Transcript Document
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Passive Component Update
Topics: • Market • Technology • Production • Material Issues New & Redesign Recommendations New Products 1 www.niccomp.com
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Sources:
Nippon Industries Company Ltd
(Japan)
NIC Components Corp.
(Taiwan)
Paumanok Publications, Inc
Leading passive component market analysts… & publishers of
Passive Component Industry
Magazine Bi-monthly look at the passive component market and technology www.paumanokgroup.com/
Reed Electronics Research
www.rer.co.uk
Electronic Buyer News (EBN)
www.ebnonline.com
Electronic Component News (ECN)
www.ecnmag.com
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Changing Technology Impact Passive Devices Technology Innovations Lower voltage of operation
ESR capacitors = increased circuit current = higher demands on voltage - power management circuitry = tighter line (supply voltage) regulation (reduce ripple voltage) = increased demand for low
Faster circuit speeds
= reduced response time for voltage - power management circuits = increased demand on capacitor bank
Higher frequency operation
performing & smaller devices = reduced trace distances = better All impact
signal
&
supply voltage
integrity
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Development of Passive Components
Passive component research & development: New & Improved Materials + improve characteristics + reduce costs Improved Processing & Equipment + expanded available range + increased production + reduced components sizes
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Passive Component Usage by Market Industrial 5% Medical 2% Defense 3% Automotive 11%
Computer / EDP 24%
Consumer (AV & Appl) 30%
Important Segments Cell Phones Hard Disk Drives TV Monitors PC Motherboards PC Monitors Automotive Game Console Audio Laptop PC High Speed Modems Digital Cameras
Communication 25%
Global Units 2002 Production 420 Million 185 Million 160 Million 112 Million 85 Million 55 Million 45 Million 25 Million 25 Million 20 Million 15 Million Passive Comp Value $6.23
$2.37
$12.96
$19.50
$6.93
$49.45
$26.00
$35.00
$21.60
$8.68
$12.67
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Passive Components Markets Review:
• ~12% growth in 2002 Passive Component Market ($ value) as compared to 2001 level • Price erosion is substantial • Limited capacity expansion
Alum E-Cap 9% SLC 6% Film 3% Tant E-Cap 2% CAPACITOR MARKET (2002) 615 Billion units = $8.38 billion
MLCC 80%
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MULTILAYER CERAMIC CHIP CAPACITORS : Materials Shift
Electrodes ( Pd Ag or BME- Base Metal: Nickel)
BME Pd-Ag 2002 Estimates:
70% of global MLCC production is BME Nickel Electrode Powder Shipments 1995 = 95 Tons 2000 = 645 Tons 2005 (E) = 1830 Tons 7 www.niccomp.com
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MULTILAYER CERAMIC CHIP CAPACITORS : Materials Shift Pd-Ag … Price Per Troy Ounce (USD)
$ 800 $ 700 $ 600 $ 500 $ 400 $ 300 $ 200 $ 1 00 $ 0
$152 1995 $130 1996 $181 1997 $300 1998 $700 2000
$591 2001 $360
2002
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MULTILAYER CERAMIC CHIP CAPACITORS : Developments
Nickel electrodes & Copper terminations = reduced component costs – Greater equipment (firing) costs Increased number of layers [ >100 layers ] 1uF and above = very low ESR [ sub 0.010ohm @ 100KHz) X7R (-55 ~ +125) & X5R (-55 ~ +85) = ± 15% Cap change Encroaching upon tantalum electrolytic range 100uF / 6.3VDC [1210 in X5R & Y5V TCs] Thinner (sub–micron) dielectric layers = lower voltage ratings – Voltage-coefficient effects – Aging effects & piezo-electric noise
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MULTILAYER CERAMIC CHIP CAPACITORS NMC Series: MLCCs Ceramic Chip Capacitors 0201 size NPO =
(101) 100pF / 25VDC
X7R =
(332) 3300pF/16VDC
X5R
New!
=
(103) 0.01uF/10VDC
X5R =
(104) 0.1uF/4VDC
0402 size NPO =
(471) 470pF / 16VDC
X7R =
(104) 0.10uF/10VDC
New!
Y5V X5R = =
(105) 1.0uF/10VDC (105) 1.0uF/6.3VDC
0603 size NPO =
(182) 1800pF / 50VDC
New!
New!
Y5V X7R X5R = =
(105) 1.0uF/10VDC (225) 2.2uF/6.3VDC
=
(225) 2.2uF/10VDC
0805 size NPO
= (682) 6800pF /50VDC
New!
X7R
= (475) 4.7uF/10VDC
New!
X5R Y5V
= (106) 10uF/6.3VDC
= (106) 10uF/10VDC
1206 size NPO
= (103) 0.01uF /50VDC
New!
X7R
= (106) 10uF/6.3VDC
X5R Y5V
= (226) 22uF/10VDC = (226) 22uF/10VDC
1210 size NPO
= (103) 0.01uF / 50VDC
X7R
= (106) 10uF/16VDC
X5R
= (476) 47uF/6.3VDC
New!
New!
