Transcript The CAD Library of the Future

The CAD Library
of the Future
PCB Designerens kunnskaper
om hvordan man skal bygge et
CAD biblioteks komponenter,
er nøklen til å automatisere all
elektronikk produktutvikling
sett i et framtidig perspektiv. .
Presentert av:
Transidé AS
Jan-Erik Johansen
DNU 07. 09.07
på vegne av
Tom Hausherr
Director of Technology
PCB Libraries, Inc.
[email protected]
INTRODUKSJON
Elektroniske komponenter krever at det
er loddepader i PCB Layout.
Loddepader kan kategoriseres i to
kategorier…..
1. Møte industri standard vilkår for å
kunne automatisere produksjonen.
2. Mislykkes i å møte industri standard
vilkår og skape kaos i produksjonen.
INTRODUKSJON
Framtidens CAD Bibliotek vil være et “One
World Standard Library” som er et
akseptert grunnlag for utforming,
bygget på erfaring fra elektronikkindustrien,
hvor trend og muligheter er hentet fra alle
sektorer som kretsdesign, PCB Design
produksjon og montasje sett i sin helhet
som prosess.
De følgende sider illustrerer hva som er
nødvendig for å oppnå dette.Men først, la
oss se hvilke nøkkelorganisasjoner som er
involvert for å oppnå standardiseringen.
STANDARDS ORGANIZATIONS
World
Standard
CAD
Library
LAND PATTERN
NAMING CONVENTION
Family
SO
SOP
SSOP
TSOP
TSSOP
Pitch
1.27
0.65
0.50
0.65
0.50
P
Lead Span
7.10
7.10
7.10
7.10
7.10
L
Pin Qty
14
14
14
14
14
Note: An Odd
Pin Qty =
Thermal Tab
in Center
LAND PATTERN NAMING CONVENTION
SOP = Small Outline Package
T = Thin or component height 1.6mm or smaller
S = Shrink or pin pitch less than 0.625mm
Pitch = Two places past both sides of the
decimal point followed by a “P” (50P = 0.50mm)
Lead Span = Two places past both sides of the
decimal point followed by a “X” (710 = 7.10mm)
Height = Two places past both sides of the
decimal point followed by a “-” (120- = 1.20mm)
Naming Convention for Gull Wing Lead Parts:
Thin + Shrink + Family + Pitch + Lead Span X
Height - Pin Qty + Environment Level (L, N or M)
Example: TSSOP50P710X120-14N
JEDEC Component Lead Forms
SOLDER JOINT TOLERANCE
Component Lead Space Tolerance
Solder Joint Tolerance er den innvendige
dimensjon mellom komponent terminalene.
Normalt representert av “S” symbol. Brukes til å
kalkulere “HEEL” i loddeforbindelsen.
S
S
S
SOLDER JOINT TOLERANCE
Land Pattern Pad Length Tolerance “G”
dimensjon brukes for å kalkulere minimum
og maximum innside avstand mellom lodde
pad. “Z” dimensjon brukes for å kalkulere
minimum og maximum utside avstand
mellom lodde pad.
G
HEEL
TOE
G Z
SIDE
Z
SOLDER JOINT ANALYSIS
Solder Joint Toe, Heel and Side Goal
Tabellen under viser et eksempel på Gull Wing
komponent “Solder Joint Goal”
SOLDER JOINT ANALYSIS
The illustration below provides a graphical
representation of the Gull Wing component
lead to calculate the Toe, Heel and Side
minimum and maximum values
SOLDER JOINT ANALYSIS
Solder Joint / Land Protrusion
Produksjonstoleranse



Fabrikasjons toleranse
Montasje toleranse
Komponent terminal tolerances
Målsettinger for
loddeforbindelser
ZERO COMPONENT
ORIENTATION


