Document

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Development of Passive Components

Passive component research & development: New & Improved Materials + improve characteristics + reduce costs Improved Processing & Equipment + expanded available range + increased production + reduced components sizes

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Passive Component Usage by Market Industrial 5% Medical 2% Defense 3% Automotive 11%

Computer / EDP 24%

Consumer (AV & Appl) 30%

Important Segments Cell Phones Hard Disk Drives TV Monitors PC Motherboards PC Monitors Automotive Game Console Audio Laptop PC High Speed Modems Digital Cameras

Communication 25%

Global Units 2002 Production 420 Million 185 Million 160 Million 112 Million 85 Million 55 Million 45 Million 25 Million 25 Million 20 Million 15 Million Passive Comp Value $6.23

$2.37

$12.96

$19.50

$6.93

$49.45

$26.00

$35.00

$21.60

$8.68

$12.67

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Passive Components Markets Review:

• ~12% growth in 2002 Passive Component Market ($ value) as compared to 2001 level • Price erosion is substantial • Limited capacity expansion

Alum E-Cap 9% SLC 6% Film 3% Tant E-Cap 2% CAPACITOR MARKET (2002) 615 Billion units = $8.38 billion

MLCC 80%

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MULTILAYER CERAMIC CHIP CAPACITORS : Materials Shift

Electrodes ( Pd Ag or BME- Base Metal: Nickel)

BME Pd-Ag 2002 Estimates:

70% of global MLCC production is BME Nickel Electrode Powder Shipments 1995 = 95 Tons 2000 = 645 Tons 2005 (E) = 1830 Tons 7 www.niccomp.com

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MULTILAYER CERAMIC CHIP CAPACITORS : Materials Shift Pd-Ag … Price Per Troy Ounce (USD)

$ 800 $ 700 $ 600 $ 500 $ 400 $ 300 $ 200 $ 1 00 $ 0

$152 1995 $130 1996 $181 1997 $300 1998 $700 2000

$591 2001 $360

2002

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MULTILAYER CERAMIC CHIP CAPACITORS : Developments

 Nickel electrodes & Copper terminations = reduced component costs – Greater equipment (firing) costs  Increased number of layers [ >100 layers ]  1uF and above = very low ESR [ sub 0.010ohm @ 100KHz)  X7R (-55 ~ +125) & X5R (-55 ~ +85) = ± 15% Cap change  Encroaching upon tantalum electrolytic range  100uF / 6.3VDC [1210 in X5R & Y5V TCs]  Thinner (sub–micron) dielectric layers = lower voltage ratings – Voltage-coefficient effects – Aging effects & piezo-electric noise

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MULTILAYER CERAMIC CHIP CAPACITORS NMC Series: MLCCs Ceramic Chip Capacitors 0201 size NPO =

(101) 100pF / 25VDC

X7R =

(332) 3300pF/16VDC

X5R

New!

(103) 0.01uF/10VDC

X5R =

(104) 0.1uF/4VDC

0402 size NPO =

(471) 470pF / 16VDC

X7R =

(104) 0.10uF/10VDC

New!

Y5V X5R = =

(105) 1.0uF/10VDC (105) 1.0uF/6.3VDC

0603 size NPO =

(182) 1800pF / 50VDC

New!

Y5V X7R X5R = =

(105) 1.0uF/10VDC (225) 2.2uF/6.3VDC

(225) 2.2uF/10VDC

0805 size NPO

= (682) 6800pF /50VDC

New!

X7R

= (475) 4.7uF/10VDC

New!

X5R Y5V

= (106) 10uF/6.3VDC

= (106) 10uF/10VDC

1206 size NPO

= (103) 0.01uF /50VDC

New!

X7R

= (106) 10uF/6.3VDC

X5R Y5V

= (226) 22uF/10VDC = (226) 22uF/10VDC

1210 size NPO

= (103) 0.01uF / 50VDC

X7R

= (106) 10uF/16VDC

X5R

= (476) 47uF/6.3VDC

New!

X5R Y5V

= (107) 100uF / 6.3VDC

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MULTILAYER CERAMIC CHIP CAPACITORS

MLCC Market:

Year 2000 was record year (30% growth to $5.6Billion; source RER) production expansion equipment. Supply should meet all over-supply and reduced costs of raw materials ( BME vs. Pd-Ag for MLCC industry with demand exceeding supply and prices inching up. During year 2000 crunch many producers added considerable demands through year 2002 & 2003. Pricing has eroded due to ). MLCC expansion has been focused on BME ( Base Metal Electrode; nickel ) construction for X7R and Y5V as opposed to Pd-Ag electrode construction. NPO will remain Pd-Ag ( although with reduced Pd loading ) and will likely transition to BME over time.

