Transcript Who are Semelab plc - Aerospace Wales Forum

Who are Semelab plc ?
• Based at Lutterworth, Leics.
• Privately-Owned UK Company
• Established 35 years
• Grown year -on- year
• Profitable every year
• Own diffusion fab – Semefab
• Based in Glenrothes, Scotland
• Acquired 15 years ago
• Key focus – Mixed-signal A.S. I.C.s
• MEMS & NanoMems
• In house die supply
Today solutions:World wide producers are designing the next generation of commercial airliners
Boeing 787 Dream liner and Airbus A380 & A350 Tupolev TU334, Sukholi Superjet 100
Typical these are designed to have a 20 % reduction in
fuel consumption and subsequent emissions, while
offering exceptional noise reduction while in flight
This is achieved by the extensive use of the following:-
• Composite bodies
•
•
•
•
over 50% saving in the use of aluminium
Power electronic cooling system
Electronic braking rather than hydraulic
HID/ LED lighting
Advance Electronic Flight control and wing surfaces
All items marked in red supplied by Semelab
M.O.E.T
More Open Electrical Technology
A European commission led program to develop
the next generation of electric aircraft
Main partners:•Airbus
•Goodrich
•Safran Group
•Leibherr
•Rolls Royce
•Semelab
P.O.A
E.T.R.A.S
Power Optimised Aircraft
Electrical reverse thrust actuation system
Semelab working with Hispano Suiza, Messier Bugatti and Sagem
To develop the next generation of flight control systems
“Tomorrows aircraft will based more on electronic systems offering more
reliability affordable and cleaner aircraft”
Alain Coutrot Vice president Research and technology Safran Group
Typical Products being built and supplied now by
Semelab PLC
for the future aircraft use
Power modules for the following applications:• Flight surface actuation modules
• Rudder control
• Slats controllers
• Aeriolons controls
• Engine reverse thrust module
• Advanced de-icing controllers
• Wheel antilock braking systems
Advanced Flight module
A380 Rudder control
3 phase input rectifier
A380 I.G.B.T Module For flight
actuation systems:•300 Amp
•1200 Volts
•3000 temp Cycles –50ºC - 150 ºC
Semelab have optimise
standard plastic module for
aircraft use in order to
achieve the following:• Low weight typical 66% of the weight
of conventional modules
• Enhanced performance designed to
last for a 25 year aircraft life
• Typically survives 2500
temperature cycles from -50 C +150 Deg C
Typical constructions consist of:• Lightweight metal matrix base
plate
•CTE of 7 p.p.m
• A.M.B substrates
•CTE of 6 p.p.m
•State of the art die
•CTE of 4.5 p.p.m
•Custom die coats and encapsulates
It can be see that our structure as a
very closely match vertical C.T.E
structure and hence the stress in the
module is kept to a minimum.
In Flight Comfort
State of the art electronics offer better air conditioning
approx 20 % improvement on air circulation time
While building on Semelab world beating “D” Class
Amplifiers, Anti noise system will be developed to ensure a
more comfortable and relaxing flight
Please note the anti noise
system could also be
used in Industrial or
office based systems
The same technology can also be used provide high
efficiency power supplies in aircraft for your laptop Ipod
or PDA
Hermetic packages for the future
Typical module construction for today’s application:• Copper or copper base plate
• Kovar ring frame
• ALN substrate
• Expensive glass or ceramic - metal seals
Typical application:• Rocket steering thrust vectors
• Oil feed drill steering
• Engine vane control
Antle Engine
Turbine Vane ACTUATOR
Designed to increase fuel efficiency by 10%
SI3N4 Via connectivity
“state of the art” packaging
•
•
•
Removal of glass/ceramic seals – Hermeticity
Minimised number of wirebonds – Reliability
Size/Weight reduction – Efficiency
FEATURES :
•
•
•
•
•
•
AMB (active metal brazed)
Hermetic Substrate Package
Copper conductors
Si3N4 Insulator
No glass/ceramic seals
Comparable thermal resistance to AlN
•
Production Alumina DBC (Cu metallization)
–
500(max) temp cycles -55°C to 125°C expected before conchoidal fractures appear
»
•
(Source: Semelab Plc)
Production AlN AMB (with Al metallization)
–
2000 temp cycles passed -55°C to 125°C without fracture or delamination
(Source: Semelab Plc)
•
AMB Silicon Nitride (Cu metallization)
–
–
5000 temp cycles passed -60°C to 175°C without fracture or delamination
2000 temp cycles passed -65°C to 150°C without hermiticity failure
(Source: Kyocera Corp
Semelab parts under qualification)
• Alumina DBC package (no baseplate)
– 0.3/0.635/0.3mm Cu/Al2O3/Cu
– 1.24 °C/W
• AlN AMB package (no baseplate)
– 0.3/0.635/0.3mm Al/AlN/Al
– 0.42 °C/W
• Si3N4 package (integrated baseplate)
– 0.3/0.32/0.3/0.3/0.635/0.3mm Cu/Si3N4/Cu/Cu/Si3N4/Cu
– 0.76 °C/W
Rth1-2(deg.C/W)
Thermal Characteristicsof Si3N4 against AlN
0.70
Si3N4(0.635t)
0.65
0.60
0.55
0.50
OK
Si3N4(0.32t)
AlN(0.635t)
AlN Crack!
0.45
0.40
0
0.1
0.2
0.3
0.4
0.5
Copper Thcikness (mm) (per Side)
0.6
Typical use of Si3N4 Packages
Radiation tolerant Mosfet bridge with steering elements
And protection circuitryPrograms For space Altika and YAHsat satellites
• 150 Krad total dose
• Good safe operating area up to 59 LET (MeV)
Full radiation specification available on request
Si3N4 Substrate combined
With
Conventional technology
The use of Si3N4 offers:• Low weight
•Thermally efficiency
•Increased current density
•Vibration resistance
Fully authorised Aircraft wheel braking system
NEW DESIGN FOR OPTIMISED THERMAL PERFORMANCE
die
solder
copper
Aluminium nitride
Copper
solder
MMC Base
plate
Heat sink
compound
Copper or Aluminium
Heat sink
die
solder
copper
die
solder
Aluminium nitride
copper
Copper
Aluminium nitride
solder
Copper
MMC Heat sink (2) - Now
Impingement cooler (3)
solder
die
solder
copper
SILICON CARBIDE
Future Advanced (4)
- 3 years
DESIGN CONCEPTS TO ACHIEVE THERMAL PERFORMANCE AND RELIABILITY
MEDIUM RISK - Impingement cooling
• Total Pressure drop 13221 Pa (1.92 PSI)
• Temperature rise ≤ 3.5 °C
Thank You