X5R Y5V
= (107) 100uF / 6.3VDC
= (107) 100uF / 6.3VDC
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MULTILAYER CERAMIC CHIP CAPACITORS
MLCC Market:
Year 2000 was record year (30% growth to $5.6Billion; source RER) production expansion equipment. Supply should meet all over-supply and reduced costs of raw materials ( BME vs. Pd-Ag for MLCC industry with demand exceeding supply and prices inching up. During year 2000 crunch many producers added considerable demands through year 2002 & 2003. Pricing has eroded due to ). MLCC expansion has been focused on BME ( Base Metal Electrode; nickel ) construction for X7R and Y5V as opposed to Pd-Ag electrode construction. NPO will remain Pd-Ag ( although with reduced Pd loading ) and will likely transition to BME over time.
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MULTILAYER CERAMIC CHIP CAPACITORS
NIC Monthly Capacity by Case Size
Case Size 2002 0201 6KK 0402 0603 400KK 550KK 0805 1206 > 1206 Cap Arrays TOTAL = 200KK 55KK 15KK 5KK 1230KK 2003 20KK 600KK 650KK 200KK 50KK 15KK 20KK 1555KK
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MULTILAYER CERAMIC CHIP CAPACITORS
NMC Series:
0201 size MLCCs
Ultra-Small Ceramic Chip Capacitors
[L x W x H = 0.6 x 0.3 x 0.3mm]
NPO
+ 10V / 16V / 25V / 50V + 0.47 ~ 100pF + P/N: NMC0201NPOxxx
X7R
+ 16V / 25V / 50V + 39pF ~ 3300pF + NMC0201X7Rxxx
X5R & Y5V
+ 4 / 6.3 / 10V + 1200pF ~ 0.1uF
+ NMC0201X5Rxxx Applications: Ultra-Small for Hand Held – Embedded Device Precautions: Solder Paste & Placement Issues
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MULTILAYER CERAMIC CHIP CAPACITORS
NMC-L Low ESR / High Q NPO Ceramic Chip Capacitors
/ NMC-M Series:
0402, 0603, 0805
O.5 ~ 150pF Low ESR / High Q up to 2GHz
Ultra-Stable High Frequency NPO Ceramic Chip Capacitors
NIC, has added a new range of low ESR multilayer ceramic chip capacitors. Ideally suited to high speed, high frequency applications such as those found in Bluetooth and Wi-Fi (IEEE 802.11b) products. Manufactured using ultra stable, low loss NPO/COG dielectric, the devices are available with values ranging from 0.5pF to 150pF. Both 50V dc and 100V dc rated parts are available. Supplied in tape and reel packaging, the NMC-L range is compatible with both re-flow and flow soldering processes.
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MULTILAYER CERAMIC CHIP CAPACITORS : Recommendations
Transition away from larger (>0805) sizes
Use 0603 and 0402 on new and redesigns as much as possible
Smaller sizes have best availability and lowest costs going forward
Be aware and plan for possible future P&D issues with:
– Larger (>0805) sizes – Higher voltage parts
(>100VDC)
– High capacitance (
high Pd content ) NPO
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SMT ALUMINUM ELECTROLYTIC CAPACITORS:
Market - Technology:
SMT aluminum electrolytic types have led ( and will continue to lead ) in high demand. Useful as alternates to chip tantalum in many applications, and at lower cost has fueled growth – acceptance industry wide. No raw material – production issues are expected to impact this product type. Lower unit pricing expected over time as non-Japanese manufactures accelerate production.
Focus ( types.
chiefly solid electrolyte types ) in development of lower ESR – Z types for lower voltage – higher current power management applications. Introduction of larger case sizes has allowed higher capacitance values and high voltage rated versions, as replacement for leaded & snap-in
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SMT ALUMINUM ELECTROLYTIC CAPACITORS: NIC Monthly Capacity by Size Size (Dia.)
3 ø 4 ø 5 ø 6.3 ø 8 ø 10 ø 12.5 ø & Larger Total =
2002
Capacity (unit: Kpcs) 1,000 30,000 8,500 18,000 10,000 3,500 2,200 73,200
2003
Capacity (unit: Kpcs) 2,000 37,500 10,000 21,500 12,500 4,000 3,200 90,700
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SMT Low ESR ELECTROLYTIC CAPACITOR COMPARISON:
NIC Series NACX NACZ NACZF NSPE NSPV NSPZ Type V-Chip Liquid
Electrolyte
V-Chip Hybrid
Electrolyte
V-Chip Solid Aluminum Voltage
6.3 ~
100VDC
4 ~ 16VDC
ESR
From
0.028 ohm
From
0.023 ohm
2.5 ~ 25VDC From
0.015 ohm NSP NTP NTC-L Flat Chip Solid Aluminum
2 ~ 16VDC From
0.005 ohm Flat Chip Polymer Cathode Tantalum Flat Chip MnO2 Cathode Tantalum
4 ~ 10VDC 6.3 ~ 35VDC From
0.018 ohm
From
0.100 ohm Ripple Current Rating
0.03 ~ 2.49A
0.90 ~ 2.18A
1.35 ~ 5.10A
1.30 ~ 4.00A
0.10 ~ 2.89A
0.37 ~ 1.10A
Life at (Rated Temperature) Cost Size
MODERATE (+105degC)
LOWEST
4x5.5 ~ 18x22 MODERATE (+105degC)
LONG
(+105degC)
LONG
(+105degC)
LONG
(+105/+125degC)
LONG
(+125degC)
MODERATE
HIGH 6.3x6.3, 8x10.8, 10x10.8
6.3x6, 8x7, 10x8 HIGHEST HIGH
MODERATE SMALL
D (7343)
SMALL
J ~ D
SMALL
B ~ D
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SMT Low ESR ELECTROLYTIC CAPACITOR COMPARISON:
ELNA TYPE: SMT V-Chip PV SOLID ALUMINUM HYBRID ELECTROLYTE ALUMINUM Plastic Molded SMT Flat Chip Radial Lead - - - - SMT V-Chip Radial Lead - - - - FUJITSU KEMET NIC Components Corp.