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MULTILAYER CERAMIC CHIP CAPACITORS

NIC Monthly Capacity by Case Size

Case Size 2002 0201 6KK 0402 0603 400KK 550KK 0805 1206 > 1206 Cap Arrays TOTAL = 200KK 55KK 15KK 5KK 1230KK 2003 20KK 600KK 650KK 200KK 50KK 15KK 20KK 1555KK

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MULTILAYER CERAMIC CHIP CAPACITORS

NMC Series:

0201 size MLCCs

Ultra-Small Ceramic Chip Capacitors

[L x W x H = 0.6 x 0.3 x 0.3mm] 

NPO

+ 10V / 16V / 25V / 50V + 0.47 ~ 100pF + P/N: NMC0201NPOxxx



X7R

+ 16V / 25V / 50V + 39pF ~ 3300pF + NMC0201X7Rxxx



X5R & Y5V

+ 4 / 6.3 / 10V + 1200pF ~ 0.1uF

+ NMC0201X5Rxxx Applications: Ultra-Small for Hand Held – Embedded Device Precautions: Solder Paste & Placement Issues

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MULTILAYER CERAMIC CHIP CAPACITORS

NMC-L Low ESR / High Q NPO Ceramic Chip Capacitors



/ NMC-M Series:

0402, 0603, 0805

 

O.5 ~ 150pF Low ESR / High Q up to 2GHz

Ultra-Stable High Frequency NPO Ceramic Chip Capacitors

NIC, has added a new range of low ESR multilayer ceramic chip capacitors. Ideally suited to high speed, high frequency applications such as those found in Bluetooth and Wi-Fi (IEEE 802.11b) products. Manufactured using ultra stable, low loss NPO/COG dielectric, the devices are available with values ranging from 0.5pF to 150pF. Both 50V dc and 100V dc rated parts are available. Supplied in tape and reel packaging, the NMC-L range is compatible with both re-flow and flow soldering processes.

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MULTILAYER CERAMIC CHIP CAPACITORS : Recommendations



Transition away from larger (>0805) sizes



Use 0603 and 0402 on new and redesigns as much as possible



Smaller sizes have best availability and lowest costs going forward



Be aware and plan for possible future P&D issues with:

– Larger (>0805) sizes – Higher voltage parts

(>100VDC)

– High capacitance (

high Pd content ) NPO

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SMT ALUMINUM ELECTROLYTIC CAPACITORS:

Market - Technology:

SMT aluminum electrolytic types have led ( and will continue to lead ) in high demand. Useful as alternates to chip tantalum in many applications, and at lower cost has fueled growth – acceptance industry wide. No raw material – production issues are expected to impact this product type. Lower unit pricing expected over time as non-Japanese manufactures accelerate production.

Focus ( types.

chiefly solid electrolyte types ) in development of lower ESR – Z types for lower voltage – higher current power management applications. Introduction of larger case sizes has allowed higher capacitance values and high voltage rated versions, as replacement for leaded & snap-in

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SMT ALUMINUM ELECTROLYTIC CAPACITORS: NIC Monthly Capacity by Size Size (Dia.)

3 ø 4 ø 5 ø 6.3 ø 8 ø 10 ø 12.5 ø & Larger Total =

2002

Capacity (unit: Kpcs) 1,000 30,000 8,500 18,000 10,000 3,500 2,200 73,200

2003

Capacity (unit: Kpcs) 2,000 37,500 10,000 21,500 12,500 4,000 3,200 90,700

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SMT Low ESR ELECTROLYTIC CAPACITOR COMPARISON:

NIC Series NACX NACZ NACZF NSPE NSPV NSPZ Type V-Chip Liquid

Electrolyte

V-Chip Hybrid

Electrolyte

V-Chip Solid Aluminum Voltage

6.3 ~

100VDC

4 ~ 16VDC

ESR

From

0.028 ohm

From

0.023 ohm

2.5 ~ 25VDC From

0.015 ohm NSP NTP NTC-L Flat Chip Solid Aluminum

2 ~ 16VDC From

0.005 ohm Flat Chip Polymer Cathode Tantalum Flat Chip MnO2 Cathode Tantalum

4 ~ 10VDC 6.3 ~ 35VDC From

0.018 ohm

From

0.100 ohm Ripple Current Rating

0.03 ~ 2.49A

0.90 ~ 2.18A

1.35 ~ 5.10A

1.30 ~ 4.00A

0.10 ~ 2.89A

0.37 ~ 1.10A

Life at (Rated Temperature) Cost Size

MODERATE (+105degC)

LOWEST

4x5.5 ~ 18x22 MODERATE (+105degC)

LONG

(+105degC)

LONG

(+105degC)

LONG

(+105/+125degC)

LONG

(+125degC)

MODERATE

HIGH 6.3x6.3, 8x10.8, 10x10.8

6.3x6, 8x7, 10x8 HIGHEST HIGH

MODERATE SMALL

D (7343)

SMALL

J ~ D

SMALL

B ~ D

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SMT Low ESR ELECTROLYTIC CAPACITOR COMPARISON:

ELNA TYPE: SMT V-Chip PV SOLID ALUMINUM HYBRID ELECTROLYTE ALUMINUM Plastic Molded SMT Flat Chip Radial Lead - - - - SMT V-Chip Radial Lead - - - - FUJITSU KEMET NIC Components Corp.

