filtered to each detector stack at 1 liter/hour
THEMIS Instrument PDR
38
UCB, October 15-16, 2003
SST Mechanical Design
Electronics and Cabling
•
DAP Board
–
–
–
–
•
Located within IDPU
Type 6U card
Radiation shielded with 5mm of aluminum
Will be discussed in further detail in IDPU section
Harness
–
–
Approximate length of 1.2m
Composition:
–
–
–
THEMIS Instrument PDR
10 coaxial cables (36 AWG)
4 twisted wire pairs (26 AWG)
4 single wires (36 AWG)
39
UCB, October 15-16, 2003
SST Mechanical Design
Mass Summary
Sensors
Magnets
Yoke
Magnet and Yoke Cage
Foil Collimator (Electron)
Open Collimator (Ion)
Housing 20 mil
Bottom closeout 20 mil
Attenuator (1 axle/4 paddles/2 cams)
AFE board (loaded)
Amptek Shield Cover
Detector Stack
HM Switches
SMA actuator
18-8 SS Fasteners
Sensor Total:
0.8 gm/cm2
Cables:
7 Coax; 5 twisted pairs
Connectors
Cable Total:
44.0 gm/m
IDPU electronics
DAP board
Shield board
Edge Shielding
IDPU Total:
1.0 gm/cm2
0.1 gm/cm2
57.0 cm2
1.3 m
368.0 cm2
368.0 cm2
69.3 cm3
Total:
THEMIS Instrument PDR
Unit Mass
[g]
6.6
20.2
10.0
12.0
6.0
57.0
4.0
10.0
45.6
9.0
12.0
6.0
3.0
0.4
57.2
15.0
368.0
36.8
Units/SST
4
2
1
2
2
1
1
1
2
2
2
2
2
80
2
4
1
1
Mass [g]
# units
Total Mass
[g]
26.2
40.3
10.0
24.0
12.0
57.0
4.0
10.0
91.2
18.0
24.0
12.0
6.0
32.0
366.7
2
733.4
114.4
60.0
174.4
2
348.8
368.0
36.8
187.1
591.9
1
591.9
1674.1
40
UCB, October 15-16, 2003
SST Mechanical Design
Questions/Comments?
THEMIS Instrument PDR
41
UCB, October 15-16, 2003
Design Details
Design Details
Thomas Moreau
THEMIS Instrument PDR
42
UCB, October 15-16, 2003
Sensor Considerations
Detector system
•
Measure electrons and protons > 20 keV
Geometrical analysis
•
•
•
Collimator aperture
Solid state detector size
Thin foil
–
•
Magnet system
–
–
–
•
Stop protons < 350keV
Deflect electrons < 200 keV
Not to disturb particle trajectories out of the magnet gap
Low stray magnetic field at the position of the magnetometers
Attenuator System
–
–
Reduce count rate during high flux
Reduce radiation damage (especially to open side)
THEMIS Instrument PDR
43
UCB, October 15-16, 2003
Detector System
Detectors stacked in “Triplet” sequence:
•
•
•
•
Foil (F) | Thick (T) | Open (O)
Area used 1.0  0.5 cm2
Front detectors F and O are 300 m thick while
T is 600 m (with two detectors back to back)
Detectors associated with a system of
coincidence/anticoincidence logic
T O
FT O
FT  O
FT O
FT O
THEMIS Instrument PDR
F
44
UCB, October 15-16, 2003
Opto-Mechanical System
Most of stray light
from an out-offield source are
eliminated by a
proper design
Critical onebounce scatter
28
Section
view of the
wide
aperture
Section
view of the
narrow
aperture
48
THEMIS Instrument PDR
28
45
UCB, October 15-16, 2003
Collimator System
3D numerical model (GEANT3) of the collimator with detectors/foil
•
•
•
•
•
THEMIS Instrument PDR
46
Collimator baffle offers 48  28
rectangular full field-of-view
Tungsten knife-edges intercept
out-of-beam low-energy particles
and reduce scattered light
Aluminum housing shielding
(0.5 mm) stops normally incident
protons < 8 MeV and electrons
< 400 keV
Al:Si/Lexan/Al:Si three layer foil
(1449Å/3.877m/1353Å) absorbs
protons < 350 keV while
permitting electrons ~20 keV to
penetrate
Geometric factor ~ 0.11 cm2sr
UCB, October 15-16, 2003
Telescope Response
Monte-Carlo simulation
•
•
3D ray tracings
Angular response 37  22 FWHM
• Efficiency plots
for electron and proton
THEMIS Instrument PDR
47
UCB, October 15-16, 2003
Magnet System
Magnetic circuit design
•
•
•
Magnet gap
4 permanent magnets + 2 yokes
Two oppositely oriented dipoles
Stray fields < 10 nT at 1m distance
Permanent magnet
