OCP-IP Introductory Presentation

Download Report

Transcript OCP-IP Introductory Presentation

OCP-IP Corporate Introduction
Ian R. Mackintosh
President, OCP-IP
OCP International Partnership © 2009
OCP-IP Industry Vision
NATIVE
VALUE ADDED
WHOLE
INFRASTRUCTURE
Proprietary/
Closed
Proprietary/
Closed
Proprietary/
Closed
Best-of-Breed/
Open
P
P
P
Corporate Growth
(Product-centric)
S
Industry Growth
(Standard-centric)
Source: Mackintosh Model
2
OCP International Partnership © 2009
OCP-IP Public Membership List (pg. 1)
3Plus1
4DSP, Inc.
Accent
Advanced Architectures
AerieLogic
Agnisys Technology PVT-Ltd.
Aizyc Technology
Alcatel
Alpha Data
Amimon
Amphion Semiconductor
Applied Science &
Technology Research Institute
Arasan Chip Systems, Inc.
ARC International
Artec Design Group
Arteris
Atomic Rules
ASICs World Services, Ltd.
Atrenta, Inc.
Attogenix Biosystems
Australian Semiconductor
Technology Co.
Averant, Inc.
Axell Corporation
AXYS Design Automation
Beceem Communications
Bluespec, Inc.
Boston Circuits, Inc.
Broadcom
Cadence Design Systems, Inc.
Carbon Design Systems
Carnegie Mellon University
CAST
CCLRC
Celoxica, Inc.
Chips & Media, Inc.
CircuitSutra Technologies
Pvt Ltd.
CNFM
Cologne Chip AG
Comtech EF Data
ControlNet India PVT-Ltd.
CoWare
Crevinn Teoranta
Cubic Defense Applications
Curtiss-Wright Controls
Embedded Computing
DAFCA
Denali Software, Inc.
Den Comm
Design and Reuse
Digimarc Corp.
Digital Blocks, Inc.
Digital Dynamics Corporation
Digital Media Professionals
Dolphin Integration
Doulos
Duolog Technologies
EADS Astrium
eASiC
Ecole Polytechnique de Montreal
EDA Café
EDA Consortium
EDA Express
eInfochips, Inc.
Elliptic Semiconductor, Inc.
Embedded Systems Lab.
ENSTA
Entropic Communications
Ernst & Young, LLP
Esterel Technologies
ETIS/ENSEA
European Electronic Chips &
Systems
European Space Agency
Evatronix S.A.
EVE
First Silicon Solutions
Forte Design Systems
FueTrek Co.
GDA Technologies
GeoLogic Design, LLP
Georgia Institute of Technology
GreenSocs
HCL Technologies
HDL Design House
HDL Dynamics
Hifn
Hughes
IBM
IBM, Japan
Icera Semiconductor
Icron Technologies
Imagination Technologies
Infineon Technologies
Inicore, inc.
Innovision Research
Integrated Device Technology
Inventure, Inc.
ITRI
ITT Corporation
Jasper Design Automation
JEDA Technologies, Inc.
Jetstream Media Technologies
Kaben Wireless Silicon
Kawasaki Microelectronics
KETI
L-3 Communications Systems
Leiden University
LTRIM Technologies
Magillem Design Services
Magnum Semiconductor
Manhattan Routing, inc.
Marvell Semiconductor, inc.
Mentor Graphics
Mercury
Micronas
Mimasic
Ministry of Information Industry
MIPS Technology
MIT Lincoln Library
Mobileye
3
OCP International Partnership © 2009
OCP-IP Public Membership List (pg. 2)
Motorola
Mtekvision Co. Ltd.
Nallatech
Nascentric, Inc.
National Applied Research Labs
National Tsing Hua University
NEC Electronics
Nexus 5001 Forum
NoBug
Nokia
NVIDIA Corporation
Olympus Digital System Design
Corp.
ON DEMAND Microelectronics
On2 Technologies
OSCI
Paradigm Works
Pixelworks, Inc.
pls Programmierbare Logik
Systeme GmbH
Princeton University
ProDesign Electronics Corporation
PUCRS
QThink
QualCore Logic
Realtek Semiconductor Corporation
Regulus Co., Ltd.
Republic of Tunisia, Faculty of
Sciences
Ricoh Company, Ltd.
Rockwell Collins
Royal Institute of Technology
Sasken Communication Tech.
Savant Company, Inc.
Semiconductor Technology Academic
Research Center
Sesca Embedded Solutions
Shanghai Hometown Microsystems
Shenzhen Graduate School
SIEMENS AG Oesterreich
Silicon & Software Systems
Silicon Hive
Silicon Image GmbH
Silicon Integration Initiative
Silicon Interfaces Private, Ltd.
Silicon Laboratories Inc.
Silicon Valley PA, Inc.