NICHICON PANASONIC SANYO UCC- NIPPON CHEMICON - - -

- - NSPZ

NA SPV SVP PXA - - AO-CAP

NSP

- - SP - - PT FP-RE

- - NSPZR

SEP - - SEP PS - - -

- - -

NSP - - - - - - - - E - - -

- - NSPER

- - - - - - - - - POLYMER CATHODE TANTALUM Plastic Molded SMT Flat Chip - - - - - KO-CAP

NTP

F55 - - POSCAP - - -

Many E-capacitor suppliers have developed low ESR capacitors…

NIC offers the most options – design choices…

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SMT ALUMINUM ELECTROLYTIC CAPACITORS: Recommendations



Use SMT aluminum electrolytic capacitors: + when low cost is needed

(lowest cost per uF of SMT types)

+ when high voltage

(>20VDC)

rating

(or no de-rating is possible)

+ where component height can be tolerated is required + when >470uF is required

(values to 6800uF in SMT Alum V-Chip)

+ where component must be tolerant of voltage – current transients + when looking to replace leaded electrolytic capacitors + when high speed placement is needed & reflow soldering



SMT aluminum electrolytic capacitors are available in: + Low ESR – Solid Aluminum

(100KHz ESR to 0.005ohm)

+ High Voltage

(up to 450VDC)

+ 125 ° C, 105 ° C & 85 ° C Ratings + Low Leakage Current & Bi-Polar Styles

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS Market & Technology:

Explosive growth in SMT type is replacing portions of radial leaded applications. No raw material – production issues expected to impact this product. Focus is upon development of lower ESR – Z types for lower voltage – higher current power management applications. Elimination or alternate to PVC Sleeving to be phased in. Migration of Japan – Taiwan production to China likely will result in price erosion over time

Size (Dia.)

4 ø 5 ø 6.3 ø 8 ø 10 ø 12 ø 16 ø 18 ø Others: Total =

2002

Capacity (unit: Kpcs) 4,000 8,910 9,400 16,680 25,750 3,080 840 230 5,000 73,890

2003

Capacity (unit: Kpcs) 5,000 12,000 10,500 15,000 25,000 3,500 1,000 500 5,000 77,500 21

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS

MARCH 2003 MARKET UPDATE:

+ Increasing lead times on Low ESR Radial (8 & 10mm diameters) from Japan + Motherboard producers in effort to isolate themselves from Taiwan E-cap troubles have booked available capacity from most Japanese suppliers + Consumer entertainment equipment showing strong demand; DVDs, set-top boxes, satellite dishes, video games, LCD televisions, flat panel plasma displays and audio systems

RECOMMENDATIONS:

+ Prepare for longer lead times on 6.3mm, 8mm & 10mm diameter with scheduled orders out as long as four months.

+ Consider building a buffer inventory on certain types and sizes.

+ Choose quality manufacturers who can document raw material suppliers and provide life test data.

+ Select suppliers with global logistic capabilities to insure allocation for each region.

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: New Products Ultra-Low ESR Solid Aluminum

( NSPZR

Electrolytic Capacitors

Series) Radial Leaded 100KHz ESR = 0.008ohm 100KHz RCR = 5.500Arms Capacitance Values = 180 ~ 820uF Voltage Ratings = 4 ~ 16VDC Sizes = 8 & 10mm Diameters

Lowest ESR of Radial Leaded Types

( NSPER

Lower Cost Hybrid Electrolyte Aluminum Electrolytic Capacitors

Series) Radial Leaded 100KHz ESR = 0.012ohm 100KHz RCR = 2.34Arms Capacitance Values = 330 ~ 1000uF Voltage Ratings = 4 ~ 10VDC Sizes = 8 & 10mm Diameters

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: New Products Low ESR Aluminum Electrolytic Capacitors

( NRSK Series) Radial Leaded 100KHz ESR = 0.012ohm 100KHz RCR = 3.29Arms Capacitance Values = 470 ~ 3300uF Voltage Ratings = 6.3 ~ 16VDC Sizes = 8 & 10mm Diameters

( NRSG

4000 Hour Life Aluminum Electrolytic Capacitors

Series) Radial Leaded

100KHz ESR = 0.016ohm

100KHz RCR = 3.29Arms

Capacitance Values = 82 ~ 4700uF Voltage Ratings = 4 ~ 25VDC Sizes = 6.3, 8, 10 & 12.5mm Dia.

