Transcript CMS - CNNNJ - Consultants Network of Northern New Jersey

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RoHS Enforcement
http://www.rohs.gov.uk/Docs/Links/RoHS%20Enforcement%20Guidance%20Document%20-%20v.1%20May%202006.pdf
Compliance Assurance System
(CAS)
• A definition of the purpose of the system,
its essential requirements and
specification. This specification should
cover compliance both within the company
and within the supply chain
Compliance Assurance System
(CAS)
• A formally defined process which
implements the requirements of the
system and is integrated within the
organization’s quality and management
systems
Compliance Assurance System
(CAS)
• A technical documentation system (paper
and/or electronic) to support the process
and measures to assure conformity with
the requirements of the system together
with necessary training, tools and
infrastructure.
Evidence of Active Control of the
CAS
• Results of internal and supplier audits to
validate Compliance Assurance System
and/or processes. i.e. the supplier’s ability
to assure compliance.
Evidence of Active Control of the
CAS
• Evidence that the system is being followed
including results of product specific
conformance assessments comprising
items such as product assessments
(including justification of RoHS
categorization and use of exemptions),
materials declarations, procurement,
inventory and production controls and
substance analysis where appropriate
Evidence of Active Control of the
CAS
• Overview of any internal data system used
for the management of RoHS compliance
data
Evidence of Active Control of the
CAS
• Producers’ or suppliers’ completed
materials declaration for each part
(including revision for revised parts) and
justification of RoHS categorization and
use of exemptions. These declarations
would be limited to the list of RoHS
substances, not full materials declarations
Evidence of Active Control of the
CAS
• Analysis report for homogeneous
materials in parts/components, (which
could be the producers or suppliers own
internal or external test results). The test
results should refer to homogenous
materials in parts/components.
Evidence of Active Control of the
CAS
• Producers’ or suppliers’ warranties
/certificates declaring that the use of the
restricted substances is within the
permitted levels
Evidence of Active Control of the
CAS
• Provide evidence that procedures are
being followed to show that materials
declarations have been assessed to
determine if they can be trusted.
Enforcement authorities will also need to
see documented compliance procedures
Three Steps to RoHS Compliance
• Documentation
• Procedures
• Marketing
Documentation
• Design for RoHS Compliance
• Bill of Material Conversions
– Components, Hardware
• Build to Print Drawings
– PCB’s
– Metals
– Metal Finishes
- Cables
- Plastics
- Paints
• Material Declarations
• Testing
(RoHS) Directive
IPC 1065
ANNEX B: Level B Materials and Substances
For Level B materials and substances, the default threshold level is 1000 ppm based upon the weight of the product
or subpart being declared. Reporting below the threshold is allowed, but not required.
Where metals are listed in Annex B, they require reporting of the metal content in the metal alloys..
Note: Materials/substances are listed by group. Please refer to Annexes E and F for details.
Material/Substance
Threshold level
Antimony/Antimony Compounds
1000 ppm
Arsenic/Arsenic Compounds
1000 ppm
Beryllium/Beryllium Compounds
1000 ppm
Bismuth/Bismuth Compounds
1000 ppm
Brominated Flame Retardants (other than PBBs or PBDEs)
1000 ppm
Nickel/Nickel Compounds (external applications only ¹)
1000 ppm
Certain Phthalates (see Annex F)
1000 ppm
Selenium/Selenium Compounds
1000 ppm
Polyvinyl Chloride (PVC)
(Disclosure is limited to “is present”/”is not present” in
amounts that exceed threshold)
1000 ppm
1) Nickel alloys are not reportable. Nickel and nickel compounds must be reported when used in applications where nickel
compounds are likely to result in prolonged skin exposure (e.g., an outer enclosure for a portable electronic product designed to
be carried). Use of nickel or nickel compounds in components and parts designed to be located inside the outer enclosure of a
product need not be reported.
Homogeneous material
-Semiconductor package contains six
different homogeneous materials.
The term “homogeneous” is understood as “of uniform composition throughout”.
