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HIOKI E.E. CORPORATION
Automatic Test Equipment
Road Map for ATE (Automated Test
Equipment)
X-Y HiTESTER
PCB
1115
1117
1116
PACKAGE
UNIT HiTESTER
1300
BOARD ASSEMBLY
PRESS-TYPE
HiTESTER
1101
1985
1107
1108
X-Y HiTESTER
1110
1102
1111/12
1114
1105
1990
1995
2000
1105 IN-CIRCUIT HiTESTER
• High-speed
inspection
• Capability of lifted
IC lead detection
• High-stability
measurement
• Reversely
mounted capacitor
detection
1114 X-Y IN-CIRCUIT HiTESTER
•
•
•
•
Reduces running costs
Flexibility
Unmanned visual inspection.
Unmanned operation.
1115 X-Y C HiTESTER
•
•
•
•
•
•
Ultra high speed
High-precision probing
Scratch-less
High accuracy
Gerber data utilization
Unmanned Operation
1116 X-Y C HiTESTER
• Ultra high-speed
inspection (4 arms)
• High-precision probing
• Scratch-less
• High accuracy
(resolution of 5aF)
• Gerber data utilization
• Unmanned Operation
1107 UNIT HiTESTER
• High-speed inspection of
IC packages, MCM
• High-speed measurement
• High positioning accuracy:
repeatability within +/-3um
• Dedicated fixture of
minimum 150um pitch
• User-replaceable probe
1107 UNIT HiTESTER Details
1.High accuracy
Position repeatability : Within ±3μm
2.High-speed measurement
Inspection time : 0.3sec/1024points
3.Fine-pitch probe
Minimum pitch : 150μm
4.Component test
L, C, R and Diode measurement
5.Insulation test
Applied voltage: 1V-step adjustable
1107 UNIT HiTESTER
Two Inspection Stages
B
Alignment
Area
A
Inspection
Area
1108 UNIT HiTESTER
High-speed testing
for IC packages,
such as MCM, BGA,
FC-PGA, FC-BGA, CSP
and high-density boards
In Actual Bare Board Inspection …
Each pattern has the capacitance that is proportional to its area
between probe and electrically isolated inspecting electrode
(sensor board).
Bare board
under test
Pattern
Probe
Capacitance
measurement
circuit
Insulating
film
Inspection stage
Sensor board
Short-Circuit/Disconnected Pattern Inspection
with Area (Capacitance) Measurement
A: Area
ε: Dielectric Constant
Capacitance C=
L: Length
εA
L
The capacitance between parallel lines is proportional factor to its area.
Therefore, capacitance measurement enables to measure its area.
In Actual Inspection …
A Flying probe contacts flip-chip side and fourterminal probes contact PGA side with a fixture to
measure resistance
Bare board
under test
Pattern Four-terminal probeﾞ
Resistance
measurement
Circuit
Jig for inspection
How To Measure Electrical Path Resistance
Four-terminal measurement method
With four-terminal measurement method, accurate resistance value
can be measured by getting rid of wiring and contact resistance
Resistance measurement circuit
Constant current
source
Voltmeter
I
r2
r4
E
E0
Resistance:
r3
R0
r1 r1～
r4：
Wiring and contact
resistance
Minute electrical path resistance can be
measured with four-terminal method
1172-67 Double-Link Probe
1172-41 Ｆour-Terminal Probe
In Actual testing …
A probe for reversely mounted capacitor detection contacts
the case of a electrolytic capacitor and the probes of a jig
contacts the terminals
Probe for reversely
mounted capacitor
detection contacts here
Probe for reversely
mounted capacitor
detection
How To Detect Reversely Mounted Capacitors
The voltage drop between the case and the terminals
of a electrolytic capacitor is measured to detect its
polarity
Probe for reversely
mounted capacitor
detection
PCB
Electrolytic
capacitor
Voltage
measurement
circuit
Road Map Appearance and Internal Inspection
1995
Packaging Structure
2000
2005
PGA QFP TCP
MCM BGA CSP
Flip Chip (BGA, LGA,
SO, etc.)
FBGA/LGA
Thick film circuit,
LCD Display,
Build-up structure
board
2010
In-circuit modules
3-D structure
packaging
COC
Light
interconnection
WOW
Inspection Object
Line/Space(μm)
Pad size(μm)
Dielectric constant
Thickness of insulator
Thickness of conductor
50/50
100
4.4～4.7
40～80
20
30/30
60
3.8～4.0
20～40
15
20/20
40
3.5～3.8
15～20
10
10/10
18
3.0～3.5
10～15
5