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RADIAL LEADED Low ESR ELECTROLYTIC CAPACITOR COMPARISON:

NIC Series NRSZ NRSX NRSG NRSJ NRSK Type Liquid

Electrolyte

Liquid

Electrolyte

Liquid

Electrolyte

NSPER Hybrid

Electrolyte

Voltage

6.3 ~ 100VDC

ESR Ripple Current Ratings

From

0.015 ohm

0.03 ~ 3.20A

6.3 ~ 35VDC From

0.016 ohm

0.40 ~ 3.29A

6.3 ~ 50VDC 6.3 ~ 16VDC From

0.012 ohm

0.92 ~ 2.55A

1.14 ~ 2.80A

Load Life at +105degC

MODERATE 2000 ~ 7000 hours BETTER 2000 ~ 4000hours MODERATE 2000 hours 4 ~ 10VDC From

0.012 ohm

1.45 ~ 2.34A

MODERATE 2000 hours

Cost LOW LOW MODERATE Size

4x7~ 18x35.5

6.3x11 ~ 12.5x30

LOWEST

8x11.5 ~ 10x23 8x11.5 & 10x12.5

NSPZR Solid Aluminum

4 ~ 16VDC From

0.008 ohm 4.36 ~ 5.54A

LONGEST

(No Dry-Out) HIGH 8x11.5 & 10x12.5

also see www.lowESR.com

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: Recommendations



Use Leaded aluminum electrolytic capacitors:

    

when lowest cost is needed

(lowest cost per uF of all types)

when high voltage

(up to 450VDC)

rating

(or no de-rating is possible)

where component height can be tolerated is required when high capacitance is required

(values to 1.2Farad = 1,200,000uF)

where component must be tolerant of voltage – current transients



Leaded aluminum electrolytic capacitors are available in:

 

Low ESR – Solid Aluminum

(100KHz ESR to 0.008ohm)

High Voltage

(up to 450VDC)   

+125 ° C, +105 ° C & +85 ° C Ratings Low Leakage Current & Bi-Polar Styles Radial, Snap-In and Screw Terminals

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SMT TANTALUM ELECTROLYTIC CAPACITORS

Market :

Year 2000 was record year (~50% growth from 1999* standard construction ( MnO2 cathode projected to be stable for 10+ years. *source RER ). High demand, with long lead times and pricing increases. Since late 2000 ) capacitors demand has dropped significantly. Industry over-stock and reduced demand has resulted in severe continued price erosion. Raw material supply - chain has been expanded and is NEW Reduced case sizes low voltage 2.5VDC ~ 16VDC

0603 (J) 0805 (P)

MONTHLY CAPACITY CASE SIZE

P & J A B C D/E TOTAL

2002 (UNITS)

4 KK 15 KK 15 KK 6.5 KK 6.5 KK 47 KK

2003 (UNITS)

10 KK 25 KK 20 KK 7.5 KK 7.5 KK 70 KK 27 www.niccomp.com

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SMT TANTALUM ELECTROLYTIC CAPACITORS

TANTALUM CAPACITOR PROCESS STEPS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PROCESS Powder Mixing Tantalum Powder Pressing Tantalum Wire Vacuum Sintering

Refined tantalum powder suppliers – supply chain were source of year 2000 shortage

Pellet Assembly Oxide Film Formation Forming Liquid Manganese Dioxide or Polymer Cathode Formation Graphite Baking Graphite Conductive Layer Formation Anode/Cathode Connection Silver Paste Lead Frame Conductive Adhesive Molding Resin Marking Ink Burn-In Lead Forming

Inspection

Cathode Materials:

MnO2 – Standard & reduced ESR PPY - Polypyrrole (Low ESR)

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LOW ESR POLYMER CATHODE TANTALUM ELECTROLYTIC CAPACITORS

Technology: Use of POLYMER in place of MnO2 for CATHODE results in low ESR, high ripple current ratings (RCR) and suppression of combustion (will not support flame) under failure. Applications in high density low voltage – high current power management designs. Larger sizes C & D/V cases continue to be popular. Expansion has covered all sizes P ~ D/V. Newer NTP series parts developed include lower ESR 0.015-ohm products.