NICHICON PANASONIC SANYO UCC- NIPPON CHEMICON - - -
- - NSPZ
NA SPV SVP PXA - - AO-CAP
NSP
- - SP - - PT FP-RE
- - NSPZR
SEP - - SEP PS - - -
- - -
NSP - - - - - - - - E - - -
- - NSPER
- - - - - - - - - POLYMER CATHODE TANTALUM Plastic Molded SMT Flat Chip - - - - - KO-CAP
NTP
F55 - - POSCAP - - -
Many E-capacitor suppliers have developed low ESR capacitors…
NIC offers the most options – design choices…
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SMT ALUMINUM ELECTROLYTIC CAPACITORS: Recommendations
Use SMT aluminum electrolytic capacitors: + when low cost is needed
(lowest cost per uF of SMT types)
+ when high voltage
(>20VDC)
rating
(or no de-rating is possible)
+ where component height can be tolerated is required + when >470uF is required
(values to 6800uF in SMT Alum V-Chip)
+ where component must be tolerant of voltage – current transients + when looking to replace leaded electrolytic capacitors + when high speed placement is needed & reflow soldering
SMT aluminum electrolytic capacitors are available in: + Low ESR – Solid Aluminum
(100KHz ESR to 0.005ohm)
+ High Voltage
(up to 450VDC)
+ 125 ° C, 105 ° C & 85 ° C Ratings + Low Leakage Current & Bi-Polar Styles
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LEADED ALUMINUM ELECTROLYTIC CAPACITORS Market & Technology:
Explosive growth in SMT type is replacing portions of radial leaded applications. No raw material – production issues expected to impact this product. Focus is upon development of lower ESR – Z types for lower voltage – higher current power management applications. Elimination or alternate to PVC Sleeving to be phased in. Migration of Japan – Taiwan production to China likely will result in price erosion over time
Size (Dia.)
4 ø 5 ø 6.3 ø 8 ø 10 ø 12 ø 16 ø 18 ø Others: Total =
2002
Capacity (unit: Kpcs) 4,000 8,910 9,400 16,680 25,750 3,080 840 230 5,000 73,890
2003
Capacity (unit: Kpcs) 5,000 12,000 10,500 15,000 25,000 3,500 1,000 500 5,000 77,500 21
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LEADED ALUMINUM ELECTROLYTIC CAPACITORS
MARCH 2003 MARKET UPDATE:
+ Increasing lead times on Low ESR Radial (8 & 10mm diameters) from Japan + Motherboard producers in effort to isolate themselves from Taiwan E-cap troubles have booked available capacity from most Japanese suppliers + Consumer entertainment equipment showing strong demand; DVDs, set-top boxes, satellite dishes, video games, LCD televisions, flat panel plasma displays and audio systems
RECOMMENDATIONS:
+ Prepare for longer lead times on 6.3mm, 8mm & 10mm diameter with scheduled orders out as long as four months.
+ Consider building a buffer inventory on certain types and sizes.
+ Choose quality manufacturers who can document raw material suppliers and provide life test data.
+ Select suppliers with global logistic capabilities to insure allocation for each region.
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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: New Products Ultra-Low ESR Solid Aluminum
( NSPZR
Electrolytic Capacitors
Series) Radial Leaded 100KHz ESR = 0.008ohm 100KHz RCR = 5.500Arms Capacitance Values = 180 ~ 820uF Voltage Ratings = 4 ~ 16VDC Sizes = 8 & 10mm Diameters
Lowest ESR of Radial Leaded Types
( NSPER
Lower Cost Hybrid Electrolyte Aluminum Electrolytic Capacitors
Series) Radial Leaded 100KHz ESR = 0.012ohm 100KHz RCR = 2.34Arms Capacitance Values = 330 ~ 1000uF Voltage Ratings = 4 ~ 10VDC Sizes = 8 & 10mm Diameters
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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: New Products Low ESR Aluminum Electrolytic Capacitors
( NRSK Series) Radial Leaded 100KHz ESR = 0.012ohm 100KHz RCR = 3.29Arms Capacitance Values = 470 ~ 3300uF Voltage Ratings = 6.3 ~ 16VDC Sizes = 8 & 10mm Diameters
( NRSG
4000 Hour Life Aluminum Electrolytic Capacitors
Series) Radial Leaded
100KHz ESR = 0.016ohm
100KHz RCR = 3.29Arms
Capacitance Values = 82 ~ 4700uF Voltage Ratings = 4 ~ 25VDC Sizes = 6.3, 8, 10 & 12.5mm Dia.