[Samarium-Cobalt 18 MGOe]
Magnetic flux density
Yoke
[Vacoflux 50 Iron-Cobalt alloy]
THEMIS Instrument PDR
48
UCB, October 15-16, 2003
Magnet System
Particle tracing simulations
THEMIS Instrument PDR
49
UCB, October 15-16, 2003
Electrical Design
Block Diagram
DFE–Analog Front End
•
•
•
•
•
(aka: AFE)
Functions: Preamp/Shaping
Schematics
Parts
Layout
Testing
DAP board (aka: ADC)
•
•
•
•
•
•
Functions: Baseline restoration, Peak detect, ADC, Logic
Schematics
Parts
Layout (currently incomplete)
Testing
Actel Specs
Power Estimates
THEMIS Instrument PDR
50
UCB, October 15-16, 2003
Electrical Systems
Ron Canario
THEMIS Instrument PDR
51
UCB, October 15-16, 2003
Electronics Block Diagram
Signal chain: 1 of 12 channels shown
Bias Voltage
Test Pulser
DAC
Thresh
Gain
PD
A225F
Preamp
Shaper
ADC
Memory
BLR
Det/Preamp
Board
THEMIS Instrument PDR
FPGA
Coincidence
Logic &
Accumulators
ADC/ACTEL Board
52
UCB, October 15-16, 2003
Detectors
Thin dead layer (PIPS like) detector
Fabricated by LBNL (PI: Craig Tindall)
THEMIS Instrument PDR
53
UCB, October 15-16, 2003
DFE Schematics
Analog Front End Schematic
THEMIS Instrument PDR
54
UCB, October 15-16, 2003
Preamps/Shaping
Using Amptek 225F (6pin sip Hybrid)
Characteristics:
•
•
•
•
•
~6 keV electronic noise (with 1.5 cm2 detector)
~2.5 uS shaping time (time to peak)
~12 mW at +5.0Volts
100 Krad (still needs ~3mm Al shield)
Operating range: -55 to +125 C
THEMIS Instrument PDR
55
UCB, October 15-16, 2003
DFE Layout
Preliminary board layout. (possibly
adequate for ETU)
•
•
•
A225Fs have 3.5 mm radiation
shielding
Caps/Resistors have ~0.5mm
shielding
Detectors located near Preamps
Detector Stack
Al shield
A225Fs
15 pin D
THEMIS Instrument PDR
56
UCB, October 15-16, 2003
SST Schematic
THEMIS Instrument PDR
57
UCB, October 15-16, 2003
DFE Schematic
THEMIS Instrument PDR
58
UCB, October 15-16, 2003
DAP Schematic
THEMIS Instrument PDR
59
UCB, October 15-16, 2003
ADC Schematic
THEMIS Instrument PDR
60
UCB, October 15-16, 2003
Quad Converter Schematic
THEMIS Instrument PDR
61
UCB, October 15-16, 2003
ADC Schematic
THEMIS Instrument PDR
62
UCB, October 15-16, 2003
Test Pulse Schematic
THEMIS Instrument PDR
63
UCB, October 15-16, 2003
Bias Supply Schematic
THEMIS Instrument PDR
64
UCB, October 15-16, 2003
Controller Schematic
THEMIS Instrument PDR
65
UCB, October 15-16, 2003
DAP Layout
ACTEL
Preliminary layout suggests the
SST/DAP board will fit on a 6U card
12 identical channels
THEMIS Instrument PDR
66
UCB, October 15-16, 2003
DFE Testing
Figure 4
AmpTek output
in response to a
much wider
input pulse
THEMIS Instrument PDR
67
UCB, October 15-16, 2003
DFE Testing
•
Split ground planes
Positive vs Neg A225F Out
1200
Positive Output (WP)
Negative Output (WP)
1000
Positive Output
Negative Output
Output (mv 0tp)
800
600
400
200
0
0
50
100
150
200
Input (mv 0tp)
THEMIS Instrument PDR
68
UCB, October 15-16, 2003
ACTEL Development
Noise measurements
Test Pulser control
ADC Readout
Data Binning
Coincidence
Data
Analog Housekeeping control
THEMIS Instrument PDR
69
UCB, October 15-16, 2003
SST GSE
Jim Lewis
THEMIS Instrument PDR
70
UCB, October 15-16, 2003
Power / Thermal / Mechanical
Power
•
•
Provide regulated voltages
Facilitate current measurements
Mechanical
•
•
•
•
6U VME support (without Wedge-locks)
Portable and Rugged for transport
Open rack for access while under test
Connectors are acceptable for flight interconnection
THEMIS Instrument PDR
71
UCB, October 15-16, 2003
Electrical Interface
Mechanical interface to signals
•
•
Before DCB & ETC, GSE connectors as defined for SST-toIDPU
Afterwards data is taken through DCB.