Polymer Cathode Suppliers

NIC NTP Kemet Tokin-NEC Sanyo Nichicon T520 "KO-Cap" PSL "NeoCap" TP "PosCap" F55

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NEW TECHNOLOGY COMPONENTS: Materials - Product Development

Niobium Electrolytic Capacitors

92.90638

Niobium is one of the alternatives being considered to replace tantalum in capacitors. Estimates, niobium is over 100 times more plentiful than tantalum ( less than 1/10 th the cost ). NIC’s NBP series has same construction as conductive polymer cathode tantalum ( NIC NTP Series ). It is anticipated that in the future, niobium capacitors will be used for high-capacity devices ( up to 1000µF ), which are too costly to produce using tantalum.

NIC’s niobium capacitor at a glance Specifications: Rated Voltage 2.5V

Capacitance Size ESR Part Number 220uF (D) 7.3 x 4.3 x 2.8mm

0.055ohms

NBP series (specifications in development)

[

Higher material costs (as compared to tantalum types) has suppressed product develop activity on Nb types at most e-cap producers

]

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SMT TANTALUM ELECTROLYTIC CAPACITORS: Recommendations



Use SMT tantalum aluminum electrolytic capacitors: + when small size is required

+ when low profile (low head-row) is needed

+ where long life at high temperature operation

(>+65 ° C)

is needed + where operation voltage is tightly regulated:

protected from transients, over-voltage or reverse voltage

+ when looking to replace leaded electrolytic capacitors + when high speed placement are needed + when flow – wave soldering compatibility is needed



Today SMT tantalum electrolytic capacitors are available in: + Low ESR – Polymer Cathode and MnO2 Cathode Types

+ Reduced 0603 (J) & 0805 (P) case size + Capacitance values to 470uF (2VDC)

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FILM CHIP CAPACITORS (SMT)

Products

  

Raw Materials: (PEN / PPS Films)

Thin metallized films (16 ~ 100VDC) Stable characteristics over temperature, voltage & time      (as compared to X5R/X7R/Y5V/Z5U ceramics) 0805 / 1206 / 1210 / 1913 / 2416 Sizes High capacitance - tight tolerance (up to 0.47uF in ± 2%, ± 5%) Low dielectric absorption (DA) characteristics for A/D conversion applications Low dissipation factor (DF) for high efficiency display circuits (portable - battery powered designs) Immunity to cracking = good choice as compared to SMT ceramic capacitors

Recommendations:

Use SMT film chip capacitors    When need better performance than ceramic types is needed When (MLCC) component cracking has been issue When lowest loss (DF) for high circuit efficiency is needed 32 www.niccomp.com

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Technology Roadmap SMT Magnetics Products

Products

SMT – Surface Mount



Ferrite Chips Beads:

Noise suppression – filtering at high frequency



Standard



(low ~ medium current) 0603 ~ 1812 sizes



High Current (5Amp) Lead & Core



1612, 3119 & 3312 sizes

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Technology Roadmap SMT Magnetics Products

SMT – Surface Mount



Chip Inductors: NIS Series :

Surface Sprial High Frequency Performance!

(high Q)

0201, 0402 & 0603 sizes

Low Cost!

NML Series :

Multilayer (MLI) Chips

0402 & 0603 sizes NIN-H Series

Crosses – Replaces COILCRAFT

:

WireWound Open Frame

(high current)

0402, 0603, 0805 & 1008 sizes

Older Designs

NIN-F Series :

WireWound Molded Case

1008, 1210 & 1812 sizes

Power Supplies

NPI Series :

Power Inductors

(High Current Power Supplies)

9.0mm x 12.0mmm size

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SMT Magnetics Products

Cross-Reference:

Products

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SMT RESISTORS & ARRAYS

Products

Market & Technology:

Slow market conditions for thick film resistor products. Pricing has eroded to historical low levels. Alumina substrates cost is largest cost factor. Focus on 0402 & 0603 sizes for new and expanded production. Smaller (0201) size will be expanded as market acceptance increases. 0404, 0408 & 0612 Array sizes expansion ahead of larger sizes. Development of better lower TCR,sub 1.0 ohm and high 100 Mega-ohm styles [ NRC-E series ]

MONTHLY CAPACITY CASE SIZE

0201 0402 0603 0805 1206 1210 / 2010 / 2512 ARRAYS TOTAL

2002 (UNITS)

20KK 330KK 600KK 350KK 200KK 40KK 40KK 1580 KK

2003 (UNITS)

50KK 450KK 600KK 350KK 200KK 50KK 50KK 1750KK

Chip Resistor Global Market Value:

1998 = $0.82 Billion 2000 = $1.37 Billion 2002 = $0.69 Billion [ Source: 2002 Paumamanok ]

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Products

LEGACY LEADED TECHNOLOGIES High Voltage Ceramic Disc Capacitors

• 0.5pF ~ 0.22uF • 12V ~ 15,000VDC Rated • Temperature compensating TCs (N150 ~ N3300 PPM/degC) • Taped, Bulk or Cut – Formed Lead Styles