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RADIAL LEADED Low ESR ELECTROLYTIC CAPACITOR COMPARISON:
NIC Series NRSZ NRSX NRSG NRSJ NRSK Type Liquid
Electrolyte
Liquid
Electrolyte
Liquid
Electrolyte
NSPER Hybrid
Electrolyte
Voltage
6.3 ~ 100VDC
ESR Ripple Current Ratings
From
0.015 ohm
0.03 ~ 3.20A
6.3 ~ 35VDC From
0.016 ohm
0.40 ~ 3.29A
6.3 ~ 50VDC 6.3 ~ 16VDC From
0.012 ohm
0.92 ~ 2.55A
1.14 ~ 2.80A
Load Life at +105degC
MODERATE 2000 ~ 7000 hours BETTER 2000 ~ 4000hours MODERATE 2000 hours 4 ~ 10VDC From
0.012 ohm
1.45 ~ 2.34A
MODERATE 2000 hours
Cost LOW LOW MODERATE Size
4x7~ 18x35.5
6.3x11 ~ 12.5x30
LOWEST
8x11.5 ~ 10x23 8x11.5 & 10x12.5
NSPZR Solid Aluminum
4 ~ 16VDC From
0.008 ohm 4.36 ~ 5.54A
LONGEST
(No Dry-Out) HIGH 8x11.5 & 10x12.5
also see www.lowESR.com
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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: Recommendations
Use Leaded aluminum electrolytic capacitors:
when lowest cost is needed
(lowest cost per uF of all types)
when high voltage
(up to 450VDC)
rating
(or no de-rating is possible)
where component height can be tolerated is required when high capacitance is required
(values to 1.2Farad = 1,200,000uF)
where component must be tolerant of voltage – current transients
Leaded aluminum electrolytic capacitors are available in:
Low ESR – Solid Aluminum
(100KHz ESR to 0.008ohm)
High Voltage
(up to 450VDC)
+125 ° C, +105 ° C & +85 ° C Ratings Low Leakage Current & Bi-Polar Styles Radial, Snap-In and Screw Terminals
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SMT TANTALUM ELECTROLYTIC CAPACITORS
Market :
Year 2000 was record year (~50% growth from 1999* standard construction ( MnO2 cathode projected to be stable for 10+ years. *source RER ). High demand, with long lead times and pricing increases. Since late 2000 ) capacitors demand has dropped significantly. Industry over-stock and reduced demand has resulted in severe continued price erosion. Raw material supply - chain has been expanded and is NEW Reduced case sizes low voltage 2.5VDC ~ 16VDC
0603 (J) 0805 (P)
MONTHLY CAPACITY CASE SIZE
P & J A B C D/E TOTAL
2002 (UNITS)
4 KK 15 KK 15 KK 6.5 KK 6.5 KK 47 KK
2003 (UNITS)
10 KK 25 KK 20 KK 7.5 KK 7.5 KK 70 KK 27 www.niccomp.com
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SMT TANTALUM ELECTROLYTIC CAPACITORS
TANTALUM CAPACITOR PROCESS STEPS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PROCESS Powder Mixing Tantalum Powder Pressing Tantalum Wire Vacuum Sintering
Refined tantalum powder suppliers – supply chain were source of year 2000 shortage
Pellet Assembly Oxide Film Formation Forming Liquid Manganese Dioxide or Polymer Cathode Formation Graphite Baking Graphite Conductive Layer Formation Anode/Cathode Connection Silver Paste Lead Frame Conductive Adhesive Molding Resin Marking Ink Burn-In Lead Forming
Inspection
Cathode Materials:
MnO2 – Standard & reduced ESR PPY - Polypyrrole (Low ESR)
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LOW ESR POLYMER CATHODE TANTALUM ELECTROLYTIC CAPACITORS
Technology: Use of POLYMER in place of MnO2 for CATHODE results in low ESR, high ripple current ratings (RCR) and suppression of combustion (will not support flame) under failure. Applications in high density low voltage – high current power management designs. Larger sizes C & D/V cases continue to be popular. Expansion has covered all sizes P ~ D/V. Newer NTP series parts developed include lower ESR 0.015-ohm products.