Silistix
SMI Corporation
SoC Microelectronics GmbH
Sonics
Spreadtrum
Springsoft
SSIPEX
STMicroelectronics
Stream Processors
Synfora
Synopsys
Taiwan SoC Consortium
Tampere University of Technology
Tata Elxsi Limited
Technical University of Denmark
TechOnLine
Temento Systems
Tensilica, Inc.
Teradici Corporation
Texas Instruments
The MITRE Corporation
Thomson
Toshiba Semiconductor
Tower Semiconductor
TransEDA, Inc.
TranSwitch Corporation
TrustIC Design SRL
TSMC
UMC
Universidad de Castilla-La Mancha
Universita di Bologna
Universite de Bretange Sud
Universite de Cergy Pontoise
University of Bristol, UK
University of British Columbia
University of California at Berkeley
University of Houston
University of Southampton
University of Tokyo, VDEC
VaST Systems Technology
Verification Technology Inc.
VeriLab Inc.
Vimicro
Vivante
VSI Alliance
VTT
Washington State University
Wavante
Wipro Technologies
WiQuest Communications
Xilinx, inc.
Yamaha Corporation
YogiTech
Zoetronics
Zoran
Zuken, Inc.
4
OCP International Partnership © 2009
OCP – Applications Served – 100’s Mu’s
Switches
Set-top Boxes
DVD Players
Printers
Mobile Phones
Computers
Wireless LANs
Game Consoles
Video Recorders
DTVs
Note: OCP usage is expanding in both FPGA and military applications (both low and
high volumes)
OCP International Partnership © 2009
5
OCP-IP Mission
“….to promote and support OCP as the complete
socket standard that ensures rapid creation
and integration of interoperable IP cores.”
6
OCP International Partnership © 2009
Important OCP Facts
•
ONLY complete and proven SoC socket
• Essential for “reuse without rework”
• The only path to Plug and Play
• NOT tied to any one supplier
• Tools/Interconnect/Design style, Independent
• Specification freely available
• HIGH Value Infrastructure in place for Members
• Huge cost savings from Deliverables
• Dramatic TTM advantages for users (a TTM win = Profit $$)
7
OCP International Partnership © 2009
Core-centric Interface
IP Core
OCP
SOCKET
Interface
Target Bus A
SOCKET IS NOT
A BUS INTERFACE
OR
Interface
Target Bus B
Note: OCP separates the computational IP core
from its communication activity.
White Paper available re: “Sockets” at
www.ocpip.org/socket/whitepapers.
8
OCP International Partnership © 2009
Charter of OCP-IP
• Governance of OCP Specification
• Evolution and enhancement
• Compliance testing and certification
• Community source products administration
• Specification
• Tools, support, services, etc.
• Promotion of the standard
• Non-profit operation
• HQ Beaverton, Oregon
9
OCP International Partnership © 2009
Membership Structure
• Governing Steering Committee (“GSC”)
• The Governing BoD
• Sponsor
• Eligible for Working Groups
• Community
• Free Community Source Products
Note: Sponsor fees $25K, Community $10K per year
($1K for company with annual revenues < $10million)
10
OCP International Partnership © 2009
University Program
• Launched January 2003
• World-leading participants
• Suitable for undergraduates and post-graduates
• Free software tools, support and training
• Research Copies of OCP Specification
• 1,000 university copies worldwide
11
OCP International Partnership © 2009
OCP-IP Benefits are Compelling
Industry-wide Breadth of Standards and Specifications
Interface
Specification
Continuous
Enhancements
interface
adoption requires
depth
• OCP-IP provides
this depth
Implementation
Tools
High-Level APIs
Training Program
Compliance
Program
Self-Certification
Seal
Focused Depth
• Successful
Technical Support
Verification Tools
12
OCP International Partnership © 2009
Extensive OCP Infrastructure
Visit the website for details of the
benefits offered by OCP-IP:
www.ocpip.org/membership/information/wheel
13
OCP International Partnership © 2009
OCP-IP in Asia: Supporting Global Design
•
Multiple, existing local-language websites:
• Japanese, Chinese and Korean
• Reach homepages via www.ocpip.org
•
Technical support in Japanese, available now
• Contact [email protected]
•
OCP and CoreCreator Training in Japanese, available now
• Contact [email protected]
•
Expansion continuing in India CY2009
• Many Indian companies already hold membership in OCP-IP
14
OCP International Partnership © 2009
OCP-IP Working Groups (WGs)
•
•
•
•
•
•
•
•
Technical Vision
Marketing
Specification
• Cache Coherence (*)
System-Level Design
Functional Verification
Debug (*)
NoC Benchmarking (*)
MetaData (*)
…all groups meet weekly or bi-weekly
(*) Newer WGs driven by Heterogeneous Processor, Multi-Core Systems
15
OCP International Partnership © 2009
Reviewing Status of OCP-IP WGs
• View “infrastructure wheel” for general status and