MLCC Radial – Axial Ceramic Capacitors

• NPO / X7R / Z5U • 1.0pF ~ 4.7uF • 50, 100, 200VDC

Radial / Axial Film Capacitors

• Polyester, Metallized Polyester, Metallized Polypropylene • 1000pF ~ 6.8uF • 100V ~ 630VDC Rated

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LEGACY LEADED TECHNOLOGIES

Carbon Film, Metal Film, Metal Oxide Film Resistors

• 1.0 ohm ~ 10 Meg-ohm • 1/8W, 1/4W, 1/2W, 1W, 2W, 5W, 3W, 5W, 7W Rated • +/-1%, +/-2%, +/-5% tolerance • Taped or Bulk Boxed

SIP Resistor Networks

• 4 ~ 13 Pins • Common – Bussed, Isolated or Custom Circuits • 10ohm ~ 3.3Meg-Ohm elements

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Products

ENVIRONMENTAL: LEAD–FREE | PVC - FREE

National Electronics Manufacturing Initiative (NEMI) Japan Electronics and Information Technology Industries Association (JEITA) was formed on November 1, 2000, through the merger of the Electronic Industries Association of Japan (EIAJ) and Japan Electronic Industries Development Association (JEIDA).

World Lead-free Soldering Roadmap and Agree to Eliminate Lead by 2005 European legislation and the JEITA roadmap will use a target of 0.1wt percent.

Lead free Solder Alloy Selection… The type of solder composed of Sn-Ag-Cu is recommended for board assembly Environmental pressure to remove LEAD components. Item defined as LEAD-FREE 0.2%

(NEMI) or

0.1%

(JEITA)

(Pb) & PVC Sleeving from if lead content is less than of total (component) weight

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ENVIRONMENTAL: LEAD–FREE | PVC - FREE

Products

Complete elimination of lead from terminal finish is need for

compatibility to Lead-Free (Sn-Ag-Cu or Sn-Zn-Bi) soldering processes

LEAD-FREE Terminal Finish Versions available today…

  

MLCC

(100% Sn)

Tantalum E-Cap

(100% Sn)

Aluminum E-Cap

(100% Sn & Sn-Bi*) 

Film Cap

(100% Sn & Sn-Ag-Cu) 

Chip Resistors & Thermistors

(100% Sn)  

Inductors & Ferrite Chip Beads

(100% Sn & Sn-Cu)

Diodes

(100% Sn)

SMT Alum E-Caps: Sn-Bi* Sn-Zn-Bi group : NEC, Sharp, JVC 40 www.niccomp.com

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ENVIRONMENTAL: PVC - FREE

Products

Removing PVC Insulation Sleeving Aluminum E-Caps

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Products

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Control of Non-Conforming Material

QUALITY CONTROL

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Flow Chart

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Calibration

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Contract Review

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Corrective Action

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Document Control

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Handling, Storage

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Packaging and Delivery

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Inspection and Test Status

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Inspection and Testing

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Management Responsibility

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Product Identification and Traceability

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Process Control

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Quality Audits

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Quality Records

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Quality System

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Statistical Techniques

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Training

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ISO-9001:2000 Certification

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Global Support – Product Quality Why NIC is preferred

Bruce Haskin Director of Quality Assurance

NIC Components Corp.

(631) 396-7500 x 221 [email protected]

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FLOW CHART: Customer Order QC Process

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Custome r Orde r Re quire me nt Contra ct Re v ie w Re v ie w Custome r Spe cia l Re quire me nts

Add Spe cial Re quir e m e nts To Cus tom e r M as te r File

Yes

Comply with Re quire me nts

No Yes Yes

Ente r orde r using CX e ntry scre e n.

Print orde r in Dist. Ce nte r Re solv e with Custome r Pick ing Proce ss.

QMP 280-3 Pick a nd v e rify P/N a nd Qty .

Comply with custome r spe cia l instructions F ina l Inspe ction QMP 200 Ve rify P/N a nd Qty .

Ve rify complia nce with custome r spe cia l Instructions.

(La be ling /Pa ck a ging) No Doe s the orde r me e t custome rs re quire me nt

Yes

Pa ck a ging a nd Shipping

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Calibration

NIC Components maintains and controls all Measurement and Test equipment used to ensure product quality by: • Identifying the calibration requirements of this equipment, and ensuring that the equipment remains in a state of calibration throughout specified intervals and conditions of use. • Ensuring equipment is labeled with calibration status and next calibration due date. • Using qualified external calibration facilities for all calibrations. The company maintains certified calibration records, which are traceable to NIST standards.