Examples of “homogeneous materials” are individual types of: plastics, ceramics, glass,
metals, alloys, paper, board, resins, and coatings. The Commission further states that a
“homogeneous material” cannot be mechanically disjointed into different materials.
The term “mechanically disjointed” means that the materials can be, in principle,
separated by mechanical actions. This means that an insulated wire is considered as
two homogeneous materials: the metal wire and the plastic insulating material.
Texas Instruments, Inc.
Search Results for "74ALVC16244ADGGRE4"
Current Production Information
TI Part Number
74ALVC16244ADGGRE4
Assembly Site
TI MALAYSIA A/T
Lead/Ball Finish
CU NIPDAU
Package Type / Pins
DGG | 48
Package Body Size (WxLxH)
mm
6.1x12.5x1.15
Level-1-250C-UNLIM
Total Device Mass (mg)
201.729963
RoHS & High-Temp Compatible
Y
Green Compatible
N
Pb-Free (RoHS) Conversion Date
01-Aug-2003 (DC 0331)
Green Conversion Date
Aug-2005
Pb-Free (RoHS) Available Supply
Date
15-Apr-2005
Green Available Supply Date
Jun-2006
Planned Lead/Ball Finish
MSL / Reflow Ratings
Pb-Free (RoHS) & Green Details
Component
Amount (mg)
Homogeneous Material Level
Component Level
Percentage %
Percentage %
Substance
CAS Number
ppm
ppm
Metallurgy
Gold
7440-57-5
0.504594
98.9468
989467
0.2501
2501
Trace Metal
Calcium
7440-70-2
0.00001
0.002
19
0
0
Trace Metal
Copper
7440-50-8
0.000003
0.0006
5
0
0
Trace Metal
Palladium
7440-05-3
0.005355
1.0501
10500
0.0027
26
Trace Metal
Silver
7440-22-4
0.000003
0.0006
5
0
0
0.509965
100
1000000
0.2528
2527
0.203
70
700000
0.1006
1006
0.0377
13
129999
0.0187
186
Bond Wire
Sub-Total
Die Attach Adhesive
Conductive Material
Silver
7440-22-4
Polymer
Epoxy
Polymer
Proprietary Resin
0.01595
5.5
54999
0.0079
79
Reactive Diluent
Proprietary
Material
0.03335
11.5
114999
0.0165
165
0.29
100
1000000
0.1438
1436
Sub-Total
Lead Frame
Base Metal
Copper
7440-50-8
61.680318
97.425
974249
30.5757
305756
Base Metal
Iron
7439-89-6
1.519454
2.4
24000
0.7532
7532
Base Metal
Lead
7439-92-1
0.018993
0.03
299
0.0094
94
Base Metal
Phosphorus
7723-14-0
0.009497
0.015
150
0.0047
47
Base Metal
Tin
7440-31-5
0.018993
0.03
299
0.0094
94
Base Metal
Zinc
7440-66-6
0.063311
0.1
1000
0.0314
313
63.310566
100
1000000
31.3838
313836
Sub-Total
Component
Amount
(mg)
Homogeneous Material Level
Component Level
Percentage %
Percentage %
Substance
CAS Number
ppm
ppm
Plating
Gold
7440-57-5
0.025736
2.5
25000
0.0128
127
Plating
Nickel
7440-02-0
0.926496
90
900000
0.4593
4592
Plating
Palladium
7440-05-3
0.077208
7.5
75000
0.0383
382
1.02944
100
1000000
0.5103
5101
0.26586
0.2
2000
0.1318
1317
111.262402
83.7
836999
55.1541
551541
1.3293
1
10000
0.659
6589
0.53172
0.4
4000
0.2636
2635
5.3172
4
40000
2.6358
26358
Lead Frame Plating
Sub-Total
Mold Compound
Coloring
Carbon Black
1333-86-4
Filler
Fused Silica
60676-86-0
Flame Retardant
Additive
Antimony Oxide
1309-64-4
Flame Retardant
Polymer
Brominated Epoxy
Hardener
Phenolic Novolac
Hardener
Proprietary Hardener
0.66465
0.5
5000
0.3295
3294
Other additives
Catalyst Mold Release
Adhesion
Agent
0.93051
0.7
7000
0.4613
4612
Polymer
Biphenyl Epoxy
1.3293
1
10000
0.659
6589
Polymer
Cresol Novolac Epoxy
10.6344
8
80000
5.2716
52716
Stress Relief Agent
Silicone
0.66465
0.5
5000
0.3295
3294
132.929992
100
1000000
65.895
658945
3.66
100
1000000
1.8143
18143
3.66
100
1000000
1.8143
18143
100
1000000
Sub-Total
Semiconductor Device
Silicon Chip
Sub-Total
Total
Doped Silicon
7440-21-3
201.729963
JEDEC 97 / IPC 1066
Solder Finish Categories
The following categories are meant to describe the Pb-free 2nd level
interconnect
e1 – SnAgCu
e2 – Other Sn alloys (ie. SnCu, SnAg, SnAgCuX, etc.)
