Transcript Metal Injection Molded Photonic Device Packaging

Metal Injection Molded
Photonic Device Packaging
Rob Linke
MIMforms LLC
Rob Linke, MIMforms LLC - Slide 1
Outline
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Metal injection molding defined
Manufacturing process
Materials for photonics packaging
Benefits of metal injection molding
Future directions
Conclusions and resources
Rob Linke, MIMforms LLC - Slide 2
What is MIM?
Rob Linke, MIMforms LLC - Slide 3
Metal Injection Molding
 Utilizes wealth of technology developed for
plastic injection molding
 Injection molding of metal powder
compounded with binder (plastic/wax)
 Debinding of component (solvent or thermal)
 Sintering of part to final density
Rob Linke, MIMforms LLC - Slide 4
Manufacturing Process
 Design of Component
 Tooling of Mold
 Injection Molding
 Debinding
 Sintering
 Optional CNC Machining
 Finishing/Plating
Rob Linke, MIMforms LLC - Slide 5
Compounding
 Components
 Metal powder
 Wax
 Polymers
 Goals
 Sufficient binder
to fill all voids
 Uniform mixture
Metal powder at 100x
D50 : 2-10 µm
Rob Linke, MIMforms LLC - Slide 6
Injection Molding
 Virtually identical to plastic
injection molding
 “Feedstock” is molded at low
temperatures (150oC) with
consistency of toothpaste
 Consists of metal powder in
binder matrix (~ 40% binder
by volume)
 Yields “green” part
Rob Linke, MIMforms LLC - Slide 7
Debinding
 Binder removal from matrix
(disposable component)
 Solvent – water or other solvent
 Thermal decomposition
 Results in structurally weak
component with small amount
of binder remaining
Rob Linke, MIMforms LLC - Slide 8
Sintering
 Sintering densification
increases the atomic
bonds between particles
 Temperature is near
melting point
 Density of up to 98.5%
 Real world example –
ice cubes sticking
together in freezer
Sintering Furnace
Rob Linke, MIMforms LLC - Slide 9
Shrinkage in Sintering
 Green part typically
shrinks 15% during
sintering
 Density increases
 Strength increases
 Final mechanical
properties attained
Rob Linke, MIMforms LLC - Slide 10
Post-Sintering Structure
3000x Magnification
Rob Linke, MIMforms LLC - Slide 11
CNC Machining and Plating
MIM tolerances
 +/- 0.5%
 For features <4.0 mm it is
+/- 0.02 mm
CNC tolerances
 +/- 15 µm
Plating
 Gold
 Nickel
 Other
Rob Linke, MIMforms LLC - Slide 12
MIM Materials: Kovar®
Photonic and optoelectronics packages
which match CTE of borosilicate glass
29% W, 17% Co, 53% Fe
Properties
 CTE (30-400oC) 4.4-5.2 ppm/ oC
 Density – 7.95 g/cm3
 % Density – 97%
Rob Linke, MIMforms LLC - Slide 13
MIM Materials: Iron-Nickel
Photonic and optoelectronics packages
50% Fe, 50% Ni
 Properties
 CTE – 8.8 ppm/ oC
 Density – 7.75 g/cm3
 % Density - 95%
Rob Linke, MIMforms LLC - Slide 14
MIM Materials:
Tungsten-Copper
Heatsinks for photonic housings which
mirror CTE of borosilicate glass
80%W, 20% Cu as Example
 Properties
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CTE – 7.4 ppm/ oC at 50oC
Themal Conductivity – 189 W/m K
Density – 14.89 g/cm3
% Density - 95%
Rob Linke, MIMforms LLC - Slide 15
Tungsten Copper Structures
Infiltrated
Tungsten skeleton
with liquid Copper
Vacuum Sintered
Tungsten-Copper
powder
Rob Linke, MIMforms LLC - Slide 16
Why use MIM?
 Reduce or eliminate
individual CNC machining
 Reduce material waste
 Enable mass production of
intricate, highly detailed
structures
 Reduce total cost
Kovar Lens
Holder
Rob Linke, MIMforms LLC - Slide 17
Machine Once or Many?
 Each part is machined
to final shape
individually
MIM
 The mold is machined
once and parts are
molded to final shape
CNC
MIM
package cost ►
CNC machining
production volume ►
Rob Linke, MIMforms LLC - Slide 18
Shape Complexity
 Each detail adds to
cost (and time)
MIM
 Details are machined
into the mold – once
 Reproduced in each
package during
molding
CNC
MIM
package cost ►
CNC machining
shape complexity ►
Rob Linke, MIMforms LLC - Slide 19
Material Waste Reduction
 CNC removes large
amounts of metal to
yield housing
 MIM uses only metal
necessary
 75% waste
reduction typical
 Runners, gates can
be recycled on-site
Material waste with
CNC Machining
Rob Linke, MIMforms LLC - Slide 20
Future Directions
 Complex designs specifically
for MIM manufacturing
 Custom MIM alloys/mixtures
 Higher dimensional tolerance
MIM components
 Increasing adoption of MIM
package use in North America
Rob Linke, MIMforms LLC - Slide 21
Conclusions
MIM can be an enabling technology for
photonic and optoelectronic packaging
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Mass production
Low/no cost structures
Reduced material waste
Designs not possible or economical with
CNC machining
 Greater alloy flexibility through batch
compounding
Rob Linke, MIMforms LLC - Slide 22
Additional Information on MIM
Organization:
CISP-Center for Innovative
Sintered Products-Penn State
Book:
Injection Molding of Metals and
Ceramics German & Bose
Rob Linke, MIMforms LLC - Slide 23