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Contract Review

All customer requests for quotations are reviewed by NIC Components to ensure that: • The requirements are adequately defined and documented; where no written statement of requirement is available for an order received by verbal means, NIC Components ensures that the order requirements are agreed upon before their acceptance. • NIC Components has the capability to meet the contract or accepted order requirements. • All special contract requirements, special instructions, quality requirements, and delivery requirements are carefully reviewed, to determine whether the company is able to meet these requirements. • Any requirements differing from those in the order are resolved. • After acceptance, any changes to the scope of the contract will force additional contract review.

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Control of Non-Conforming Material

A documented system is in place to control non-conforming material. The procedure outlines how non-conforming material is segregated and dispositioned. All identified non-conforming material is segregated into the (RJ1) warehouse. Material received into this warehouse code cannot be inadvertently mixed or used as good inventory. The Product Manager is responsible for the disposition of non-conforming material identified during receiving inspection. The VP of Operations, Director of Quality Assurance, and the Warehouse Manager are responsible for the disposition of all other non-conforming material. Records are maintained on all non-conforming material.

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Corrective Action

The company maintains a system for the timely corrective action of all conditions detrimental to product and process quality, including deficiencies encountered during processing. Supplier, Customer and Internal Audit corrective action systems are in effect. The prime objective of the corrective action system is to preclude the recurrence of a nonconformance by identification and correction of the root cause and contributing factors.

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Document Control

The Director of Quality Assurance has overall responsibility for the creation, approval and issue of all QMS documents. The Director of Quality Assurance is also responsible for ensuring that: • Copies of appropriate documents are available at all locations where operations that can affect quality are performed. • Obsolete documents are promptly removed from all points of issue and use. Changes to controlled documents are permitted only after formal submission to the Director of Quality Assurance, who has overall responsibility for approving all changes. He/she will consult with the party(s) responsible for adherence to the document before approving a change.

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Handling, Storage, Packaging, Preservation and Delivery

Necessary protection of all products is provided to prevent damage, loss, deterioration, or substitution. •Product is packaged with materials necessary to prevent deterioration, corrosion, or handling damage. •A FIFO inventory usage system is in effect. •Packaging and marking of products is in accordance with specified requirements to assure proper identification, preservation, and segregation, including delivery to the customer.

Inspection and Test Status

A system is in place to identify product and customer orders throughout the inspection process. Inspection status is identified on our computer system from product receipt through final inspection.

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Inspection and Testing

Inspection and Test is performed using documented procedures in the following areas: Receiving Inspection - A documented system exists for receiving inspection. 100% of all incoming receipts are visually inspected for manufacturer's part number, quantity, packaging, condition and documentation. Based on receiving history, suppliers are identified as "Skip Lot" and "Non Skip Lot". All "Non Skip Lot" suppliers require a more in-depth physical inspection. In-process Inspection - Inspection is performed during the picking process to identify product that does not meet customer special requirements such as, date code restrictions, revision levels, packaging, and labeling. When an error is detected, the product is moved to a "mark out" area-awaiting disposition. Final Inspection - 100% final inspection is performed on all orders prior to shipment. Verification of manufacturer's part number, quantity, date code, packaging, bar code labeling, and customer specific instructions are performed.

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Management Responsibility

The Director of Quality Assurance is the Management Representative responsible for all matters related to quality and the Quality Management System (QMS). The Director of Quality Assurance is a member of the company's senior management, and is afforded the authority, support, and resources necessary to adequately fulfill his/her responsibility. The Director of Quality Assurance is charged with the following: • Ensuring that the Quality System is established, implemented, and maintained in accordance with the requirements of ISO 9002. • Setting quality objectives with other management personnel. • Determining the root causes of non-conformances, initiating corrective / preventive action and verifying solutions. • Measure quality performance in key areas and review with senior management staff. • All managers and supervisors are responsible for ensuring that company quality policies are understood, implemented, and maintained throughout the organization.

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Process Control

A system is established and maintained for monitoring all processing operations. Documented procedures are developed and maintained to ensure that material/product are consistently delivered to meet customer requirements.

Product Identification and Traceability

The part number, lot number and date code and a NIC internal item number identify all products. Inventory is traceable from the time of receipt to the time of shipment.

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Quality Audits

Internal quality audits are performed to verify that all Quality Operating Instructions are in compliance with the NI Components QA Manual. The internal quality audit addresses all clauses in ISO 9002. Personnel independent of the function(s) being audited perform audits. Corrective action requests are generated on non-conformances, and corrective action effectiveness is verified. Audit results are reviewed with the area manager/supervisor and distributed to upper management.

Quality Records

Quality records are maintained for all quality and inspection activities. Quality records are filed and retained for auditing, tracking, and reference purposes. Records are easily retrievable and maintained under appropriate environmental conditions. Records are kept on file for a minimum of 5 years after the conclusion of a contract or activity.