(No Bi or Zn)
e3 – Sn
e4 – Precious metals (ie. Ag, Au, NiPd, NiPdAu, but
no Sn)
e5 – SnZn, SnZnX (no Bi)
e6 – Contains Bi
e7 – Low temperature solder (<150°C) containing indium
but no bismuth
e8, e9 symbols are unassigned categories at this time.
Compliance Data
• Format
• Where do you put it?
• Design / ECN Loop
Form Structure
1752 Form
Companies Supporting IPC 1752
•3M Technologies S Pte Ltd
•5-Trees LLC
•Ageus Solutions
•Agile Software
•Array Solutions
•Austin Insulators Inc.
•Beckman Coulter
•C&D Technologies
•Celestica, Inc.
•Circuit Connect, Inc.
•Coherent
•Conexant
•Datakey Electronics, Inc.
•DiSS Technology (HK) Co., Ltd.
•E2open
•Electronic Hardware Corp.
•Energy Transformation Systems
•ExcelStor Technology
•Foresite Systems
•Foxconn Electronics Inc.
•Freescale Semiconductor
•Future Electronics
•GE Security
•Harris Corp.
•Harvard Custom Manufacturing
•Indian Springs Mfg. Co., Inc.
•Information Handling Services
•Jabil Circuit
•Kemet Electronics Corp.
•LG Chemical
•Lucent Technologies
•MHTB
•Maxtor Corp.
•MicroRam Electronics, Inc.
•Molex
•National Semiconductor
•Nexgen Mediatech Inc
•Omnitrix, Inc.
•Optichron Inc.
•PCNalert
•Panasonic Electronic Devices Co., Ltd.
•Pantronix Corporation
•Paxar Americas, Inc.
•Precience, Inc.
•PTC
•Qualcomm, Inc.
•Ramtron International Corp.
•Sagem Tunis
•Sanmina-SCI
•Schaffner
•Shenzhen Newstar Microelectronics Co., Ltd.
•Solectron Corporation
•Speedline Technologies
•Sun Microsystems
•Sunpower Technology Co.
•Symbol Technologies, Inc.
•Synapsis Technology
•Temex
•Teradyne
•Texas Instruments
•The GoodBye Chain Group
•Trompeter Semflex, Inc.
•Tyan Computer Corp.
•Tyco Electronics
•UPE Electronics
•Uawithya
•Vitesse
Documentation
• Design for RoHS Compliance
• Bill of Material Conversions
– Components, Hardware
• Build to Print Drawings
– PCB’s
– Metals
– Metal Finishes
- Cables
- Plastics
- Paints
• Material Declarations
• Testing
PCB’s
Surface Finishes
SURFACE
FINISH
THICKNESS
ADVANTAGES
DISADVANTAGES
HASL
50-1500 pm
"Nothing solders like
solder."
Easily applied.
Lots of industry
experience.
Easily reworked.
Good bond strength
Withstands multiple
thermal cycles.
