Transcript Foundry Certified Cadence DFM Turnkey Service Signoff Seminar

Foundry Certified Cadence DFM
Turnkey Service
Signoff Seminar November 2013
Rudy Mason- Senior Staff Application Engineer – VCAD
Background
• Litho Process Check (LPC) is required for TSMC 28nm
process nodes and below and is recommended at larger
process nodes
• Chemical Mechanical Polishing check (VCMP) is
recommended for TSMC 45nm, 40nm and 28nm process
nodes
• Cadence DFM Service is customized to the customer’s
needs and scheduled to provide fastest turn-around for
LPC or VCMP checks. Analysis can be performed on
– Early design data
– Close to tapeout design data
– Final tapeout data
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DFM Introduction
DRC clean is not sufficient
Litho
• Litho process check (LPC)
– Problem: Some DRC-clean layouts do not print on silicon
– Solution: Must-have litho hotspot detection and fixing
of design with foundry-certified tools
– TSMC certified tool: Litho Physical Analyzer
• Chemical-Mechanical Polishing (CMP)
– Problem: Copper erodes during CMP step
and leads to yield loss and reliability issues
– Solution: Must-have CMP hotspot detection
and fixing using foundry-certified tools
– TSMC certified tool: Cadence CMP Predictor
CMP
Oxide Loss
Isolated
Thin-Lines
Dishing
Isolated
Wide-Lines
Total Copper Loss
Dense Array
Thin-Lines
Dense Array
Wide-Lines
Foundries demand that new DFM verification standards are met
by the customer prior to agreeing to manufacture
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Cadence LPC Service (Litho Process Check)
• Cadence will analyze customer’s GDSII database with production
proven Litho Physical Analyzer (LPA) software to ensure layout meets
TSMC’s DFM requirements for Lithography Process Check
– Customer data must be DRC clean
• Cadence LPA is qualified by TSMC to simulate the actual resist shapes
created at each photo step on all critical mask layers
– LPA is TSMC's golden engine for 40nm and 28nm
– LPA has been the first to qualify at TSMC 65-28nm nodes,
– LPA is used in the TSMC ISF flows
• Hotspots identified by LPA like pinch and bridge patterns may pass
DRCs, but are known to pose yield issues that can be avoided
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Cadence CMP Service
• Cadence will analyze customer’s GDSII data base with
production proven Cadence CMP Predictor (CCP) software
to ensure layout meets all TSMC’s DFM requirements for
VCMP check.
– CCP simulates the interconnect copper thickness over customer’s
layout.
• Cadence CMP Predictor tool is qualified by TSMC and uses
the latest available DDKs (DFM Data Kits) and engines to
simulate TSMC’s CMP process
• Hotspot locations that will not meet required thickness
control specifications are detected and fed back to the
customer to improve the layout
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Benefits of Cadence DFM Services
• Sign-off analysis compliance: ensures compliance to TSMC DFM
checking mandate
• Lowest total cost of ownership: No investment in software tools, multiCPU infrastructure and learning of new tools
• Efficient access: provides priority turnkey access to TSMC Golden DFM
analysis both prior to and at tape-out
• Reduced schedule risk: allows the customer to verify DFM compliance
early with an Initial Top Level GDSII run
• Optimal time-to-results: harnesses 50-100 dedicated CPUs/run in our
server farm for fast turn-around time
• Security: leverages a highly reliable and state-of-the-art IT and security
infrastructure which ensures protection from unauthorized access.
• Leverage Cadence expertise: leverages team with many man years of
experience and combined resources of Cadence Design Services and R&D
• Low risk learning experience: provides a learning experience for
designers to understand DFM while designing with advanced process nodes
• Automated repair: Output report enables automated fixing of LPC hotspots
in Cadence Encounter or Virtuoso implementation flows
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LPC Service Solution
• Customer provides Initial Top Level GDSII database
• Cadence performs LPA analysis to meet TSMC’s LPC
requirements
• Deliverables
LPC Output:
– Hotspot locations and level of severity reported after each run with
guidelines for modifying layout to remove the highest priority yield
detractors.
– Output files enable auto fixing with Cadence Encounter or Virtuoso
implementation flows
– Comprehensive report file for the foundry
Consultation as needed to fix the yield detractors
• The Updated Top Level GDSII database with “fixes” will be
run again to confirm LPC DFM compliance
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© 2013 Cadence Design Systems, Inc. All rights reserved.
CMP Service Solution
• Customer provides Initial Top Level GDSII database
• Cadence performs CMP analysis to meet TSMC CMP
requirements
• Deliverables
CMP Output:
– Metal density distribution (heat map) and histogram chart
– Metal thickness distribution (heat map) and histogram chart
– Hotspot locations with type of errors
Consultation as needed to fix the yield detractors
• The Updated Top Level GDSII database with “fixes” will be
run again to confirm CMP DFM compliance
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Customer Provided Data
• Customer provides GDSII/OASIS input for each
DFM Analysis
– FTP compressed, encrypted GDSII/OASIS to a secure
Cadence drop-box (Data should be DRC clean with
respective log information)
– Identification of all technology information, process
options, and CAD layers should be included
• Required GDSII layers
– LPC: OD, PO, CO, M1, VIAx and all Mx
– CMP: M1, all Mx, My, Mz, Mr
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© 2013 Cadence Design Systems, Inc. All rights reserved.
Summary
• Cadence’s provides end-to-end TSMC certified DFM signoff analysis which ensures compliance to TSMC’s DFM
recommendation
• Over 75 DFM runs completed so far
• Offers a secure and risk-free alternative to in-house DFM
signoff and complements efficiently in-Design DFM Analysis
• Cadence provides expertise leveraging TSMC certified
tools, methodologies, processes and use models to provide
the fastest turnaround time
• Can be combined with In-Design tool solution for block
screening
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