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Quality System

The Quality Management System (QMS) is comprised of the following: • The Quality Assurance Manual, which defines the policies relating to the elements of ISO 9001:2000. • Quality Manual Procedures (QMPs) are the instructions written at the operator level to provide the operator with precise direction on how to perform his/her tasks. • Records of work and inspections performed. • Auditing of the system, to ensure compliance with procedures and the requirements of ISO 9001:2000. • Documentation / Data control system. • Corrective / Preventive Action system. • Management Review.

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Statistical Techniques

Statistical techniques are used to measure internal and external quality data. The data collected is used to identify trends, reject types, and when necessary, to initiate corrective action. The Director of Quality Assurance is responsible for creating monthly reports to be reviewed with upper management. The review is designed to monitor quality performance and continuous improvement efforts.

Training

It is an essential requirement of our Quality Management System that all staff be suitably trained, and demonstrate a satisfactory level of skill and knowledge in their functional areas. Training records are kept on file and updated accordingly.

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ISO-9001:2000 Certification

NIC has been ISO-9002 NIC received certified since February 01, 1996 ISO-9001:2000 certification on October 20th, 2002 Auditor: Underwriter's Laboratories Inc.

Certification covers NIC facilities located: Melville, NY (USA) & San Jose, CA (USA)

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NIC Global Support – Product Quality e-mail: Global Technical Support: [email protected]

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European Operations: NIC Eurotech Ltd 14 Top Angel Buckingham Industrial Park Buckingham MK18 1TH United Kingdom Tel: 44 1280 813 737 Fax: 44 1280 814 737 1 Supplier Quality Personnel on Staff

Japan Operations Nippon Industries (Tokyo, Japan) 3 Supplier Quality Personnel on Staff North American Operations Corporate Head Quarters: NIC Components Corp.

70 Maxess Road Melville, NY 11747 Tel (631) 396-7500 Fax (631) 396-7575 3 Supplier Quality Personnel on Staff

Taiwan Operations NIC - EIAN (Taiwan) Asia Operations: NIC Components Asia Pte Ltd 701 Sims Drive, #07-01 LHK Building Singapore 387383 Tel: 65-8441575 Fax: 65-8441646 1 Supplier Quality Personnel on Staff 1 Supplier Quality Personnel on Staff

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NIC Global Logistics Locations

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West Coast Operations: NIC Components Corp.

2070 Ringwood Avenue San Jose, CA 95131

European Operations: NIC Eurotech Ltd 14 Top Angel Buckingham Industrial Park Buckingham MK18 1TH United Kingdom Japan Operations Nippon Industries (Tokyo, Japan) 3PL:

 

Monterey, Mexico Guadalajara,Mexico Taiwan Operations NIC – EIAN (Taipei, Taiwan) North American Operations Corporate Head Quarters: NIC Components Corp.

70 Maxess Road Melville, NY 11747

Asia Operations: NIC Components Asia Pte Ltd 701 Sims Drive, #07-01 LHK Building Singapore 387383 Additional Sales Personnel in:



Penang, Malaysia

 

Hong Kong Shanghai, China 3PL:



Hong Kong

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Global Support

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Shared Unified Data-base Move programs – builds from location to location

seamlessly

 

Single Global Part Numbers No competing -disputing regional divisions

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Global Support Network

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West Coast USA

NIC CA

Mid-Atlantic USA

NIC NY

Western Europe

NIC EUROTECH

Scandinavia

NIC EUROTECH

NIC Local Warehouses (7) Mexico

NIC CA

Mid-West USA

NIC NY

SE Asia

NIC COMP ASIA

Eastern Europe

NIC EUROTECH

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1975

Nippon Industries Company - Japan

“NIC” 1982 NIC Components Corp.

(North America)

1990 NIC West

(San Jose)

1996 NIC Eurotech

(Europe)

1998 NIC Asia

(SE Asia)

2000~2002 NIC Regional Sales Offices

• Pacific North West • South East • Southern California • Canada NIC Components Corporation [ ™], in association with Nippon Industries Co. Ltd is a designer, manufacturer and worldwide supplier of passive components.

• Established in 1975 as a manufacturer of aluminum electrolytic capacitors, NIC has developed into a major supplier of capacitors, resistors, magnetics and specialty products. • Using Nippon Industries' manufacturing and design expertise, a select group of specialized factories was recruited to augment our core products and add complimentary products to our expansive line.

• NIC's expertise and diligence in selection and integration of quality fabs is world-renowned. Long-term supplier relationships (averaging over ten years) have been fostered by shared strategy and partnering management teams. • Quality is our number one commitment. Every step, from component design to raw material selection, manufacturing processing to final inspection is meticulously controlled.

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