The Component Zero Orientation relates to
the Pick & Place machine tape and reel and
component tubes. The rotation of the actual
component in the tube or tape & reel is
referred to as the Zero Orientation for the
CAD Library part and how it should be built in
the CAD library. All CAD Library parts should
be built in the CAD system in the same
rotation that the component is packaged in
the tape and reel or assembly feeder tube.
The JEDEC JEP95 & EIAJ 481 are the industry
guidelines for component packaging
information and Component Zero Orientation.
ZERO COMPONENT
ORIENTATION
1
1) Chip Capacitors, Resistors and Inductors – Pin 1 on Left
2) Molded Capacitors, Resistors and Inductors – Pin 1 (Positive or
Cathode) on Left
3) MELF Resistors and Diodes – Pin 1 (Positive or Cathode) on Left
4) SOT Devices (SOT23, SOT223, SOT89, SOT143) – Upper Left
5) TO252 & TO263 (DPAK Type) Devices – Upper Left
6) Small Outline Gullwing ICs (SOIC, SOP, TSOP, SSOP) – Upper Left
7) Ceramic Flat Packs (CFP) – Pin 1 Upper Left
8) Small Outline J Lead ICs (SOJ) – Pin 1 Upper Left
9) Quad Flat Pack ICs (PQFP, SQFP) – Pin 1 Upper Left
10) Ceramic Quad Flat Packs (CQFP) – Pin 1 Upper Left
11) Bumper Quad Flat Pack ICs (BQFP) – Pin 1 Top Center
12) Plastic Leaded Chip Carriers (PLCC) – Pin 1 Top Center
13) Leadless Chip Carriers (LCC) – Pin 1 Top Center
14) Quad Flat No-Lead ICs (QFN) – Pin 1 Upper Left
15) Ball Grid Arrays (BGA) – Pin A1 Upper Left
2
LAND PATTERN ORIGIN
PAD mønstrets origo er komponentens
“Center of Gravity” i de fleste tilfeller
sentret av biblioteksfiguren. Et eksempel
hvor det ikke er tilfelle er DPAK eller TO252 komponent.
PLACEMENT COURTYARD
Den primære bruk av “placement courtyard” er å gi
PCB designer retningslinjer for å plassere komponentens pader slik at komponenter kan plasseres
ved siden av hverandre med nok plass til å
kompensere for komponentens toleranser.
LAND PATTERN COURTYARD
DETERMINATION
SILKSCREEN OUTLINE
 Silkscreen outlines are used for cosmetic purposes
only and are really not required by manufacturing.
 The silkscreen can be drawn by the PCB designer
very complex to illustrate their creative talent or very
simple. In the end, it really doesn’t matter because you
can only see it when the physical PC board passes
between the fabrication facilities to the assembly shop.
Once the parts are assembled, all the silkscreen
outlines are covered up and cannot be seen.
 When PCB designers start to use all the principles
discussed in this outline, the manufacturing assembly
process can be fully automated and silkscreen
component outlines will not be required.
SILKSCREEN POLARITY
MARKINGS
 The term Polarity Marking came from its use to
identify the Positive Pin on a “Polarized” capacitor.
But polarity marking is also used on Diodes to
indicate the Cathode Pin.
 Polarity Markings are also used when there is a
potential for inverting the part placement in the
assembly process that would result in a malfunction
of the component.
MELF DIODE
OSCILLATOR
CAPACITOR
ASSEMBLY OUTLINE
The assembly drawing outline should represent the
maximum outline of the component body. Unlike the
silkscreen outline which has to be created to avoid
solder pads (a fake component outline); the assembly
outline only gets placed on an assembly drawing that
goes to the assembly shop.
Here is some sample assembly drawing component
outlines in relationship to the solder pad
ASSEMBLY POLARITY
The assembly Polarity Marking is
sometimes totally different than the
silkscreen Polarity Marking because the
silkscreen must avoid touching the
component solder pad
SMT PADSTACKS
En overflatekomponents padstack består av
loddepad, loddemaske og pastamaske. Vi har
tidligere sett på hvordan vi konstruerer en
loddepad. I utgangspunktet er loddemasken
og pastamasken lik loddepaden.
Solder Mask – Man kan tillate mønsterkortprodusenten til å øke maskens størrelse til
den teknologi fabrikanten bruker for å kunne
garantere at det ikke kommer lakk på padene.
 Solder Paste – Man kan tillate at stensil blir
laget I samsvar med montasjebedriftens krav
til størrelse og utforming for å oppnå optimal
loddeprosess.