Polymer Cathode Suppliers
NIC NTP Kemet Tokin-NEC Sanyo Nichicon T520 "KO-Cap" PSL "NeoCap" TP "PosCap" F55
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NEW TECHNOLOGY COMPONENTS: Materials - Product Development
Niobium Electrolytic Capacitors
41
Nb
92.90638
Niobium is one of the alternatives being considered to replace tantalum in capacitors. Estimates, niobium is over 100 times more plentiful than tantalum ( less than 1/10 th the cost ). NIC’s NBP series has same construction as conductive polymer cathode tantalum ( NIC NTP Series ). It is anticipated that in the future, niobium capacitors will be used for high-capacity devices ( up to 1000µF ), which are too costly to produce using tantalum.
NIC’s niobium capacitor at a glance Specifications: Rated Voltage 2.5V
Capacitance Size ESR Part Number 220uF (D) 7.3 x 4.3 x 2.8mm
0.055ohms
NBP series (specifications in development)
[
Higher material costs (as compared to tantalum types) has suppressed product develop activity on Nb types at most e-cap producers
]
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SMT TANTALUM ELECTROLYTIC CAPACITORS: Recommendations
Use SMT tantalum aluminum electrolytic capacitors: + when small size is required
+ when low profile (low head-row) is needed
+ where long life at high temperature operation
(>+65 ° C)
is needed + where operation voltage is tightly regulated:
protected from transients, over-voltage or reverse voltage
+ when looking to replace leaded electrolytic capacitors + when high speed placement are needed + when flow – wave soldering compatibility is needed
Today SMT tantalum electrolytic capacitors are available in: + Low ESR – Polymer Cathode and MnO2 Cathode Types
+ Reduced 0603 (J) & 0805 (P) case size + Capacitance values to 470uF (2VDC)
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FILM CHIP CAPACITORS (SMT)
Products
Raw Materials: (PEN / PPS Films)
Thin metallized films (16 ~ 100VDC) Stable characteristics over temperature, voltage & time (as compared to X5R/X7R/Y5V/Z5U ceramics) 0805 / 1206 / 1210 / 1913 / 2416 Sizes High capacitance - tight tolerance (up to 0.47uF in ± 2%, ± 5%) Low dielectric absorption (DA) characteristics for A/D conversion applications Low dissipation factor (DF) for high efficiency display circuits (portable - battery powered designs) Immunity to cracking = good choice as compared to SMT ceramic capacitors
Recommendations:
Use SMT film chip capacitors When need better performance than ceramic types is needed When (MLCC) component cracking has been issue When lowest loss (DF) for high circuit efficiency is needed 32 www.niccomp.com
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Technology Roadmap SMT Magnetics Products
Products
SMT – Surface Mount
Ferrite Chips Beads:
Noise suppression – filtering at high frequency
Standard
(low ~ medium current) 0603 ~ 1812 sizes
High Current (5Amp) Lead & Core
1612, 3119 & 3312 sizes
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Technology Roadmap SMT Magnetics Products
SMT – Surface Mount
Chip Inductors: NIS Series :
Surface Sprial High Frequency Performance!
(high Q)
0201, 0402 & 0603 sizes
Low Cost!
NML Series :
Multilayer (MLI) Chips
0402 & 0603 sizes NIN-H Series
Crosses – Replaces COILCRAFT
:
WireWound Open Frame
(high current)
0402, 0603, 0805 & 1008 sizes
Older Designs
NIN-F Series :
WireWound Molded Case
1008, 1210 & 1812 sizes
Power Supplies
NPI Series :
Power Inductors
(High Current Power Supplies)
9.0mm x 12.0mmm size
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SMT Magnetics Products
Cross-Reference:
Products
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SMT RESISTORS & ARRAYS
Products
Market & Technology:
Slow market conditions for thick film resistor products. Pricing has eroded to historical low levels. Alumina substrates cost is largest cost factor. Focus on 0402 & 0603 sizes for new and expanded production. Smaller (0201) size will be expanded as market acceptance increases. 0404, 0408 & 0612 Array sizes expansion ahead of larger sizes. Development of better lower TCR,sub 1.0 ohm and high 100 Mega-ohm styles [ NRC-E series ]
MONTHLY CAPACITY CASE SIZE
0201 0402 0603 0805 1206 1210 / 2010 / 2512 ARRAYS TOTAL
2002 (UNITS)
20KK 330KK 600KK 350KK 200KK 40KK 40KK 1580 KK
2003 (UNITS)
50KK 450KK 600KK 350KK 200KK 50KK 50KK 1750KK
Chip Resistor Global Market Value:
1998 = $0.82 Billion 2000 = $1.37 Billion 2002 = $0.69 Billion [ Source: 2002 Paumamanok ]
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LEGACY LEADED TECHNOLOGIES High Voltage Ceramic Disc Capacitors
• 0.5pF ~ 0.22uF • 12V ~ 15,000VDC Rated • Temperature compensating TCs (N150 ~ N3300 PPM/degC) • Taped, Bulk or Cut – Formed Lead Styles
MLCC Radial – Axial Ceramic Capacitors
• NPO / X7R / Z5U • 1.0pF ~ 4.7uF • 50, 100, 200VDC
Radial / Axial Film Capacitors
• Polyester, Metallized Polyester, Metallized Polypropylene • 1000pF ~ 6.8uF • 100V ~ 630VDC Rated
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LEGACY LEADED TECHNOLOGIES
Carbon Film, Metal Film, Metal Oxide Film Resistors
• 1.0 ohm ~ 10 Meg-ohm • 1/8W, 1/4W, 1/2W, 1W, 2W, 5W, 3W, 5W, 7W Rated • +/-1%, +/-2%, +/-5% tolerance • Taped or Bulk Boxed
SIP Resistor Networks
• 4 ~ 13 Pins • Common – Bussed, Isolated or Custom Circuits • 10ohm ~ 3.3Meg-Ohm elements
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ENVIRONMENTAL: LEAD–FREE | PVC - FREE
National Electronics Manufacturing Initiative (NEMI) Japan Electronics and Information Technology Industries Association (JEITA) was formed on November 1, 2000, through the merger of the Electronic Industries Association of Japan (EIAJ) and Japan Electronic Industries Development Association (JEIDA).