Huge coplanarity differences resulting in off-contact printing
and assembly defects.
Contains lead.
Not suited for high aspect ratios.
Not suited for <0.020" pitch.
PCB dimensional stability issues.
Bridging problems on fine pitch assemblies.
Inconsistent coating thickness (on varying pad sizes).
OSP
Benzimidazo
les)
0.2-0.6 pm
Flat, coplanar pads.
Reworkable (by
fabricator).
Doesn't affect final hole
size.
Short, easy process.
CU-SN IMC formed has
been reported to be
stronger and more robust
than Bu-Sn from HASL
and Ni-Sn from Ni-Au.
Assembly line changes may be required; not a drop-in.
Question remains over reliability of exposed Cu after
assembly.
Limited thermal cycles.
Cannot be reworked by assembler.
Sensitive to some solvents and used for misprint cleaning.
Limited shelf life.
Test pins cut coating, leaving exposed copper.
ENIG
125-250 pin Ni
2-8 pin Au
Planar surface.
Consistent thicknesses.
Withstands multiple
thermal cycles.
Long shelf life.
Solders easily.
Good for fine-pitch
product.
Not wire bondable.
Expensive.
Should not be used on < 1.0 mm pitch;black pad issues
Waste treatment of Ni.
Cannot be reworked by fabricator.
Ni is suspected carcinogen.
Not optimal for higher speed signals.
Surface Finishes
SURFACE
FINISH
THICKNESS
ADVANTAGES
DISADVANTAGES
Immersion
Ag
> 5 pin
Good for fine-pitch product.
Planar surface.
No black pad concerns.
Short, easy process cycle.
Eliminates nickel.
Doesn't affect final hole size.
Long shelf life.
Can be reworked/reapplied
by the fabricator.
OK for multiple insertions.
Inexpensive.
Drop-in process for the
assembler.
Good for ultra-high speed
signals.
High friction coefficient; not be suited for compliant pin
insertion (Ni-Au pins).
Some systems cannot throw into blind vias with aspect ratios
>1:1.
Tarnishing must be controlled.
Immersion
Sn
25-60 pin
Good for fine-pitch product.
Planar surface.
Eliminates nickel.
Can substitute for reflowed
solder in selective strip.
Inexpensive.
Handling concerns.
Panels need to be routed and electrically tested before coating.
Contains thiourea.
Limited rework cycles at assembler.
Horizontal process needs nitrogen blanket.
Laminates
Restricted Substances in Alloys
• Lead as an alloying element in steel
greater than 0.35% lead by weight.
• Lead as an alloying element in aluminum
greater than 0.4 % lead by weight.
• Lead as an alloying element in copper
greater than 4% by weight.
Aluminum 2011A Composition Spec
Component
Wt. %
Al
91.4 - 95.1
Bi
Cu
Component
Fe
Wt. %
Component
Wt. %
Max 0.5
Pb
0.2 - 0.6
0.2 - 0.6
Other, each Max 0.05
Si
Max 0.4
4.5 - 6
Other, total Max 0.15
Zn
Max 0.3
Metal Plating
Cable and Harness Assemblies
• Most restricted substances in the RoHS
Directive can be found in the insulation,
tinning, solder, connectors, and
terminations commonly used in cable and
harness assemblies. Therefore,
component and wire specification and
selection are critical to meeting the
concentration limits for these substances
Cable and Harness Assemblies
Cable Assemblies
Plastics
Plastic Enclosures:
PBB’s & PBDE’s
IEC Standard draftLevels of RoHS compliance testing
•
Non-destructive Screening
– XRF handheld or laboratory analyzer
– No parts disassembly required
– for uniform and homogeneous samples
•
Destructive Screening
– XRF handheld or laboratory analyzer
– Different materials are analyzed separately
– mechanical sample preparation is needed
•
Verification methods
– GC/MS-FTIR, verification of polymers+ electronics
– HPLC-UV, verification of polymers + electronics
– ICP-MS
IEC Standard draft Preferred RoHS analysis techniques by
elements
•
Pb, Cd
– ICP-MS, ICP-AES (destructive) ,verification
– AAS (destructive)
– XRF (non-destructive)
•
Cr (VI), hexavalent Chrome
– Spot test ISO3613, Alkaline digestion & colorimetric test
