Transcript 投影片 1 - Google Code

Lite-On Semiconductor Corp.
(
敦
南
科
技
)
LITE-ON GROUP
LITE-ON TECH CORP.
PC/ INTERNET PLATFORM,
COMM & SEMI BUSINESS
(LITE-ON ELEC. INC.)
(SILITEK CORP.)
(GVC CORP.)
LITE-ON IT. CORP.
LITE-ON SEMICONDUCTOR CORP.
DIODE INC.
LITE-ON GROUP
SINCE 1975
LITE-ON JAPAN
Chairman : Raymond Soong
LITE-ON AUTO. CORP.
LITE-ON ENCLOSURE INC
LITE-ON e Segment
LITE-ON INC.
INVESTMENT BUSINESS
& CULTURAL FOUNDATION
SILPORT INVEST. CORP.
DYNA INVEST. CO., LTD.
LITE-ON CULTURAL FOUNDATION.
敦南科技
LITE-ON Semiconductor Corp.
OUR VISION
TO BE A WORLD CLASS EXCELLENT COMPANY.
OUR MISSION
TO OFFER BEST QUALITY PRODUCTS
AND SERVICES TO MAINTAIN CORPORATE
GROWTH AND PROFITABILITY.
Brief of LITE-ON Semiconductor
Capital
: US$ 88.6M
資本額
Revenue
: US$ 194M (Y2003 consolidated)
營業額
Employee
: 3,919人 (up to Jul. 31, 2003)
Main Products : CIS,Cmos Camera Module, Diodes, Rectifiers,
Thyristors, Transistors
主要產品
接觸式影像感測器、Cmos 照相模組,二極體、整流器、閘流體、
電晶體
Facility
: Hisn-Tien, Taiwan (Image)
Cavite, Philippines (Image)
Wuxi,China(Image)
Keelung, Taiwan (Discrete)
Shanghai, China (SSEC & KaiHong, Discrete)
Human Resource of
LITE-ON Semi.


Wuxi
- LSC (650人)

Shanghai
- Seefull (1073 人)
- Kai Hong (605 人)
French

- DIC Sales Office (2 人)
Philippines
- Dyna Image (586 人)
TOT EMPLOYEE 3,919人
Missouri
- Fabtech (186人)
Taipei
- LSC (697 人)
- DII (47 人)



Westlake
- DIC (73人)
MAIN CUSTOMER LIST
TAIWAN
KOREA
JAPAN
Europe/America

BENQ
• SAMSUNG
• SHARP
• PHILIPS (AUSTRIA)

KIMPO (金寶)
• SINDO RICOH
• KME (PANASONIC)
• SAGEM (FRANCE)

LITEON TECH
• KBT (CMOS)
• MGCS(PANASONIC)
• HP
(SILITEK旭麗)
• MAXON (CMOS)
• SANYO
• ESSNET (SWEDEN)

TECO (東友)
• VOXSON(CMOS)
• RICOH
• REINER (GERMANY)

MUSTEK (鴻友)
• BROTHER
• ANATECH (America)

PLUSTEK (精益)
• KYOCERA MITA
• PAN (ITALY)