World Lead-free Soldering Roadmap and Agree to Eliminate Lead by 2005 European legislation and the JEITA roadmap will use a target of 0.1wt percent.
Lead free Solder Alloy Selection… The type of solder composed of Sn-Ag-Cu is recommended for board assembly Environmental pressure to remove LEAD components. Item defined as LEAD-FREE 0.2%
(NEMI) or
0.1%
(JEITA)
(Pb) & PVC Sleeving from if lead content is less than of total (component) weight
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ENVIRONMENTAL: LEAD–FREE | PVC - FREE
Products
Complete elimination of lead from terminal finish is need for
compatibility to Lead-Free (Sn-Ag-Cu or Sn-Zn-Bi) soldering processes
LEAD-FREE Terminal Finish Versions available today…
MLCC
(100% Sn)
Tantalum E-Cap
(100% Sn)
Aluminum E-Cap
(100% Sn & Sn-Bi*)
Film Cap
(100% Sn & Sn-Ag-Cu)
Chip Resistors & Thermistors
(100% Sn)
Inductors & Ferrite Chip Beads
(100% Sn & Sn-Cu)
Diodes
(100% Sn)
SMT Alum E-Caps: Sn-Bi* Sn-Zn-Bi group : NEC, Sharp, JVC 40 www.niccomp.com
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ENVIRONMENTAL: PVC - FREE
Products
Removing PVC Insulation Sleeving Aluminum E-Caps
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QUALITY CONTROL
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Control of Non-Conforming Material
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Product Identification and Traceability
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Global Support – Product Quality Why NIC is preferred
Bruce Haskin Director of Quality Assurance
NIC Components Corp.
(631) 396-7500 x 221 [email protected]
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FLOW CHART: Customer Order QC Process
Products
Custome r Orde r Re quire me nt Contra ct Re v ie w Re v ie w Custome r Spe cia l Re quire me nts
Add Spe cial Re quir e m e nts To Cus tom e r M as te r File
Yes
Comply with Re quire me nts
No Yes Yes
Ente r orde r using CX e ntry scre e n.
Print orde r in Dist. Ce nte r Re solv e with Custome r Pick ing Proce ss.
QMP 280-3 Pick a nd v e rify P/N a nd Qty .
Comply with custome r spe cia l instructions F ina l Inspe ction QMP 200 Ve rify P/N a nd Qty .
Ve rify complia nce with custome r spe cia l Instructions.
(La be ling /Pa ck a ging) No Doe s the orde r me e t custome rs re quire me nt
Yes
Pa ck a ging a nd Shipping
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Products
Calibration
NIC Components maintains and controls all Measurement and Test equipment used to ensure product quality by: • Identifying the calibration requirements of this equipment, and ensuring that the equipment remains in a state of calibration throughout specified intervals and conditions of use. • Ensuring equipment is labeled with calibration status and next calibration due date. • Using qualified external calibration facilities for all calibrations. The company maintains certified calibration records, which are traceable to NIST standards.
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Contract Review
All customer requests for quotations are reviewed by NIC Components to ensure that: • The requirements are adequately defined and documented; where no written statement of requirement is available for an order received by verbal means, NIC Components ensures that the order requirements are agreed upon before their acceptance. • NIC Components has the capability to meet the contract or accepted order requirements. • All special contract requirements, special instructions, quality requirements, and delivery requirements are carefully reviewed, to determine whether the company is able to meet these requirements. • Any requirements differing from those in the order are resolved. • After acceptance, any changes to the scope of the contract will force additional contract review.
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Control of Non-Conforming Material
A documented system is in place to control non-conforming material. The procedure outlines how non-conforming material is segregated and dispositioned. All identified non-conforming material is segregated into the (RJ1) warehouse. Material received into this warehouse code cannot be inadvertently mixed or used as good inventory. The Product Manager is responsible for the disposition of non-conforming material identified during receiving inspection. The VP of Operations, Director of Quality Assurance, and the Warehouse Manager are responsible for the disposition of all other non-conforming material. Records are maintained on all non-conforming material.