EPA3060A diphenyl-carbazide color test, verification of metals
– XRF (for Cr total presence)
•
PBB’s and PBDE’s (Br compounds)
– GC/MS-FTIR, verification of polymers+ electronics
– HPLC-UV, verification of polymers + electronics
– XRF (for Br total presence only)
Hg
– ICP-MS, ICP-AES,
– CV-AAS,AFS verification method
– XRF
•
Testing
Tracking materials
declaration
-suggested test points
Three Steps to RoHS Compliance
• Documentation
• Procedures
• Marketing
Procedures
Continual Improvement of the Quality Management System
Management
Responsibility
RoHS
Compliant
Bill of
Material
RoHS
Compliant
Finished
Product
Resource
Management
INPUT
Measurement
Analysis &
Improvement
Product
Realization
OUTPUT
PRODU
CT
Management Responsibility and
Resources
•
•
•
Have you composed a hazardous substance
list? RoHS vs. Green?
Have you identified equipment that will be
needed for manufacturing compliant product?
Soldering irons, solder pots, XRF, dedicated
work areas, rework stations.
Have you provided proper training? IPC 610D,
IPC 620, JSTD 001D.
Design and Development
•
•
•
•
Compliant bill of material. What level of
documentation will you provide? MSL, peak
temperature, metal finishes, material
declarations.
Have you developed specifications for cables,
metals, metal finishes, paints, plastics,
hardware?
What documentation do you require your
customer provide?
Will you offer RoHS compliant documentation
services to you customer? i.e. BOM
conversions.
Purchasing
•
•
•
•
•
•
What RoHS compliance requirements will you
provide to your suppliers?
What RoHS verification at incoming do you
perform?
What documentation do you require from your
suppliers?
Do you audit suppliers for RoHS compliance to
assess high risk?
Do you have a unique part numbering for
compliant vs. noncompliant parts?
Do you label parts at incoming to distinguish
compliant vs. noncompliant?
Production Process
•
•
•
•
•
•
What documentation do you require from your
customer for production processes? (MSL, peak
temperature, lead finish)
Will you segregate floor space for compliant
assembly? (Dedicated cells, machines, equipment)
Will you mark equipment for use with leaded
processes, non-leaded processes, or both?
Have you chosen you solder alloys and fluxes?
Do you have a process for material handling of
compliant vs. non-compliant product?
Has all personnel been trained to new standards, IPC
610D, IPC 620, JSTD 001D new equipment and new
processes.
Measurement Analysis and
Improvement
•
•
•
•
•
•
Will you perform XRF testing?
Is there a process for non-conforming product?
Do you have a process for non-compliant
traceability and containment?
Do you keep records of non-compliant
substances found on the manufacturing floor?
Do you include RoHS compliance in your
internal audit program?
Is RoHS compliance part of your Management
Review?
Three Steps to RoHS Compliance
• Documentation
• Procedures
• Marketing
Marketing
• Documentation / C of C to Customer
• Product Marking / Advertising
• Third Party Certification of RoHS
Compliance
– (ISO 9000 / QC 080000)
QC 080000 Advantages
• Clear competitive advantage.
• Demonstrate superior processes and
documentation for RoHS compliance.
• Lock-in and grow existing customers.
• Now even more of a “Value Added
Supplier”
Advantages For Your Customer
• Your certification goes a long way towards
your customer providing “Due Diligence”
for RoHS compliance.
• Reduces his audit requirements of your
RoHS compliance.
Summary
•
•
•
•
Your Product will be tested.
Penalties inversely proportional to effort.
Material Declarations versus C of C’s
Revised “Build to Print” Drawings and
Specifications.
• Compliance Assurance System
• Third Party Certification (QC 080000) to
demonstrate compliance.