UMAX (CMOS)
• OKI
• VISIONEER

QUANTA (CMOS)
• MURATA
• RISO
(America)
• DOCUPORT
(Canada)
LITE-ON Semiconductor
Organization Chart
LITE-ON SEMICONDUCTOR CORP.
敦南科技股份有限公司
IMAGE SBG
影像事業群
CIS SBU
CIS 事業部
Wuxi Plant Phili. Plant
(無錫廠)
(菲律賓廠)
CCM SBU
CCM 事業部
Hsin-Tien
Plant
(新店廠)
Wuxi Plant Phili. Plant
(無錫廠)
(菲律賓廠)
Discrete SBU
分離式元件事業部
Hsin-Tien
Plant
(新店廠)
上海旭福廠
基隆廠
LITE-ON Semiconductor
Organization Chart
CMOS SBU
J.M. Lin
G.M.
Project
Management
Jacky Tsai
Sales & MKT
Project ENG.
Steven Cheng
Meadi Jeng
Process/Test
ENG.
Vincent Hsiao
Procurement
QRA
S. F. Chang
Fumio Chin
LITE-ON Semi. Corp.
, Phils. , China
Phils.
China
Founded
December 1995
December 2002
Location
Lot 1&2, Block 24, Phase No. 2, Chang Jiang S Rd.,
4, Peza Ecozone, Rosario, New District, Wuxi City
Cavite Phils.
Jiangsu, PRC.
Lot Area
10,000 sq. meters
227,600 sq. meters
Employees
Around 586
Around 650
Inside the Factory &
the Clean Room (100)
Roadmap of CMOS Camera Module
2.1 M module
RGB output
.18u; 1/2“;
10.5X10.5X7.77mm
1.3 M module
RGB output
.18u; 1/4“; 9X9X7mm
Camera
Module for
Mobile Phone
VGA module/YUV output
.35u; 1/4 ”;8.0X8.0X6.0mm
(2003-2004)
.25u; 1/4.5 “;
7.5X7.5X5.0mm
(2004-2005)
1.3 / 2.1 M
RGB/YUV
Interface: SPI / MMC
Camera
Module for
PDA
USB interface
PC Camera
SD interface
USB1.1
03
USB 2.0
04
05
06
Structure of CMOS Camera Module
COB TYPE:
Lens
Holder
Target thickness:
<6mm for VGA
<6mm for CIF
IR Filter
Components
Sensor
0.25mm
PCB
0.50mm
Patent Number :
92118123
Patent Date
07/02/2003
:
FPC
LSC total solution of CCM
L ens Detail
Resolutuon
Sensor
Chip
Size
L ens Spec
supplier
Size
Pixelplus
CIF
PO2010N
Pixelplus
PO3030N
M odule
Size( M in)
M ar co
Data For mat
Volt
L ens
Remar k
Size
Str uctur e
DVDD : 2.5V
1/7"
DS-050
NEWMAX
1/7"
1P
7.5*7.5*5.3
Bayer/YUV/RGB
AVDD : 2.5V
Digital IO : 1.8V - 2.8V
DVDD : 1.8V
1/6"
907A
LARGAN
1/6"
2P
6*6*4.5
Bayer/YUV/RGB
s ocket type
AVDD : 1.8V
available
Digital IO : 1.8V - 3.3V
DVDD : 1.8V
OV 7660
VGA
1/5"
923B LARGAN
1/5"
3P
6.5*6.5*5
Bayer/YUV/RGB
AVDD : 2.5V
Digtial IO : 2.5V - 3.3V
Hynix
HV7131GP
Hynix
HV7131RP
Mircon
Pixelplus
PO3130K
1/4"
1/4.5"
1/4"
DS055B
NEWMAX
DS055B
NEWMAX
GS8228A
GENIUS
1/4"
2P
8*8*5.3
Bayer/YUV/RGB
1/4"
2P
8*8*5.3
Bayer/YUV/RGB
1/4"
1G2P
8*10*5.75
Bayer/YUV/RGB
DVDD : 2.8V
AVDD : 2.8V
DVDD : 2.8V
AVDD : 2.8V
DVDD : 2.8V
AVDD : 2.8V
DVDD : 1.8V
1/3.2"
KT30370CJL
KANTO
1/4"
3P
9*9*6.6
Bayer/YUV/RGB
AVDD : 1.8V
Digital IO : 1.8V - 3.3V
DVDD : 1.8V
OV 9650
1/4"
KT30370CJL
KANTO
1/4"
3P
9*9*6.6
Bayer/YUV/RGB
AVDD : 2.5V
s ocket type
9*9*6.9
Digital IO : 2.5V - 3.3V
SXGA(1.3M)
DVDD : 2.8V
Mircon
MT9M011
Mircon
MT9M111
1/3"
924B LARGAN
1/3"
1G2P
9.5*9.5.6.6
Bayer
AVDD : 2.8V
Digital IO : 1.8V - 2.8V
DVDD : 2.8V
1/3"
924B LARGAN
1/3"
1G2P
9.5*9.5*6.6
Bayer/YUV/RGB
AVDD : 2.8V
Digital IO : 1.8V - 2.8V
10*10*6.9
available
LSC total solution of CCM
L ens Detail
Resolutuon
Sensor
Chip
Size
supplier
L ens Spec
Size
Str uctur e
M odule
Size( M in)
Zoran
ZR32316
UXGA(2.0M)
Pixelplus
Siliconfile
noon200pc10
M ar co
Data For mat
Volt
Size
1/2.7"
DSL951 SUNEX
1/2.7"
3P
10.5*10.5*7.8
Bayer
1/3"
SHOWIN
1/3"
1G2P
9*9*7.7
Bayer/YUV/RGB
DVDD : 3.3V
AVDD : 3.3V
DVDD :
AVDD :
DVDD : 1.8V
1/3"
SHOWIN
1/3"
1G2P
9*9*7.7
L ens
Bayer/YUV/RGB
AVDD : 2.8V
Digital IO : 2.8V
Remar k
COB vs. CSP
COST Comparison
CSP Fabrication
COB
SMT
Chip Test
PCB + FPC Holder
IR Filter
COB in LSC
X
O
X
X
O
O
CSP
O
X
O
O
O
O
(Blue Glass)
Testing Labor O/H
Lens
O
O
O
O
Benefit of Socket solution
 Shortening the Lead time of Camera module
 Reducing the cost (w/o FPC, higher Yield rate)
 Simplifying the production process of Module maker and
customer (easier replace and test )
 Standardizing the connector spec of camera module