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Corrective Action
The company maintains a system for the timely corrective action of all conditions detrimental to product and process quality, including deficiencies encountered during processing. Supplier, Customer and Internal Audit corrective action systems are in effect. The prime objective of the corrective action system is to preclude the recurrence of a nonconformance by identification and correction of the root cause and contributing factors.
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Document Control
The Director of Quality Assurance has overall responsibility for the creation, approval and issue of all QMS documents. The Director of Quality Assurance is also responsible for ensuring that: • Copies of appropriate documents are available at all locations where operations that can affect quality are performed. • Obsolete documents are promptly removed from all points of issue and use. Changes to controlled documents are permitted only after formal submission to the Director of Quality Assurance, who has overall responsibility for approving all changes. He/she will consult with the party(s) responsible for adherence to the document before approving a change.
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Handling, Storage, Packaging, Preservation and Delivery
Necessary protection of all products is provided to prevent damage, loss, deterioration, or substitution. •Product is packaged with materials necessary to prevent deterioration, corrosion, or handling damage. •A FIFO inventory usage system is in effect. •Packaging and marking of products is in accordance with specified requirements to assure proper identification, preservation, and segregation, including delivery to the customer.
Inspection and Test Status
A system is in place to identify product and customer orders throughout the inspection process. Inspection status is identified on our computer system from product receipt through final inspection.
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Inspection and Testing
Inspection and Test is performed using documented procedures in the following areas: Receiving Inspection - A documented system exists for receiving inspection. 100% of all incoming receipts are visually inspected for manufacturer's part number, quantity, packaging, condition and documentation. Based on receiving history, suppliers are identified as "Skip Lot" and "Non Skip Lot". All "Non Skip Lot" suppliers require a more in-depth physical inspection. In-process Inspection - Inspection is performed during the picking process to identify product that does not meet customer special requirements such as, date code restrictions, revision levels, packaging, and labeling. When an error is detected, the product is moved to a "mark out" area-awaiting disposition. Final Inspection - 100% final inspection is performed on all orders prior to shipment. Verification of manufacturer's part number, quantity, date code, packaging, bar code labeling, and customer specific instructions are performed.
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Management Responsibility
The Director of Quality Assurance is the Management Representative responsible for all matters related to quality and the Quality Management System (QMS). The Director of Quality Assurance is a member of the company's senior management, and is afforded the authority, support, and resources necessary to adequately fulfill his/her responsibility. The Director of Quality Assurance is charged with the following: • Ensuring that the Quality System is established, implemented, and maintained in accordance with the requirements of ISO 9002. • Setting quality objectives with other management personnel. • Determining the root causes of non-conformances, initiating corrective / preventive action and verifying solutions. • Measure quality performance in key areas and review with senior management staff. • All managers and supervisors are responsible for ensuring that company quality policies are understood, implemented, and maintained throughout the organization.
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Products
Process Control
A system is established and maintained for monitoring all processing operations. Documented procedures are developed and maintained to ensure that material/product are consistently delivered to meet customer requirements.
Product Identification and Traceability
The part number, lot number and date code and a NIC internal item number identify all products. Inventory is traceable from the time of receipt to the time of shipment.
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Products
Quality Audits
Internal quality audits are performed to verify that all Quality Operating Instructions are in compliance with the NI Components QA Manual. The internal quality audit addresses all clauses in ISO 9002. Personnel independent of the function(s) being audited perform audits. Corrective action requests are generated on non-conformances, and corrective action effectiveness is verified. Audit results are reviewed with the area manager/supervisor and distributed to upper management.
Quality Records
Quality records are maintained for all quality and inspection activities. Quality records are filed and retained for auditing, tracking, and reference purposes. Records are easily retrievable and maintained under appropriate environmental conditions. Records are kept on file for a minimum of 5 years after the conclusion of a contract or activity.
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Quality System
The Quality Management System (QMS) is comprised of the following: • The Quality Assurance Manual, which defines the policies relating to the elements of ISO 9001:2000. • Quality Manual Procedures (QMPs) are the instructions written at the operator level to provide the operator with precise direction on how to perform his/her tasks. • Records of work and inspections performed. • Auditing of the system, to ensure compliance with procedures and the requirements of ISO 9001:2000. • Documentation / Data control system. • Corrective / Preventive Action system. • Management Review.
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Statistical Techniques
Statistical techniques are used to measure internal and external quality data. The data collected is used to identify trends, reject types, and when necessary, to initiate corrective action. The Director of Quality Assurance is responsible for creating monthly reports to be reviewed with upper management. The review is designed to monitor quality performance and continuous improvement efforts.
Training
It is an essential requirement of our Quality Management System that all staff be suitably trained, and demonstrate a satisfactory level of skill and knowledge in their functional areas. Training records are kept on file and updated accordingly.
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ISO-9001:2000 Certification
NIC has been ISO-9002 NIC received certified since February 01, 1996 ISO-9001:2000 certification on October 20th, 2002 Auditor: Underwriter's Laboratories Inc.