THROUGH HOLE PADSTACKS
Typisk padstack for hullmonterte
komponenter:
 Primary Side Solder Mask
 Primary Side Pad
 Inner Layer Pad
 Plane Anti-pad
 Plane Thermal Relief
 Secondary Side Pad
 Secondary Side Solder Mask
 Drilled Hole
3D COMPONENT OUTLINE
Every CAD tool has a different approach to
handling 3D Models of component data.
Some are much more elaborate than others.
The CAD Library of the Future will have 3D
Model attributes built into every land pattern
to use as a mechanical drafting aid for the
reduction of errors in product packaging.
3D COMPONENT OUTLINE
This is sample 3D
model of a PCB
design imported
into Solidworks.
This will
increasingly
become more
popular as
technology
expands its limits
IPC-7351 3-Tier LIBRARY SYSTEM

Three land pattern geometry variations are supplied for each of the device
families; maximum land protrusion (Density Level A), median land protrusion
(Density Level B) and minimum land protrusion (Density Level C).

Density Level A: Maximum (Most) Land Protrusion – For low-density product
applications, the 'maximum' land pattern condition has been developed to
accommodate wave or flow solder of leadless chip devices and leaded gull- wing
devices. The geometry furnished for these devices, as well as inward and “J”formed lead contact device families, may provide a wider process window for
reflow solder processes as well.

Density Level B: Median (Nominal) Land Protrusion – Products with a moderate
level of component density may consider adapting the 'median' land pattern
geometry. The median land patterns furnished for all device families will provide
a robust solder attachment condition for reflow solder processes and should
provide a condition suitable for wave or reflow soldering of leadless chip and
leaded gull-wing type devices.

Density Level C: Minimum (Least) Land Protrusion – High component density
typical of portable and hand-held product applications may consider the
'minimum' land pattern geometry variation. Selection of the minimum land
pattern geometry may not be suitable for all product use categories. The use of
classes of performance (1, 2, and 3) is combined with that of component density
levels (A, B, and C) in explaining the condition of an electronic assembly. As an
example, combining the description as Levels 1A or 3B or 2C, would indicate the
different combinations of performance and component density to aid in
understanding the environment and the manufacturing requirements of a
particular assembly.
IPC-7351 3-Tier
LIBRARY SYSTEM
IPC-7351 Libraries
PCB Libraries builds all “IPC-7351 Standard SMT Library
Parts”, in many different CAD formats. One of PCB
Libraries goals is to build every standard part in the
world and offer it on www.PCBLibraries.com eventually
to every CAD Tool via IPC-2581 format.
Here is a list of Standard IPC-7351 SMT parts:
• BGA
• QFP
• SQFP
• TQFP
• SOIC
• SOP
• TSOP
•TSSOP
• QFN
• SOJ
• PLCC
• SOT
• MELF
• LCC
• CFP
• CQFP
• Chip Resistor, Capacitor and Inductor
• Aluminum Electrolytic Capacitors
• Tantalum Capacitor
• Molded Inductor
• Wire Wound Inductor
• Molded Resistor, Diode
• TO Packages
• Oscillators and Chip Array’s
IPC-2581
NEUTRAL CAD FORMAT
A neutral CAD database format has always been a known
fact to support electronic product design and development
and failure to create and accept a neutral CAD database
format has stifled the automation process.
The IPC-2581 neutral CAD database format will fulfill a 30
year search for a universal acceptable format. This one
single aspect can greatly accelerate the process of all
electronic product development because it is the common
language between all machines: The CAD system, the
fabrication equipment and the assembly equipment.
The IPC-2581 provides component manufacturers a solution
to build their own CAD land patterns using a single intelligent
database format that can be imported into every CAD tool.
TRANSITIONING TO THE
METRIC SYSTEM
The United States is now the only industrialized
country in the world that does not use the
metric system as its predominant system of
measurement.
All the World Standard Groups involved in the
electronics industry (IPC, IEC, NIST, JEDEC,
EIA & JEITA) have made the transition to the
metric measurement system. They formed an
alliance to stop using English units and all
the data they publish is in metric units.
TRANSITIONING TO THE
METRIC SYSTEM
The current effort toward national
metrication is based on the conclusion
that industrial and commercial
productivity, mathematics and science
education, and the competitiveness of
American products and services in
world markets, will be enhanced by
completing the change to the metric
system of units. Failure to complete the
change will increasingly handicap the
Nation's industry and economy.
TRANSITIONING TO THE
METRIC SYSTEM
The “CAD Library of
the Future” will be
built in metric units
PCB Library for IPC 7351A selges av oss, ta kontakt for demo,
evalueringslisens og levering
Nedre vei 8, Horten Industripark
Postboks 368, N-3193 Horten
Telefon: +47 33035311
Direkte linjer:
Jan-Erik Johansen 33035314, 91735314
EMail:[email protected]
www.transide.no