Analog Housekeeping
•
1 analog housekeeping output (shared backplane ANA HSK
signal)
Electrical Quality
•
GSE Interface circuitry must be flight grade
THEMIS Instrument PDR
72
UCB, October 15-16, 2003
Command and Telemetry Handling
Commands (to DCB)
•
•
•
•
Sends CDI 24-bit commands per ICD specification
User command interface in STOL
Reads STOL command files
Compatible format with IDPU GSE and MOC GSE
Commands (before DCB) are CDI
Telemetry
•
•
Before DCB & ETC, data is taken directly by GSE h/w
Afterwards data is extracted from packet telemetry.
THEMIS Instrument PDR
73
UCB, October 15-16, 2003
Data Manipulation
Input data or outputs from calculations can be displayed,
saved to disk, and/or plotted with library routines.
Plot data over user-defined energies and angle.
Convenient access to data for offline processing (FTP,
HTTP, etc.)
Supports “screen print” capability
THEMIS Instrument PDR
74
UCB, October 15-16, 2003
Errors and Responses
GSE software monitors serial instrument data stream for
missing or corrupted data. All detected anomalies are
logged, counted, and displayed in user interface.
THEMIS Instrument PDR
75
UCB, October 15-16, 2003
Mission Requirements
Compatibility with next level integration
•
•
Uses ITOS, LabWindows, C
PC standards (same platform through all mission phases)
THEMIS Instrument PDR
76
UCB, October 15-16, 2003
Testing and Calibration
•
•
•
GSE Devolopment
Vacuum Chamber Refurb
Ion Gun (Peabody Scientific)
THEMIS Instrument PDR
77
UCB, October 15-16, 2003
Vacuum chamber
Optional uplink to lab network
SST TM ENA
Electron
or ion gun
SST SectorClk
Multiport Ethernet Hub/Firewall
SST CLK
GSE
Interface
Board
SST
SST CMD
Manipulator
SST TLM
ANA HSK
LVPS
equivalent
PWR
3-axis servo
amplifier
New components
THEMIS Instrument PDR
Ethernet
GSE software: based
on Mike Hashii’s
STEREO GSE tools
ACS-Tech80
Servo control card
Manipulator/HVPS
control workstation
HVPS
GPIB via USB
RS232
GSE workstation
GPIB
Existing components
78
UCB, October 15-16, 2003
Contamination Control
Standard cleanliness procedures will be followed
The sensor units will have a dry Nitrogen purge system
and red tagged covers (removed at last possible
opportunity)
Nitrogen purge can be removed for transport (<24?
hours) with sensor in sealed containers.
Satellite manuevers should be done with attenuator in
the closed position.