Certification covers NIC facilities located: Melville, NY (USA) & San Jose, CA (USA)
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NIC Global Support – Product Quality e-mail: Global Technical Support: [email protected]
Products
European Operations: NIC Eurotech Ltd 14 Top Angel Buckingham Industrial Park Buckingham MK18 1TH United Kingdom Tel: 44 1280 813 737 Fax: 44 1280 814 737 1 Supplier Quality Personnel on Staff
Japan Operations Nippon Industries (Tokyo, Japan) 3 Supplier Quality Personnel on Staff North American Operations Corporate Head Quarters: NIC Components Corp.
70 Maxess Road Melville, NY 11747 Tel (631) 396-7500 Fax (631) 396-7575 3 Supplier Quality Personnel on Staff
Taiwan Operations NIC - EIAN (Taiwan) Asia Operations: NIC Components Asia Pte Ltd 701 Sims Drive, #07-01 LHK Building Singapore 387383 Tel: 65-8441575 Fax: 65-8441646 1 Supplier Quality Personnel on Staff 1 Supplier Quality Personnel on Staff
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NIC Global Logistics Locations
Products
West Coast Operations: NIC Components Corp.
2070 Ringwood Avenue San Jose, CA 95131
European Operations: NIC Eurotech Ltd 14 Top Angel Buckingham Industrial Park Buckingham MK18 1TH United Kingdom Japan Operations Nippon Industries (Tokyo, Japan) 3PL:
Monterey, Mexico Guadalajara,Mexico Taiwan Operations NIC – EIAN (Taipei, Taiwan) North American Operations Corporate Head Quarters: NIC Components Corp.
70 Maxess Road Melville, NY 11747
Asia Operations: NIC Components Asia Pte Ltd 701 Sims Drive, #07-01 LHK Building Singapore 387383 Additional Sales Personnel in:
Penang, Malaysia
Hong Kong Shanghai, China 3PL:
Hong Kong
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Global Support
Products
Shared Unified Data-base Move programs – builds from location to location
seamlessly
Single Global Part Numbers No competing -disputing regional divisions
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Global Support Network
Products
West Coast USA
NIC CA
Mid-Atlantic USA
NIC NY
Western Europe
NIC EUROTECH
Scandinavia
NIC EUROTECH
NIC Local Warehouses (7) Mexico
NIC CA
Mid-West USA
NIC NY
SE Asia
NIC COMP ASIA
Eastern Europe
NIC EUROTECH
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Products
1975
Nippon Industries Company - Japan
“NIC” 1982 NIC Components Corp.
(North America)
1990 NIC West
(San Jose)
1996 NIC Eurotech
(Europe)
1998 NIC Asia
(SE Asia)
2000~2002 NIC Regional Sales Offices
• Pacific North West • South East • Southern California • Canada NIC Components Corporation [ ™], in association with Nippon Industries Co. Ltd is a designer, manufacturer and worldwide supplier of passive components.
• Established in 1975 as a manufacturer of aluminum electrolytic capacitors, NIC has developed into a major supplier of capacitors, resistors, magnetics and specialty products. • Using Nippon Industries' manufacturing and design expertise, a select group of specialized factories was recruited to augment our core products and add complimentary products to our expansive line.
• NIC's expertise and diligence in selection and integration of quality fabs is world-renowned. Long-term supplier relationships (averaging over ten years) have been fostered by shared strategy and partnering management teams. • Quality is our number one commitment. Every step, from component design to raw material selection, manufacturing processing to final inspection is meticulously controlled.
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NIC Products
Products
SURFACE MOUNT COMPONENTS
Capacitors: »
Aluminum Electrolytic Capacitors
» » » »
Ceramic Capacitors: Chip - Array - IPC Film Capacitors Tantalum Electrolytic Capacitors Low ESR Electrolytic Capacitors
Resistive Products: »
Thick Film Chip - Array - IPC
»
NTC Thermistors
Magnetics: »
Inductors
»
Ferrite Beads
Diodes & Circuit Protection: »
Silicon Rectifier Diodes
»
Schottky Barrier Diodes
»
Varistors (MLV) 65 www.niccomp.com
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NIC Products
Products
LEADED (TH) COMPONENTS
Capacitors: »
Aluminum Electrolytic Capacitors
» » »
Ceramic Capacitors Film Capacitors Tantalum Electrolytic Capacitors
Resistive Products: »
Film Resistors
»
Networks
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Products
Cutting Edge Technology
Ultra-
Low ESR Capacitors: Solid Aluminum E-Caps
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Products
Cutting Edge Technology
Ultra-
Low ESR Capacitors: Solid Aluminum E-Caps
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Products
Cutting Edge Technology
Low ESR Capacitors: Hybrid Electrolyte Aluminum E-Caps
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Products
Cutting Edge Technology
Low ESR Capacitors: Polymer Cathode Tantalum E-Caps
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Products
Cutting Edge Technology
Low ESR Capacitors: High Capacitance & High Frequency MLCCs
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Products
Cutting Edge Technology
High Frequency (Wireless) Design Components
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Products
Cutting Edge Technology
Ultra-Small (0201) Components » MLCC Capacitors » Chip Inductors » Chip Resistors
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Products
END
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