activities of working groups
• http://www.ocpip.org/membership/information/wheel
• Quarterly updates on individual working groups
provided in OCP-IP newsletter
• http://www.ocpip.org/pressroom/newsletters/
• Enquiries regarding specific working group activity or
your request for participation
• Contact us at [email protected]
16
OCP International Partnership © 2009
OCP Benefits
• Bus/interconnect independent (vendor neutral)
• ONLY complete socket
• Extensive, Proven and Tested industrial-grade tools
environment provided free as part of paying
membership entitlement
• IP core-centric (key to true reuse)
17
OCP International Partnership © 2009
Membership Benefits Matrix
Governing
Steering
Committee
(requires Board
Approval)
Technical
• Contribute to OCP
Specification enhancement
• Influence OCP technology
direction
Marketing
• Drive OCP-IP
evangelism campaign
• Create work groups
Other
• Board seat
• Drive new OCP
development tools
Technical
• Evaluate draft specifications
• Participate in work groups
Marketing
• Participate in work
groups
Other
Technical
• Access to OCP Specification
• CoreCreator® Product
• CoreCreator II Product
• OCP Checker
• OCP Conductor Product
• OCP Debug Socket
• OCP NoC Benchmarking
Spec (Parts 1 &2)
• Free technical support
• TLM’s, Monitors and Adapters
• Compliance Checks and
Functional Coverage
• Property Specific Language
(PSL) Suite
• Training
• Access to all new community
source products and services
Marketing
• Logo usage
• Member roster listing
• Participate in PR
events
• Ability to list IP and/or
EDA products
• Numerous datasheets
Other
• Members Only Web
site access
• Various white papers
Sponsor
($25K/year)
Community
($10K/year)
University
($1K/year)
X
X
X
X
X
X
18
OCP International Partnership © 2009
OCP-IP Membership Benefits
Recommended:
Regular, GSC, Sponsor and Community
Members
Participant
(No Cost)
License to use the OCP Specifications for commercial purposes (3 off)
Yes
Yes
Official Vendor Identification (VID) Number
Yes
Yes
Quarterly OCP-IP newsletter
Yes
Yes
Technical Support
Yes
No
Training
Yes
No
CoreCreator® and CoreCreator II
Yes
No
OCP Checker
Yes
No
OCP Conductor transaction viewer
Yes
No
Members Only Web site access
Yes
No
Compliance Seal
Yes
No
PR and marketing opportunities
Yes
No
Low-cost access to publications/marketing opportunities
Yes
No
Participation in product developments/Working Groups – GSC & Sponsors Only
Yes
No
Extensive SystemC TLM’s Deliverables set
Yes
No
Product Specific Language (PSL) Suite
Yes
No
Native SystemC Assertions
Yes
No
Compliance Checks
Yes
No
Functional Coverage
Yes
No
Product Library Listing
Yes
No
OCP International Partnership © 2009
19
White Papers Available from OCP-IP
•
“Survey of Network-on-Chip Proposals”
•
“Standard Debug Interface Socket Requirements for OCP-Compliant SoC”
•
“An Initiative Towards Open Network-on-Chip Benchmarks”
•
“OCP TLM for Architectural Modeling, Methodology White Paper”
•
“SystemC based SoC Communication Modeling for the OCP Protocol”
•
“The Importance of Sockets in SOC Design”
•
“Socket-Centric IP Core Interface Maximizes IP Applications”
•
All white papers available FREE at:
http://www.ocpip.org/socket/whitepapers/
20
OCP International Partnership © 2009
OCP-IP Promotional Benefits
• Access to OCP-IP endorsed promotional activities such
as tradeshows, technology pavilions, presentations, etc.
• Company listing, URL and logo on the member roster
• Collaboration or support on article placement
• Promotion in OCP-IP’s libraries
• IP: www.ocpip.org/library/ip/
• EDA Products: www.ocpip.org/library/eda/
• Related Services: www.ocpip.org/library/services_asic/
• Newsletter feature
• Joint press releases
21
OCP International Partnership © 2009
Organizational Growth
Mar ‘01
Formal founding
Jun ‘01
Web site/products/services
Sep ‘01
“GSC” BoD Formation
Oct ‘01
Public announcement
Dec ‘01
Official OCP 2.0 Release
Sep ‘03
Official OCP 2.1 Release
Mar ’05
Official OCP 2.2 Release
Q4 ’06
Official OCP 2.2 Rev 1.1 Release Q2 ‘08
• OCP-IP plan
•
•
•
•
•
•
•
•
22
OCP International Partnership © 2009
OCP-IP Membership
Join OCP-IP now by contacting:
[email protected]
OCP-IP Association
3855 SW 153rd Drive
Beaverton, OR 97006
Tel: 1-503-619-0560
Fax: 1-503-644-6708
23
OCP International Partnership © 2009
Becoming an OCP-IP Member
• Get membership application:
www.ocpip.org/data/OCPIP_Membership_Application.pdf
• Complete application form (takes two minutes!)
• Fax completed application to 1-503-644-6708
24
OCP International Partnership © 2009
OCP-IP Corporate Introduction
Ian R. Mackintosh
President, OCP-IP
OCP International Partnership © 2009