THEMIS Instrument PDR
79
UCB, October 15-16, 2003
Vacuum Chamber Refurb
IG-2
Convectron -2
Ion Chamber
valve
Vacuum
chamber
Ion
chamber
Vent valve
Convectron -1
Roughing
valve
IG-1
Gate valve
Turbo
controller
Roughing
pump
Turbo
pump
Cryo pump
Backing
pump
ReGen valve
Compressor
THEMIS Instrument PDR
80
UCB, October 15-16, 2003
Vacuum Chamber refurb
9/11/2003
item
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
description
vendor
Cryo Pump
CTI
Cryo temp indicator
CTI
chamber gate valve
MDC
gate valve hardware
MDC
Turbo-V 301 Navigator
Varian
turbo air cooling kit
Varian
turbo inlet screen
Varian
SH-100 Scroll pump
Varian
exhaust silencer
Varian
scroll pump power cord
Varian
adapter nipple
MDC
reducing cross
MDC
Ion Chamber valve
MDC
roughing valve
MDC
vent valve
Varian
regen valve
MDC
vacuum gauge controller
Granville-Phillips
ion chamber rough gauge
Granville-Phillips
chamber rough gauge
Granville-Phillips
ion chamber ion gauge
Granville-Phillips
chamber ion gauge
Granville-Phillips
rough gauge cables
Granville-Phillips
ion gauge cable
Granville-Phillips
ion gauge cable
Granville-Phillips
misc.plumbing
cleaning chamber
Pullbrite(510 659-9770)
half nipple
Varian
in house fab
SSL shop
p/n
8160001sys
8043459G001
304005-05
190177
9698828
9699299
9699302
SH01001UNIV
SH0100EXSLR
656458203
832008
825043
306005
312029
9515085
310073
307502-C10-T1
275316
275316
27453
27453
303040-10
307046-CR
307046-CR
INH1000400
Total
THEMIS Instrument PDR
price($)
note
14200.00
Cryo-Torr 8 / 8200 Compressor System, complete
1372.00
Cryo head temp monitor
2825.00
8" port, 1-1/2" rough port, ANSI ASA6 flanges
74.00
hex head bolts for ASA6 flange
7280.25 complete system w/ controller, N2 250 L/s, 120VAC, ISO NW100
297.60
very convenient
76.60
2450.00
backing pump for turbo, 120VAC, 60Hz, oil-free
83.00
free
15A/125VAC, 6' length
225.00
ISO NW100 to ISO NW80 reducer
290.00
ISO NW80 to NW40 KF
1500.00
4" port manual swing gate valve, ISO NW100 flange
340.00
2-3/4" CCF, metal seal bonnet, manual
325.00
Rt angle valve, NW16 KF, manual
245.00
NW25 KF, metal seal bonnet, manual
2095.00
307, dual IG/rough gauge capability, IEEE 488
180.00
Convectron gauge(1), range atm to 8e-4 Torr, NW40 KF
180.00
Convectron gauge(2), range atm to 8e-4 Torr, NW40 KF
470.00
BA Nude IG(1), all metal case, NW40 KF
470.00
BA Nude IG(2), all metal case, NW40 KF
90.00
Dual Convectron cable, 10'
140.00
BA IG cable
140.00
BA IG cable
2000.00
fittings, rough lines, switches, etc.
750.00
soak, scrub, and electropolish
100.00
ISO NW100 weldable to chamber
1325.00
25 hr @ $53.00/ hr
39523.45
81
UCB, October 15-16, 2003
Ion Gun Specifications
10/6/2003
List of Specs
1
2
3
energy range
energy width
energy stability
1KeV to 50 KeV
0.5% over full range or 50eV, whichever is greater
1% over full range for 20 minutes
4
5
6
7
particle flux
beam cross section
beam flux stability
beam flux variation
1000 to 100000 particles/s/cm2
4 cm diameter
<2% for 20 minutes
<20% over cross section
8
9
10
11
12
13
14
species
mass resolution
system footprint
power requirement
cooling requirements
lead time
vacuum system req
H+, He+, Ne+, O+, N+, Ar+, (Kr+)
distinguish above species
not to exceed 9' x 4' (preference, not required)
120VAC
preferably air, but H2O OK
4 to 5 month
ability to interface to 250 l/s turbo pumping system
THEMIS Instrument PDR
82
UCB, October 15-16, 2003
Ion Gun Schematic
THEMIS Instrument PDR
83
UCB, October 15-16, 2003
Schedule
THEMIS Instrument PDR
84
UCB, October 15-16, 2003